CN108807714A - The formed method of light-extraction layer and organic LED structure - Google Patents
The formed method of light-extraction layer and organic LED structure Download PDFInfo
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- CN108807714A CN108807714A CN201710306801.4A CN201710306801A CN108807714A CN 108807714 A CN108807714 A CN 108807714A CN 201710306801 A CN201710306801 A CN 201710306801A CN 108807714 A CN108807714 A CN 108807714A
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- substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
Abstract
The invention discloses a kind of formed method of light-extraction layer and organic LED structure, light-extraction layer includes first substrate, second substrate and multiple diffusing structures.First substrate has multiple grooves.Second substrate is set on first substrate, and wherein first substrate is in direct contact second substrate, and first substrate is identical as the material of second substrate.Diffusing structure is respectively arranged in different grooves.Light-extraction layer be able to will be used for enhancing the light extraction efficiency of organic LED structure.
Description
Technical field
The present invention relates to a kind of formed method of light-extraction layer and organic LED structures.
Background technology
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) is to be organised using luminiferous
The luminescence component of object is closed, there is spontaneous light characteristic, and its slimming, display quality and electricity-saving characteristic are all better than liquid crystal display
(Liquid Crystal Display, LCD).Since Organic Light Emitting Diode has the spies such as wide viewing angle, high reaction speed, ultra-thin
Property so that organic LED panel will be used wider and wider general.
In order to further improve every characteristic of Organic Light Emitting Diode, related field is there's no one who doesn't or isn't painstakingly developed.How
A kind of Organic Light Emitting Diode with preferable characteristic can be provided, it is real to belong to current important research and development project, also become currently associated neck
There is an urgent need for improved targets in domain.
Invention content
The one of the present invention is designed to provide a kind of method forming light-extraction layer, forms light-extraction layer whereby, can be with
For enhancing the light extraction efficiency of organic LED structure.
A kind of method of the formation light-extraction layer provided according to an embodiment of the present invention, comprises the steps of.First, exist
Barrier layer is formed on first substrate.Then, multiple openings are formed in barrier layer and first substrate.Then, it fills in the opening
Scattering material.Come again, removes barrier layer, while leaving scattering material on the first substrate.Then, planarization substrate and scattering material
Material.Finally, second substrate is engaged on first substrate.
In one or more embodiments of the present invention, in the step of removing barrier layer, barrier layer is to pass through stripping
Mode removes.
According to the light-extraction layer that another embodiment of the present invention provides, light-extraction layer include first substrate, second substrate with
And multiple diffusing structures.First substrate has multiple grooves.Second substrate is set on first substrate, and wherein first substrate is direct
Second substrate is contacted, and first substrate is identical as the material of second substrate.Diffusing structure is respectively arranged in different grooves.
In one or more embodiments of the present invention, the depth of groove is 20 microns to 50 microns.
In one or more embodiments of the present invention, the line width of groove is 150 microns to 400 microns.
In one or more embodiments of the present invention, the line-spacing of groove is 150 microns to 350 microns.
In one or more embodiments of the present invention, diffusing structure is that transparent organic material is mixed into multiple metal oxidations
Object microparticle, the wherein size of metal oxide microparticle are 0.5 micron to 4 microns, and metal oxide microparticle is tied in scattering
The concentration expressed in percentage by weight of structure is 5% to 10%.
In one or more embodiments of the present invention, the material of metal oxide microparticle is aluminium oxide or oxidation
Zirconium.
In one or more embodiments of the present invention, the material of first substrate and second substrate is glass.
According to the organic LED structure that a further embodiment of this invention provides, organic LED structure includes
Light-extraction layer, first electrode layer, light emitting structure and the second electrode lay above-mentioned.First electrode layer is set in light-extraction layer.
Light emitting structure is set in first electrode layer.The second electrode lay is set on light emitting structure.
The diffusing structure being set in groove will can make the light that light emitting structure is emitted generate scattering effect when passing through
It answers, then the direction of these light will be by correcting, thus avoids these light in the interface by first substrate and air
Shi Yinwei is totally reflected and can not project first substrate.Then, the light extraction efficiency of organic LED structure will effectively enhance.
Furthermore, it is understood that because first substrate is in direct contact second substrate, and the material phase of first substrate and second substrate
Together, so the light that is emitted of light emitting structure is by not will produce when interface between first substrate and second substrate need not
The refraction or total reflection wanted, thus the case where avoid light extraction efficiency from being interfered, and then further enhance Organic Light Emitting Diode
The light extraction efficiency of structure.
In addition, because second substrate is in direct contact first substrate, and second substrate is smooth substrate, so when the first electricity
When pole layer is formed on second substrate, first electrode layer is row in a smooth plane.Thus, first electrode layer
Manufacturing yield will effectively be promoted, and then avoid generating short circuit phenomenon or resistance and the bad phenomenons such as rise.
Description of the drawings
Fig. 1 to Fig. 7 is painted the section signal in different process step according to the light-extraction layer of an embodiment of the present invention
Figure.
Fig. 8 is painted the schematic top plan view of the light-extraction layer according to an embodiment of the present invention.
Fig. 9 is painted regards schematic diagram according to the section of the organic LED structure of an embodiment of the present invention.
Figure 10 is painted the Organic Light Emitting Diode that traditionally organic LED structure is different from the present invention embodiment
The briliancy of structure-line width figure.
Figure 11 is painted the Organic Light Emitting Diode that traditionally organic LED structure is different from the present invention embodiment
Another briliancy-line-spacing figure of structure.
Figure 12 is painted the schematic top plan view of the light-extraction layer according to another embodiment of the present invention.
Figure 13 is painted the Organic Light Emitting Diode that traditionally organic LED structure is different from the present invention embodiment
Another briliancy-line-spacing figure of structure.
Specific implementation mode
Multiple embodiments of the present invention, as clearly stated, the details in many practices will be disclosed below with attached drawing
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying attached drawing, one
A little known usual structures will be painted in a manner of simply illustrating in the accompanying drawings with component.
Fig. 1 to Fig. 7 is painted to be shown according to section of the light-extraction layer 100 of an embodiment of the present invention in different process step
It is intended to.Different embodiments of the present invention provide a kind of method forming light-extraction layer 100, form light-extraction layer 100 whereby, can
With for enhancing the light extraction efficiency of organic LED structure.
Show as depicted in FIG. 1, first substrate 110 is provided.
Specifically, the material of first substrate 110 is transparent insulation material.The material of above-mentioned first substrate 110 can be
Glass.The thickness of first substrate 110 can be about 0.5 millimeter.
As illustrated in Figure 2, barrier layer 120 is formed on first substrate 110.
Specifically, the material on barrier layer 120 can be macromolecule material.The material on above-mentioned barrier layer 120 can be poly- two
Methylsiloxane (Polydimethylsiloxane, PDMS).The thickness on barrier layer 120 can be about 300 microns.
In the present embodiment, barrier layer 120 is to be coated on first substrate 110 using spin coater, wherein spin coater
Rotating speed in 300rpm and maintains 10 seconds in order to control.
Show as depicted in fig. 3, multiple opening 120o are formed in barrier layer 120 and first substrate 110, thus in first substrate
Multiple groove 120g are formed in 110.Specifically, the depth of groove 120g can be 20 microns to 50 microns, the line of groove 120g
Wide is 150 microns to 400 microns, and the line-spacing of groove 120g can be 150 microns to 350 microns.
In the present embodiment, opening 120o is and the laser by laser-engraving technique direct engraving on barrier layer 120
Energy be 16 watts, but it is not limited to this.In other embodiments, opening 120o can pass through exposure imaging and etching
Mode is formed.
As depicted in Fig. 4, scattering material 130 is filled being open in 120o, therefore scattering material 130 is also filled in groove
In 120g.
Specifically, scattering material 130, which is transparent organic material, is uniformly blended into multiple metal oxide microparticles.It is transparent to have
Machine material can be SU-8 organic solutions.The material of metal oxide microparticle can be aluminium oxide or zirconium oxide.Metal oxide is micro-
The size of particle can be 0.5 micron to 4 microns.Metal oxide microparticle can be in the concentration expressed in percentage by weight of scattering material 130
5% to 10%.
In the present embodiment, scattering material 130 is first dropped in into first substrate 110 on barrier layer 120 first, then made
Spin coating is carried out with spin coater, wherein the rotating speed of spin coater in 300rpm and maintains 10 seconds in order to control, thus keeps scattering material 130 high
Degree is uniform.Then, baking 10 minutes is carried out for first substrate 110, barrier layer 120 and scattering material 130 with 95 degree Celsius.So
Afterwards, cure scattering material 130 using ultraviolet radiator.Finally, with 95 degree Celsius for first substrate 110, barrier layer 120 and scattering
Material 130 carries out baking 10 minutes.
Show as shown graphically in fig 5, removes barrier layer 120, while leaving at least partly scattering material 130 on first substrate 110.
Specifically, the scattering material 130 left is located at least in groove 120g.
In the present embodiment, barrier layer 120 is to be removed by stripping mode.Then, predominantly it is located in opening 120o
Scattering material 130 carry over.
As depicted in Fig. 6, planarization first substrate 110 and scattering material 130, thus diffusing structure 131 is formed in groove
In 120g.Specifically, the rotating speed of grinding table maintains 150rpm when planarization, and milling time is 20 minutes.
Show as depicted in fig. 7, second substrate 140 is engaged on first substrate 110, then forms light-extraction layer 100.Specifically
For, second substrate 140 is identical as the material of first substrate 110.The material of second substrate 140 is transparent insulation material.It is aforementioned
The material of second substrate 140 can be glass.
In the present embodiment, be adhesively fixed two end sides of second substrate 140 and first substrate 110 using packaging plastic 191
Face, the wherein material of packaging plastic are dimethyl silicone polymer (Polydimethylsiloxane, PDMS), then second substrate
140 are in direct contact first substrate 110.In other embodiments, can utilize anodic bonding process engagement second substrate 140 with
First substrate 110.
Fig. 8 is painted the schematic top plan view of the light-extraction layer 100 according to an embodiment of the present invention.Show as depicted in figure 8, scatters
Structure 131 is strip, and is evenly distributed in first substrate 110.
As depicted in Fig. 7 and Fig. 8, another embodiment of the present invention provides a kind of light-extraction layer 100.Light-extraction layer 100 is wrapped
Containing first substrate 110, second substrate 140 and multiple diffusing structures 131.First substrate 110 has multiple groove 120g.Second
Substrate 140 is set on first substrate 110, and wherein first substrate 110 is in direct contact second substrate 140, and first substrate 110 with
The material of second substrate 140 is identical.Diffusing structure 131 is respectively arranged in different groove 120g.
Specifically, the depth of groove 120g can be 20 microns to 50 microns, the line width of groove 120g can be for 150 microns extremely
400 microns, the line-spacing of groove 120g can be 150 microns to 350 microns.
Specifically, diffusing structure 131, which is transparent organic material, is mixed into multiple metal oxide microparticles.Metal oxide
The material of microparticle is aluminium oxide or zirconium oxide.The size of metal oxide microparticle is 0.5 micron to 4 microns.Metal aoxidizes
Object microparticle is 5% to 10% in the concentration expressed in percentage by weight of diffusing structure.
Specifically, the material of first substrate 110 and second substrate 140 is glass.
Fig. 9 is painted regards schematic diagram according to the section of the organic LED structure 200 of an embodiment of the present invention.Such as figure
Depicted in 9, different embodiments of the present invention provide a kind of organic LED structure 200.Organic LED structure 200
Including light-extraction layer 100, first electrode layer 210, light emitting structure 220 and the second electrode lay 230.First electrode layer 210 is arranged
In in light-extraction layer 100.Light emitting structure 220 is set in first electrode layer 210.The second electrode lay 230 is set to light emitting structure
On 220.
The diffusing structure 131 being set in groove 120g will can make light that light emitting structure 220 emitted when passing through
Generate scattering effect, then the direction of these light will by correcting, thus avoid these light by first substrate 140 with
When the interface of air first substrate 140 can not be projected because of total reflection.Then, organic LED structure 200 goes out
Light efficiency will effectively enhance.
Furthermore, it is understood that because first substrate 110 is in direct contact second substrate 140, and first substrate 110 and second substrate
140 material is identical, so the light that light emitting structure 220 is emitted is by between first substrate 110 and second substrate 140
Not the case where unnecessary refraction or total reflection are not will produce when interface, thus light extraction efficiency is avoided to be interfered, and then into one
The light extraction efficiency of step enhancing organic LED structure 200.
In addition, because second substrate 140 is in direct contact first substrate 110, and second substrate 140 is smooth substrate, institute
With when first electrode layer 210 is formed on second substrate 140, first electrode layer 210 is row in a smooth plane.
Thus, which the manufacturing yield of first electrode layer 210 will be promoted effectively, and then avoid generating short circuit phenomenon or resistance rising etc.
Bad phenomenon.
Figure 10 is painted the Organic Light Emitting Diode that traditionally organic LED structure is different from the present invention embodiment
The briliancy of structure 200-line width figure.As depicted in Figure 10, straight line 410 represents traditional OLED structure, and (i.e. it does not have
Including light-extraction layer 100) emitting brightness, point 420 represent organic LED structure 200 groove 120g line width as
Emitting brightness when 150 microns and line-spacing are 250 microns, point 430 represent organic LED structure 200 groove 120g's
Emitting brightness when line width is 250 microns and line-spacing is 250 microns, point 440 represent organic LED structure 200 in groove
The emitting brightness when line width of 120g is 350 microns and line-spacing is 250 microns, point 450 represent organic LED structure 200
Emitting brightness when the line width of groove 120g is 450 microns and line-spacing is 250 microns.Compare straight line 410 with point 420,430,
440, after 450 it can be found that can effectively promote the light extraction of organic LED structure 200 really using light-extraction layer 100
Brightness.At the same time, when the line-spacing of groove 120g is 250 microns, the line width of groove 120g, which is 350 microns, can make organic hair
Optical diode structure 200 has best emitting brightness.
Figure 11 is painted the Organic Light Emitting Diode that traditionally organic LED structure is different from the present invention embodiment
Another briliancy-line-spacing figure of structure.As depicted in Figure 11, straight line 510 represents traditional OLED structure, and (i.e. it does not have
Including light-extraction layer 100) emitting brightness, point 520 represent organic LED structure 200 groove 120g line width as
Emitting brightness when 350 microns and line-spacing are 125 microns, point 530 represent organic LED structure 200 groove 120g's
Emitting brightness when line width is 350 microns and line-spacing is 150 microns, point 540 represent organic LED structure 200 in groove
The emitting brightness when line width of 120g is 350 microns and line-spacing is 200 microns, point 550 represent organic LED structure 200
Emitting brightness when the line width of groove 120g is 350 microns and line-spacing is 250 microns, point 560 represent Organic Light Emitting Diode
Emitting brightness of the structure 200 when the line width of groove 120g is 350 microns and line-spacing is 300 microns, point 570 represent organic light emission
Emitting brightness of the diode structure 200 when the line width of groove 120g is 350 microns and line-spacing is 350 microns.Compare straight line 510
With point 520,530,540,550,560,570 after it can be found that can effectively promote organic light emission really using light-extraction layer 100
The emitting brightness of diode structure 200.At the same time, when the line width of groove 120g is 350 microns, the line-spacing of groove 120g is
150 microns can make organic LED structure 200 have best emitting brightness.
Figure 12 is painted the schematic top plan view of the light-extraction layer 101 according to another embodiment of the present invention.As depicted in Figure 12,
Diffusing structure 131 is dotted, and is evenly distributed in first substrate 110.
Figure 13 is painted the Organic Light Emitting Diode that traditionally organic LED structure is different from the present invention embodiment
Another briliancy-line-spacing figure of structure.As depicted in Figure 13, point 620 represents organic LED structure 200 in its light-extraction layer
The emitting brightness when line width of 101 groove 120g is 350 microns and line-spacing is 125 microns, point 630 represent organic light-emitting diodes
Emitting brightness of the pipe structure 200 when the line width of the groove 120g of its light-extraction layer 101 is 350 microns and line-spacing is 150 microns,
Point 640 represent organic LED structure 200 the groove 120g of its light-extraction layer 101 line width as 350 microns and line-spacing
Emitting brightness when being 175 microns, point 650 represent organic LED structure 200 its light-extraction layer 101 groove 120g
Line width be 350 microns and emitting brightness when line-spacing is 225 microns, point 660 represents organic LED structure 200 at it
The emitting brightness when line width of the groove 120g of light-extraction layer 101 is 350 microns and line-spacing is 250 microns, point 670 represent organic
Light emitting diode construction 200 is when the line width of the groove 120g of its light-extraction layer 101 is 350 microns and line-spacing is 300 microns
Emitting brightness.It can be found that the line of the groove 120g when light-extraction layer 101 after comparison point 620,630,640,650,660,670
When width is 350 microns, the line-spacing of groove 120g, which is 175 microns, can be such that organic LED structure 200 goes out with best
Brightness.
The diffusing structure 131 being set in groove 120g will can make light that light emitting structure 220 emitted when passing through
Generate scattering effect, then the direction of these light will by correcting, thus avoid these light by first substrate 140 with
When the interface of air first substrate 140 can not be projected because of total reflection.Then, organic LED structure 200 goes out
Light efficiency will effectively enhance.
Furthermore, it is understood that because first substrate 110 is in direct contact second substrate 140, and first substrate 110 and second substrate
140 material is identical, so the light that light emitting structure 220 is emitted is by between first substrate 110 and second substrate 140
Not the case where unnecessary refraction or total reflection are not will produce when interface, thus light extraction efficiency is avoided to be interfered, and then into one
The light extraction efficiency of step enhancing organic LED structure 200.
In addition, because second substrate 140 is in direct contact first substrate 110, and second substrate 140 is smooth substrate, institute
With when first electrode layer 210 is formed on second substrate 140, first electrode layer 210 is row in a smooth plane.
Thus, which the manufacturing yield of first electrode layer 210 will be promoted effectively, and then avoid generating short circuit phenomenon or resistance rising etc.
Bad phenomenon.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention, all essences in the present invention
In god and principle, any modification, equivalent substitution, improvement and etc. done should be included in the scope of protection of the invention.
Claims (10)
1. a kind of method forming light-extraction layer, which is characterized in that include：
Barrier layer is formed on the first substrate；
Multiple openings are formed in the barrier layer and the first substrate；
Scattering material is filled in the multiple opening；
The barrier layer is removed, while leaving the scattering material on the first substrate；
Planarize the first substrate and the scattering material；And
Second substrate is engaged on the first substrate.
2. the method according to claim 1 for forming light-extraction layer, which is characterized in that in the step of removing the barrier layer
In, the barrier layer is to be removed by stripping mode.
3. a kind of light-extraction layer, which is characterized in that include：
First substrate, wherein the first substrate has multiple grooves；And
Second substrate is set on the first substrate, wherein the first substrate is in direct contact the second substrate, and it is described
First substrate is identical as the material of the second substrate；And
Multiple diffusing structures are respectively arranged in the multiple groove.
4. light-extraction layer according to claim 3, which is characterized in that the depth of the multiple groove is 20 microns to 50 micro-
Rice.
5. light-extraction layer according to claim 3, which is characterized in that the line width of the multiple groove is 150 microns to 400
Micron.
6. light-extraction layer according to claim 3, which is characterized in that the line-spacing of the multiple groove is 150 microns to 350
Micron.
7. light-extraction layer according to claim 3, which is characterized in that the multiple diffusing structure is mixed for transparent organic material
Enter multiple metal oxide microparticles, wherein the size of the multiple metal oxide microparticle is 0.5 micron to 4 microns, institute
It is 5% to 10% that multiple metal oxide microparticles, which are stated, in the concentration expressed in percentage by weight of the multiple diffusing structure.
8. light-extraction layer according to claim 7, which is characterized in that the material of the multiple metal oxide microparticle is
Aluminium oxide or zirconium oxide.
9. light-extraction layer according to claim 3, which is characterized in that the material of the first substrate and the second substrate
For glass.
10. a kind of organic LED structure, which is characterized in that include：
According to the light-extraction layer described in claim 3~9 any one；
First electrode layer is set in the light-extraction layer；
Light emitting structure is set in the first electrode layer；And
The second electrode lay is set on the light emitting structure.
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| JP2015048274A (en) * | 2013-09-02 | 2015-03-16 | 日本電気硝子株式会社 | Glass substrate for organic el element |
| JP2017077684A (en) * | 2015-10-21 | 2017-04-27 | コニカミノルタ株式会社 | Gas barrier film, transparent conductive member, and organic electroluminescent element |
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| CN1578565A (en) * | 2003-07-29 | 2005-02-09 | 三星Sdi株式会社 | Substrate for optical element, organic electroluminescence element and organic electroluminescence display device |
| CN103608944A (en) * | 2011-03-29 | 2014-02-26 | 株式会社Lg化学 | Substrate for organic electrode device |
| JP2013012500A (en) * | 2012-10-15 | 2013-01-17 | Panasonic Corp | Light emitting device |
| JP2015048274A (en) * | 2013-09-02 | 2015-03-16 | 日本電気硝子株式会社 | Glass substrate for organic el element |
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Application publication date: 20181113 |