CN108790305A - A kind of grid paper and its manufacturing process - Google Patents
A kind of grid paper and its manufacturing process Download PDFInfo
- Publication number
- CN108790305A CN108790305A CN201710313631.2A CN201710313631A CN108790305A CN 108790305 A CN108790305 A CN 108790305A CN 201710313631 A CN201710313631 A CN 201710313631A CN 108790305 A CN108790305 A CN 108790305A
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- Prior art keywords
- grid
- layer
- embossed
- leaching membrane
- thickness
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000002386 leaching Methods 0.000 claims abstract description 50
- 239000012528 membrane Substances 0.000 claims abstract description 50
- 238000012545 processing Methods 0.000 claims abstract description 11
- 239000004698 Polyethylene Substances 0.000 claims description 28
- 238000002156 mixing Methods 0.000 claims description 28
- 239000002994 raw material Substances 0.000 claims description 26
- 229920001684 low density polyethylene Polymers 0.000 claims description 24
- 239000004702 low-density polyethylene Substances 0.000 claims description 24
- 229920001903 high density polyethylene Polymers 0.000 claims description 22
- 238000003475 lamination Methods 0.000 claims description 13
- 239000002826 coolant Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 230000007935 neutral effect Effects 0.000 claims description 3
- 238000004513 sizing Methods 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 2
- 239000004700 high-density polyethylene Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 2
- 230000036541 health Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 113
- 239000004743 Polypropylene Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Paper (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of grid papers, are made of original paper layer, embossed layer and leaching membrane layer, and original paper layer is between embossed layer and leaching membrane layer, and the upper surface of embossed layer is grid surface, and grid surface has several grids being intervally arranged；The thickness of embossed layer is 20-30 μm or 40-50 μm；The thickness of original paper layer is 60-100 μm or 120-150 μm；The thickness of leaching membrane layer is 15-40 μm, and the depth of grid is 15 μm -30 μm or 40-50 μm.For the present invention relative to other products, grid paper flatness is good, and chip manufacturing is generally full-automatic mechanical operation, flatness and release effect requirements to separated type material is higher, the present invention uses grid release paper, and due to the design of grid, position stationarity is good when making chip, simultaneously, when the processing procedure of downstream, manipulator is facilitated to fetch LED chip, and chip will not on the make be fallen into net slot, not siliceous, health environment-friendly simultaneously.
Description
Technical field
The present invention relates to grid paper and its preparing technical field, more particularly to a kind of making technology for LED chip is protected
The grid paper of shield, when use are that grid paper and PP (polypropylene) film combinations use.
Background technology
The manufacture craft of LED chip, process is more, and the period is long, and it is more fragile, is easy to scratch, therefore, LED chip
Protection in processing procedure is just particularly important.Protection of the LED chip in processing procedure at present mainly use common release film or from
Type paper, has the disadvantages that, first, when making, LED chip position stationarity is poor, is easy sliding, or even fall into net slot；Second is that
In downstream processing procedure in use, since the making of LED chip is generally full-automatic mechanical operation, it has not been convenient to which manipulator is positioned and fetched
LED chip；Third, the flatness of existing separated type material and release ineffective, cannot meet full-automatic mechanically operated need
It asks.
To overcome the above disadvantages, the positive research and innovation of the present inventor, to create a kind of Novel net ruled paper.
Invention content
The invention mainly solves the technical problem of providing a kind of grid papers, relative to other products, grid paper flatness
Good, chip manufacturing is generally full-automatic mechanical operation, and the flatness and release effect requirements to separated type material are higher, and the present invention adopts
With grid release paper, due to the design of grid, position stationarity is good when making chip, meanwhile, when the processing procedure of downstream, facilitate machinery
Hand fetches LED chip, and chip will not on the make be fallen into net slot, while not siliceous, health environment-friendly.
In order to solve the above technical problems, one aspect of the present invention is：A kind of grid paper is provided, by body paper
Layer, embossed layer and leaching membrane layer composition, the original paper layer is between the embossed layer and leaching membrane layer, the upper surface of the embossed layer
For grid surface, the grid surface has several grids being intervally arranged；
The thickness of the embossed layer is 20-30 μm or 40-50 μm；
The thickness of the original paper layer is 60-100 μm or 120-150 μm；
The thickness of the leaching membrane layer is 15-40 μm.
It further says, the depth of the grid is 15 μm -30 μm or 40-50 μm.
It further says, the grid surface of the embossed layer has the grid of several uniform intervals arrangement, and the grid is
Round or polygon.
It further says, the grid is parallelogram, and the spacing between the adjacent grid is 0.06-0.1mm, institute
The length for stating a pair of of linea angulata of grid is 0.3-0.8mm, and another cornerwise length of the grid is 0.3-0.8mm.
It further says, the spacing between the adjacent grid is 0.08mm, and the length of a pair of of linea angulata of the grid is
Another cornerwise length of 0.46mm, the grid are 0.68mm, and the depth of the grid is 0.03m.
It further says, the embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE
20-40% and LDPE 60-80%.
It further says, the leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE
20-40% and LDPE 60-80%.
It further says, the original paper layer is yellow neutral sizing layer.
The present invention also provides a kind of a kind of manufacturing process of grid paper, include the following steps：
It is embossed to get embossed layer, the embossed layer in a side surface lamination of the original paper layer using knurling rolls and rubber roller
230-320 DEG C of processing temperature, the coolant water temperature of the knurling rolls and rubber roller is 25-32 DEG C；
Using steel rider and rubber roller the original paper layer another side surface lamination to get leaching membrane layer, the leaching membrane layer plus
The coolant water temperature of 230-320 DEG C of work temperature, the steel rider and rubber roller is 25-32 DEG C.
The beneficial effects of the invention are as follows：The present invention includes three layers of original paper layer, embossed layer and leaching membrane layer, reasonable for structure, therefore this
Invention has at least the following advantages：
One, the present invention is for the process protection in chip manufacturing process, and when manufacture, chip is positioned over to the grid of grid paper
It is interior, then paste one layer of PP film above, i.e. chip is convenient for chip array and fixation between grid paper and PP films, and
Chip will not on the make be fallen into net slot, and chip can be more protected in processing procedure；When in downstream, processing procedure takes chip, it is only necessary to
The present invention is removed, since chip manufacturing is generally full-automatic mechanical operation, the flatness to separated type material and release effect
Fruit is more demanding because have between the adjacent mesh of grid paper it is at regular intervals, when manipulator fetches chip, convenient for positioning, side
Just, fast；
Two, the one side that the present invention is contacted with chip has several grids and grid surface is smooth, is convenient for tearing off when removing；
Three, the lamination mode that embossed layer of the invention is carried out at the same time using lamination with embossing, only need to be to the side of original paper layer
Surface lamination is primary, the technique being embossed again is squeezed out compared to single layer, this production technology is relatively simple, and low energy consumption, and process is easy to control
System, cost are relatively low；
Four, not silicate-containing oil of the invention, processing procedure and product are all environment friendly and pollution-free, no chemical residues.
Above description of the invention is only the general introduction of technical solution of the present invention, in order to better understand the skill of the present invention
Art means, and being implemented in accordance with the contents of the specification with presently preferred embodiments of the present invention and coordinate attached drawing specifically below
It is bright as after.
Description of the drawings
Fig. 1 is the sectional view of the present invention；
Fig. 2 is the overall structure diagram of the present invention；
Fig. 3 is the vertical view of the grid surface of the present invention；
Fig. 4 is the process flow chart of the present invention；
Each section label is as follows in attached drawing：
Original paper layer 100, embossed layer 200, leaching membrane layer 300, spacing d1, grid the length of a pair of of linea angulata be d2 and grid
Another cornerwise length d3.
Specific implementation mode
Illustrate that the specific implementation mode of the present invention, those skilled in the art can be by these below by way of particular specific embodiment
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also other different modes give
Implement, that is, under the scope of without departing substantially from disclosed, different modification and change can be given.
Embodiment：A kind of grid paper, as shown in Fig. 1 to Fig. 3, by 300 groups of original paper layer 100, embossed layer 200 and leaching membrane layer
At for the original paper layer 100 between the embossed layer 200 and leaching membrane layer 300, the upper surface of the embossed layer 200 is grid
Face, the grid surface have several grids being intervally arranged；
The thickness of the embossed layer 200 is 20-30 μm or 40-50 μm；
The thickness of the original paper layer 100 is 60-100 μm or 120-150 μm；
The thickness of the leaching membrane layer 300 is 15-40 μm.
It further says, the depth of the grid is 15 μm -30 μm or 40-50 μm.
The grid surface of the embossed layer 200 has the grid of several uniform intervals arrangement, and the grid is round or more
Side shape.
The grid is parallelogram, and the spacing d1 between the adjacent grid is 0.06-0.1mm, the grid
The length d2 of a pair of of linea angulata is 0.3-0.8mm, and another cornerwise length d3 of the grid is 0.3-0.8mm.
Preferably, the spacing d1 between the adjacent grid is 0.08mm, and the length d2 of a pair of of linea angulata of the grid is
Another cornerwise length of 0.46mm, the grid are 0.68mm, and the depth d3 of the grid is 0.03m.
The embossed layer 200 is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE (high-density polyethylenes
Alkene) 20-40% and LDPE (low density polyethylene (LDPE)) 60-80%.
The leaching membrane layer 300 is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE20-40% and
LDPE 60-80%.
The original paper layer 100 is yellow neutral sizing layer.
Embodiment 1 all has above-mentioned identical structure to embodiment 8, the difference is that：
Embodiment 1：The thickness of the embossed layer is 20 μm；The thickness of the original paper layer is 80 μm；The thickness of the leaching membrane layer
Degree is 15 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 20% and LDPE
80%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 20% and LDPE
80%.
Embodiment 2：The thickness of the embossed layer is 25 μm；The thickness of the original paper layer is 60 μm；The thickness of the leaching membrane layer
Degree is 20 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 30% and LDPE
70%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 30% and LDPE
70%.
Embodiment 3：The thickness of the embossed layer is 30 μm；The thickness of the original paper layer is 100 μm；The thickness of the leaching membrane layer
Degree is 25 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 40% and LDPE
60%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 40% and LDPE
60%.
Embodiment 4：The thickness of the embossed layer is 28 μm；The thickness of the original paper layer is 70 μm；The thickness of the leaching membrane layer
Degree is 22 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 25% and LDPE
75%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 25% and LDPE
75%.
Embodiment 5：The thickness of the embossed layer is 22 μm；The thickness of the original paper layer is 90 μm；The thickness of the leaching membrane layer
Degree is 18 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 35% and LDPE
65%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 35% and LDPE
65%.
Embodiment 6：The thickness of the embossed layer is 40 μm；The thickness of the original paper layer is 150 μm；The thickness of the leaching membrane layer
Degree is 15 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 22% and LDPE
78%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 22% and LDPE
78%.
Embodiment 7：The thickness of the embossed layer is 50 μm；The thickness of the original paper layer is 120 μm；The thickness of the leaching membrane layer
Degree is 40 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 28% and LDPE
72%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 28% and LDPE
72%.
Embodiment 8：The thickness of the embossed layer is 45 μm；The thickness of the original paper layer is 130 μm；The thickness of the leaching membrane layer
Degree is 30 μm.
The embossed layer is the raw material that PE batch mixing embossed layers include following weight percentage：HDPE 34% and LDPE
66%.
The leaching membrane layer is the raw material that PE batch mixing leaching membrane layers include following weight percentage：HDPE 34% and LDPE
66%.
Embodiment 1 arrives embodiment 8, the manufacturing process of a kind of grid paper, as shown in figure 4, including the following steps：
Step A：It after body paper is carried out drying and sided corona treatment, is unreeled by unreeling machine and is delivered to lamination section, carry out first
All over lamination, wherein unwinding tension is 4bar, and corona tension is 4bar, and it is 60m/min to unreel speed；
Step B：The raw materials of PE batch mixing embossed layers is sent into a laminating machine, by screw cylinder by PE batch mixing embossed layers
Raw material heats, and wherein heating process is divided into 6 sections, and the heating temperature of 6 sections is followed successively by：1 230 DEG C of area；2 280 DEG C of areas；3
300 DEG C of area；4 315 DEG C of areas；5 320 DEG C of areas；6 320 DEG C of areas；Enter die head lamination later, in the compound suppressing of knurling rolls and rubber roller
It it is all 320 DEG C in the temperature of 6 sections of the die head to get the PE batch mixings embossed layer under effect；Lamination pressure 6kg/
cm2, 30 DEG C of coolant water temperature；
Step C：The raw material of PE batch mixing leaching membrane layers is sent into another laminating machine, by screw cylinder by PE batch mixing leaching membrane layers
Raw material heating, wherein heating process is divided into 6 sections, and the heating temperature of 6 sections is followed successively by：1 230 DEG C of area；2 280 DEG C of areas；
3 300 DEG C of areas；4 315 DEG C of areas；5 320 DEG C of areas；6 320 DEG C of areas；Enter die head lamination later, makees in the compound suppressing of steel rider and rubber roller
It it is all 320 DEG C in the temperature of 6 sections of the die head to get the PE batch mixings embossed layer under；Lamination pressure 6kg/cm2,
30 DEG C of coolant water temperature；
Step D：Winding is got product, and wherein winding tension is 4bar.
The operation principle and the course of work of the present invention is as follows：
The present invention is used for the process protection in chip manufacturing process, and when manufacture, chip is positioned in the grid of grid paper,
Paste one layer of PP film above again, i.e. chip is convenient for chip array and fixation, and chip between grid paper and PP films
It will not on the make fall into net slot, chip can be more protected in processing procedure；When in downstream, processing procedure takes chip, it is only necessary to incite somebody to action this
Invention removes, and since chip manufacturing is generally full-automatic mechanical operation, flatness and release effect to separated type material are wanted
Ask higher because have between the adjacent mesh of grid paper it is at regular intervals, it is convenient, fast convenient for positioning when manipulator fetches chip
It is prompt.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields, similarly
It is included in the scope of patent protection of the present invention.
Claims (9)
1. a kind of grid paper, it is characterised in that：It is made of original paper layer, embossed layer and leaching membrane layer, the original paper layer is located at the pressure
Between lamina and leaching membrane layer, the upper surface of the embossed layer is grid surface, and the grid surface has several grids being intervally arranged；
The thickness of the embossed layer is 20-30 μm or 40-50 μm；
The thickness of the original paper layer is 60-100 μm or 120-150 μm；
The thickness of the leaching membrane layer is 15-40 μm.
2. a kind of grid paper according to claim 1, it is characterised in that：The depth of the grid is 15 μm -30 μm or 40-
50μm。
3. a kind of grid paper according to claim 1, it is characterised in that：The grid surface of the embossed layer has several uniform
The grid being intervally arranged, and the grid is round or polygon.
4. a kind of grid paper according to claim 1, it is characterised in that：The grid is parallelogram, adjacent described
Spacing between grid is 0.06-0.1mm, and the length of a pair of of linea angulata of the grid is 0.3-0.8mm, the grid it is another
Cornerwise length is 0.3-0.8mm.
5. a kind of grid paper according to claim 4, it is characterised in that：Spacing between the adjacent grid is
The length of 0.08mm, a pair of of linea angulata of the grid are 0.46mm, and another cornerwise length of the grid is 0.68mm, and
The depth of the grid is 0.03m.
6. a kind of grid paper according to claim 1, it is characterised in that：The embossed layer be PE batch mixing embossed layers include with
The raw material of lower weight percentage：HDPE 20-40% and LDPE 60-80%.
7. a kind of grid paper according to claim 1, it is characterised in that：The leaching membrane layer be PE batch mixing leaching membrane layers include with
The raw material of lower weight percentage：HDPE 20-40% and LDPE 60-80%.
8. a kind of grid paper according to claim 1, it is characterised in that：The original paper layer is yellow neutral sizing layer.
9. a kind of using a kind of manufacturing process of grid paper according to claim 1, it is characterised in that：Including walking as follows
Suddenly：
It is embossed to get embossed layer in a side surface lamination of the original paper layer using knurling rolls and rubber roller, the embossed layer adds
The coolant water temperature of 230-320 DEG C of work temperature, the knurling rolls and rubber roller is 25-32 DEG C；
Using steel rider and rubber roller the original paper layer another side surface lamination to get leaching membrane layer, the processing temperature of the leaching membrane layer
The coolant water temperature of 230-320 DEG C of degree, the steel rider and rubber roller is 25-32 DEG C.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313631.2A CN108790305A (en) | 2017-05-05 | 2017-05-05 | A kind of grid paper and its manufacturing process |
| TW107112198A TWI678291B (en) | 2017-05-05 | 2018-04-09 | A grid paper and fabrication technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710313631.2A CN108790305A (en) | 2017-05-05 | 2017-05-05 | A kind of grid paper and its manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108790305A true CN108790305A (en) | 2018-11-13 |
Family
ID=64054792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710313631.2A Pending CN108790305A (en) | 2017-05-05 | 2017-05-05 | A kind of grid paper and its manufacturing process |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108790305A (en) |
| TW (1) | TWI678291B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113550173A (en) * | 2021-07-23 | 2021-10-26 | 江苏斯迪克新材料科技股份有限公司 | Micro-grid release paper and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277793A (en) * | 2011-08-22 | 2011-12-14 | 福建师范大学 | Preparation method of release paper with #-shaped groove structure |
| CN202208868U (en) * | 2011-09-09 | 2012-05-02 | 苏州斯迪克电子胶粘材料有限公司 | Release paper |
| CN102691231A (en) * | 2012-05-10 | 2012-09-26 | 广州市鸿鹄胶粘材料科技有限公司 | Non-silicon release paper |
| CN205219969U (en) * | 2015-11-24 | 2016-05-11 | 广东弘擎电子材料科技有限公司 | Net drenches membrane paper |
| WO2016173287A1 (en) * | 2015-04-27 | 2016-11-03 | 苏州斯迪克新材料科技股份有限公司 | Process for manufacturing embossed substrate film for release film |
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| JP4870512B2 (en) * | 2006-10-11 | 2012-02-08 | リンテック株式会社 | Anti-counterfeit pressure-sensitive adhesive sheet and method for producing the same |
| CN203919913U (en) * | 2014-06-27 | 2014-11-05 | 浙江豪博鞋材有限公司 | A kind of two-sided release liners |
| CN205219961U (en) * | 2015-11-24 | 2016-05-11 | 广东弘擎电子材料科技有限公司 | Cross cutting printing is with leaving type paper |
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| CN102277793A (en) * | 2011-08-22 | 2011-12-14 | 福建师范大学 | Preparation method of release paper with #-shaped groove structure |
| CN202208868U (en) * | 2011-09-09 | 2012-05-02 | 苏州斯迪克电子胶粘材料有限公司 | Release paper |
| CN102691231A (en) * | 2012-05-10 | 2012-09-26 | 广州市鸿鹄胶粘材料科技有限公司 | Non-silicon release paper |
| WO2016173287A1 (en) * | 2015-04-27 | 2016-11-03 | 苏州斯迪克新材料科技股份有限公司 | Process for manufacturing embossed substrate film for release film |
| CN205219969U (en) * | 2015-11-24 | 2016-05-11 | 广东弘擎电子材料科技有限公司 | Net drenches membrane paper |
| CN106273956A (en) * | 2016-07-29 | 2017-01-04 | 佛山市南海区新永泰胶粘制品有限公司 | A kind of embossing release film and processing technology thereof |
| CN206690634U (en) * | 2017-05-05 | 2017-12-01 | 松本涂层科技（昆山）有限公司 | A kind of grid paper |
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| CN113550173A (en) * | 2021-07-23 | 2021-10-26 | 江苏斯迪克新材料科技股份有限公司 | Micro-grid release paper and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201843058A (en) | 2018-12-16 |
| TWI678291B (en) | 2019-12-01 |
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