CN108789993A - Die for shoe-sole with heating function - Google Patents

Die for shoe-sole with heating function Download PDF

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Publication number
CN108789993A
CN108789993A CN201710305288.7A CN201710305288A CN108789993A CN 108789993 A CN108789993 A CN 108789993A CN 201710305288 A CN201710305288 A CN 201710305288A CN 108789993 A CN108789993 A CN 108789993A
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CN
China
Prior art keywords
die
die holder
shoe
heating
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710305288.7A
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Chinese (zh)
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CN108789993B (en
Inventor
黄相宇
林士家
谢宏武
陈汝城
郭宗伟
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Pou Chen Corp
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Pou Chen Corp
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Priority to CN201710305288.7A priority Critical patent/CN108789993B/en
Publication of CN108789993A publication Critical patent/CN108789993A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34Auxiliary operations
    • B29C44/3415Heating or cooling
    • B29C44/3423Heating or cooling by using a heated or cooled preformed part, e.g. in the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34Auxiliary operations
    • B29C44/58Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/48Wearing apparel
    • B29L2031/50Footwear, e.g. shoes or parts thereof
    • B29L2031/504Soles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A kind of die for shoe-sole with heating function, including a lower die unit mounted on a lower die holder and lower heating unit, and a upper die unit mounted on a upper die holder and a upper heating unit.The lower heating unit includes a lower high frequency coil, is heated for making one within the scope of electromagnetic induction lower mode group or the lower die holder generate eddy current.Heating unit includes a upper high frequency coil on this, is heated for making upper cores within the scope of electromagnetic induction or the upper die holder generate eddy current.Whereby, reach heating purpose using high frequency, not only the rate of heat addition is fast, and the control that heating temperature can be refined, and then promotes the quality of finished product.

Description

Die for shoe-sole with heating function
Technical field
The present invention relates to a kind of molds, more particularly to a kind of die for shoe-sole with heating function.
Background technology
EVA foaming materials or TPU foaming materials have many advantages, such as good buffering, antidetonation, heat-insulated, moisture-proof, resist chemical, And it is nontoxic, do not absorb water, and meet ecological requirements, therefore, be widely used in the midsole or outsole of footwear product.
Refering to fig. 1, by taking a kind of existing molding machine 1 disclosed in the 576329th Patent Case of TaiWan, China patent as an example, Include mainly a heating mould 11 and a cooling mold 12.There are one under lower mold 111 and this for the heating mould 11 tool 111 pairing of mold and a upper mold 113 for defining a die cavity 112, and be arranged in the lower mold 111 and the upper mold Several electrothermal tubes 114 in 113.Whereby, after the electrothermal tube 114 is conductive generates heat, so that it may to conduct heat to the lower die Tool 111 and the upper mold 113 achieve the purpose that heat blank.
In general, heating and the efficiency of heating surface of the lower mold 111 and the upper mold 113, can influence homogeneous heating degree with Molding cycle, although with fastest, about 1~3 DEG C/sec that electrothermal tube 114 (Heater Heating) heats, institute The temperature not easy to control generated of electrothermal tube 114 is stated, temperature control effect is poor, and because of heat-conduction effect, and heat can diffuse to and the lower die Tool 111 or other components of the upper mold 113 contact, and influence the service life of other components.
Invention content
The purpose of the present invention is to provide a kind of rate of heat addition is fast, and the control that heating temperature can be refined, Jin Erti Rise the die for shoe-sole with heating function of final product quality.
The present invention has the die for shoe-sole of heating function, and for heating a blank material, which includes:One lower die The upper heating unit of seat, a lower die unit, a upper die holder, a upper die unit, a lower heating unit and one.
The lower die holder includes a lower mounting portion.
The lower die unit is mounted on the lower mounting portion of the lower die holder, and includes the lower mode to be formed there are one die cavity Group.
The upper die holder includes a upper mounting portion.
The upper die unit is mounted on the upper mounting portion of the upper die holder, and includes the opposite die cavity and be used for and the die cavity pairing A upper cores.
The lower heating unit includes a lower high frequency coil of the lower mounting portion mounted on the lower die holder, for making electromagnetism At least one of which in lower mode group, the lower die holder two in induction range generates eddy current and heats.
Heating unit includes a upper high frequency coil of the upper mounting portion mounted on the upper die holder on this, for making electromagnetism At least one of which in upper cores, the upper die holder two in induction range generates eddy current and heats.
The die for shoe-sole with heating function of the present invention, which is steel, and the lower heating unit further includes setting The lower mounting portion in the lower die holder and at least one shielded layer positioned at electromagnetic induction range are set, which is steel, and should Upper heating unit further includes that the upper mounting portion in the upper die holder and at least one shielded layer positioned at electromagnetic induction range is arranged.
The die for shoe-sole with heating function of the present invention, the lower die holder and the upper die holder are respectively steel, the lower mode Group and the upper cores are respectively copper material, when the upper die holder within the scope of electromagnetic induction generates eddy current with the lower die holder and are heated, The lower mode group with the upper cores as conduction of heat and heat.
The die for shoe-sole with heating function of the present invention, which further includes a lower pairing towards the upper die holder Face, and it is formed in a lower insulating layer of the lower involutory surface, which further includes a upper involutory surface towards the lower die holder, And it is formed in a upper insulating layer of involutory surface on this.
The die for shoe-sole with heating function of the present invention, the lower heating unit further include being contacted with the lower mode group and position In a lower magnetic layer within the scope of electromagnetic induction, heating unit further includes being contacted with the upper cores and being located at electromagnetic induction on this A upper magnetic layer in range, when the upper magnetic layer within the scope of aforementioned electromagnetic induction generates eddy current with lower magnetic layer and adds Heat, the lower mode group with the upper cores as conduction of heat and heat.
The die for shoe-sole with heating function of the present invention, the lower mode group and the upper cores are respectively steel, the lower die There is benevolence group a lower insulating layer for being formed in outer surface, the upper cores to have one that is formed in outer surface upper insulating layer.
The die for shoe-sole with heating function of the present invention, which is a kind of porous material, and at least One circuit, which is used to guide thermal current into and out of the lower mode group, and makes the thermal current in the circuit by porous material Hole overflow dissipate.
The die for shoe-sole with heating function of the present invention, which further includes four fixed blocks, each is fixed Block have for thermal current into and out of a runner, the lower mode group have mounted on the lower die holder lower mounting portion in and for institute State the spaced template of fixed block, and form four lower modes of the die cavity, the template have for thermal current into and out of and A duct in first circuit is formed, the lower mode is displaceably arranged around a center line in the template, each Lower mode have for thermal current into and out of a runner, and relative to two neighboring a fixed block, in a pairing position and one Displacement between a cracking position, at the pairing position, the runner of each lower mode is connect with the runner of two neighboring fixed block, Form Article 2 circuit, and reduce the bore of the die cavity, at the cracking position, the runner of each lower mode be detached from it is adjacent The runner of two fixed blocks, and expand the bore of the die cavity.
The die for shoe-sole with heating function of the present invention, which further includes several gas seal members, each is airtight The entrance of the relatively respective runner of part and outlet are arranged between the fixed block and lower mode of relative position, and there are one linkings for tool Hole, when the lower mode is located at the pairing position, each convergence hole is connected to adjacent two runners.
The die for shoe-sole with heating function of the present invention, which is a kind of porous material, and with a stream Road, the runner are used to guide thermal current into and out of the upper cores, and so that thermal current is overflow by the hole of porous material and dissipate.
The beneficial effects of the present invention are:Can expand and shrink the lower module group of the die cavity bore, the foaming is promoted Convenience when blank material is placed in or finished product takes out, and can smoothly compress the foaming blank material, and then promote final product quality and good Rate.
Description of the drawings
The other features and effect of the present invention, will clearly be presented in the embodiment with reference to schema, wherein:
Fig. 1 is a partial schematic sectional view, illustrates that one kind disclosed in No. 576329 Patent Case of TaiWan, China patent is existing Some foaming substance pressure controlling forming devices;
Fig. 2 is a sectional view, illustrates that the present invention has a first embodiment of die for shoe-sole for heating function;
Fig. 3 is an incomplete schematic top plan view, illustrates that a lower mode group in the first embodiment is located at one Pairing position;
Fig. 4 is the sectional view intercepted along the line IV-IV in Fig. 2;;
Fig. 5 is the sectional view intercepted along the line V-V in Fig. 2;
Fig. 6 is a sectional view, illustrates that mode group is located at a cracking position under each in the first embodiment;
Fig. 7 is an incomplete schematic top plan view, illustrates that lower module group described in the first embodiment expands a mould The bore in cave for a foaming blank merging or takes out the die cavity;And
Fig. 8 is a sectional view, illustrates that the present invention has a second embodiment of die for shoe-sole for heating function.
Specific implementation mode
Before the present invention is described in detail, it shall be noted that in the following description content, similar element is with identical Number indicate.
Refering to Fig. 2, Fig. 3, the present invention has one embodiment of the die for shoe-sole of heating function, for heating, compressing one A foaming blank material 3 forms a finished product (foaming material).The die for shoe-sole includes a lower die unit 5, one of lower die holder 4, one The lower heating unit 8 of upper die unit 7, one of upper die holder 6, one and a upper heating unit 9.
The lower die holder 4 is steel, and includes a lower involutory surface 41, is formed in a lower insulating layer of the lower involutory surface 41 42, and a lower mounting portion 43 being recessed along a direction center line L by the lower involutory surface 41.
The lower die unit 5 is mounted on the lower mounting portion 43 of the lower die holder 4, and includes 51, four fixations of a lower mode group Block 52 and several gas seal members 53 (see Fig. 4).The lower mode group 51 is a kind of porosity copper product, is printd with powder metallurgy or 3D Mode manufactures, and with a template 511 being fixedly provided in the lower mounting portion 43 of the lower die holder 4, and around the center Line L is displaceably arranged in the template 511 and defines with the template 511 four lower modes 513 of a die cavity 512.The mould Plate 511 have for thermal current into and out of and formed first circuit a duct 5111.Each lower mode 513 has heat supply Air-flow into and out of a runner 5131.The fixed block 52 is fixedly provided in the template 511 and spaced.Each is solid Determine block 52 have for thermal current into and out of a runner 521 (see Fig. 4).In the present embodiment, each gas seal member 53 is relatively right The entrance for the runner 5131 answered is arranged with outlet in corresponding lower mode 513, and positioned at the fixed block 52 and lower die of relative position Between benevolence 513, and there are one convergence holes 531 for tool.
Refering to Fig. 4, it is worth noting that, each lower mode 513 is relative to two neighboring fixed block 52 in a pairing Displacement between position (such as Fig. 3, Fig. 4) and cracking position (such as Fig. 6, Fig. 7), at the pairing position, each lower mode 513 Runner 5131 connect by the convergence hole 531 of the gas seal member 53 with the runner 521 of two neighboring fixed block 52, formed second Circuit makes thermal current be overflow by the hole of porosity copper product and dissipates, and reduces the bore of the die cavity 512, at the cracking position, The runner 5131 of each lower mode 513 is detached from the runner 521 with two neighboring fixed block 52, and expands the mouth of the die cavity 512 Diameter.
The upper die holder 6 is steel, and includes a upper involutory surface 61, is formed in a upper insulating layer of involutory surface 61 on this 62, and a upper mounting portion 63 being recessed along the directions center line L by involutory surface on this 61.
The upper die unit 7 is mounted on the upper mounting portion 63 of the upper die holder 6, and includes the opposite die cavity 512 and be used for and this One upper cores 71 of 512 pairing of die cavity.
The upper cores 71 are a kind of porosity copper products, are manufactured in such a way that powder metallurgy or 3D are printd, and with a stream Road 711.The runner 711 is used to guide thermal current into and out of the upper cores 71, and thermal current is made to be overflow by the hole of porosity copper product It dissipates.
The lower heating unit 8 include mounted on the lower die holder 4 mounting portion 43 a lower high frequency coil 81, setting exist The lower mounting portion 43 of the lower die holder 4 and a shielded layer 82 within the scope of the electromagnetic induction of the lower high frequency coil 81, and The lower magnetic layer 83 for contacting and being located within the scope of the electromagnetic induction of the lower high frequency coil 81 with the lower mode group 51.
Heating unit 9 includes a upper high frequency coil 91 being mounted in the upper mounting portion 63 of the upper die holder 6, sets on this Set the upper mounting portion 63 in the upper die holder 6 and a shielded layer within the scope of the electromagnetic induction of high frequency coil 91 on this 92, and contacted with the upper cores 71 and be located at magnetic layer 93 one on this within the scope of electromagnetic induction of high frequency coil 91 upper.
Refering to Fig. 2, Fig. 3, when the upper die holder 6, the upper die unit 7 and the lower die holder 3,4 pairing of lower die unit, each Lower mode 513 can be moved to the pairing position relative to two neighboring fixed block 52, at this point, the runner of each lower mode 513 5131 can be connect with the runner 521 of two neighboring fixed block 52 by the convergence hole 531 of the gas seal member 53, and reduce the die cavity 512 bore, and compress the foaming blank material 3 in the die cavity 512.
Refering to Fig. 2, Fig. 4 and Fig. 5, whereby, when 91 conducting electric current of high frequency coil on the lower high frequency coil 81 and this Afterwards, the lower magnetic layer 83 of this within the scope of electromagnetic induction can generate eddy current respectively with magnetic layer on this 93 and heat rapidly, and should Lower mode group 51 with the upper cores 71 as conduction of heat and heat.Meanwhile thermal current can be respectively by the upper cores 71 Runner 711 into and out of the upper cores 71, by the duct 5111 of the template 511 into and out of the template 511, and by the lower mode 513 runner 5131 and the runner 521 of the fixed block 52 are into and out of the lower mode 513 and the fixed block 52, and due to more Porous material has concrete dynamic modulus, and therefore, thermal current can be further by the upper cores 71, the template 511, the lower mode 513 Hole overflow and dissipate, keep the upper cores 71 contact with the foaming blank material 3, template 511, lower mode 513 rapid and uniformly heat up, reach To the purpose of heating.
It is worth noting that (figure is not for the valve of the controllable outlet size of outlet setting of aforementioned runner 5131,5111,711 Show), whereby, it need to only control the size of the outlet of the valve, so that it may to control thermal current in the lower mode 513, the template 511 With the scattered flow that overflows in the upper cores 71, and then heating rate is controlled.
Although in addition, the lower die holder 4 and the upper die holder 6 be can with the steel of magnetic conduction, in the shielded layer 82, the screen Under the shielding action for covering layer 92, the lower die holder 4, the upper die holder 6 is set not to will produce eddy current, or reduce and control generation eddy current Region.
And the upper insulating layer of the lower insulating layer 42 of the lower involutory surface 41 of the lower die holder 4 and the upper involutory surface 61 of the upper die holder 6 62, it not exclusively can will not generate electrical arcing at 61 pairing of involutory surface on the lower involutory surface 41 and this because of contact, keep away Exempt from the lower die holder 4 to damage with the upper die holder 6.
Refering to Fig. 6, Fig. 7, when the upper die holder 6, the upper die unit 7 are far from the lower die holder 4, the lower die unit 5, under each Mode 513 can be moved to the cracking position relative to two neighboring fixed block 52, at this point, the runner of each lower mode 513 5131 can be detached from the runner of two neighboring fixed block 52 521, and expand the bore of the die cavity 512, for the foaming blank material 3 with Automation equipment (not shown) is taken out by the die cavity 512 easily, or is placed in the die cavity 512.
A second embodiment of the invention refering to Fig. 8, it is roughly the same with the first embodiment, difference be in:
The lower magnetic layer 83 and upper magnetic layer 93 such as Fig. 2 is omitted.
The lower mode group 51 is a kind of porosity Steel material, is equally manufactured in such a way that powder metallurgy or 3D are printd.And it is each A lower mode 513 also has a lower insulating layer 5132 for being formed in top surface.
The upper cores 71 are a kind of porosity Steel materials, are equally manufactured in such a way that powder metallurgy or 3D are printd, and also have shape At a upper insulating layer 712 in top surface.
Whereby, due to Steel material also can magnetic conduction, when the lower high frequency coil 81 and this on high frequency coil 91 be connected After electric current, the lower mode group 51 within the scope of electromagnetic induction can generate eddy current respectively with the upper cores 71 and heat rapidly, into And reach heating purpose.
Likewise, the upper insulating layer 712 of the lower insulating layer 5132 of the lower mode 513 and the upper cores 71, it can be right When conjunction, electrical arcing not exclusively will not be generated because of contact, the lower die holder 4 is avoided to be damaged with the upper die holder 6.
Via above explanation, the advantages of previous embodiment, can be summarized as follows:
1, the present invention reaches heating purpose using high frequency, and not only the rate of heat addition is fast, and heating temperature or heating region energy The control being enough refined, and then promote the quality of finished product.
Furthermore 2, the present invention has mushy characteristic using porous material, and thermal current can be made in the lower mode group 51 and the upper cores 71 hole between overflow dissipate, further speed up heating rate and heating when uniformity, be not only able to substantially contract Short processing time promotes economic benefit, and can further promote the quality of finished product, and also has practicability.
As described above, only the embodiment of the present invention is when cannot be limited the scope of implementation of the present invention with this, i.e., all According to simple equivalent changes and modifications made by claims of the present invention and description, all still belong to the scope of the present invention.

Claims (10)

1. a kind of die for shoe-sole with heating function, for heating a blank material, which includes:
One lower die holder, including a lower mounting portion;
One lower die unit, is mounted on the lower mounting portion of the lower die holder, and includes the lower mode group to be formed there are one die cavity;
One upper die holder, including a upper mounting portion;
One upper die unit, is mounted on the upper mounting portion of the upper die holder, and includes the opposite die cavity and be used for and the die cavity pairing A upper cores;
It is characterized in that:The die for shoe-sole also includes:
One lower heating unit includes a lower high frequency coil of the lower mounting portion mounted on the lower die holder, for making electromagnetism At least one of which in lower mode group, the lower die holder two in induction range generates eddy current and heats;And
One upper heating unit includes a upper high frequency coil of the upper mounting portion mounted on the upper die holder, for making electromagnetism At least one of which in upper cores, the upper die holder two in induction range generates eddy current and heats.
2. the die for shoe-sole according to claim 1 with heating function, it is characterised in that:The lower die holder is steel, and The lower heating unit further includes that the lower mounting portion in the lower die holder and at least one shielded layer positioned at electromagnetic induction range is arranged, The upper die holder is steel, and heating unit further includes the upper mounting portion being arranged in the upper die holder and is located at electromagnetic induction range on this At least one shielded layer.
3. the die for shoe-sole according to claim 1 with heating function, it is characterised in that:The lower die holder and the upper die holder Respectively steel, the lower mode group and the upper cores are respectively copper material, when upper die holder and the lower die within the scope of electromagnetic induction Seat generate eddy current and heat, the lower mode group with the upper cores as conduction of heat and heat.
4. the die for shoe-sole according to claim 2 or 3 with heating function, it is characterised in that:The lower die holder further includes A lower involutory surface towards the upper die holder, and it is formed in a lower insulating layer of the lower involutory surface, which further includes face To a upper involutory surface of the lower die holder, and it is formed in a upper insulating layer of involutory surface on this.
5. the die for shoe-sole according to claim 3 with heating function, it is characterised in that:The lower heating unit further includes The lower magnetic layer for contacting and being located within the scope of electromagnetic induction with the lower mode group, heating unit further includes and the upper mold on this Benevolence contacts and one within the scope of electromagnetic induction upper magnetic layer, when the upper magnetic layer within the scope of aforementioned electromagnetic induction is led under Magnetosphere generate eddy current and heat, the lower mode group with the upper cores as conduction of heat and heat.
6. the die for shoe-sole according to claim 1 with heating function, it is characterised in that:The lower mode group and the upper mold Benevolence is respectively steel, which has a lower insulating layer for being formed in outer surface, which, which has, is formed in appearance The upper insulating layer of one of face.
7. the die for shoe-sole according to claim 1 with heating function, it is characterised in that:The lower mode group is that one kind is more Porous material, and there is at least one circuit, which is used to guide thermal current into and out of the lower mode group, and makes in the circuit Thermal current by porous material hole overflow dissipate.
8. the die for shoe-sole according to claim 7 with heating function, it is characterised in that:The lower die unit further includes four A fixed block, each fixed block have for thermal current into and out of a runner, the lower mode group have be mounted on the lower die holder Lower mounting portion in and supply the spaced template of the fixed block, and form four lower modes of the die cavity, the template With for thermal current into and out of and formed first circuit a duct, the lower mode around a center line displaceably Setting in the template, each lower mode have for thermal current into and out of a runner, and relative to two neighboring fixed block, The displacement between a pairing position and a cracking position, at the pairing position, the runner and adjacent two of each lower mode The runner of a fixed block connects, and forms Article 2 circuit, and reduce the bore of the die cavity, at the cracking position, under each The runner of mode is detached from the runner with two neighboring fixed block, and expands the bore of the die cavity.
9. the die for shoe-sole according to claim 8 with heating function, it is characterised in that:The lower die unit further includes number Fixed block and lower mode in relative position is arranged in a gas seal member, entrance and the outlet of the relatively corresponding runner of each gas seal member Between, and there are one convergence holes for tool, and when the lower mode is located at the pairing position, adjacent two stream of each convergence hole connection Road.
10. the die for shoe-sole according to claim 1 with heating function, it is characterised in that:The upper cores are that one kind is more Porous material, and there is a runner, which is used to guide thermal current into and out of the upper cores, and makes thermal current by porosity The hole of material, which overflows, to be dissipated.
CN201710305288.7A 2017-05-03 2017-05-03 Sole mould with heating function Active CN108789993B (en)

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Application Number Priority Date Filing Date Title
CN201710305288.7A CN108789993B (en) 2017-05-03 2017-05-03 Sole mould with heating function

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CN108789993B CN108789993B (en) 2020-08-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113043522A (en) * 2019-12-26 2021-06-29 复盛应用科技股份有限公司 Thermoplastic material forming method and forming die

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394603A (en) * 1990-06-20 1995-03-07 Tetra Laval Holdings & Finance S.A. Method for heating and molding platelike parts
CN205835798U (en) * 2016-06-29 2016-12-28 常州松林橡塑有限公司 A kind of sponge secondary high density foaming and forming apparatus
CN106393549A (en) * 2016-09-20 2017-02-15 东莞市乔迪麦机械科技有限公司 Small-foam insole molding combination type die and insole molding machine applying the same
CN206106200U (en) * 2016-10-08 2017-04-19 黄遵建 Compression molding mould based on electromagnetic induction heating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394603A (en) * 1990-06-20 1995-03-07 Tetra Laval Holdings & Finance S.A. Method for heating and molding platelike parts
CN205835798U (en) * 2016-06-29 2016-12-28 常州松林橡塑有限公司 A kind of sponge secondary high density foaming and forming apparatus
CN106393549A (en) * 2016-09-20 2017-02-15 东莞市乔迪麦机械科技有限公司 Small-foam insole molding combination type die and insole molding machine applying the same
CN206106200U (en) * 2016-10-08 2017-04-19 黄遵建 Compression molding mould based on electromagnetic induction heating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113043522A (en) * 2019-12-26 2021-06-29 复盛应用科技股份有限公司 Thermoplastic material forming method and forming die

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