CN108760892A - A kind of AE signal detection system devices of ultra thin plate microsecond delay mold - Google Patents

A kind of AE signal detection system devices of ultra thin plate microsecond delay mold Download PDF

Info

Publication number
CN108760892A
CN108760892A CN201810521919.3A CN201810521919A CN108760892A CN 108760892 A CN108760892 A CN 108760892A CN 201810521919 A CN201810521919 A CN 201810521919A CN 108760892 A CN108760892 A CN 108760892A
Authority
CN
China
Prior art keywords
signal
detection
module
electrically connected
output end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810521919.3A
Other languages
Chinese (zh)
Inventor
赵淑珍
闫建新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heze City Products Inspection And Testing Institute
Original Assignee
Heze City Products Inspection And Testing Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heze City Products Inspection And Testing Institute filed Critical Heze City Products Inspection And Testing Institute
Priority to CN201810521919.3A priority Critical patent/CN108760892A/en
Publication of CN108760892A publication Critical patent/CN108760892A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

It is disclosed by the invention to belong to micro-plasticity forming and signal detection technique field,The AE signal detection system devices of specially a kind of ultra thin plate microsecond delay mold,Including AE sensor nodes,The output end of the AE sensor nodes is electrically connected the input terminal of detection base station,The output end of the detection base station is electrically connected the input terminal of wireless communication module,The output end of the wireless communication module is electrically connected the input terminal of detection computer,The input terminal of alarm module and print module is electrically connected in the output end of the detection computer,The detection computer bidirectional is electrically connected signal analysis module,A kind of AE signal detection system devices for ultra thin plate microsecond delay mold that the invention proposes,It is easily installed and removes,Save set-up time and expense,It is easy to use,Pass through the processing to detecting signal,Improve accuracy of detection,Realize the detection to small damage,It can also realize the positioning to damage position,Meet and uses needs.

Description

A kind of AE signal detection system devices of ultra thin plate microsecond delay mold
Technical field
The present invention relates to micro-plasticity forming and signal detection technique field, specially a kind of AE of ultra thin plate microsecond delay mold Signal detection system device.
Background technology
Microsecond delay manufacturing technology is for producing overall dimension or feature functionality area or tolerance with millimeter even micron The product of meter, for the microsecond delay of ultra thin plate, drip molding is easy to will appear the fine crack that naked eyes cannot be shown in, this The fine crack that naked eyes cannot be shown in can be because the series of factors such as stress, vibration, environment be further during the use of product Extension, forms larger crack, it will it is to cause to surpass to cause unpredictable economic loss, the damage of ultra thin plate microsecond delay mold Thin plate generates the major reason of fine crack, therefore needs to be detected ultra thin plate microsecond delay mold, existing detection device inspection It is low to survey precision, is not easy to operate, and cost is higher, for this purpose, it is proposed that a kind of AE signal detections of ultra thin plate microsecond delay mold System and device.
Invention content
The purpose of the present invention is to provide a kind of AE signal detection system devices of ultra thin plate microsecond delay mold, in solution It is low to state the existing detection device accuracy of detection proposed in background technology, is not easy to operate, and the higher problem of cost.
To achieve the above object, the present invention provides the following technical solutions:A kind of AE signals inspection of ultra thin plate microsecond delay mold Examining system device, including AE sensor nodes, the output end of the AE sensor nodes are electrically connected the input terminal of detection base station, The output end of the detection base station is electrically connected the input terminal of wireless communication module, and the output end of the wireless communication module is electrical Alarm module and print module is electrically connected in the output end of the input terminal of connecting detection computer, the detection computer Input terminal, the detection computer bidirectional are electrically connected signal analysis module;
The damage check to different location on ultra thin plate microsecond delay mold is carried out by multigroup AE sensor nodes, and Detection data is transmitted to the detection base station, summarizing and count to the data of acquisition is realized in the detection base station, and passes through Data are wirelessly transmitted to the detection computer by the wireless communication module, by the signal analysis module to the number of acquisition According to being handled and being analyzed, when the data of detection are more than threshold value, alarm module is alarmed, and is realized by the print module Printing to detection data.
Preferably, the AE sensor nodes include AE sensors, and the output end of the AE sensors is electrically connected micro- place The input terminal of device is managed, the output end of the microprocessor is electrically connected the input terminal of communication module, the two-way electricity of microprocessor Property connection signal processing module, the input terminal of the AE sensors, microprocessor and communication module are electrically connected power module Output end;
The AE sensors are measured in real time the AE signals sent out when ultra thin plate microsecond delay mold work, and will inspection For the signal transmission of survey to the microprocessor, the microprocessor realizes signal acquisition and pretreatment to detection, the signal Processing of the processing modules implement to signal, and by the communication module realize will treated signal transmission to the detection base It stands, the power module is that entire AE sensor nodes are powered.
Preferably, the signal processing module includes preamplifier, and the output end of the preamplifier is electrically connected The input terminal of AE converters, the output end of the AE converters are electrically connected the input terminal of amplitude device, the output of the amplitude device End is electrically connected the input terminal of bandpass filter;
The signal preamplifier realizes that the amplification to the small-signal of reception, the AE converters are realized to AE signals Format conversion, and by transformed signal transmission to the amplitude device, the amplitude device realizes the amplitude modulation to AE signals, And it is transmitted to the bandpass filter and carries out signal filtering.
Preferably, the signal analysis module includes wavelet analysis module, spectrum analysis module and positioning analysis module, institute It states wavelet analysis module and multi-scale refinement is gradually carried out to signal by flexible shift operations, it is thin to be finally reached the high frequency treatment time Point, frequency is segmented at low frequency, and multiple noise number is decomposed into compared with simple signal by the spectrum analysis module, the positioning analysis module Realize the positioning analysis to damage position on ultra thin plate microsecond delay mold.
Preferably, the wavelet analysis module includes wave speed measurement module and peak value measurement module.
Compared with prior art, the beneficial effects of the invention are as follows:A kind of ultra thin plate microsecond delay mold that the invention proposes AE signal detection system devices, are easily installed and remove, and save set-up time and expense, easy to use, by detecting signal Processing, improve accuracy of detection, realize the detection to small damage, additionally it is possible to realize the positioning to damage position, meet Use needs.
Description of the drawings
Fig. 1 is principle of the invention block diagram;
Fig. 2 is AE sensor nodes functional block diagram of the present invention;
Fig. 3 is signal processing module functional block diagram of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of AE signal detections system of ultra thin plate microsecond delay mold Bulk cargo is set, including AE sensor nodes, and the output end of the AE sensor nodes is electrically connected the input terminal of detection base station, described The output end for detecting base station is electrically connected the input terminal of wireless communication module, and the output end of the wireless communication module is electrically connected The input terminal of computer is detected, the input of alarm module and print module is electrically connected in the output end of the detection computer End, the detection computer bidirectional are electrically connected signal analysis module;
The damage check to different location on ultra thin plate microsecond delay mold is carried out by multigroup AE sensor nodes, and Detection data is transmitted to the detection base station, summarizing and count to the data of acquisition is realized in the detection base station, and passes through Data are wirelessly transmitted to the detection computer by the wireless communication module, by the signal analysis module to the number of acquisition According to being handled and being analyzed, when the data of detection are more than threshold value, alarm module is alarmed, and is realized by the print module Printing to detection data.
Wherein, the AE sensor nodes include AE sensors, and the output end of the AE sensors is electrically connected microprocessor The input terminal of device, the output end of the microprocessor are electrically connected the input terminal of communication module, and the microprocessor is two-way electrically The input terminal of connection signal processing module, the AE sensors, microprocessor and communication module is electrically connected power module Output end;The AE sensors are measured in real time the AE signals sent out when ultra thin plate microsecond delay mold work, and will inspection For the signal transmission of survey to the microprocessor, the microprocessor realizes signal acquisition and pretreatment to detection, the signal Processing of the processing modules implement to signal, and by the communication module realize will treated signal transmission to the detection base It stands, the power module is that entire AE sensor nodes are powered, and the signal processing module includes preamplifier, described The output end of preamplifier is electrically connected the input terminal of AE converters, and the output end of the AE converters is electrically connected amplitude device Input terminal, the output end of the amplitude device is electrically connected the input terminal of bandpass filter;The signal preamplifier is realized Amplification to the small-signal of reception, the AE converters realize the format conversion to AE signals, and transformed signal is passed The amplitude device is transported to, the amplitude device realizes the amplitude modulation to AE signals, and is transmitted to the bandpass filter and carries out letter Number filtering.The signal analysis module includes wavelet analysis module, spectrum analysis module and positioning analysis module, the small wavelength-division Analysis module gradually carries out multi-scale refinement by flexible shift operations to signal, is finally reached high frequency treatment time subdivision, at low frequency Frequency is segmented, and multiple noise number is decomposed into compared with simple signal by the spectrum analysis module, and the positioning analysis module is realized to super The positioning analysis of damage position on thin plate microsecond delay mold, the wavelet analysis module include wave speed measurement module and peak value measurement Module.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace And modification, the scope of the present invention is defined by the appended.

Claims (5)

1. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold, including AE sensor nodes, it is characterised in that:Institute The output end for stating AE sensor nodes is electrically connected the input terminal of detection base station, and the output end of the detection base station is electrically connected nothing The input terminal of line communication module, the output end of the wireless communication module are electrically connected the input terminal of detection computer, the inspection The input terminal of alarm module and print module is electrically connected in the output end for surveying computer, and the detection computer bidirectional is electrical Connection signal analysis module;
The damage check to different location on ultra thin plate microsecond delay mold is carried out by multigroup AE sensor nodes, and will inspection Measured data is transmitted to the detection base station, and summarizing and count to the data of acquisition is realized in the detection base station, and by described Data are wirelessly transmitted to the detection computer by wireless communication module, by the signal analysis module to the data of acquisition into Row processing and analysis, when the data of detection are more than threshold value, alarm module is alarmed, and is realized to inspection by the print module The printing of measured data.
2. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 1, it is characterised in that: The AE sensor nodes include AE sensors, and the output end of the AE sensors is electrically connected the input terminal of microprocessor, institute The output end for stating microprocessor is electrically connected the input terminal of communication module, the two-way electric connection signal processing mould of microprocessor Block, the input terminal of the AE sensors, microprocessor and communication module are electrically connected the output end of power module;
The AE sensors are measured in real time the AE signals sent out when ultra thin plate microsecond delay mold work, and by detection For signal transmission to the microprocessor, the microprocessor realizes signal acquisition and pretreatment to detection, the signal processing Module realizes processing to signal, and by the communication module realize will treated signal transmission to the detection base station, The power module is that entire AE sensor nodes are powered.
3. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 2, it is characterised in that: The signal processing module includes preamplifier, and the output end of the preamplifier is electrically connected the input of AE converters End, the output end of the AE converters are electrically connected the input terminal of amplitude device, and the output end of the amplitude device is electrically connected band logical The input terminal of filter;
The signal preamplifier realizes that the lattice to AE signals are realized in the amplification to the small-signal of reception, the AE converters Formula is converted, and by transformed signal transmission to the amplitude device, the amplitude device realizes the amplitude modulation to AE signals, and passes It transports to the bandpass filter and carries out signal filtering.
4. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 1, it is characterised in that: The signal analysis module includes wavelet analysis module, spectrum analysis module and positioning analysis module, the wavelet analysis module Multi-scale refinement is gradually carried out to signal by flexible shift operations, is finally reached high frequency treatment time subdivision, frequency fine at low frequency Point, multiple noise number is decomposed into compared with simple signal by the spectrum analysis module, and the positioning analysis module is realized micro- to ultra thin plate The positioning analysis of damage position on shaping dies.
5. a kind of AE signal detection system devices of ultra thin plate microsecond delay mold according to claim 4, it is characterised in that: The wavelet analysis module includes wave speed measurement module and peak value measurement module.
CN201810521919.3A 2018-05-28 2018-05-28 A kind of AE signal detection system devices of ultra thin plate microsecond delay mold Pending CN108760892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810521919.3A CN108760892A (en) 2018-05-28 2018-05-28 A kind of AE signal detection system devices of ultra thin plate microsecond delay mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810521919.3A CN108760892A (en) 2018-05-28 2018-05-28 A kind of AE signal detection system devices of ultra thin plate microsecond delay mold

Publications (1)

Publication Number Publication Date
CN108760892A true CN108760892A (en) 2018-11-06

Family

ID=64006258

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810521919.3A Pending CN108760892A (en) 2018-05-28 2018-05-28 A kind of AE signal detection system devices of ultra thin plate microsecond delay mold

Country Status (1)

Country Link
CN (1) CN108760892A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101532902A (en) * 2009-04-14 2009-09-16 江苏大学 Quality-monitoring and fault-diagnosing method for cold-punching mold
CN101656078A (en) * 2009-08-26 2010-02-24 深圳市冠旭电子有限公司 Method, device and system for treating noise
CN102814957A (en) * 2012-08-10 2012-12-12 浙江工业大学 Embedded type mold protection system and method based on ZigBee network
CN103743821A (en) * 2013-12-20 2014-04-23 江苏大学 AE (acoustic emission) signal detection system device and method of ultrathin plate micro-forming mold
CN204536865U (en) * 2014-11-13 2015-08-05 台州市黄岩精英设计有限公司 Mould of plastics operating mode real-time inspection and control system
CN106774215A (en) * 2016-12-31 2017-05-31 重庆市搏润模具有限公司 A kind of long-range mould control system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101532902A (en) * 2009-04-14 2009-09-16 江苏大学 Quality-monitoring and fault-diagnosing method for cold-punching mold
CN101656078A (en) * 2009-08-26 2010-02-24 深圳市冠旭电子有限公司 Method, device and system for treating noise
CN102814957A (en) * 2012-08-10 2012-12-12 浙江工业大学 Embedded type mold protection system and method based on ZigBee network
CN103743821A (en) * 2013-12-20 2014-04-23 江苏大学 AE (acoustic emission) signal detection system device and method of ultrathin plate micro-forming mold
CN204536865U (en) * 2014-11-13 2015-08-05 台州市黄岩精英设计有限公司 Mould of plastics operating mode real-time inspection and control system
CN106774215A (en) * 2016-12-31 2017-05-31 重庆市搏润模具有限公司 A kind of long-range mould control system

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
单德彬 等: "金属薄板微成型技术的研究进展", 《塑性工程学报》 *
卢文祥 等: "《工程测试与信息处理》", 31 August 1994 *
江俊: "基于SSI的远程模具信息管理系统的设计与实现", 《中国优秀硕士学位论文全文数据库 信息科技辑》 *
祝奔奔 等: "基于声发射技术的锚杆腐蚀的检测与信号处理研究", 《软件》 *
第十五届中国国际模展模具评定评述专家组: "第十五届中国国际模具技术和设备展览会模具水平评述", 《电加工与模具》 *
米永东 等: "基于大数据和物联网技术的模具维修保养系统", 《模具工业》 *

Similar Documents

Publication Publication Date Title
CN205506984U (en) Power transmission line insulator leakage current on -line monitoring system
CN203502545U (en) Cable fault detector
CN105445535A (en) Digital current transducer and detection device
CN110823283A (en) Capacitance and temperature signal sensor
CN116087689A (en) Cable fault detection device and method based on optical fiber synchronization
CN104458905A (en) Internet-of-things atmospheric pollution monitoring device based on surface acoustic wave sensor
CN108760892A (en) A kind of AE signal detection system devices of ultra thin plate microsecond delay mold
CN204007928U (en) Power cable connector running temperature measurement mechanism based on surface acoustic wave
CN203798466U (en) Operating temperature measuring device based on surface acoustic wave for conductor connection point in switch cabinet
CN107911119A (en) A kind of gathered data processing system applied to security monitoring device
CN204556030U (en) Multiple sensor signals acquisition processing device
CN103472376B (en) Partial discharge of transformer superfrequency positioning analysis device and method for positioning analyzing thereof
CN203490294U (en) High power multi-port measurement apparatus
CN203489833U (en) Digital display measuring tool with wireless transmission function
CN202916243U (en) Bus duct operating condition real-time wireless monitoring system
CN204439206U (en) Low-consumption wireless vibration monitoring device
CN102914248B (en) Passive type linear encoder
CN203231763U (en) Environment monitoring prompting device
CN219456507U (en) Multichannel weak narrow pulse signal acquisition device
CN206258695U (en) Environmental test chamber wireless monitoring device
CN211698051U (en) Partial discharge monitoring system
CN203761384U (en) 2.4GHz radio frequency transmit-receive apparatus
CN205229288U (en) Digit type current transmitter and detection equipment
CN212363630U (en) Pressure vessel monitoring device
CN204833663U (en) Press data management ware

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20181106

RJ01 Rejection of invention patent application after publication