CN108760892A - A kind of AE signal detection system devices of ultra thin plate microsecond delay mold - Google Patents
A kind of AE signal detection system devices of ultra thin plate microsecond delay mold Download PDFInfo
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- CN108760892A CN108760892A CN201810521919.3A CN201810521919A CN108760892A CN 108760892 A CN108760892 A CN 108760892A CN 201810521919 A CN201810521919 A CN 201810521919A CN 108760892 A CN108760892 A CN 108760892A
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- 238000001514 detection method Methods 0.000 title claims abstract description 63
- 238000004458 analytical method Methods 0.000 claims abstract description 29
- 238000004891 communication Methods 0.000 claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 16
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 4
- 230000008054 signal transmission Effects 0.000 claims description 8
- 238000007689 inspection Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 6
- 238000010183 spectrum analysis Methods 0.000 claims description 6
- 230000003321 amplification Effects 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims 1
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- 238000005516 engineering process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
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Abstract
It is disclosed by the invention to belong to micro-plasticity forming and signal detection technique field,The AE signal detection system devices of specially a kind of ultra thin plate microsecond delay mold,Including AE sensor nodes,The output end of the AE sensor nodes is electrically connected the input terminal of detection base station,The output end of the detection base station is electrically connected the input terminal of wireless communication module,The output end of the wireless communication module is electrically connected the input terminal of detection computer,The input terminal of alarm module and print module is electrically connected in the output end of the detection computer,The detection computer bidirectional is electrically connected signal analysis module,A kind of AE signal detection system devices for ultra thin plate microsecond delay mold that the invention proposes,It is easily installed and removes,Save set-up time and expense,It is easy to use,Pass through the processing to detecting signal,Improve accuracy of detection,Realize the detection to small damage,It can also realize the positioning to damage position,Meet and uses needs.
Description
Technical field
The present invention relates to micro-plasticity forming and signal detection technique field, specially a kind of AE of ultra thin plate microsecond delay mold
Signal detection system device.
Background technology
Microsecond delay manufacturing technology is for producing overall dimension or feature functionality area or tolerance with millimeter even micron
The product of meter, for the microsecond delay of ultra thin plate, drip molding is easy to will appear the fine crack that naked eyes cannot be shown in, this
The fine crack that naked eyes cannot be shown in can be because the series of factors such as stress, vibration, environment be further during the use of product
Extension, forms larger crack, it will it is to cause to surpass to cause unpredictable economic loss, the damage of ultra thin plate microsecond delay mold
Thin plate generates the major reason of fine crack, therefore needs to be detected ultra thin plate microsecond delay mold, existing detection device inspection
It is low to survey precision, is not easy to operate, and cost is higher, for this purpose, it is proposed that a kind of AE signal detections of ultra thin plate microsecond delay mold
System and device.
Invention content
The purpose of the present invention is to provide a kind of AE signal detection system devices of ultra thin plate microsecond delay mold, in solution
It is low to state the existing detection device accuracy of detection proposed in background technology, is not easy to operate, and the higher problem of cost.
To achieve the above object, the present invention provides the following technical solutions:A kind of AE signals inspection of ultra thin plate microsecond delay mold
Examining system device, including AE sensor nodes, the output end of the AE sensor nodes are electrically connected the input terminal of detection base station,
The output end of the detection base station is electrically connected the input terminal of wireless communication module, and the output end of the wireless communication module is electrical
Alarm module and print module is electrically connected in the output end of the input terminal of connecting detection computer, the detection computer
Input terminal, the detection computer bidirectional are electrically connected signal analysis module;
The damage check to different location on ultra thin plate microsecond delay mold is carried out by multigroup AE sensor nodes, and
Detection data is transmitted to the detection base station, summarizing and count to the data of acquisition is realized in the detection base station, and passes through
Data are wirelessly transmitted to the detection computer by the wireless communication module, by the signal analysis module to the number of acquisition
According to being handled and being analyzed, when the data of detection are more than threshold value, alarm module is alarmed, and is realized by the print module
Printing to detection data.
Preferably, the AE sensor nodes include AE sensors, and the output end of the AE sensors is electrically connected micro- place
The input terminal of device is managed, the output end of the microprocessor is electrically connected the input terminal of communication module, the two-way electricity of microprocessor
Property connection signal processing module, the input terminal of the AE sensors, microprocessor and communication module are electrically connected power module
Output end;
The AE sensors are measured in real time the AE signals sent out when ultra thin plate microsecond delay mold work, and will inspection
For the signal transmission of survey to the microprocessor, the microprocessor realizes signal acquisition and pretreatment to detection, the signal
Processing of the processing modules implement to signal, and by the communication module realize will treated signal transmission to the detection base
It stands, the power module is that entire AE sensor nodes are powered.
Preferably, the signal processing module includes preamplifier, and the output end of the preamplifier is electrically connected
The input terminal of AE converters, the output end of the AE converters are electrically connected the input terminal of amplitude device, the output of the amplitude device
End is electrically connected the input terminal of bandpass filter;
The signal preamplifier realizes that the amplification to the small-signal of reception, the AE converters are realized to AE signals
Format conversion, and by transformed signal transmission to the amplitude device, the amplitude device realizes the amplitude modulation to AE signals,
And it is transmitted to the bandpass filter and carries out signal filtering.
Preferably, the signal analysis module includes wavelet analysis module, spectrum analysis module and positioning analysis module, institute
It states wavelet analysis module and multi-scale refinement is gradually carried out to signal by flexible shift operations, it is thin to be finally reached the high frequency treatment time
Point, frequency is segmented at low frequency, and multiple noise number is decomposed into compared with simple signal by the spectrum analysis module, the positioning analysis module
Realize the positioning analysis to damage position on ultra thin plate microsecond delay mold.
Preferably, the wavelet analysis module includes wave speed measurement module and peak value measurement module.
Compared with prior art, the beneficial effects of the invention are as follows:A kind of ultra thin plate microsecond delay mold that the invention proposes
AE signal detection system devices, are easily installed and remove, and save set-up time and expense, easy to use, by detecting signal
Processing, improve accuracy of detection, realize the detection to small damage, additionally it is possible to realize the positioning to damage position, meet
Use needs.
Description of the drawings
Fig. 1 is principle of the invention block diagram;
Fig. 2 is AE sensor nodes functional block diagram of the present invention;
Fig. 3 is signal processing module functional block diagram of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of AE signal detections system of ultra thin plate microsecond delay mold
Bulk cargo is set, including AE sensor nodes, and the output end of the AE sensor nodes is electrically connected the input terminal of detection base station, described
The output end for detecting base station is electrically connected the input terminal of wireless communication module, and the output end of the wireless communication module is electrically connected
The input terminal of computer is detected, the input of alarm module and print module is electrically connected in the output end of the detection computer
End, the detection computer bidirectional are electrically connected signal analysis module;
The damage check to different location on ultra thin plate microsecond delay mold is carried out by multigroup AE sensor nodes, and
Detection data is transmitted to the detection base station, summarizing and count to the data of acquisition is realized in the detection base station, and passes through
Data are wirelessly transmitted to the detection computer by the wireless communication module, by the signal analysis module to the number of acquisition
According to being handled and being analyzed, when the data of detection are more than threshold value, alarm module is alarmed, and is realized by the print module
Printing to detection data.
Wherein, the AE sensor nodes include AE sensors, and the output end of the AE sensors is electrically connected microprocessor
The input terminal of device, the output end of the microprocessor are electrically connected the input terminal of communication module, and the microprocessor is two-way electrically
The input terminal of connection signal processing module, the AE sensors, microprocessor and communication module is electrically connected power module
Output end;The AE sensors are measured in real time the AE signals sent out when ultra thin plate microsecond delay mold work, and will inspection
For the signal transmission of survey to the microprocessor, the microprocessor realizes signal acquisition and pretreatment to detection, the signal
Processing of the processing modules implement to signal, and by the communication module realize will treated signal transmission to the detection base
It stands, the power module is that entire AE sensor nodes are powered, and the signal processing module includes preamplifier, described
The output end of preamplifier is electrically connected the input terminal of AE converters, and the output end of the AE converters is electrically connected amplitude device
Input terminal, the output end of the amplitude device is electrically connected the input terminal of bandpass filter;The signal preamplifier is realized
Amplification to the small-signal of reception, the AE converters realize the format conversion to AE signals, and transformed signal is passed
The amplitude device is transported to, the amplitude device realizes the amplitude modulation to AE signals, and is transmitted to the bandpass filter and carries out letter
Number filtering.The signal analysis module includes wavelet analysis module, spectrum analysis module and positioning analysis module, the small wavelength-division
Analysis module gradually carries out multi-scale refinement by flexible shift operations to signal, is finally reached high frequency treatment time subdivision, at low frequency
Frequency is segmented, and multiple noise number is decomposed into compared with simple signal by the spectrum analysis module, and the positioning analysis module is realized to super
The positioning analysis of damage position on thin plate microsecond delay mold, the wavelet analysis module include wave speed measurement module and peak value measurement
Module.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold, including AE sensor nodes, it is characterised in that:Institute
The output end for stating AE sensor nodes is electrically connected the input terminal of detection base station, and the output end of the detection base station is electrically connected nothing
The input terminal of line communication module, the output end of the wireless communication module are electrically connected the input terminal of detection computer, the inspection
The input terminal of alarm module and print module is electrically connected in the output end for surveying computer, and the detection computer bidirectional is electrical
Connection signal analysis module;
The damage check to different location on ultra thin plate microsecond delay mold is carried out by multigroup AE sensor nodes, and will inspection
Measured data is transmitted to the detection base station, and summarizing and count to the data of acquisition is realized in the detection base station, and by described
Data are wirelessly transmitted to the detection computer by wireless communication module, by the signal analysis module to the data of acquisition into
Row processing and analysis, when the data of detection are more than threshold value, alarm module is alarmed, and is realized to inspection by the print module
The printing of measured data.
2. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 1, it is characterised in that:
The AE sensor nodes include AE sensors, and the output end of the AE sensors is electrically connected the input terminal of microprocessor, institute
The output end for stating microprocessor is electrically connected the input terminal of communication module, the two-way electric connection signal processing mould of microprocessor
Block, the input terminal of the AE sensors, microprocessor and communication module are electrically connected the output end of power module;
The AE sensors are measured in real time the AE signals sent out when ultra thin plate microsecond delay mold work, and by detection
For signal transmission to the microprocessor, the microprocessor realizes signal acquisition and pretreatment to detection, the signal processing
Module realizes processing to signal, and by the communication module realize will treated signal transmission to the detection base station,
The power module is that entire AE sensor nodes are powered.
3. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 2, it is characterised in that:
The signal processing module includes preamplifier, and the output end of the preamplifier is electrically connected the input of AE converters
End, the output end of the AE converters are electrically connected the input terminal of amplitude device, and the output end of the amplitude device is electrically connected band logical
The input terminal of filter;
The signal preamplifier realizes that the lattice to AE signals are realized in the amplification to the small-signal of reception, the AE converters
Formula is converted, and by transformed signal transmission to the amplitude device, the amplitude device realizes the amplitude modulation to AE signals, and passes
It transports to the bandpass filter and carries out signal filtering.
4. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 1, it is characterised in that:
The signal analysis module includes wavelet analysis module, spectrum analysis module and positioning analysis module, the wavelet analysis module
Multi-scale refinement is gradually carried out to signal by flexible shift operations, is finally reached high frequency treatment time subdivision, frequency fine at low frequency
Point, multiple noise number is decomposed into compared with simple signal by the spectrum analysis module, and the positioning analysis module is realized micro- to ultra thin plate
The positioning analysis of damage position on shaping dies.
5. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 4, it is characterised in that:
The wavelet analysis module includes wave speed measurement module and peak value measurement module.
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CN102814957A (en) * | 2012-08-10 | 2012-12-12 | 浙江工业大学 | Embedded type mold protection system and method based on ZigBee network |
CN103743821A (en) * | 2013-12-20 | 2014-04-23 | 江苏大学 | AE (acoustic emission) signal detection system device and method of ultrathin plate micro-forming mold |
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CN102814957A (en) * | 2012-08-10 | 2012-12-12 | 浙江工业大学 | Embedded type mold protection system and method based on ZigBee network |
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