CN108781487B - Microwave processing apparatus - Google Patents
Microwave processing apparatus Download PDFInfo
- Publication number
- CN108781487B CN108781487B CN201780017063.XA CN201780017063A CN108781487B CN 108781487 B CN108781487 B CN 108781487B CN 201780017063 A CN201780017063 A CN 201780017063A CN 108781487 B CN108781487 B CN 108781487B
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- oscillation frequency
- periodic structure
- oscillation
- frequency
- power distribution
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/66—Circuits
- H05B6/68—Circuits for monitoring or control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/705—Feed lines using microwave tuning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/707—Feed lines using waveguides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/74—Mode transformers or mode stirrers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
Abstract
A microwave processing device (101) comprises: a heating chamber (11); an oscillation source (1) for microwaves; a placing table (4) which is provided in the heating chamber (11) and on which an object (7) to be heated is placed; and a waveguide (6) that guides the microwave to the heating chamber (11). The microwave processing device (101) further comprises: a periodic structure (5) which is provided in the waveguide (6) and propagates the microwave in a surface wave mode; a detection antenna (9) near the periodic structure (5); a detection unit (8) that detects the electromagnetic wave received by the detection antenna (9); and a control unit (10) that controls the oscillation source (1). The control unit (10) recognizes the power distribution of the electromagnetic field in the vicinity of the periodic structure (5) from the detected electromagnetic wave, and controls the oscillation source (1) so that the oscillation frequency is set to any one of the 1 st oscillation frequency and the 2 nd oscillation frequency, based on the power distribution of the electromagnetic field. According to this aspect, by correcting the characteristic variation of the periodic structure, a preferable power distribution of the electromagnetic field in the vicinity of the periodic structure can be maintained.
Description
Technical Field
The present invention relates to a Microwave processing device (Microwave transmission apparatus) having a surface wave transmission line using a periodic structure.
Background
Conventionally, as such a microwave processing apparatus, there is known a microwave processing apparatus including: the microwave processing apparatus includes a waveguide having a ladder circuit including a Ridge portion and a Slot portion (Slot) (see, for example, patent document 1). According to this conventional technique, coloring (browning) and dielectric heating can be simultaneously performed on an object to be heated by using concentration of power distribution of an electromagnetic field generated by a ladder circuit. The concentration of the power distribution of the electromagnetic field can also be adjusted when the ridge is moved.
Further, the following microwave processing apparatus is known: the microwave processing apparatus includes a heater plate formed of a periodic structure, and excites microwaves with the heater plate (see, for example, patent document 2). According to this conventional technique, the intensity of surface wave heating can be adjusted by changing the depth of the grooves of the periodic structure, and the heating distribution in the vertical direction can be controlled.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 49-16944
Patent document 2: japanese laid-open patent publication No. 5-66019
Disclosure of Invention
In the conventional technique described in patent document 1, in order to concentrate the power distribution of the electromagnetic field in the vicinity of the periodic structure, the periodic structure such as a waveguide having a ladder circuit propagates the microwave in a Surface wave mode (Surface wave mode).
In this conventional technique, it is not possible to detect a change in the power distribution of the electromagnetic field due to a change in the characteristics of the periodic structure depending on the shape, type, volume, and the like of the object to be heated. Therefore, the influence of the object cannot be corrected. As a result, the power distribution of the electromagnetic field in the vicinity of the periodic structure cannot be maintained.
The conventional technique described in patent document 2 includes a moving mechanism for changing the depth of the groove of the periodic structure in the space in which the microwave propagates, and controls the power distribution of the electromagnetic field in the vicinity of the periodic structure.
In this configuration, in order to prevent electric discharge, the moving mechanism needs to be reliably electrically connected to the peripheral structure. A countermeasure for preventing the microwave from leaking from the hole for transmitting power to the moving mechanism is also required. Since a motor for driving the moving mechanism is required, the apparatus is not easily miniaturized.
A microwave processing device according to one embodiment of the present invention includes: a heating chamber for accommodating an object to be heated; an oscillation source that oscillates microwaves, and an oscillation frequency of the microwaves is variable; a placing table provided in the heating chamber and configured to place an object to be heated; and a waveguide that guides the microwave to the heating chamber.
The microwave processing apparatus further includes: a periodic structure which is provided in the waveguide and propagates the microwave in a surface wave mode; a detection antenna disposed in the vicinity of the periodic structure; a detection section that detects the electromagnetic wave received by the detection antenna; and a control unit configured to control the oscillation source.
The control unit is further configured to recognize a power distribution of an electromagnetic field in the vicinity of the periodic structure from the electromagnetic wave detected by the detection unit, and control the oscillation source so that the oscillation frequency is set to at least any one of a 1 st oscillation frequency and a 2 nd oscillation frequency different from the 1 st oscillation frequency, based on the power distribution of the electromagnetic field.
According to this aspect, by changing the oscillation frequency, the power distribution of the electromagnetic field in the vicinity of the periodic structure can be controlled. By detecting and correcting the characteristic change of the periodic structure due to the influence of the object to be heated, a preferable power distribution of the electromagnetic field in the vicinity of the periodic structure can be maintained. As a result, desired coloring can be imparted to the object to be heated in various shapes, types, and volumes.
Drawings
Fig. 1 is a schematic cross-sectional view showing the structure of a microwave processing apparatus according to embodiment 1.
Fig. 2 is a perspective view showing the structure in the waveguide of the microwave processing device according to embodiment 1.
Fig. 3 is a graph showing the frequency characteristics of leakage power in embodiment 1.
Fig. 4 is a diagram showing the power distribution of the electromagnetic field in the vicinity of the periodic structure in embodiment 1.
Fig. 5 is a schematic cross-sectional view showing the structure of a microwave processing apparatus according to embodiment 2.
Detailed Description
A microwave processing apparatus according to claim 1 of the present invention includes: a heating chamber for accommodating an object to be heated; an oscillation source that oscillates microwaves, and an oscillation frequency of the microwaves is variable; a placing table provided in the heating chamber and configured to place an object to be heated; and a waveguide that guides the microwave to the heating chamber.
The microwave processing apparatus further includes: a periodic structure which is provided in the waveguide and propagates the microwave in a surface wave mode; a detection antenna disposed in the vicinity of the periodic structure; a detection section that detects the electromagnetic wave received by the detection antenna; and a control unit configured to control the oscillation source.
The control unit is further configured to recognize a power distribution of an electromagnetic field in the vicinity of the periodic structure from the electromagnetic wave detected by the detection unit, and control the oscillation source so that the oscillation frequency is set to at least any one of a 1 st oscillation frequency and a 2 nd oscillation frequency different from the 1 st oscillation frequency, based on the power distribution of the electromagnetic field.
According to the microwave processing device of the 2 nd aspect of the present invention, in the 1 st aspect, the control unit is configured to determine a frequency at which the concentration of the power distribution of the electromagnetic field in the vicinity of the periodic structure is maximum from the electromagnetic wave detected by the detection unit while controlling the oscillation source to vary the oscillation frequency, and to set the determined frequency as the 1 st oscillation frequency.
According to the microwave processing device of the 3 rd aspect of the present invention, in the 1 st aspect, the control unit is configured to determine a frequency at which concentration of the power distribution of the electromagnetic field in the vicinity of the periodic structure is minimum from the electromagnetic wave detected by the detection unit while controlling the oscillation source to vary the oscillation frequency, and to set the determined frequency to the 2 nd oscillation frequency.
According to the microwave treatment device of the 4 th aspect of the present invention, in the 1 st aspect, the control unit is configured to control the oscillation source to change the oscillation frequency in accordance with the state of the object to be heated during heating of the object to be heated.
According to the microwave processing device of the 5 th aspect of the present invention, in the 1 st aspect, the control unit is configured to set a frequency between the 1 st oscillation frequency and the 2 nd oscillation frequency as the oscillation frequency.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(embodiment mode 1)
Fig. 1 is a schematic sectional view showing the structure of a waveguide 6 and a heating chamber 11, in particular, of a microwave processing apparatus 100 according to embodiment 1 of the present invention. Fig. 2 is a perspective view showing a structure provided in the waveguide 6 of the microwave processing apparatus 100.
As shown in fig. 1 and 2, the microwave processing apparatus 100 includes an oscillation source 1, an antenna 2, a metal plate 3, a mounting table 4, a periodic structure 5, a waveguide 6, and a heating chamber 11.
The oscillation source 1 oscillates microwaves. The oscillation frequency of the microwave from the oscillation source 1 is variable. The control unit 10 is constituted by a microcomputer, and controls the oscillation source 1 to change the oscillation frequency of the microwave. The oscillation source 1 may have an oscillator and an amplifier made of a semiconductor element. When the oscillation source 1 includes an oscillator and an amplifier, the oscillation frequency can be easily controlled by the control unit 10.
The waveguide 6 is provided below the heating chamber 11 in proximity to the mounting table 4, and extends from the installation location of the antenna 2 to below the heating chamber 11. The metal plates 3 are a plurality of metal plates perpendicular to the inner wall surface of the waveguide 6. The periodic structure 5 is configured by periodically disposing a plurality of metal plates at a constant interval in the waveguide 6.
When the height, the interval, or the like of the metal plate 3 is optimized, the microwave becomes a Slow wave (Slow wave) in a range where the periodic structure 5 is provided, and propagates above the metal plate 3 in a surface wave mode. As a result, the power distribution of the electromagnetic field is concentrated near the upper side of the metal plate 3.
When the object 7 is placed on the table 4, the object 7 approaches the periodic structure 5. Since the waveguide 6 is open on the side facing the mounting table 4, the heating object 7 is heated from below by concentrating the power distribution of the electromagnetic field in the vicinity of the upper side of the metal plate 3.
The operation and action of the microwave processing apparatus configured as described above will be described.
Fig. 3 shows leakage power from the periodic structure 5 at an oscillation frequency in the frequency band of 2.4GHz to 2.5 GHz. In fig. 3, the horizontal axis represents the oscillation frequency of the oscillation source 1, and the vertical axis represents the leakage power measured at a position separated from the periodic structure 5 by a predetermined distance.
In the case where the power distribution of the electromagnetic field is less concentrated near the periodic structure 5 and the microwave is diffused to the space, the leakage power increases. In the case where the power distribution of the electromagnetic field is concentrated near the periodic structure 5 and the microwave is not diffused to the space, the leakage power is reduced.
As shown in fig. 3, the leakage power varies depending on the oscillation frequency of the oscillation source 1. In addition to optimization of the height, the interval, and the like of the metal plate 3, by setting an appropriate oscillation frequency, the microwave becomes a slow wave in the range where the periodic structure 5 is provided, and propagates on the upper side of the metal plate 3 in the surface wave mode. As a result, the power distribution of the electromagnetic field is concentrated near the upper side of the metal plate 3.
Fig. 4 shows the power distribution of the electromagnetic field in the vicinity of the periodic structures 5. In fig. 4, the horizontal axis represents the power of the electromagnetic field, and the vertical axis represents the distance (i.e., height) from the periodic structure 5 in the vertical direction. In fig. 4, a graph indicated by a solid line represents a power distribution of an electromagnetic field generated by microwaves of 2.41GHz, and a graph indicated by a broken line represents a power distribution of an electromagnetic field generated by microwaves of 2.46 GHz.
As shown in fig. 3 and 4, in any case, the power of the electromagnetic field is maximum near the periodic structure 5 and decreases as it goes away from the periodic structure 5.
At the oscillation frequency (2.41GHz) at which the leakage power is the smallest, the power distribution of the electromagnetic field is more strongly concentrated near the periodic structure 5, and sharply attenuates when away from the periodic structure 5. On the other hand, at the oscillation frequency (2.46GHz) at which the leakage power is maximum, concentration in the vicinity of the periodic structure 5 is weakened, and when the periodic structure 5 is away, the concentration is gradually attenuated, and the electromagnetic wave power is distributed in a wide range.
Hereinafter, the oscillation frequency at which the leakage power is minimum in the range of 2.4GHz to 2.5GHz is referred to as the 1 st oscillation frequency. The oscillation frequency at which the leakage power is maximum is referred to as a 2 nd oscillation frequency. The concentration of the power distribution of the electromagnetic field is largest in the case where the oscillation frequency is the 1 st oscillation frequency, and is smallest in the case where the oscillation frequency is the 2 nd oscillation frequency.
That is, when the oscillation frequency is set to the 1 st oscillation frequency, the power distribution of the electromagnetic field can be concentrated in the vicinity of the periodic structure 5. When the oscillation frequency is set to the 2 nd oscillation frequency, the microwave can be diffused into the space apart from the periodic structure 5. As shown in fig. 3, the leakage power continuously changes with respect to the oscillation frequency.
According to the present embodiment, the power distribution of the electromagnetic field in the vicinity of the periodic structure 5 can be controlled by setting the 1 st oscillation frequency, the 2 nd oscillation frequency, and the frequency between the 1 st oscillation frequency and the 2 nd oscillation frequency as the oscillation frequency.
The oscillation frequency of the oscillation source 1 can be easily and safely set by an electric signal from the control unit 10. Therefore, it is not necessary to stop the oscillation source 1 in order to change the power distribution of the electromagnetic field. Since a mechanism for setting the oscillation frequency of the oscillation source 1 is not required, the apparatus can be miniaturized.
(embodiment mode 2)
A microwave processing apparatus 101 according to embodiment 2 of the present invention will be described below.
Fig. 5 is a schematic cross-sectional view showing the structure of the microwave processing apparatus 101. In the description of the present embodiment, the same or corresponding portions as those in embodiment 1 are assigned the same reference numerals, and redundant description is omitted.
As shown in fig. 5, the detection antenna 9 is disposed in the heating chamber 11 near the periodic structure 5. The detection section 8 detects the electromagnetic wave received by the detection antenna 9. The controller 10 can recognize the power distribution of the electromagnetic field in the vicinity of the periodic structure 5 from the electromagnetic wave detected by the detector 8.
The detection antenna 9 may be disposed at a position capable of detecting the microwave in the surface wave mode propagating along the periodic structure 5. The detection antenna 9 may also be disposed at a position capable of detecting microwaves radiated into the space.
The object 7 approaches the periodic structure 5 when placed on the placing table 4. The object 7 placed on the placing table 4 affects the microwave propagating near the tip of the metal plate 3, and disturbs propagation in the surface wave mode. The influence on the microwave varies depending on the shape, type, volume, temperature, and the like of the object 7 to be heated.
According to the present embodiment, the controller 10 controls the oscillation source 1 to vary the oscillation frequency, and the detector 8 detects the power distribution of the electromagnetic field in the vicinity of the periodic structure 5.
The controller 10 obtains the frequency characteristic of the leakage power showing the power distribution state of the electromagnetic field under the condition including the influence of the object 7 shown in the graph of fig. 3, from the detected power distribution of the electromagnetic field. The control section 10 determines the 1 st and 2 nd oscillation frequencies based on the obtained frequency characteristics of the leakage power.
Thus, the microwave processing device 101 can obtain desired heating performance by correcting the frequency characteristic variation of the periodic structure 5 due to the object 7 to be heated.
According to the present embodiment, the controller 10 controls the oscillation source 1 to change the oscillation frequency in accordance with the state of the object 7 to be heated during heating of the object 7, thereby changing the power distribution of the electromagnetic field in the vicinity of the periodic structure 5. As a result, the microwave processing apparatus 101 can impart desired coloring to the object 7 to be heated in various shapes, types, and volumes.
Industrial applicability
The microwave treatment apparatus of the present invention can be applied to a heating apparatus using dielectric heating, such as a microwave oven and a garbage disposer.
Description of the reference symbols
1: an oscillation source; 2: an antenna; 3: making a metal plate; 4: a mounting table; 5: a periodic structure; 6: a waveguide; 7: an object to be heated; 8: a detection unit; 9: detecting an antenna; 10: a control unit; 11: a heating chamber; 100. 101: provided is a microwave processing device.
Claims (4)
1. A microwave processing apparatus, comprising:
a heating chamber for accommodating an object to be heated;
an oscillation source that oscillates microwaves, and an oscillation frequency of the microwaves is variable;
a mounting table provided in the heating chamber and configured to mount the object to be heated;
a waveguide that guides the microwaves to the heating chamber;
a periodic structure which is provided in the waveguide and propagates a microwave in a surface wave mode;
a detection antenna disposed in the vicinity of the periodic structure;
a detection section that detects the electromagnetic wave received by the detection antenna; and
and a control unit configured to control the oscillation source, recognize a power distribution of an electromagnetic field in the vicinity of the periodic structure from the electromagnetic wave detected by the detection unit, and control the oscillation source so that the oscillation frequency is set to any one of a 1 st oscillation frequency, a 2 nd oscillation frequency different from the 1 st oscillation frequency, and a frequency between the 1 st oscillation frequency and the 2 nd oscillation frequency, based on the power distribution of the electromagnetic field.
2. The microwave processing apparatus according to claim 1,
the control unit is configured to determine a frequency at which the concentration of the power distribution of the electromagnetic field in the vicinity of the periodic structure is maximum, based on the electromagnetic wave detected by the detection unit, while controlling the oscillation source to vary the oscillation frequency, and set the determined frequency as the 1 st oscillation frequency.
3. The microwave processing apparatus according to claim 1,
the control unit is configured to determine a frequency at which concentration of power distribution of the electromagnetic field in the vicinity of the periodic structure is minimum from the electromagnetic wave detected by the detection unit while controlling the oscillation source to vary the oscillation frequency, and to set the determined frequency as the 2 nd oscillation frequency.
4. The microwave processing apparatus according to claim 1,
the controller is configured to control the oscillation source to change the oscillation frequency in accordance with a state of the object to be heated during heating of the object to be heated.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016057956 | 2016-03-23 | ||
| JP2016-057956 | 2016-03-23 | ||
| PCT/JP2017/009910 WO2017163964A1 (en) | 2016-03-23 | 2017-03-13 | Microwave treatment apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108781487A CN108781487A (en) | 2018-11-09 |
| CN108781487B true CN108781487B (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780017063.XA Active CN108781487B (en) | 2016-03-23 | 2017-03-13 | Microwave processing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3435738B1 (en) |
| JP (1) | JPWO2017163964A1 (en) |
| CN (1) | CN108781487B (en) |
| WO (1) | WO2017163964A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3661326B1 (en) * | 2016-06-30 | 2022-04-20 | Panasonic Intellectual Property Management Co., Ltd. | High-frequency heating device |
| WO2019187457A1 (en) * | 2018-03-26 | 2019-10-03 | パナソニックＩｐマネジメント株式会社 | Microwave heating device |
| EP3780909B1 (en) * | 2018-04-06 | 2022-05-04 | Panasonic Intellectual Property Management Co., Ltd. | High-frequency heating device |
| JP2019185965A (en) * | 2018-04-06 | 2019-10-24 | パナソニックＩｐマネジメント株式会社 | High frequency heating device |
| JP7113209B2 (en) * | 2018-04-06 | 2022-08-05 | パナソニックＩｐマネジメント株式会社 | High frequency heating device |
| JP7285413B2 (en) * | 2019-03-29 | 2023-06-02 | パナソニックＩｐマネジメント株式会社 | High frequency heating device |
| CN111432514A (en) * | 2020-03-23 | 2020-07-17 | 成都赛纳微波科技有限公司 | Modular periodic loading microwave heating equipment |
| CN114245506A (en) * | 2021-12-10 | 2022-03-25 | 广东美的厨房电器制造有限公司 | Cooking apparatus |
| CN114269035A (en) * | 2021-12-10 | 2022-04-01 | 广东美的厨房电器制造有限公司 | Cooking apparatus |
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|---|---|---|---|---|
| US4121078A (en) * | 1975-04-30 | 1978-10-17 | Matsushita Electric Industrial Co., Ltd. | Microwave heating apparatus |
| JPH04371724A (en) * | 1991-06-19 | 1992-12-24 | Matsushita Electric Ind Co Ltd | Microwave oven |
| JPH06260275A (en) * | 1993-03-03 | 1994-09-16 | Matsushita Electric Ind Co Ltd | High frequency heating device |
| CN102067723A (en) * | 2008-06-25 | 2011-05-18 | 松下电器产业株式会社 | Microwave heating device |
| CN102474925A (en) * | 2009-07-10 | 2012-05-23 | 松下电器产业株式会社 | Microwave heating device and microwave heating control method |
| JP2015162273A (en) * | 2014-02-26 | 2015-09-07 | パナソニック株式会社 | Micro wave processor |
| JP2015220189A (en) * | 2014-05-21 | 2015-12-07 | パナソニックＩｐマネジメント株式会社 | High-frequency heating device |
| CN106063373A (en) * | 2014-02-26 | 2016-10-26 | 松下电器产业株式会社 | Microwave treatment device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5824398Y2 (en) * | 1980-06-19 | 1983-05-25 | 松下電器産業株式会社 | High frequency heating device |
-
2017
- 2017-03-13 EP EP17770007.7A patent/EP3435738B1/en active Active
- 2017-03-13 WO PCT/JP2017/009910 patent/WO2017163964A1/en active Application Filing
- 2017-03-13 JP JP2018507235A patent/JPWO2017163964A1/en active Pending
- 2017-03-13 CN CN201780017063.XA patent/CN108781487B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4121078A (en) * | 1975-04-30 | 1978-10-17 | Matsushita Electric Industrial Co., Ltd. | Microwave heating apparatus |
| JPH04371724A (en) * | 1991-06-19 | 1992-12-24 | Matsushita Electric Ind Co Ltd | Microwave oven |
| JPH06260275A (en) * | 1993-03-03 | 1994-09-16 | Matsushita Electric Ind Co Ltd | High frequency heating device |
| CN102067723A (en) * | 2008-06-25 | 2011-05-18 | 松下电器产业株式会社 | Microwave heating device |
| CN102474925A (en) * | 2009-07-10 | 2012-05-23 | 松下电器产业株式会社 | Microwave heating device and microwave heating control method |
| JP2015162273A (en) * | 2014-02-26 | 2015-09-07 | パナソニック株式会社 | Micro wave processor |
| CN106063373A (en) * | 2014-02-26 | 2016-10-26 | 松下电器产业株式会社 | Microwave treatment device |
| JP2015220189A (en) * | 2014-05-21 | 2015-12-07 | パナソニックＩｐマネジメント株式会社 | High-frequency heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108781487A (en) | 2018-11-09 |
| EP3435738A4 (en) | 2019-04-03 |
| WO2017163964A1 (en) | 2017-09-28 |
| EP3435738A1 (en) | 2019-01-30 |
| EP3435738B1 (en) | 2020-02-12 |
| JPWO2017163964A1 (en) | 2019-01-31 |
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