CN108760124A - A kind of PCBA-BGA chip adaptability to changes method for measurement - Google Patents
A kind of PCBA-BGA chip adaptability to changes method for measurement Download PDFInfo
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- CN108760124A CN108760124A CN201810521424.0A CN201810521424A CN108760124A CN 108760124 A CN108760124 A CN 108760124A CN 201810521424 A CN201810521424 A CN 201810521424A CN 108760124 A CN108760124 A CN 108760124A
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- Prior art keywords
- pcba
- adaptability
- test
- bga chip
- bga
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/08—Shock-testing
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
A kind of PCBA-BGAchip adaptabilitys to changes method for measurement, includes the following steps：1), foil gauge is installed；2), board installation and system assembles；3), joint sealing, be packaged and weigh；4), drop test；5) test result acquisition, comparison, analysis.Using dynamic strain indicator, triaxial stress piece, G Value Datas collector and falling tester, accurately measure server after drop test each PCBA-BAG chip by adaptability to changes.It simultaneously can be with the method come digging mechanism design, the welding procedure risk for causing BGA tin balls to be broken such as bad.BGA stress tests are executed, improve the risk with the tin ball fracture of the corners prevention BGA ahead of time.
Description
Technical field
The present invention relates to circuit board testing technical field, more particularly to a kind of PCBA-BGA chip adaptability to changes method for measurement.
Background technology
With the fast-developing and highdensity requirement of server industries, first device such as BGA welded ball arrays encapsulation on board
The volume of part encapsulation is also smaller and smaller, at the same industry one after another response to the environmentally protective demand to leadless process, the devices such as BGA with
The increase for connecting the also solder crack odds caused by the plate excessively in manufacturing process is curved of PCB.
Cross plate it is curved caused by may be incomplete solder crack phenomenon, and this incomplete solder crack is produced in PCB, transport and test
In may not be able to be found, then also not necessarily just will appear failure using initial stage at user scene end；When product is subjected to
After the use of the various environment of user (vibration, mechanical shock, temperature change etc.) or after transport, solder crack phenomenon may add
Play, therefore the failure of client feedback also can be more and more.Incomplete solder crack can't lead to imminent failure, therefore general
Functional test cannot detect it is bad, need by some it is destructive test quickly excitation excavation problem.
In entire product turnout transit link, packaging, which is fallen, can trigger larger board adaptability to changes and cause BGA that may go out
Existing tin ball solder crack, therefore should consider that introducing dynamic strain power tests in the design phase for the larger PCBA of risk.
Invention content
To overcome problems of the prior art, the present invention provides a kind of PCBA-BGA chip (printed circuit boards-
Spherical matrix package chip) adaptability to changes method for measurement.
The technical scheme adopted by the invention to solve the technical problem is that：This kind of PCBA-BGA chip adaptabilitys to changes measurement side
Method includes the following steps：
1), foil gauge is installed；
2), board installation and system assembles；
3), joint sealing, be packaged and weigh；
4), drop test；
5) test result acquisition, comparison, analysis.
Further, the installation steps of foil gauge are in step 1)：
Chosen position：Specific location is the corresponding back sides PCB of device soldered ball time outer ring four corner location of bga chip；
Grinding process：It finds the corresponding test position in the device back side and makes a check mark, the component of corresponding position is all ground
Fall, sticks foil gauge；
The line of tension of the foil gauge pasted is arranged neat and is fixed on PCB, while four test positions are carried out
Number.
Further, foil gauge uses triaxial strain piece, four test positions to be polished flat with sand paper, clung and answered with glue
Power piece, stress section paste direction be 45 degree towards chip inner or outer side.
Further, board installation and system assembles in step 2)：
The mainboard for posting foil gauge or board are mounted in test prototype；
G-sensor is puted up in case side wall.
Further, joint sealing in step 3), be packaged and weigh：
Test prototype is put into packing case, strain line is connected to deformeter successively, G-sensor lines are connected to G values
On data collector；
Then joint sealing is weighed.
Further, drop test in step 4)：
According to weight set dropping table falling height；
Packaging drop test is executed in sequence:Above-below-the left side-middle rib-of the long rib-of the right side-anterior-posterior-is short
Rib-angle.
Further, angle is the lower left corner of packing case one side where cabinet front window, it is long in short rib be test angles extend three
Rib.
Further, test result acquisition, comparison, analysis in step 5)：
Deformeter generates adaptability to changes document, checks in document Calculate Result Table in " Results " sheet
In " emax " and " emin " two train value；
G-sensor captures the G values that cabinet receives and records maximum value；
It is carried out successively according to the sequence of falling of definition, and preserves the strain value document and G values of process record；
Strain value is acceptable less than 800 μ ε, Pass；
800 μ of μ ε~1200 ε of strain value：It need to confirm that solder joint is flawless rear acceptable by having dyed to pull out, such as find that solder joint is split
Trace is then unacceptable；
Strain value is more than 1200 μ ε：It is unacceptable.
To sum up, above-mentioned technical proposal of the invention has the beneficial effect that：
Using dynamic strain indicator, triaxial stress piece, G Value Datas collector and falling tester, server warp is accurately measured
Each PCBA-BAG chip are by adaptability to changes after crossing drop test.Simultaneously can with the method come digging mechanism design, welding procedure not
The risk for causing BGA tin balls to be broken such as good.BGA stress tests are executed, improve the wind with the tin ball fracture of the corners prevention BGA ahead of time
Danger.
Specific implementation mode
Following illustrated embodiment is only used for explaining the present invention, not limits protection scope of the present invention with this.
PCBA-BGA chip adaptability to changes method for measurement, includes the following steps：
1), foil gauge is installed；
2), board installation and system assembles；
3), joint sealing, be packaged and weigh；
4), drop test；
5) test result acquisition, comparison, analysis.
The installation steps of foil gauge are in step 1)：
Chosen position：Specific location is the corresponding back sides PCB of device soldered ball time outer ring four corner location of bga chip.
Grinding process：It finds the corresponding test position in the device back side and makes a check mark, the component of corresponding position is all ground
Falling, four test positions need to be polished flat with sand paper, stick triaxial stress piece, and 502 glue can cling stress section in right amount,
Stress section paste direction be 45 degree towards chip inner or outer side.
The line of tension of the foil gauge pasted is arranged neat and is fixed on PCB, while four test positions are carried out
Number, to correspond to test result.
Board installation and system assembles in step 2)：
The mainboard for posting foil gauge or board are mounted in test prototype.
Relatively solid place is selected to put up G-sensor (acceleration transducer) in case side wall, for acquiring in falling process
The G values that cabinet is subject to.
Joint sealing in step 3) is packaged and weighs：
Test prototype is put into packing case, strain line and G-sensor lines outgoing line position and mode is paid attention to, will answer successively
Modified line is connected to deformeter, and G-sensor lines are connected on G (acceleration) Value Data collector；
Then joint sealing is weighed.
Drop test in step 4)：
According to weight set dropping table falling height, height setting is as follows with reference to table：
| Measured object weight (KG) | Falling height (mm) |
| ≤15 | 1000 |
| 15-30 | 800 |
| 30-40 | 600 |
| 40-45 | 500 |
| 45-50 | 400 |
| > 50 | 300 |
Packaging drop test is executed in sequence：Above-below-the left side-middle rib-of the long rib-of the right side-anterior-posterior-is short
Rib-angle.
Angle is the lower left corner of packing case one side where cabinet front window, it is long in short rib be three ribs that test angles extend.
Test result acquisition, comparison, analysis in step 5)：
Deformeter generates adaptability to changes document, checks in document Calculate in " Results " sheet (result bar)
" emax " (maximum value in table) and " emin " (minimum value in table) two train values in Result Table (result of calculation table)；
The positive and negative direction for only representing stress of " emax " " emin " intermediate value.For below, emax is up to 242, emin and is up to 245.
G-sensor captures the G values that cabinet receives and records maximum value.
It is carried out successively according to the sequence of falling of definition, and preserves the strain value document and G values of process record.
Criterion：
Strain value is acceptable less than 800 μ ε, passes through；
800 μ of μ ε~1200 ε of strain value：It need to confirm that solder joint is flawless rear acceptable by having dyed to pull out, such as find that solder joint is split
Trace is then unacceptable；
Strain value is more than 1200 μ ε：It is unacceptable.
Above-described embodiment is only the description that is carried out to the preferred embodiment of the present invention, not to the scope of the present invention into
Row limit, under the premise of not departing from design spirit of the present invention, relevant technical staff in the field to the present invention various modifications and
It improves, should all expand in protection domain determined by claims of the present invention.
Claims (8)
1. a kind of PCBA-BGA chip adaptability to changes method for measurement, which is characterized in that include the following steps：
1), foil gauge is installed；
2), board installation and system assembles；
3), joint sealing, be packaged and weigh；
4), drop test；
5) test result acquisition, comparison, analysis.
2. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 1, which is characterized in that in step 1)
The installation steps of foil gauge are：
Chosen position：Specific location is the corresponding back sides PCB of device soldered ball time outer ring four corner location of bga chip；
Grinding process：It finds the corresponding test position in the device back side and makes a check mark, the component of corresponding position is all ground off, paste
Upper foil gauge；
The line of tension of the foil gauge pasted is arranged neat and is fixed on PCB, while four test positions are numbered.
3. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 2, which is characterized in that foil gauge is adopted
With triaxial strain piece, four test positions are polished flat with sand paper, cling stress section with glue, it is 45 degree that stress section, which pastes direction,
On the inside or outside of towards chip.
4. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 1, which is characterized in that in step 2)
Board is installed and system assembles：
The mainboard for posting foil gauge or board are mounted in test prototype；
G-sensor is puted up in case side wall.
5. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 1, which is characterized in that in step 3)
Joint sealing is packaged and weighs：
Test prototype is put into packing case, strain line is connected to deformeter successively, G-sensor lines are connected to G Value Datas and adopt
On storage；
Then joint sealing is weighed.
6. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 1, which is characterized in that in step 4)
Drop test：
According to weight set dropping table falling height；
Packaging drop test is executed in sequence:Above-below-short rib-angle of the left side-middle rib-of the long rib-of the right side-anterior-posterior-.
7. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 5, which is characterized in that angle is cabinet
The lower left corner of packing case one side where front window, short rib is three ribs that test angles extend in growing.
8. a kind of PCBA-BGA chip adaptability to changes method for measurement according to claim 1, which is characterized in that in step 5)
Test result acquisition, comparison, analysis：
Deformeter generates adaptability to changes document, checks in document in " Results " sheet in Calculate Result Table
" emax " and " emin " two train value；
G-sensor captures the G values that cabinet receives and records maximum value；
It is carried out successively according to the sequence of falling of definition, and preserves the strain value document and G values of process record；
Strain value is acceptable less than 800 μ ε, Pass；
800 μ of μ ε~1200 ε of strain value：It need to confirm that solder joint is flawless rear acceptable by having dyed to pull out, if finding solder joint slight crack
It is unacceptable；
Strain value is more than 1200 μ ε：It is unacceptable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810521424.0A CN108760124A (en) | 2018-05-28 | 2018-05-28 | A kind of PCBA-BGA chip adaptability to changes method for measurement |
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| CN201810521424.0A CN108760124A (en) | 2018-05-28 | 2018-05-28 | A kind of PCBA-BGA chip adaptability to changes method for measurement |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110196256A (en) * | 2019-06-06 | 2019-09-03 | 上海机器人产业技术研究院有限公司 | A kind of mechanical failure analysis method of semiconductor devices |
| CN111623702A (en) * | 2020-04-29 | 2020-09-04 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for testing strain of welding spot of integrated circuit component |
| CN112179310A (en) * | 2019-07-02 | 2021-01-05 | 中兴通讯股份有限公司 | Processing method and device for Printed Circuit Board (PCB) |
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| CN101984442A (en) * | 2010-10-29 | 2011-03-09 | 北京工业大学 | Method for predicting fatigue life of lead-free solder joint in electronic packaging |
| CN104655489A (en) * | 2015-02-06 | 2015-05-27 | 哈尔滨工业大学 | Method for measuring stress concentration at weld toe of butt joint of thick plates |
| CN106370384A (en) * | 2016-12-13 | 2017-02-01 | 郑州云海信息技术有限公司 | Fall-off test method and device |
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| CN101706400A (en) * | 2009-11-27 | 2010-05-12 | 北京工业大学 | Detection and evaluation method for dropping impact property of solder connector for electronic packaging |
| CN101984442A (en) * | 2010-10-29 | 2011-03-09 | 北京工业大学 | Method for predicting fatigue life of lead-free solder joint in electronic packaging |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110196256A (en) * | 2019-06-06 | 2019-09-03 | 上海机器人产业技术研究院有限公司 | A kind of mechanical failure analysis method of semiconductor devices |
| CN112179310A (en) * | 2019-07-02 | 2021-01-05 | 中兴通讯股份有限公司 | Processing method and device for Printed Circuit Board (PCB) |
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| CN111623702A (en) * | 2020-04-29 | 2020-09-04 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for testing strain of welding spot of integrated circuit component |
| CN111623702B (en) * | 2020-04-29 | 2021-10-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for testing strain of welding spot of integrated circuit component |
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Application publication date: 20181106 |