CN108777825B - Earphone clamp - Google Patents

Earphone clamp Download PDF

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Publication number
CN108777825B
CN108777825B CN201810549399.7A CN201810549399A CN108777825B CN 108777825 B CN108777825 B CN 108777825B CN 201810549399 A CN201810549399 A CN 201810549399A CN 108777825 B CN108777825 B CN 108777825B
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Prior art keywords
headset
bluetooth headset
tws bluetooth
interface circuit
enameled wire
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CN108777825A (en
Inventor
石艳
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Chumen Wenwen Information Technology Co Ltd
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Chumen Wenwen Information Technology Co Ltd
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Publication of CN108777825A publication Critical patent/CN108777825A/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1025Accumulators or arrangements for charging
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00Monitoring arrangements; Testing arrangements
    • H04R29/001Monitoring arrangements; Testing arrangements for loudspeakers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Support Of Aerials (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

The invention discloses an earphone clamp, relates to the technical field of earphone testing, and can solve the problem that the earphone clamp interferes with testing when a TWS (two way set) Bluetooth earphone is subjected to production line testing in the prior art. The earphone clamp comprises a fixing frame and an interface circuit; the fixed frame comprises a metal probe, one end of a probe of the metal probe protrudes out of the upper surface of the fixed frame and is used for contacting a charging point of a real infinite stereo TWS Bluetooth headset, and the other end of the probe is connected with the interface circuit; the interface circuit is arranged at a position which is more than a critical distance away from the antenna of the TWS Bluetooth headset and is used for connecting an external power supply, and the critical distance is the farthest distance at which the performance of the antenna of the TWS Bluetooth headset can be influenced by the metal characteristics of the interface circuit. The method is mainly suitable for testing the earphone.

Description

Earphone clamp
Technical Field
The invention relates to the technical field of earphone testing, in particular to an earphone clamp.
Background
The bluetooth is a low-cost large-capacity short distance wireless communication standard, and bluetooth headset then uses bluetooth technology on the hands-free headset, makes single earphone can abandon the mode that the wire rod is connected, carries out wireless connection through bluetooth and terminal. The real Wireless Stereo (TWS) bluetooth headset is wirelessly connected between a pair of bluetooth headsets, wherein the left and right headsets can work independently, when one headset is turned on and the other headset is close to, the two headsets are connected and paired through an antenna, so that a two-channel Stereo mode can be automatically formed, a pair of Stereo headsets is formed, and Stereo playing is realized.
The TWS Bluetooth headset is required to be subjected to production line testing when leaving a factory, the testing can be carried out in a state that the headset is charged, namely the TWS Bluetooth headset is fixed on a headset clamp, and after a touch pad is clicked to carry out a testing mode, the TWS Bluetooth headset is subjected to performance testing while being charged. As shown in fig. 1, in the prior art, in order to facilitate charging, a charging box 1 of a headset is used as a headset clamp, and a TWS bluetooth headset is directly fixed on the charging box for supplying power to the TWS bluetooth headset for testing.
However, the charging box 1 must have a certain area of the main charging circuit 2 and the auxiliary charging circuit 3 and the battery 4 because of the charging function, since the TWS bluetooth headset is fixed in the charging box during the test, the circuit boards of the charging circuits and the battery 4 of the charging box 1 are very close to the TWS bluetooth headset to be tested in the spatial position, and the TWS bluetooth headset may be affected by the metal characteristics of the circuit boards and the battery 4 to cause the resonant frequency of the antenna to shift during the test. Because the performance of the TWS Bluetooth headset antenna has a great influence on the performance of the whole headset, the antenna is influenced to generate resonant frequency deviation, the test value of a Bluetooth frequency band is caused to have a lower or higher false appearance, and then the whole production line is judged wrongly.
Disclosure of Invention
In view of the above problems, the present invention provides an earphone clamp, which can solve the problem that the earphone clamp interferes with the test when the TWS bluetooth earphone is subjected to the production line test in the prior art.
In order to solve the above problems, the present invention mainly provides the following technical solutions:
the invention provides an earphone clamp, which comprises a fixing frame and an interface circuit, wherein the fixing frame comprises a fixing frame body and an interface circuit, and the interface circuit comprises:
the fixing frame comprises a metal probe, one end of a probe of the metal probe protrudes out of the upper surface of the fixing frame and is used for contacting a charging point of a real infinite stereo TWS Bluetooth headset, and the other end of the probe is connected with the interface circuit;
the interface circuit is arranged at a position which is more than a critical distance away from the antenna of the TWS Bluetooth headset and is used for connecting an external power supply, and the critical distance is the farthest distance at which the performance of the antenna of the TWS Bluetooth headset can be influenced by the metal characteristics of the interface circuit.
Optionally, the metal probe and the interface circuit are connected by an enameled wire.
Optionally, the surface of the enameled wire is coated with a hot melt adhesive, so that the position of the enameled wire relative to the fixing frame is fixed.
Optionally, the enameled wire is subjected to plastic package, so that the position of the enameled wire relative to the fixed frame is fixed.
Optionally, the length of the enameled wire is greater than or equal to 10 cm.
Optionally, the headset clip further comprises:
and the inductor is connected between the metal probe and the enameled wire in series.
Optionally, the inductor is fixed inside the fixing frame.
Optionally, the fixing frame includes:
magnet, magnet setting is in the mount upper surface is used for with TWS bluetooth headset adsorbs on the mount.
Optionally, the fixing frame includes:
the groove surrounds the metal probe and the magnet and is formed in the upper surface of the fixing frame, and the shape of the groove is formed according to the shape of the TWS Bluetooth headset.
Optionally, the shape of the recess is set according to the shape of the earphone rod of the TWS bluetooth earphone.
By means of the technical scheme, the headset clamp provided by the invention fixes the TWS Bluetooth headset by using the fixing frame which does not comprise a charging circuit and a battery, and the metal probe in the fixing frame is in contact with the charging point of the fixed TWS Bluetooth headset; and the interface circuit connected with the power supply is arranged at a position which is more than the critical distance away from the antenna of the TWS Bluetooth headset, so that the performance of the antenna of the TWS Bluetooth headset on the fixed frame is not influenced by the metal characteristics of the interface circuit. When the production line test is carried out on the TWS Bluetooth headset, the TWS Bluetooth headset can be powered only through the metal probe and the interface circuit. Utilize among the prior art to charge the box fixed and charge to TWS bluetooth headset, the metallic characteristic that leads to circuit board and battery in the box that charges produces the influence to producing the line test and compares, because metallic probe's area is minimum, compare in circuit board and battery in the box that charges, the influence that its metallic characteristic brought can be ignored, and because interface circuit and external power supply are far away from TWS bluetooth headset, the influence that its metallic characteristic brought also can be ignored, and then avoided the headphone clamp to produce the line test of TWS bluetooth headset and produced any harmful interference, in order to improve the exactness of TWS bluetooth headset test.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 shows a front sectional view of a charging box of the prior art;
fig. 2 illustrates a front cross-sectional view of a headset clip provided by an embodiment of the present invention;
fig. 3 illustrates a front cross-sectional view of another headset clip provided by an embodiment of the invention;
fig. 4 illustrates a front cross-sectional view of another headset clip provided by an embodiment of the invention;
fig. 5 is a top view of a headset clip according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In order to solve the problem that the headset clamp interferes with the production line test of the TWS bluetooth headset in the prior art, an embodiment of the present invention provides a headset clamp, which is shown in fig. 2:
the headset clamp mainly comprises a fixing frame 5 and an interface circuit 6. Wherein, a metal probe 7 is arranged in the fixed mount, one end of the probe of the metal probe 7 is protruded on the upper surface of the fixed mount 5, and the other end is connected with the interface circuit 6. Further, the fixing frame 5 is made of a material without metal characteristics, such as plastic, resin, rubber, wood, bamboo, paper, etc., and the material of the fixing frame 5 is not particularly limited in this embodiment.
The position of the probe of the metal probe 7 on the upper surface of the headset clamp corresponds to the position of a charging point of a real infinite Stereo (TWS) Bluetooth headset to be tested, so that when the TWS Bluetooth headset is fixed on the fixing frame 5, the metal probe 7 can contact the charging point and then charge the TWS Bluetooth headset.
The interface circuit 6 of the headset clamp is placed at a position far away from the fixed mount 5, specifically at a position more than a critical distance away from the antenna of the TWS bluetooth headset. The critical distance is the farthest distance over which the performance of the antenna of the TWS bluetooth headset may be affected by the metallic characteristics of the interface circuit 6. The antenna of the TWS Bluetooth headset is built in the TWS Bluetooth headset. After the distance between the placement position of the circuit interface and the position of the antenna of the TWS bluetooth headset exceeds the critical distance, the resonant frequency of the antenna of the TWS bluetooth headset is not affected by the metal characteristics of the interface circuit 6 at the position to shift during the power-on test. The critical distance may be set according to actual needs, for example, before performing a production line test, a distance between the circuit interface and the position of the antenna of the TWS bluetooth headset is experimentally tested to determine the critical distance.
Further, the circuit interface and the metal probe 7 may be connected by a wire 8, and the circuit interface may be a Universal Serial Bus (USB) interface circuit 6. When the production line is tested, the USB interface circuit 6 is connected with an external power supply through a USB line, and then the TWS Bluetooth headset is charged through the connected metal probes 7.
Based on the above description of the specific structure of the headset clamp provided in the embodiment of the present invention, it can be seen that the headset clamp fixes the TWS bluetooth headset by using the fixing frame 5 which does not include a charging circuit and a battery, and the metal probe 7 in the fixing frame 5 is in contact with the charging point of the fixed TWS bluetooth headset; and the interface circuit 6 connected with the power supply is arranged at a position which is more than the critical distance away from the antenna of the TWS Bluetooth headset, so that the performance of the antenna of the TWS Bluetooth headset on the fixed frame 5 is not influenced by the metal characteristics of the interface circuit 6. When the production line test is carried out on the TWS Bluetooth headset, the TWS Bluetooth headset can be powered only through the metal probe 7 and the interface circuit 6. Utilize among the prior art to charge the box fixed and charge to TWS bluetooth headset, the metallic characteristic that leads to circuit board and battery in the box that charges produces the influence to producing the line test and compares, because metal probe 7's area is minimum, compare in circuit board and battery in the box that charges, the influence that its metallic characteristic brought can be ignored, and because interface circuit 6 and external power supply are far away from TWS bluetooth headset, the influence that its metallic characteristic brought also can be ignored, and then avoided the headphone clamp to produce the line test of TWS bluetooth headset and produced any harmful interference, in order to improve the exactness of TWS bluetooth headset test.
Based on the above embodiments, another embodiment of the present invention further provides another headset holder, which is shown in fig. 3 to 5:
the headset clamp mainly comprises a fixing frame 5, an inductor 9 and an interface circuit 6. Two metal probes 7 are arranged in the fixing frame 5, one ends of probes of the two metal probes 7 protrude out of the upper surface of the fixing frame 5, and the other ends of the probes are respectively connected with an inductor 9. One of the inductors 9 is connected to the positive voltage output terminal of the interface circuit 6 through a wire 8, and the other inductor 9 is connected to the negative voltage output terminal of the interface circuit 6 through a wire 8. In the production line test of the TWS Bluetooth headset, the TWS Bluetooth headset fixed on the headset clamp needs to be placed in the shielding box, and the coupling data of the antenna of the TWS Bluetooth headset and the standard detection antenna of the shielding box is acquired. The enamel wire has metallic properties which also affect the resonant frequency of the standard detection antenna, resulting in a change in the coupling data, and this effect changes as the distance between the enamel wire and the antenna of the shield can changes. Therefore, before production line testing, the placing position of the enameled wire in the shielding box needs to be set, and the influence of the enameled wire on the resonant frequency of the antenna of the shielding box is detected, so that the acquired coupling data can be corrected by referring to the influence data in subsequent production line testing, and more accurate data can be obtained. However, the enameled wire is made of a soft material and has a light weight, and is easily influenced by the outside to move, for example, when the interface circuit 6 is plugged with an external power supply, the enameled wire connected with the interface circuit 6 moves along with the movement of the interface circuit 6, so that the distance between the enameled wire and the antenna of the shielding box changes. Therefore, an inductor 9 is required to be connected in series between the metal probe 7 and the interface circuit 6 for decoupling processing, and the influence of position movement of the enameled wire on coupled data can be eliminated to a great extent.
The positions of the probes of the two metal probes 7 on the upper surface of the headset clamp correspond to the positions of two charging points in the TWS Bluetooth headset to be tested. When the TWS Bluetooth headset is fixed on the fixing frame 5, the two metal probes 7 can be respectively contacted with two charging points of the TWS Bluetooth headset to charge the TWS Bluetooth headset.
Furthermore, because the contact area of the metal probe 7 and the lead 8 is relatively small, the enameled wire with a relatively small diameter is selected as the lead 8 for the convenience of welding. The diameter of the enameled wire is 0.1mm, and a lead 8 with the diameter smaller than 0.2mm can be selected to be connected with the metal probe 7 and the interface circuit 6.
Further, an enameled wire 10cm long is selected to connect the metal probe 7 and the interface circuit 6, so as to ensure that the distance between the interface circuit 6 and the antenna of the TWS bluetooth headset is greater than a critical distance.
Further, the inductor 9 may adopt an inductor 9 with a larger inductance value, for example, an inductor of 56nH or 68 nH.
Further, as shown in fig. 3, the inductor 9 is fixed inside the fixing frame 5, for example, a placing groove may be formed at a connection position of the metal probe 7 inside the fixing frame 5 according to a shape of the inductor 9, the inductor 9 is placed therein, and an enameled wire perforation is left and the placing groove is sealed, so as to avoid that the inductor 9 is fixed at the bottom of the fixing frame 5, which affects stability of the fixing frame 5 to improve a probability of movement of the enameled wire; and also the connection between the metal probe 7 and the inductance 9 can be made more firm.
Further, as shown in fig. 4, in order to reduce the manufacturing difficulty of the earphone clamp, the metal probe 7 may be connected to the first section of enameled wire 10, and the interface circuit 6 may be connected to the second section of enameled wire 11, where the length of the second section of enameled wire 11 is greater than the length of the first section of enameled wire 10, for example, the total length of the enameled wire of the earphone clamp is 11cm, the length of the first section of enameled wire 10 is 4cm, and the length of the second section of enameled wire 11 is 7 cm. The inductor 9 is connected between the two sections of enameled wires, that is, the inductor 9 is connected in series between the metal probe 7 and the interface circuit 6 and near the metal probe 7, and the closer to the metal probe 7, the more the influence of the enameled wire, which can be eliminated by the inductor 9, on the coupled data is.
Furthermore, the surface of the enameled wire is completely covered with the hot melt adhesive or the enameled wire is completely plastically packaged, so that the position of the enameled wire is better fixed, the position of the enameled wire relative to the fixing frame 5 is fixed, and the distance of the enameled wire relative to the antenna of the shielding box is also fixed, so that the influence on the coupling data is further reduced. And moreover, the enameled wire can be reinforced, and the thin and soft enameled wire is not easy to break. If the inductor 9 is connected in series on the enameled wire, the enameled wire and the inductor 9 are fixed in position by using hot melt adhesive or plastic package.
Further, as shown in fig. 5, a magnet 12 is disposed on the upper surface of the holder 5, and the magnet 12 and the built-in magnet 12 of the TWS bluetooth headset attract each other to firmly attach the TWS bluetooth headset to the holder 5. Specifically, a magnet 12 without metal characteristics is selected, and two magnets 12 are respectively arranged on the extension lines on two sides of the connecting line of the probes of the two metal probes 7.
Further, as shown in fig. 3 and 4, in order to fix the TWS bluetooth headset on the fixing frame 5 more stably, a groove 13 is formed on the upper surface of the fixing frame 5, and the metal probe 7 and the magnet 12 are covered therein, so that the metal probe 7 protrudes out of the groove 13. The shape of this recess 13 can set up according to the whole shape of TWS bluetooth headset to in stuffing the recess 13 completely with TWS bluetooth headset, also can set up according to the shape of earphone pole in the TWS bluetooth headset, only pack into the recess 13 with the earphone pole, and then reduce the degree of difficulty of mount 5 die sinking preparation.
In order to reduce interference to a test when the TWS Bluetooth headset is subjected to a production line test, the headset clamp provided by the embodiment of the invention discards a circuit board and a battery in the fixing frame 5 which is in close contact with the TWS Bluetooth headset, only uses the metal probe 7 to the TWS Bluetooth headset, and arranges the interface circuit 6 at a position which is more than a critical distance away from an antenna of the TWS Bluetooth headset, so that the influence of the circuit board on the performance of the antenna of the TWS Bluetooth headset in the test process is eliminated, and the accuracy of test data is ensured. And moreover, an enameled wire with a small diameter and capable of matching the contact area of the metal probe 7 is used as the lead 8 to connect the metal probe 7 and the interface circuit 6, so that normal connection of the circuit is ensured, and normal power supply can be provided for the TWS Bluetooth headset. In order to eliminate the influence of the position shift of the enameled wire on the test data during the test process, an inductor 9 capable of performing coupling processing is arranged between the metal probe 7 and the interface circuit 6. And in order to further fix the position of the enameled wire, the enameled wire is fixed by using hot melt adhesive or plastic package. In addition, the magnet 12 is adopted to adsorb the TWS Bluetooth headset on the fixing frame 5, so that the situation that the position of an antenna of the TWS Bluetooth headset moves in the test process and the test data is influenced is prevented. In order to further fix the TWS Bluetooth headset, a groove 13 is formed on the upper surface of the fixing frame 5 according to the overall shape of the TWS Bluetooth headset or the shape of a headset rod, so that the TWS Bluetooth headset is completely inserted into the groove 13 for fixing.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
It will be appreciated that the relevant features of the devices described above may be referred to one another. In addition, "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent merits of the embodiments.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed apparatus should not be construed to reflect the intent as follows: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
Those skilled in the art will appreciate that the components of the apparatus of the embodiments may be adapted and arranged in one or more arrangements different from the embodiments. The components of the embodiments may be combined into one component and, in addition, they may be divided into a plurality of sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the components of any apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the following claims, any of the claimed embodiments may be used in any combination. The various component embodiments of the present invention may be implemented in hardware, or in a combination thereof.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or components not listed in a claim. The word "a" or "an" preceding a component or element does not exclude the presence of a plurality of such components or elements. The invention may be implemented by means of an apparatus comprising several distinct elements. In the claims enumerating several means, several of these means may be embodied by one and the same item. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any simple modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are still within the scope of the technical solution of the present invention.

Claims (10)

1. The utility model provides an earphone clamp, includes mount and interface circuit, its characterized in that:
a metal probe is arranged in the fixed frame, one end of a probe of the metal probe protrudes out of the upper surface of the fixed frame and is used for contacting a charging point of a real wireless stereo TWS Bluetooth headset, and the other end of the probe is connected with the interface circuit through a lead; the fixing frame is made of a material without metal characteristics;
the interface circuit is arranged at a position which is more than a critical distance away from the antenna of the TWS Bluetooth headset and is used for connecting an external power supply, and the critical distance is the farthest distance at which the performance of the antenna of the TWS Bluetooth headset can be influenced by the metal characteristics of the interface circuit.
2. The headset clip of claim 1, wherein the metal probe and the interface circuit are connected by a varnished wire.
3. The headset clamp according to claim 2, wherein the surface of the enameled wire is coated with a hot melt adhesive so that the position of the enameled wire is fixed relative to the fixing frame.
4. The headset clamp of claim 2, wherein the enameled wire is plastically encapsulated so that the position of the enameled wire relative to the fixing frame is fixed.
5. The headset clip of claim 2, wherein the length of the enamel wire is 10cm or more.
6. The headset clip of claim 2, further comprising:
and the inductor is connected between the metal probe and the enameled wire in series.
7. The headset clip of claim 6, wherein the inductor is fixed inside the holder.
8. The headset clip of claim 1, wherein the mount comprises:
the magnet, magnet setting is in the upper surface of mount is used for with TWS bluetooth headset adsorbs on the mount.
9. The headset clip of claim 8, wherein the mount comprises:
the groove surrounds the metal probe and the magnet and is formed in the upper surface of the fixing frame, and the shape of the groove is formed according to the shape of the TWS Bluetooth headset.
10. The headset clip of claim 9, wherein the recess is shaped to conform to the shape of a headset stem of the TWS bluetooth headset.
CN201810549399.7A 2018-05-31 2018-05-31 Earphone clamp Active CN108777825B (en)

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CN111343563B (en) * 2020-04-13 2021-07-13 歌尔科技有限公司 Communication testing device and communication testing method of wireless earphone
CN112235708B (en) * 2020-10-29 2022-07-15 深圳市安特信技术有限公司 Testing system and method for earphone production

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