CN108769554B - Array thermal imaging instrument - Google Patents
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- CN108769554B CN108769554B CN201811005090.8A CN201811005090A CN108769554B CN 108769554 B CN108769554 B CN 108769554B CN 201811005090 A CN201811005090 A CN 201811005090A CN 108769554 B CN108769554 B CN 108769554B
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- 238000001931 thermography Methods 0.000 title claims abstract description 17
- 238000003384 imaging method Methods 0.000 claims abstract description 120
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 4
- 238000003860 storage Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
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Abstract
The invention relates to the field of thermal imaging equipment, in particular to an array thermal imager, which comprises a thermal imager body, wherein N lenses are arranged on one side of the thermal imager body, N is a natural number greater than 1, optical axes of the lenses are parallel to each other, and imaging sensors are respectively arranged on the thermal imager body at the positions of the lenses; the imaging sensor array is characterized in that the image field diameter of the lens is larger than the length of the diagonal line of the imaging sensor, each lens and the corresponding imaging sensor are relatively fixed, each imaging sensor is arranged in an array in the lens after each lens is overlapped, and the lens and the imaging sensor are arranged in such a way that adjacent imaging sensors are abutted or partially overlapped. The device has the advantages of ingenious structure and reasonable design, can obtain images with larger image field range, can ensure the precision and accuracy of the images, and is convenient for subsequent processing of the images. Obviously, the invention can effectively meet the demands of people.
Description
Technical field:
the invention relates to the field of thermal imaging equipment, in particular to an array thermal imager.
The background technology is as follows:
because the image can be generated according to the heat of the object, the thermal imager is widely applied to various fields of military, civil use and the like, especially in recent years, along with the continuous progress of unmanned aerial vehicle technology, the application of the thermal imager in unmanned aerial vehicle aerial survey is increasingly increased due to the advantages of high speed, wide range and high precision of unmanned aerial vehicle aerial survey, especially in the fields of military, fire prevention, search and rescue, industrial detection and the like. At present, the thermal imaging instrument is mainly and directly purchased into the existing finished product, because of the limitation of manufacturing cost and technical reasons, the area array size of the imaging sensor of the existing thermal imaging instrument is too small, the acquired image range is narrow, the image field range is narrow, a region to be detected with a large range cannot be handled, for example, when an unmanned aerial vehicle is in navigation, a large image field range cannot be acquired in one measuring point, a plurality of measuring points are required to be arranged continuously, not only shooting and splicing images are complicated, but also because of the instability of heat, the thermal imaging has certain timeliness, the imaging image with a large range is difficult to synthesize, and the application of the thermal imaging technology in navigation is greatly limited.
In order to solve the problem of smaller image field of the thermal imager, attempts are made in the prior art from a plurality of technical angles, and a wide-angle lens is adopted in a patent document CN201420772847.7 to increase the view angle of the whole thermal imager, but the wide-angle lens is adopted to not only form an image with unclear definition, but also enable the whole image to be easily deformed, so that the imaging quality is greatly influenced, and further the use of the image is influenced; at present, some unmanned aerial vehicles carry a plurality of cameras (not night vision) during navigation, and the lenses of the cameras are respectively arranged at different angles to obtain a larger image field range.
Obviously, the existing thermal imaging devices have not been able to effectively meet the needs of people.
The invention comprises the following steps:
the invention provides an array thermal imager which has ingenious structure and reasonable design, can obtain images with larger image field range, can ensure the precision and accuracy of the images, and is convenient for subsequent processing of the images. Obviously, the invention can effectively meet the demands of people.
The technical scheme adopted by the invention for solving the technical problems is as follows: an array thermal imager comprises a thermal imager body, wherein N lenses are arranged on one side of the thermal imager body, N is a natural number larger than 1, optical axes of the lenses are parallel to each other, and imaging sensors are respectively arranged on the thermal imager body at the positions of the lenses; the imaging sensor array is characterized in that the image field diameter of the lens is larger than the length of the diagonal line of the imaging sensor, each lens and the corresponding imaging sensor are relatively fixed, each imaging sensor is arranged in an array in the lens after each lens is overlapped, and the lens and the imaging sensor are arranged in such a way that adjacent imaging sensors are abutted or partially overlapped.
Further, the array is a linear array, three lenses are arranged in total, namely a first lens located at a middle position, a second lens located at the left side and a third lens located at the right side, an imaging sensor corresponding to the first lens is arranged in the middle of an optical axis of the imaging sensor, an imaging sensor corresponding to the second lens is arranged on the left of the optical axis of the imaging sensor, and an imaging sensor corresponding to the third lens is arranged on the right of the optical axis of the imaging sensor.
Further, the thermal imager body includes N storage units and N control units respectively corresponding to the imaging sensors.
Further, the image field diameter of the lens is larger than or equal to the length of a diagonal line when the three imaging sensors are placed side by side; and after the lenses are overlapped, the width of the overlapped area of the two adjacent imaging sensors is more than or equal to one tenth of the width of the imaging sensor.
Further, the lens is detachably connected with the thermal imaging instrument body.
Further, the removable connection is selected from a threaded connection, a bolted connection, a snap connection, or any combination thereof.
Further, a mounting plate is arranged at the corresponding position of the lens in a sliding manner, the sliding direction of the mounting plate is consistent with the length direction of the linear array, and the inner end of the lens penetrates through the mounting plate and penetrates into the inner side of the thermal imager body; wherein, the mounting panel is linked firmly through the retaining member between the thermal imaging instrument body.
Alternatively, the array is a square array.
The invention has the beneficial effects that the structure is ingenious, the design is reasonable, the plurality of lenses with larger image field ranges are arranged, and the images of different areas in the image field ranges are respectively acquired through the image sensors, so that the images with larger image field ranges can be acquired, the precision and the accuracy of the images can be ensured, the subsequent image processing is facilitated, and the influence of aging on imaging can be effectively reduced. Obviously, the invention can effectively meet the demands of people.
Description of the drawings:
fig. 1 is a schematic structural view of a first embodiment of the present invention;
FIG. 2 is a schematic side view of the internal structure of the first embodiment of the present invention;
FIG. 3 is a graph of relative positional relationship between imaging sensors;
FIG. 4 is an image taken by each imaging sensor;
FIG. 5 is an image of each imaging sensor taken with the images superimposed;
FIG. 6 is a view of a stitched image of images captured by each imaging sensor;
FIG. 7 is a schematic diagram of a second embodiment of the present invention;
FIG. 8 is a schematic side view of the internal structure of a second embodiment of the present invention;
FIG. 9 is a schematic side view of a third embodiment of the present invention;
fig. 10 is a schematic view of a structure of a third embodiment of the present invention with a part of a lens removed;
in the figure, 1, a thermal imaging instrument body; 2. a lens; 3. an imaging sensor; 4. a control unit; 5. a storage unit; 7. a mounting plate; 8. a locking member; 9. a bolt; 10. and the elastic abutting block.
The specific embodiment is as follows:
in order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below with reference to the following detailed description and the accompanying drawings.
In a first embodiment, as shown in fig. 1 to 10, an array thermal imager includes a thermal imager body 1, N lenses 2 are provided on one side of the thermal imager body 1, N is an integer greater than 1, optical axes of the lenses are all parallel to each other, and an imaging sensor 3 is provided on the thermal imager body 1 at the position of each lens 2; the image field diameter of the lens 2 is larger than the length of the diagonal line of the imaging sensor 3, each lens 2 and the corresponding imaging sensor 3 are relatively fixed, after each lens 2 is overlapped, each imaging sensor 3 is arranged in an array in the lens 2, and the lens 2 and the imaging sensors 3 are arranged in such a way that adjacent imaging sensors 3 are abutted or partially overlapped.
When the thermal imager is used, as the image field diameter of the lens 2 is larger than the length of the diagonal line of the sensor, compared with the existing thermal imager with a single lens 2 matched with a single imaging sensor 3, the lens 2 can obtain a larger image field, after each lens 2 and the imaging sensor 3 corresponding to the lens 2 are relatively fixed, each imaging sensor 3 is arranged in an array in the lens image field after each lens 2 is overlapped, so that images in a larger image field can be received through the mutual matching of a plurality of imaging sensors 3, and the images obtained by each imaging sensor 3 in one measuring point can be spliced during subsequent processing, so that the images of a larger image field can be obtained in one measuring point;
after the respective lenses 2 are overlapped, the imaging sensors 3 are arrayed in the image field of the lenses 2, and the adjacent imaging sensors 3 are abutted or partially overlapped. Therefore, when long-distance shooting is carried out, the images of the image fields in the lenses are basically consistent, the distance between the images obtained by the imaging sensors 3 is ensured to be zero or extremely small, and the subsequent processing is facilitated; when the adjacent imaging sensors 3 are partially overlapped, the obtained images can be partially overlapped, and the occurrence of operation accidents such as image separation, missing shooting and the like can be prevented;
in addition, because the optical axes of the lenses 2 are all arranged in parallel, when the invention is applied to unmanned aerial vehicle navigation, the lenses 2 can be in a vertical or approximately vertical state, so that the obtained image is a front projection image, the subsequent processing is convenient, and the navigation measurement precision can be effectively ensured; the deformation of the image is small, so that the position of an object on the image can be conveniently determined;
it is worth mentioning that, because the image obtained by the thermal imager has a certain effectiveness, the existing multi-measuring-point and post-stitching imaging method has a high possibility of changing the heat distribution in the region to be photographed in the period from one measuring point to the next measuring point, so that a plurality of difficulties are brought to the subsequent image stitching, image analysis and image positioning. The invention can obtain the images in a larger image field at the position of a measuring point, and the images obtained by the imaging sensors 3 are all shot at the same time, so that the influence of the actual effect on imaging is greatly eliminated to a certain extent.
It should be noted that the image field diameter of the lens is at least greater than the diagonal length of one imaging sensor in the present invention, so that when a plurality of imaging sensors are disposed, more images can be additionally received than one imaging sensor compared with the conventional single-lens, single-imaging sensor arrangement. In some embodiments, the external contour of the image field may be greater than or equal to the overall contour of each imaging sensor when the imaging sensors are abutted and arranged in an array, so that each imaging sensor can be fully utilized. For example, when two lenses are provided, the field diameter of the lens may be greater than or equal to the diagonal length of two imaging sensors placed side by side, or may be slightly greater than the diagonal length of one imaging sensor, and at this time, when the two imaging sensors are arranged in an array in the same lens, a certain overlapping area is provided, and of course, the field diameter of the lens applied here is greater than the field diameter of a single lens dedicated to the imaging sensors, so that a relatively large image may be obtained.
In the present embodiment, the imaging sensor adopts an uncooled micro bolometer focal plane array, and other imaging sensors may be adopted in practical use.
Specifically, in the present embodiment, the array is a linear array, and three lenses 2 are provided, namely, a first lens 2 located at a middle position, a second lens 2 located at a left side, and a third lens 2 located at a right side. Specifically, as shown in the figure, at the first lens 2, an imaging sensor 3 corresponding to the first lens 2 is located at the optical axis of the first lens 2, an imaging sensor 3 corresponding to the second lens 2 is located at the left side of the optical axis of the second lens 2, and the distance between the boundary of the imaging sensor 3 and the optical axis of the second lens 2 is smaller than half of the width of the imaging sensor 3; the imaging sensor 3 corresponding to the third lens 2 is located on the right side of the optical axis of the third lens 2, and the distance between the boundary of the imaging sensor 3 and the optical axis of the third lens 2 is smaller than the half width of the imaging sensor 3.
More specifically, in the present embodiment, in order to ensure the imaging stability and storage stability of each imaging sensor 3 during imaging, the thermal imager body 1 includes N control units 4 corresponding to each imaging sensor 3 and N storage units 5 corresponding to each imaging sensor 3. Each imaging sensor 3 is respectively and electrically connected with a corresponding control unit 4, and each control unit 4 is respectively and electrically connected with a storage unit 5, so that each imaging sensor 3 can be stored and controlled separately, imaging of each imaging sensor is controlled conveniently, data loss is prevented effectively, and heat dissipation of each component is facilitated. When shooting some small areas of the area to be tested, the part of the control unit 4 and the storage unit can be selectively closed, so that the electric quantity loss is reduced.
Specifically, the storage unit and the control unit of the thermal imaging apparatus body 1 are separately disposed in different housings, specifically, may be a conventional thermal imaging apparatus main unit model, and the housings are connected into a whole through an external fixed frame, and the lenses 2 are distributed in an array by being connected with the fixed frame, or are connected with each other. In other embodiments, the control unit 4 and the storage unit 5 of the thermal imager body 1 may be provided in the same housing.
Of course, in some embodiments, the storage unit 5 and the control unit 4 may also be integrated in order to increase the integration level of the whole device. Or, the thermal imager body 1 includes a control unit 4 and N storage units 5 corresponding to the imaging sensors 3, where each imaging sensor 3 is electrically connected to the control unit 4, and the control unit 4 is electrically connected to one storage unit 5, so that each imaging sensor 3 can be separately stored and uniformly controlled, imaging of each imaging sensor is conveniently controlled, data loss is effectively prevented, and heat dissipation of each component is also facilitated.
Specifically, three lenses 2 are arranged in a linear array, in order to make full use of the imaging sensors 3, the image field diameter of the lenses 2 is greater than or equal to the length of the diagonal line when the three imaging sensors 3 are placed side by side, in this embodiment, the image field diameter of the lenses 2 is greater than the length of the diagonal line when the three imaging sensors 3 are placed side by side, and all the three imaging sensors 3 are located in the image field range of the lenses; after the lens 2 is overlapped, the width of the overlapped area of the two adjacent imaging sensors 3 is greater than or equal to one tenth of the width of the imaging sensor 3, which is one tenth in the present embodiment. The arrangement of the lenses 2 and the imaging sensors 3 is shown in fig. 1, the arrangement of the imaging sensors 3 is shown in fig. 3 after the lenses 2 are overlapped, the finally obtained image 4 is shown in fig. 5 after the images are overlapped, and the spliced image is shown in fig. 6. As can be clearly seen from the figures, the shooting angles of the images obtained by the method are consistent, and the images obtained after the images are spliced have a larger image field range.
In some preferred embodiments, the lens 2 is detachably connected to the thermal imager body 1. Therefore, the number of the lenses 2 required to be carried during navigation can be flexibly adjusted according to the range of the area to be shot, and the whole weight of the whole thermal imager can be adjusted.
Specifically, the detachable connection is selected from a threaded connection, a bolted connection, a snap connection, or any combination thereof. In this embodiment, a threaded connection is used.
In the second embodiment, as a further optimization of the above embodiment, as shown in fig. 7 and 8, a mounting plate 7 is slidably disposed at a position corresponding to the lens 2, a sliding direction of the mounting plate 7 is consistent with a length direction of the linear array, and an inner end of the lens 2 passes through the mounting plate 7 and penetrates into an inner side of the thermal imager body 1; wherein, the mounting plate 7 is fixedly connected with the thermal imaging device body 1 through a locking piece 8. In this embodiment, the thermal imaging apparatus body 1 is provided with a space for the lens 2 to move, and the mounting plate can always keep the space closed during the moving process, so that the imaging sensor 3 can be ensured to be in a stable working environment. Therefore, the relative positions of the lenses 2 and the corresponding imaging sensors 3 and the relative positions of the lenses 2 can be adjusted, the overlapping area of the images obtained by the imaging sensors 3 can be adjusted, the image field range of the images obtained by the whole device can be adjusted according to actual shooting requirements, for example, when the area to be aerial survey is relatively small and the heat distribution in the aerial survey area is irregular, the lenses 2 can be adjusted, the overlapping area between the imaging sensors 3 is increased, the image field of the whole device is relatively small, and therefore the requirements of the image field range can be met, the shooting precision of the whole device can be improved through the overlapping area, and the follow-up processing of the images is facilitated.
The sliding connection between the mounting plate 7 and the thermal imager body 1 is as follows, on one side of the mounting plate 7 facing the thermal imager body 1, two sides of the lens 2 are respectively provided with a T-shaped sliding rail, the thermal imager body 1 is relatively provided with a T-shaped sliding groove, the locking piece 8 comprises a bolt 9 screwed with the mounting plate 7, and one side of the bolt 9 facing the thermal imager body 1 is movably provided with an elastic abutting block 10. In order to ensure tightness between the mounting plate 7 and the thermal imager body 1, an elastic layer is arranged between the mounting plate 7 and the thermal imager body 1, a concave cavity for accommodating the elastic abutting block 10 is arranged on the mounting plate 7 at the elastic abutting block 10, and when the relative position between the mounting plate 7 and the thermal imager body 1 needs to be locked, only the bolt 9 needs to be screwed inwards to tightly abut against the elastic abutting block 10 and the thermal imager body 1.
In the third embodiment, as shown in fig. 9, the array is a square array, and four lenses 2 are provided in total, each lens is arranged in a matrix, and the corresponding imaging sensors in each lens are also arranged in a matrix. Each lens 2 is located at four corners of a square centered on the center position of the imaging sensor. In practical use, the array mode of the imaging sensor 3 can also be determined according to the aerial survey requirement, for example, in order to improve the utilization rate of the image field of the lens 2, a circumferential array mode can be adopted. If the lens 2 is detachably connected, as shown in fig. 10, a part of the lens 2 can be removed according to design requirements, and the lens can be converted into a thermal imager for obtaining a linear array image.
In addition, in the above embodiment, each lens is arranged in an array manner, and in actual use, the arrangement of the lenses can be arranged according to actual requirements, for example, in order to make the structure compact, reduce the influence of deviation between image fields of the lenses on imaging, the lenses can be arranged in a circumferential array, each lens sensor is relatively fixed with its corresponding imaging sensor, and each imaging sensor is arranged in a linear array manner or a square array manner in the lenses after each lens is overlapped.
The above embodiments are not to be taken as limiting the scope of the invention, and any alternatives or modifications to the embodiments of the invention will be apparent to those skilled in the art and fall within the scope of the invention.
The present invention is not described in detail in the present application, and is well known to those skilled in the art.
Claims (3)
1. The array thermal imager is characterized by comprising a thermal imager body, wherein N lenses are arranged on one side of the thermal imager body, N is a natural number larger than 1, optical axes of the lenses are parallel to each other, imaging sensors are respectively arranged on the thermal imager body at the positions of the lenses, wherein the image field diameter of each lens is larger than the length of a diagonal line of the imaging sensor, the lenses and the corresponding imaging sensors are relatively fixed, and after the lenses are overlapped, the imaging sensors are arrayed in the lenses;
the array is a linear array and is provided with three lenses, namely a first lens positioned in a middle position, a second lens positioned on the left side and a third lens positioned on the right side, wherein an imaging sensor corresponding to the first lens is arranged in the middle of an optical axis of the imaging sensor, an imaging sensor corresponding to the second lens is arranged on the left of the optical axis of the imaging sensor, and an imaging sensor corresponding to the third lens is arranged on the right of the optical axis of the imaging sensor;
the imaging sensor is arranged on the front surface of the lens, the imaging field diameter of the lens is larger than or equal to the length of a diagonal line when the three imaging sensors are arranged side by side, each lens and the corresponding imaging sensor are relatively fixed, and after each lens is overlapped, the width of the overlapping area of two adjacent imaging sensors is larger than or equal to the width of one tenth of the imaging sensor;
the lens is detachably connected with the thermal imaging instrument body;
the detachable connection is selected from threaded connection, bolt connection, clamping connection or any combination thereof;
the lens is provided with a mounting plate in a sliding manner at the corresponding position, the sliding direction of the mounting plate is consistent with the length direction of the linear array, and the inner end of the lens penetrates through the mounting plate and penetrates into the inner side of the thermal imager body.
2. The array thermal imager of claim 1, wherein the thermal imager body includes N memory units and N control units corresponding to each imaging sensor.
3. The array thermal imager of claim 1, wherein the array is a square array.
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| CN201811005090.8A CN108769554B (en) | 2018-08-30 | 2018-08-30 | Array thermal imaging instrument |
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| CN201811005090.8A CN108769554B (en) | 2018-08-30 | 2018-08-30 | Array thermal imaging instrument |
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| CN113992857B (en) * | 2021-12-06 | 2022-03-18 | 北京拙河科技有限公司 | Image acquisition, identification and classified storage method and device based on billion-level pixels |
| CN114222063B (en) * | 2021-12-16 | 2022-11-08 | 北京拙河科技有限公司 | Method and device for processing picture and video data of hundred million-level pixels |
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| KR101751140B1 (en) * | 2015-12-24 | 2017-06-26 | 삼성전기주식회사 | Image sensor and camera module |
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| CN101294804A (en) * | 2008-06-20 | 2008-10-29 | 北京大学 | Digital airborne photography system |
| CN104301590A (en) * | 2014-09-28 | 2015-01-21 | 中国科学院长春光学精密机械与物理研究所 | Three-lens detector array video acquisition device |
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