CN108753227A - A kind of high resiliency epoxy adhesive - Google Patents
A kind of high resiliency epoxy adhesive Download PDFInfo
- Publication number
- CN108753227A CN108753227A CN201810597641.8A CN201810597641A CN108753227A CN 108753227 A CN108753227 A CN 108753227A CN 201810597641 A CN201810597641 A CN 201810597641A CN 108753227 A CN108753227 A CN 108753227A
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- CN
- China
- Prior art keywords
- parts
- component
- high resiliency
- agent
- epoxy resin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention belongs to the related fields such as building construction, bridge tunnel, highway and railway, engineering dam, industrial plant, industrial equipment, it is mainly used for that concrete in any of the above field is bonding with concrete, bonding and fixation of concrete and other accessories.It is characterized in that the mass percent of raw material and its each component is：Component A, epoxy resin：75~90 parts, diluent：10~25 parts, functional aid：5~8 parts, wetting and penetrating agent：0.3~0.5 part, adhesive promoter：3~5 parts.B component：Elastic epoxy resin curing agent：85~100 parts, accelerating agent：3~5 parts, wetting and penetrating agent：0.3~0.5, functional aid：5~8 parts.
Description
Technical field：
The invention belongs to building construction, bridge tunnel, highway and railway, engineering dam, industrial plant, industrial equipments
Etc. related fields, be mainly used for that concrete in any of the above field is bonding with concrete, concrete is bonding with other accessories
With fixation.
Background technology：
At present the country epoxy resin type building adhesive, mechanical property be substantially it is partially rigid, fracture stretch
Long rate is substantially within 5%, the epoxies building adhesive of few high resiliency or high tenacity, in many dynamic loads or needs big
The application field of deformation, conventional epoxies building adhesive is difficult to meet the requirements；Although the adhesive of polyurethane type can be with
The good product of elasticity is prepared, but due to the characteristic of polyurethane binder itself, is easy in wet environment and moisture
Reaction generates bubble, reduces the performance of product, is used to affect product, therefore, it is viscous to develop elastomeric epoxy resin
Mixture seem very it is necessary to.
Invention content：
It is a kind of big applied to building construction, bridge tunnel, highway and railway, engineering it is an object of the invention to prepare
Concrete is bonding with concrete in the related fields such as dam, industrial plant, industrial equipment, concrete and the bonding of other accessories with
Fixed high resiliency epoxy adhesive, product is high with adhesive strength, elongation at break is big, operable time is long, non-volatility
The advantages that organic solvent.
It is characterized in that the mass percent of raw material and its each component is：Component A, epoxy resin：75~90 parts, dilution
Agent：10~25 parts, functional aid：5~8 parts, wetting and penetrating agent：0.3~0.5 part, adhesive promoter：3~5 parts.B groups
Part：Elastic epoxy resin curing agent：85~100 parts, accelerating agent：3~5 parts, wetting and penetrating agent：0.3~0.5, functional aid：
5~8 parts.
Its preparation flow is as follows：
Component A：Epoxy resin, diluent, function additive, wetting and penetrating agent and adhesive promoter are added to agitator tank
The inside, stirring obtain component A after a certain period of time.
B component：Elastic epoxy curing agent, accelerating agent, wetting and penetrating agent and function additive are added to inside agitator tank, stirred
It mixes and obtains B component after a certain period of time.
The two component mass ratio of A, B being prepared is 1: 1 uniformly mixed i.e. usable.
Specific implementation mode：
Technical scheme of the present invention will be further described with reference to embodiments, but is not the limitation to invention.
Example 1
Each component raw material and component are as follows：
Example 2
Each component raw material and component are as follows：
1 example 1- examples of table, 2 high resiliency epoxy adhesive performance
| Project | Elongation at break/% | Adhesive strength/MPa | Tensile strength/MPa |
| Example 1 | 87 | 3.4 | 16 |
| Example 2 | 102 | 3.1 | 13 |
Claims (9)
1. a kind of high resiliency epoxy adhesive, it is characterised in that the mass percent of raw material and its each component is：Component A, epoxy
Resin：75~90 parts of diluents：10~25 parts, functional aid：5~8 parts, wetting and penetrating agent：0.3~0.5 part, adhesive force increases
Strong agent：3~5 parts.B component：Elastic epoxy resin curing agent：85~100 parts, accelerating agent：3~5 parts, wetting and penetrating agent：0.3~
0.5, functional aid：5~8 parts.
2. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that epoxy resin is common bisphenol-A epoxy
Resin 618.
3. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that diluent is reactive diluent 692.
4. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that functional aid is diisopropyl naphthalene.
5. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that wetting and penetrating agent BYK333,
BYK378、BYK340。
6. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that adhesive promoter KH560.
7. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that accelerating agent DMP-30.
8. a kind of high resiliency epoxy adhesive according to claim 1, it is characterised in that elastic epoxy resin curing agent is：
Aradur 3275。
9. a kind of high resiliency epoxy adhesive, preparation flow are as follows according to claim 1：
Component A：Epoxy resin, diluent, function additive, wetting and penetrating agent and adhesive promoter are added in agitator tank
Side, stirring obtain component A after a certain period of time.
B component：Elastic epoxy resin curing agent, accelerating agent, wetting and penetrating agent and function additive are added to inside agitator tank, stirred
It mixes and obtains B component after a certain period of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597641.8A CN108753227A (en) | 2018-06-12 | 2018-06-12 | A kind of high resiliency epoxy adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597641.8A CN108753227A (en) | 2018-06-12 | 2018-06-12 | A kind of high resiliency epoxy adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108753227A true CN108753227A (en) | 2018-11-06 |
Family
ID=64022609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810597641.8A Pending CN108753227A (en) | 2018-06-12 | 2018-06-12 | A kind of high resiliency epoxy adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108753227A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101161752A (en) * | 2006-09-29 | 2008-04-16 | 气体产品聚合物公司 | Self-crosslinking vinyl acetate-ethylene polymeric binders for nonwoven webs |
| CN103194149A (en) * | 2013-04-17 | 2013-07-10 | 上海东方雨虹防水工程有限公司 | Encapsulating sealant of joggle beam structure, as well as preparation thereof and use method |
| CN105492488A (en) * | 2013-05-17 | 2016-04-13 | 蓝立方知识产权有限责任公司 | Hardeners for cold-curing epoxy systems |
| CN107057621A (en) * | 2017-03-09 | 2017-08-18 | 宜兴市普利泰电子材料有限公司 | One kind outlet hairbrush epoxy adhesive and preparation method thereof |
-
2018
- 2018-06-12 CN CN201810597641.8A patent/CN108753227A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101161752A (en) * | 2006-09-29 | 2008-04-16 | 气体产品聚合物公司 | Self-crosslinking vinyl acetate-ethylene polymeric binders for nonwoven webs |
| CN103194149A (en) * | 2013-04-17 | 2013-07-10 | 上海东方雨虹防水工程有限公司 | Encapsulating sealant of joggle beam structure, as well as preparation thereof and use method |
| CN105492488A (en) * | 2013-05-17 | 2016-04-13 | 蓝立方知识产权有限责任公司 | Hardeners for cold-curing epoxy systems |
| CN107057621A (en) * | 2017-03-09 | 2017-08-18 | 宜兴市普利泰电子材料有限公司 | One kind outlet hairbrush epoxy adhesive and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181106 |
|
| WD01 | Invention patent application deemed withdrawn after publication |