CN108783746A - A kind of support chip, sole and shoes for sole - Google Patents
A kind of support chip, sole and shoes for sole Download PDFInfo
- Publication number
- CN108783746A CN108783746A CN201810744750.8A CN201810744750A CN108783746A CN 108783746 A CN108783746 A CN 108783746A CN 201810744750 A CN201810744750 A CN 201810744750A CN 108783746 A CN108783746 A CN 108783746A
- Authority
- CN
- China
- Prior art keywords
- support chip
- sole
- midsole
- ontology
- extension item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
- A43B13/18—Resilient soles
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B13/00—Soles; Sole-and-heel integral units
- A43B13/14—Soles; Sole-and-heel integral units characterised by the constructive form
- A43B13/18—Resilient soles
- A43B13/181—Resiliency achieved by the structure of the sole
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- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Abstract
The present invention discloses a kind of support chip, sole and shoes for sole.The support chip for sole includes support chip ontology and at least one extension item for being extended to form from the support chip ontology；The support chip ontology and the extension item are set to sole, and the extension item extends along sole length direction.The present invention also provides the shoes of a kind of sole using the support chip and the use sole.
Description
Technical field
The invention belongs to shoes technical fields, are specifically related to a kind of support chip, sole and shoes for sole.
Background technology
In order to enhance the high rebound cushion performance of sole, the material that density is low, resilience performance is high is used in industry.Certain
Reach the high rebound cushion performance of sole in degree, but influences the effect of the supporting & stablizing of sole, anti-torsion.
To solve the above problems, industry specialists use the technical method of TPU waist panel, that is, one is arranged at the middle waist of sole
A TPU waist panel plays the supporting & stablizing of sole, antitorque rotating function.The support that the way solves sole to a certain extent is steady
Calmly, the problem of anti-torsion, but TPU hard materials cannot achieve transition submissive between spring heel, half sole.
Invention content
It is an object of the invention to solve the problems of the prior art, provide it is a kind of for the support chip of sole, sole and
Shoes.
To reach above-mentioned purpose, the present invention adopts the following technical scheme that, a kind of support chip for sole includes support chip
Ontology and at least one extension item extended to form from the support chip ontology；The support chip ontology and the extension item are equal
Set on sole, the extension item extends along sole length direction.
Preferably, the support chip ontology extends to sole abutment wall, forms the first retaining wall.
Preferably, the extension item of the support chip extends to sole abutment wall, forms the second retaining wall.
Preferably, the extension body is equipped with groove structure, and the groove structure extends to the support chip ontology, makes
The groove of corresponding position links into an integrated entity before and after the support chip.
A kind of sole includes any support chip as above.
Preferably, the sole further includes midsole and outsole, and the support chip is set among said midsole and the outsole,
The support chip ontology be formed with forward position while and/or after along while, the front is described along towards the preceding metacarpus direction of the sole
Back edge towards the rear heel direction of the sole, it is described extend item be distributed in the support chip ontology forward position side and/or after
Along side.
Preferably, said midsole lower surface corresponds to the sunk structure that the position of the support chip is equipped with；Said midsole following table
Face corresponds to each position for extending item and is equipped with locating slot, and the extension item is set in the locating slot to realize that installation is fixed
Position.
Preferably, the sole further includes midsole and outsole, and the support chip is set to said midsole upper surface and shoe last surface
Between, the support chip ontology be formed with forward position while and/or after along while, the front is along towards the preceding metacarpus side of the sole
To the back edge is distributed in the forward position side of the support chip ontology towards the rear heel direction of the sole, the extension item
Along side after and/or.
Preferably, said midsole upper surface corresponds to the support chip position and is equipped with sunk structure, and the support chip is across institute
Sunk structure is stated to form hollow out shock-damping structure；Said midsole and the support chip ontology are clamped positioning step by locating flange
Realize inlay card positioning between the two.
A kind of shoes include any sole as above.A kind of shoes include sole as described above.
Compared to the prior art, technical solution provided by the invention has the advantages that：
1, in support chip, the support chip ontology and the extension item are set to sole, and the extension item is along sole
Length direction extends, so as to realize transmission and the flexible bending transition of power by the extension item；
2, the support chip ontology generally laminated structure, then the laminated structure of the support chip ontology make the support
Piece ontology can dissipation of ferees, with adapt to varying strength distribution stamping press, to play the work of force balance, bumper and absorbing shock
With；
3, the strip structure for extending item can not only provide submissive flexural deformation, can also provide power and transmit work(
Can, to not only ensure sole submissive bending property, the stress of sole can also be disperseed, further realize force balance,
The effect of bumper and absorbing shock；
4, the support chip ontology extends to sole abutment wall, forms the first retaining wall, and first retaining wall is set to described first
The outside on support edge edge is used to support first support edge edge, and first retaining wall and first support edge are along phase interworking
It shares and is supported in the ankle part to foot, to reduce the possibility of ankle part strain；
5, the extension item of the support chip extends to sole abutment wall, forms the second retaining wall, and second retaining wall is from described
The arch portion at bottom extends to the rear heel of said midsole, and set on the outside on second support edge edge, is used to support described the
Two support edges edge, second retaining wall and second support edge are supported the rear heel of foot along cooperating, to improve
The comfort of rear heel and dress are experienced；
6, first retaining wall and second retaining wall mutual cooperation can not only realize support function, but also can increase
Add the contact area of support chip and said midsole, to further enhance the power dispersion effect of sole；
7, the top surface of the rear heel has been recessed at least one groove, and the support chip ontology is across at least one institute
Groove is stated, and set on the top surface of the rear heel so that after heel forms two damping cavitys in the rear, and then raising is described
The damping performance of heel.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and constitutes the part of the present invention, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the structural schematic diagram for the sole that the embodiment of the present invention one provides；
Fig. 2 is the structural schematic diagram of the support chip of sole shown in Fig. 1；
Fig. 3 is the structural schematic diagram of the midsole of sole shown in Fig. 1；
Fig. 4 is the structural schematic diagram of sole provided by Embodiment 2 of the present invention；
Fig. 5 is the structural schematic diagram of the midsole of sole shown in Fig. 4；
Fig. 6 is the structural schematic diagram of support chip in sole shown in Fig. 4；
Fig. 7 is the structural schematic diagram for the sole that the embodiment of the present invention three provides.
Specific implementation mode
In order to keep technical problems, technical solutions and advantages to be solved clearer, clear, tie below
Drawings and examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
In claims of the present invention, specification and above-mentioned attached drawing, unless otherwise specifically limited, such as using term " the
One ", " second " or " third " etc. are provided to distinguish different objects, rather than for describing particular order.
In claims of the present invention, specification and above-mentioned attached drawing, unless otherwise specifically limited, for the noun of locality, such as
Using term "center", " transverse direction ", " longitudinal direction ", "horizontal", " vertical ", "top", "bottom", "inner", "outside", "upper", "lower",
The indicating positions such as "front", "rear", "left", "right", " clockwise ", " counterclockwise " or position relationship are orientation based on ... shown in the drawings
And position relationship, and be merely for convenience of the narration present invention and simplify description, do not indicate or imply the indicated device or member
Part must have a particular orientation or with specific azimuth configuration and operation, so the specific of the limitation present invention can not be interpreted as
Protection domain.
In claims of the present invention, specification and above-mentioned attached drawing, unless otherwise specifically limited, such as using term " Gu
Connect " or " being fixedly connected ", it should broadly understood, i.e., between the two without any connection side of displacement relation and relative rotation relationship
Formula, that is to say, that including be unremovably fixedly connected with, be removably secured connection, be linked together and by other devices or
Element is fixedly connected.
In claims of the present invention, specification and above-mentioned attached drawing, such as using term " comprising ", " having " and they
Deformation, it is intended that " including but not limited to ".
Embodiment one
Please refer to Fig.1-3, a kind of sole includes midsole 110, outsole 120 and between midsole 110 and outsole 120
Support chip 130.
Wherein, said midsole 110, which corresponds to upwardly extend at ankle, is formed with the first support edge along 111, and said midsole 110
It upwardly extends at corresponding followed by place and is formed with the second support edge along 112.It should be appreciated that first support edge along 111 for pair
The ankle part of foot is supported, to reduce the possibility of ankle part strain；Second support edge along 112 pairs of feet followed by carry out
Support is experienced with the comfort and dress that improve heel.
The support chip 130 include support chip ontology 131 and extended to form from the support chip ontology 131 at least one
A extension item 132, the first retaining wall 133 and the second retaining wall 134.
Wherein, the support chip ontology 131 be formed with forward position while and/or after along while, the front is along towards the sole
114 direction of preceding metacarpus, the back edge is towards 115 direction of rear heel of the sole.The extension item 132 can be distributed in
The forward position of the support chip ontology 131 while or after along while, can also the forward position of the support chip ontology 131 while and after along while it is equal
It is distributed, the present invention does not limit this.
That is, the extension item 132 of the support chip 130 can extend outwardly from the forward position side of the support chip ontology 131, shape
It can also be from the rear along side of the support chip ontology 131 at the extension item 132 of preceding claw-like structures 101 or the support chip 130
Extend outwardly, the extension item 132 of claw-like structures 102 or the support chip 130 is respectively from the support chip ontology after formation
131 forward position side and back edge extend outwardly, to be respectively formed preceding claw-like structures 101 and rear claw-like structures 102, the present invention couple
This is not limited.
Specifically, the support chip ontology 131 is set to the bottom surface of said midsole 110.Moreover, the support chip ontology 131
Generally laminated structure.Moreover, the shape of the support chip ontology 131 is adapted with the bottom shape of said midsole 110.It is described
The laminated structure of support chip ontology 131 enables 131 dissipation of ferees of support chip ontology, to adapt to varying strength distribution
Stamping press, to play the role of force balance, bumper and absorbing shock.In the present embodiment, said midsole 110 corresponds to the support
The position of piece ontology 131 is equipped with the first locating slot 1101, and the support chip ontology 131 is embedded in first locating slot 1101
To realize positioning.
Moreover, the extension item 132 extends along sole length direction.In the present embodiment, said midsole 110 corresponds to each
The position for extending item 132 is equipped with the second locating slot 1102, the extensions item 132 be set to second locating slot 1102 it is interior with
Realize installation positioning.
Moreover, first locating slot 1101 and second locating slot 1102 cooperate and constitute sunk structure, to
Realize the positioning to the support chip 130.
It should be appreciated that the strip structure for extending item 132 can not only provide submissive flexural deformation, can also provide
Power transfer function can also disperse the stress of sole to not only ensure the submissive bending property of sole, further realize flat
The effect for the stress, bumper and absorbing shock of weighing.
It should be noted that the support chip ontology 131 can be set to the arch portion 113 of said midsole 110, preceding metacarpus
The suitable position such as 114 or rear heel 115, the present invention do not limit this.
For example, the support chip ontology 131 is set to the arch portion 113 of said midsole 110, and the portion of the support chip 130
The preceding metacarpus 114 for dividing the arch portion 113 for extending item 132 from said midsole 110 towards said midsole 110 extends, claw-like before being formed
Structure 101；Other of the support chip 130 extend items 132 from the arch portion 113 of said midsole 110 towards said midsole 110
Rear heel 115 extends, claw-like structures 102 after formation；
In another example the support chip ontology 131 is set to the arch portion 113 of said midsole 110, the portion of the support chip 130
The preceding metacarpus 114 for dividing the arch portion 113 for extending item 132 from said midsole 110 towards said midsole 110 extends, claw-like before being formed
Structure 101；Alternatively, other of the support chip 130 extend items 132 from the arch portion 113 of said midsole 110 towards said midsole
110 rear heel 115 extends, claw-like structures 102 after formation；
In another example the support chip ontology 131 be set to said midsole 110 preceding metacarpus 114, the support chip 130 its
He extends item 132 and extends from the rear heel 115 of preceding metacarpus 114 towards the said midsole 110 of said midsole 110, claw-like after formation
Structure 102；
In another example the support chip ontology 131 be set to said midsole 110 arch portion 113, the support chip 130 its
He extends item 132 and extends from the preceding metacarpus 114 of arch portion 113 towards the said midsole 110 of said midsole 110, claw-like before being formed
Structure 101.
Moreover, the extension item 132 is equipped with groove structure 1321, the groove structure 1321 extends to the support chip
Ontology 131 makes the groove of corresponding position before and after the support chip 130 link into an integrated entity.
The support chip ontology 131 and the operation principle for extending item 132 are as follows：
During the motion, if sole followed by first land, 115 stress of rear heel of sole bending, and band
Move 132 flexural deformation of extension item of the rear claw-like structures 102 of the support chip 130；Extension item after described in claw-like structures 102
132 power that can be subject to are transferred to the support chip ontology 131, and the support chip ontology 131 can also pass power
It is handed to the extension item 132 of the preceding claw-like structures 101, and passes power eventually by the extension item 132 of the preceding claw-like structures 101
It is handed to the preceding metacarpus 114 of the sole；As a result, the support chip 130 can by the sole followed by stress be transferred directly to
The preceding metacarpus 114 of sole, to realize the effect of sole force balance, bumper and absorbing shock；
During the motion, if the half sole of sole first lands, the power transfer principle of the support chip 130 is similar, herein
It does not repeat.
It should be noted that if the support chip 130 is simply formed with preceding claw-like structures 101 or rear claw-like structures 102,
The power conduction principle of the support chip 130 is similar with above-mentioned principle, and main difference is：Support chip ontology 131 and extension item 132
Between power conduction be：
If the support chip 130 is formed with preceding claw-like structures 101, the stress of the support chip ontology 131 conduct to
The extension item 132 of the preceding claw-like structures 101；
If the support chip 130 is formed with rear claw-like structures 102, the extension item 132 of the rear claw-like structures 102
Stress is conducted to the support chip ontology 131.
In addition, the support chip ontology 131 on the outside of the sole extends to sole abutment wall, first retaining wall 133 is formed.Tool
Body, first retaining wall 133 is set to first support edge along 111 outside, is used to support first support edge edge
111.Extension item 132 of the support chip 130 on the outside of sole extends to sole abutment wall, forms the second retaining wall 134.Specifically,
Second retaining wall 134 extends to the rear heel 115 of said midsole 110 from the arch portion 113 of said midsole 110, and is set to institute
The second support edge is stated along 112 outside, is used to support second support edge along 112.
First retaining wall 133 and second retaining wall 134 mutual cooperation can not only realize support function, but also can
To increase the contact area of support chip 130 and said midsole 110, to further enhance the power dispersion effect of sole.
It should be appreciated that first retaining wall 133 and second retaining wall 134 are not support provided in an embodiment of the present invention
Structure necessary to piece 130, in some other embodiment, the support chip 130 can be provided only with first retaining wall 133 or
Second retaining wall 134 or the support chip 130 do not set first retaining wall 133 and second retaining wall 134, the present invention
This is not limited.
Embodiment two
Please refer to Fig. 4-6, a kind of sole includes midsole 210, outsole 220 and support chip 230, wherein the support chip 230
Between 210 upper surface of said midsole and shoe last surface.
Specifically, the support chip 230 includes support chip ontology 231 and is extended to form from the support chip ontology 231
At least one extension item 232.
Wherein, the support chip ontology 231 be formed with forward position while and/or after along while, the forward position while and it is described after along while
The preceding metacarpus 212 and rear heel 211 for being respectively facing the sole are arranged.The extension item 232 can be distributed in the support chip
The forward position of ontology 231 while or after along while, can also the forward position of the support chip ontology 231 while and after along while be distributed, this
Invention does not limit this.
That is, the extension item 232 of the support chip 230 can extend outwardly from the forward position side of the support chip ontology 231, shape
At the extension item 232 of preceding claw-like structures or the support chip 230 can also from the support chip ontology 231 it is rear along side to
Outer extension, the extension item 232 of claw-like structures or the support chip 230 is respectively before the support chip ontology 231 after formation
Extend outwardly along side and back edge, to be respectively formed preceding claw-like structures and rear claw-like structures, the present invention does not limit this.
It should be noted that the support chip ontology 231 can be set to the arch portion 213 of said midsole 210, preceding metacarpus
The suitable position such as 212 or rear heel 211, the present invention do not limit this.
Next the present embodiment is carried out so that the support chip ontology 231 is set to the rear heel 211 of said midsole 210 as an example
Explanation.
The support chip ontology 231 is set to the rear heel 211 of said midsole 210, and the extension item 232 is from said midsole
The preceding metacarpus 212 of 210 rear heel 211 towards said midsole 210 extends, claw-like structures before being formed.
The rear heel 211 and the support chip ontology 231 are clamped positioning step 201 by locating flange 202 and realize two
Inlay card positioning between person.In the present embodiment, the rear heel 211 is formed with positioning step 201, the support chip ontology
231 positions for corresponding to the positioning step 201 are formed with locating flange 202, and 202 inlay card of the locating flange is in the positioning table
Rank 201 is to realize that the inlay card between the rear heel 211 and the support chip ontology 231 positions.Certainly, it is not limited to this implementation
Example, in other alternate embodiments, the rear heel 211 can also be formed with locating flange, and the support chip ontology 231 can
It is formed with positioning step with the position of the correspondence locating flange.
Moreover, said midsole 210, which corresponds to each position for extending item 232, is formed with locating slot 203, the extension item
232 are embedded in the locating slot 203 to realize installation positioning.
It should be noted that the power conduction principle of the support chip 230 and the power of the support chip 130 in embodiment one are conducted
Principle is similar, and this will not be repeated here.
In addition, the top surface of the rear heel 211 has been recessed at least one groove 204, at least one groove 204
Constitute the sunk structure 205 of 210 upper surface of said midsole.The support chip ontology 231 across and be set to the sunk structure
205。
For example, as shown in figure 5, the top surface of the rear heel 211 is recessed, there are two spaced groove 204, institutes
Support chip ontology 231 is stated across two grooves 204 so that it includes two damping cavitys that heel 211, which is formed, in the rear
Hollow out damping, and then improve the damping performance of the rear heel 211.
It should be noted that in some other embodiment, before the support chip ontology 231 is set to said midsole 210
When metacarpus 212 or rear heel 211, said midsole 210 corresponds to 230 position of the support chip and is equipped with the sunk structure 205, institute
Support chip 230 is stated across the sunk structure 205 to form hollow out shock-damping structure.
Embodiment three
As shown in fig. 7, the sole of the offer of embodiment three and the sole that embodiment two provides are essentially identical, main difference exists
In：The sole includes projecting sole body 310, and the support chip 320 is directly arranged in the heel for projecting sole body 310
The top surface in portion 311.
In addition, the top surface of the rear heel 311 has been recessed at least one groove 304, at least one groove 304
Constitute the sunk structure 305 of 310 upper surface of said midsole.The support chip ontology 321 across and be set to the sunk structure
305。
For example, the top surface of the rear heel 311 is recessed, there are two spaced groove 304, the support chip sheets
Body 321 is across two grooves 304 so that heel 311 forms two damping cavitys in the rear, and then improves the heel
The damping performance in portion 311.
The embodiment of the present invention also provides a kind of shoes, and the shoes are used such as embodiment one or embodiment two or embodiment three
The sole of offer.
The preferred embodiment of the present invention has shown and described in above description, as previously described, it should be understood that the present invention is not office
Be limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for various other combinations, modification and
Environment, and can be changed by the above teachings or related fields of technology or knowledge in the scope of the invention is set forth herein
It is dynamic.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be appended by the present invention
In scope of the claims.
Claims (10)
1. a kind of support chip for sole, which is characterized in that extend shape including support chip ontology and from the support chip ontology
At at least one extension item；
The support chip ontology and the extension item are set to sole, and the extension item extends along sole length direction.
2. a kind of support chip as described in claim 1, it is characterised in that：The support chip ontology extends to sole abutment wall, shape
At the first retaining wall.
3. a kind of support chip as described in claim 1, it is characterised in that：The extension item of the support chip extends to fudger
Wall forms the second retaining wall.
4. a kind of support chip as described in claim 1, it is characterised in that：The extension item is equipped with groove structure, described recessed
Slot structure extends to the support chip ontology, and the groove of corresponding position before and after the support chip is made to link into an integrated entity.
5. a kind of sole, it is characterised in that：It include the support chip as described in claim 1-4 is any.
6. a kind of sole as claimed in claim 5, it is characterised in that：Institute's sole further includes midsole and outsole, the support chip
Among said midsole and the outsole, the support chip ontology be formed with forward position while and/or after along while, the front is along court
To the preceding metacarpus direction of the sole, the back edge is distributed in institute towards the rear heel direction of the sole, the extension item
State the forward position of support chip ontology while and/or after along while.
7. a kind of sole as claimed in claim 6, it is characterised in that：Said midsole lower surface corresponds to the position of the support chip
Equipped with sunk structure；
Said midsole lower surface corresponds to each position for extending item and is equipped with locating slot, and the extension item is set to the locating slot
It is interior that positioning is installed to realize.
8. a kind of sole as claimed in claim 5, it is characterised in that：Institute's sole further includes midsole and outsole, the support chip
Between said midsole upper surface and shoe last surface, the support chip ontology be formed with forward position while and/or after along while, the front
Along towards the preceding metacarpus direction of the sole, the back edge is distributed towards the rear heel direction of the sole, the extension item
In the forward position of the support chip ontology while and/or after along while.
9. a kind of sole as claimed in claim 8, it is characterised in that：Said midsole upper surface corresponds to the support chip position and sets
There is sunk structure, the support chip is across the sunk structure to form hollow out shock-damping structure；
Said midsole and the support chip ontology are clamped positioning step by locating flange and realize that inlay card between the two positions.
10. a kind of shoes, which is characterized in that include the sole as described in claim 5-9 is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744750.8A CN108783746A (en) | 2018-07-09 | 2018-07-09 | A kind of support chip, sole and shoes for sole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744750.8A CN108783746A (en) | 2018-07-09 | 2018-07-09 | A kind of support chip, sole and shoes for sole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108783746A true CN108783746A (en) | 2018-11-13 |
Family
ID=64075706
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744750.8A Pending CN108783746A (en) | 2018-07-09 | 2018-07-09 | A kind of support chip, sole and shoes for sole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108783746A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113287830A (en) * | 2020-02-21 | 2021-08-24 | 阿迪达斯股份公司 | Sole including individually deflectable reinforcing members, shoe having such a sole, and method of manufacturing such an article |
| WO2023226148A1 (en) * | 2022-05-23 | 2023-11-30 | 三六一度(中国)有限公司 | Support structure for use in sole, and sole and sports shoe thereof |
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| CN202603799U (en) * | 2012-04-18 | 2012-12-19 | 北京康尔健野旅游用品有限公司 | Heel supporting protective ventilating structure |
| KR20140003454U (en) * | 2012-11-30 | 2014-06-10 | 채원근 | Reinforcement for shoes middle layer of a shoe sole |
| CN205250513U (en) * | 2015-11-26 | 2016-05-25 | 三六一度(中国)有限公司 | Light cushion sole |
| CN208837169U (en) * | 2018-07-09 | 2019-05-10 | 三六一度(中国)有限公司 | A kind of support chip, sole and shoes for sole |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113287830A (en) * | 2020-02-21 | 2021-08-24 | 阿迪达斯股份公司 | Sole including individually deflectable reinforcing members, shoe having such a sole, and method of manufacturing such an article |
| US11779077B2 (en) | 2020-02-21 | 2023-10-10 | Adidas Ag | Sole comprising individually deflectable reinforcing members, shoe with such a sole, and method for the manufacture of such items |
| WO2023226148A1 (en) * | 2022-05-23 | 2023-11-30 | 三六一度(中国)有限公司 | Support structure for use in sole, and sole and sports shoe thereof |
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