CN108748723B - Laser positioning ceramic tile cutting equipment - Google Patents

Laser positioning ceramic tile cutting equipment Download PDF

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Publication number
CN108748723B
CN108748723B CN201810562145.9A CN201810562145A CN108748723B CN 108748723 B CN108748723 B CN 108748723B CN 201810562145 A CN201810562145 A CN 201810562145A CN 108748723 B CN108748723 B CN 108748723B
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Prior art keywords
buffer
cutting
plate
groove
laser positioning
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CN201810562145.9A
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CN108748723A (en
Inventor
杨丁中
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Suzhou Laise Technology Co ltd
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Suzhou Laise Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Abstract

The invention provides laser positioning ceramic tile cutting equipment which comprises a cutting table, wherein the tops of the front sides of a fixed plate and a baffle are fixedly connected with a cross beam through bolts, the bottom of the left side of the fixed plate is provided with a laser emitter, the outer side of the cross beam is provided with a cutting head, the left side of the cutting head is fixedly connected with a handle, the middle of the bottom of the handle is provided with an anti-collision mechanism, the tops and the bottoms of the two sides of the front side of the cutting table are respectively welded with an ear plate, and a folding mechanism is movably connected between the two ear plates through a clamping. According to the invention, through the matched use of the cutting table, the fixed plate, the baffle plate cross beam, the handle, the buffer block, the buffer groove, the buffer plate, the limiting column and the buffer spring, the problem of relatively poor anti-collision function of the cutting equipment is solved, and through the matched use of the supporting legs, the lifting groove, the movable block, the object placing plate and the magnetic block, the problem that the ceramic tile is inconvenient to cut and collect by the traditional cutting method is solved.

Description

Laser positioning ceramic tile cutting equipment
Technical Field
The invention relates to the technical field of laser cutting equipment, in particular to laser positioning ceramic tile cutting equipment.
Background
Ceramic tiles, also known as ceramic tiles, are acid and alkali resistant porcelain or stony materials formed by the processes of grinding, mixing, pressing, glazing and sintering of refractory metal oxides and semimetal oxides, and are used as building or decorative materials, which are called ceramic tiles and are mostly prepared by mixing clay, quartz sand and the like.
At present, when building construction and home decoration are carried out, tiles can be used, but when the tiles are laid, all the laid tiles are not necessarily complete due to the uncertainty of ground surface area and actual operation condition, the tiles need to be cut, the existing technology generally adopts a method of a cutting knife to cut the tiles, the cutting method is purely manual operation, when the tiles are cut, the cutting is not uniform due to manual operation, the cutting shape is irregular, in addition, the cut tiles need to be taken down after each cutting is finished, the action repetition rate is high, the cut tiles cannot be well collected and processed, some laser positioning cutting products in the market can completely and regularly cut the tiles, but when the tiles are cut, a handle can impact on a supporting structure due to the pressure effect at the last moment, although the cutting device is provided with the buffer structure, the structure of the cutting device is relatively rigid, the device is easy to impact and damage, and the construction efficiency is very critical in the construction and decoration processes, so that the cutting device of the ceramic tile is required to be convenient to carry and operate conveniently at a construction site.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides laser positioning ceramic tile cutting equipment, which solves the problem that ceramic tile cutting products are inconvenient to collect.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a laser positioning ceramic tile cutting device comprises a cutting table, wherein a fixed plate is welded on the right side of the top of the cutting table, a baffle is welded on the left side of the top of the cutting table, a cross beam is fixedly connected with the front tops of the fixed plate and the baffle through bolts, a laser transmitter is arranged at the bottom of the left side of the fixed plate, when the ceramic tile is cut, in order to ensure the cutting flatness, a laser positioning method is adopted, the laser beam is mainly utilized to prevent the ceramic tile from being bent, a support for placing the ceramic tile when the ceramic tile is cut is arranged on the back of the cutting table, scale marks are arranged on the surface of a folding rod, wherein zero scale marks are formed from the bottom of a cutting head, the cutting head is arranged on the outer side of the cross beam, a handle is fixedly connected on the left side of the cutting head, there is folding mechanism, preferably through the gim peg swing joint between two otic placodes, folding mechanism includes the folding rod, logical groove has been seted up in the left side of folding rod, the bottom overlap joint that leads to the inslot wall has the limiting plate, the top welding of limiting plate has the telescopic link, reset spring has been cup jointed in the outside of telescopic link, reset spring's bottom and the top fixed connection of limiting plate, reset spring's top and the top fixed connection who leads to the inslot wall.
Preferably, the top overlap joint of folding rod has the backup pad, the backplate has all been welded with the back in the front and the back of backup pad top both sides, the front overlap joint of backplate has the dead lever, the positive middle part through connection of dead lever has the cross axle, the back of cross axle runs through the dead lever and extends to the outside at the backplate back, the positive bottom of dead lever is through the top swing joint of gim peg and telescopic link, the bottom of folding rod is provided with the device that gathers materials.
Preferably, anticollision institution includes the buffer block, the middle part fixed connection of the top of buffer block and handle bottom, the dashpot has been seted up to the bottom of buffer block, the inner chamber activity joint of dashpot has the buffer board, spacing post has been welded at buffer board top middle part, buffer spring has been cup jointed in the outside of spacing post.
Preferably, the width of the inner side of the buffer slot is equal to the width of the buffer plate, the buffer slot is a rectangular slot, the width of the buffer plate is equal to the width of the cross beam, and the buffer block is located right above the cross beam.
Preferably, the device that gathers materials includes the supporting leg, the front of supporting leg and the bottom fixed connection of folding rod, the lift groove has all been seted up to the top and the bottom on supporting leg right side, the inner chamber activity joint in lift groove has the movable block, the one side welding that the lift groove was kept away from to the movable block has puts the thing board, the back of lift inslot chamber and the back of movable block all bond there is the magnetic path.
Preferably, the bottom of the buffer spring is fixedly connected with the top of the buffer plate, and the top of the buffer spring is fixedly connected with the top of the inner wall of the buffer groove.
Preferably, the top of the telescopic rod penetrates through the support plate and extends to the outer side of the top of the support plate, and the width of the fixing rod is equal to the distance between the two back plates.
Preferably, the number of the supporting legs is four, the supporting legs are fixedly connected with the bottoms of the folding rods and the bottoms of the cutting tables respectively, and the same-polarity surface is arranged on the opposite side of the magnetic block in the inner cavity of the lifting groove.
When the cutting tool is used, the cutting tool is placed on the ground, the supporting legs are directly contacted with a storefront, the folding rod is pulled, the right side of the folding rod rotates between the two ear plates, the folding rod is rotated to be in a state of being perpendicular to the cutting table, the plate for collecting tiles is directly placed on the object placing plate, the laser emitter is started first, the laser beam of the laser emitter directly irradiates on the cutting head, when the cutting head does not incline or distort, the laser beam penetrates through the cutting head to irradiate on the right side of the baffle, if no light spot appears on the right side of the baffle, the inclination and the distortion of the cutting head are indicated, the adjustment is needed in time to prevent the tiles from being cut irregularly, the supporting plate is pushed, the supporting plate drives the telescopic rod and the fixing rod to move along the direction of the folding rod until the size needing to be cut is moved, the fixing rod, the dead lever drives the telescopic link rebound, the telescopic link drives the limiting plate and upwards removes at the inner chamber that leads to the groove, the limiting plate drives reset spring rebound, until with the pulling of limiting plate to the top of leading to the groove inner chamber, when cutting, the pulling handle, the handle drives the cutting head and cuts it at the surperficial removal of ceramic tile, press down the handle after the cutting is accomplished and cut off the ceramic tile and handle, when pressing down the handle, the handle drives the buffer block downstream, the buffer block drives the buffer board downstream, the buffer board is direct and the top contact of crossbeam, the buffer board promotes buffer spring and is compressed to produce the pressure that deformation brought the handle and cushion the action.
(III) advantageous effects
Compared with the prior art, the ceramic tile cutting device has the advantages that the cutting table, the fixing plate, the baffle beam, the handle, the buffer block, the buffer groove, the buffer plate, the limiting column and the buffer spring are matched for use, so that the buffer plate pushes the buffer spring upwards along with being extruded to deform to perform damping and buffering actions when the ceramic tile cutting device is pressed down, the purpose of preventing the handle from directly impacting the beam to cause equipment damage is achieved, and the problem that the anti-impact function of the cutting equipment is relatively poor is solved.
This laser positioning ceramic tile cutting equipment uses through the cooperation of cutting bed, otic placode, folding rod, logical groove, limiting plate, telescopic link, reset spring and backup pad for can fold the structure of placing the ceramic tile and accomodate when not using, thereby reach the purpose that the convenience is folded cutting equipment and is carried, solved the inconvenient problem of carrying of laser positioning cutting equipment.
This laser positioning ceramic tile cutting equipment uses through the cooperation of cutting bed, otic placode, folding rod, logical groove, limiting plate, telescopic link, reset spring, backplate, dead lever and backup pad for ceramic tile location structure can be quick go on and equipment between fixed, thereby reach the mode that replaces the tradition to use the screw and fasten the purpose of spare part, solved the tradition and adopted the method of bolt to fasten the problem that the structure is comparatively loaded down with trivial details comparatively and easy slippage relatively.
This laser positioning ceramic tile cutting equipment uses through supporting leg, lift groove, movable block, the cooperation of putting thing board and magnetic path for cutting equipment can in time collect the ceramic tile after the cutting when carrying out the ceramic tile cutting, thereby reaches the purpose of collecting the ceramic tile after will cutting fast, has solved traditional cutting method and has cut and collect the comparatively inconvenient problem of ceramic tile.
This laser positioning ceramic tile cutting equipment uses through supporting leg, lift groove, movable block, the cooperation of putting thing board and magnetic path for the ceramic tile is put the thing board and can slowly orderly downstream when dropping after the cutting, thereby reaches the purpose of guaranteeing the ceramic tile safety after the cutting, has solved the cutting ceramic tile and has directly dropped and easily broken problem by pounding.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a crash prevention mechanism according to the present invention;
FIG. 3 is a schematic structural view of a folding mechanism according to the present invention;
FIG. 4 is a schematic structural diagram of the material collecting device of the present invention;
FIG. 5 is a side view of the support leg of the present invention.
Wherein, 1 cutting bed, 2 fixed plates, 3 baffles, 4 crossbeams, 5 laser emitter, 6 cutting heads, 7 handles, 8 anticollision institution, 9 otic placodes, 10 folding mechanism, 11 buffer blocks, 12 buffer slots, 13 buffer plates, 14 spacing posts, 15 buffer springs, 16 folding rods, 17 logical grooves, 18 limiting plates, 19 telescopic links, 20 reset springs, 21 backup pads, 22 backplate, 23 fixed rods, 24 horizontal axles, 25 device that gathers materials, 26 supporting legs, 27 lifting grooves, 28 movable blocks, 29 puts the thing board, 30 magnetic path.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5, the invention provides laser positioning ceramic tile cutting equipment, which comprises a cutting table 1, wherein a fixed plate 2 is welded on the right side of the top of the cutting table 1, a baffle plate 3 is welded on the left side of the top of the cutting table 1, the fixed plate 2 and the front top of the baffle plate 3 are fixedly connected with a cross beam 4 through bolts, a laser emitter 5 is arranged at the bottom of the left side of the fixed plate 2, a cutting head 6 is arranged on the outer side of the cross beam 4, a handle 7 is fixedly connected to the left side of the cutting head 6, an anti-collision mechanism 8 is arranged in the middle of the bottom of the handle 7, ear plates 9 are welded on the top and the bottom.
Anticollision institution 8 includes buffer block 11, the middle part fixed connection of the top of buffer block 11 and 7 bottoms of handle, buffer slot 12 has been seted up to buffer block 11's bottom, the inboard width of buffer slot 12 equals with buffer plate 13's width, buffer slot 12 is the rectangular channel, buffer plate 13's width equals with crossbeam 4's width, buffer block 11 is located crossbeam 4 directly over, buffer slot 12's inner chamber activity joint has buffer plate 13, buffer plate 13 top middle part has welded spacing post 14, buffer spring 15 has been cup jointed in spacing post 14's the outside, buffer spring 15's bottom and buffer plate 13's top fixed connection, buffer spring 15's top and buffer slot 12 inner walls's top fixed connection.
The folding mechanism 10 comprises a folding rod 16, a support plate 21 is lapped at the top of the folding rod 16, back plates 22 are welded on the front and the back of two sides of the top of the support plate 21, a fixing rod 23 is lapped at the front of each back plate 22, a cross shaft 24 is connected in a penetrating manner at the middle of the front of the fixing rod 23, the back of the cross shaft 24 penetrates through the fixing rod 23 and extends to the outer side of the back of each back plate 22, the front bottom of each fixing rod 23 is movably connected with the top of a telescopic rod 19 through a clamping bolt, a through groove 17 is formed in the left side of the folding rod 16, which is provided with an aggregate device 25, at the bottom of each folding rod 16, a limiting plate 18 is lapped at the bottom of the inner wall of each through groove 17, a telescopic rod 19 is welded at the top of each limiting plate 18, the top of each telescopic rod 19 penetrates through the support plate 21 and extends to, the top of the return spring 20 is fixedly connected with the top of the inner wall of the through groove 17.
Aggregate device 25 includes supporting leg 26, the quantity of supporting leg 26 is four, supporting leg 26 respectively with folding rod 16's bottom and cutting table 1's bottom fixed connection, the one side that 27 inner chamber magnetic blocks 30 are relative in lift groove is the same polarity face, supporting leg 26's front and folding rod 16's bottom fixed connection, lift groove 27 has all been seted up with the bottom at the top on supporting leg 26 right side, lift groove 27's inner chamber activity joint has movable block 28, one side welding that lift groove 27 was kept away from to movable block 28 has puts thing board 29, lift groove 27 inner chamber's the back all bonds with movable block 28's the back has magnetic path 30.
The working principle is as follows: when the cutting device is used, cutting equipment is placed on the ground, the supporting leg 26 is directly contacted with a storefront, the folding rod 16 is pulled, the right side of the folding rod 16 rotates around the two lug plates 9, the folding rod 16 is rotated to be in a state of being perpendicular to the cutting table 1, a tile block for collecting tiles is directly placed on the storage plate 29, the laser emitter 5 is started firstly, a laser beam of the laser emitter 5 directly irradiates on the cutting head 6, when the cutting head does not incline or bend, the laser beam penetrates through the cutting head 6 to irradiate on the right side of the baffle 3, if no light spot appears on the right side of the baffle 3, the cutting head 6 inclines and bends, the adjustment is needed to be carried out in time to prevent the tiles from being cut irregularly, the supporting plate 21 is pushed, the supporting plate 21 drives the telescopic rod 19 and the fixing rod 23 to move along the direction of the folding rod 16 until the size to be, pulling dead lever 23, the dead lever rotates round cross axle 24, dead lever 26 drives 19 rebound of telescopic link, 19 telescopic link drives limiting plate 18 at the inner chamber rebound that leads to groove 17, limiting plate 18 drives reset spring 20 rebound, until the pulling with limiting plate 18 to the top that leads to the groove 17 inner chamber, when cutting, pulling handle 7, handle 7 drives the cutting head and cuts it at the surperficial removal of ceramic tile, press handle 7 to cut off the ceramic tile after the cutting is accomplished, when pressing the handle, the handle drives buffer block 11 and moves down, buffer block 11 drives buffer plate 13 and moves down, buffer plate 13 is direct to be contacted with the top of crossbeam 4, buffer plate 13 promotes buffer spring 15 and is compressed the pressure that produces deformation and bring handle 7 and cushion the action.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A laser positioning tile cutting apparatus, comprising a cutting table (1), characterized in that: the cutting table is characterized in that a fixed plate (2) is welded on the right side of the top of the cutting table (1), a baffle (3) is welded on the left side of the top of the cutting table (1), a beam (4) is fixedly connected with the front tops of the fixed plate (2) and the baffle (3) through bolts, a laser emitter (5) is arranged at the left bottom of the fixed plate (2), a cutting head (6) is arranged on the outer side of the beam (4), a handle (7) is fixedly connected with the left side of the cutting head (6), an anti-collision mechanism (8) is arranged in the middle of the bottom of the handle (7), ear plates (9) are welded on the top and the bottom of the two front sides of the cutting table (1), a folding mechanism (10) is movably connected between the two ear plates (9) through a clamping bolt, the folding mechanism (10) comprises a folding, the utility model discloses a fixing device for a bicycle, including lead to groove (17) inner wall, the bottom overlap joint of lead to groove (17) inner wall has limiting plate (18), the top welding of limiting plate (18) has telescopic link (19), reset spring (20) have been cup jointed in the outside of telescopic link (19), the bottom of reset spring (20) and the top fixed connection of limiting plate (18), the top of reset spring (20) and the top fixed connection who leads to groove (17) inner wall, the top overlap joint of folding rod (16) has backup pad (21), backplate (22) have all been welded with the front and the back of backup pad (21) top both sides, the front overlap joint of backplate (22) has dead lever (23), the positive middle part through connection of dead lever (23) has cross axle (24), the back of cross axle (24) runs through dead lever (23) and extends to the outside at backplate (22) back, the positive bottom of dead lever (23) is through the top swing joint, the bottom of the folding rod (16) is provided with a material collecting device (25).
2. A laser positioning tile cutting apparatus according to claim 1, wherein: anticollision institution (8) are including buffer block (11), the middle part fixed connection of the top of buffer block (11) and handle (7) bottom, buffer slot (12) have been seted up to the bottom of buffer block (11), the inner chamber activity joint of buffer slot (12) has buffer board (13), spacing post (14) have been welded at buffer board (13) top middle part, buffer spring (15) have been cup jointed in the outside of spacing post (14).
3. A laser positioning tile cutting apparatus according to claim 2, wherein: the width of dashpot (12) inboard equals with the width of buffer board (13), dashpot (12) are the rectangular channel, the width of buffer board (13) equals with the width of crossbeam (4), buffer block (11) are located crossbeam (4) directly over.
4. A laser positioning tile cutting apparatus according to claim 1, wherein: aggregate device (25) include supporting leg (26), the front of supporting leg (26) and the bottom fixed connection of folding rod (16), lift groove (27) have all been seted up to top and bottom on supporting leg (26) right side, the movable joint of inner chamber of lift groove (27) has movable block (28), one side welding that lift groove (27) were kept away from in movable block (28) has puts thing board (29), the back of lift groove (27) inner chamber and the back of movable block (28) all bond and have magnetic path (30).
5. A laser positioning tile cutting apparatus according to claim 2, wherein: the bottom of the buffer spring (15) is fixedly connected with the top of the buffer plate (13), and the top of the buffer spring (15) is fixedly connected with the top of the inner wall of the buffer groove (12).
6. A laser positioning tile cutting apparatus according to claim 1, wherein: the top of the telescopic rod (19) penetrates through the support plate (21) and extends to the outer side of the top of the support plate (21), and the width of the fixing rod (23) is equal to the distance between the two back plates (22).
7. A laser positioning tile cutting apparatus according to claim 4, wherein: the number of the supporting legs (26) is four, the supporting legs (26) are fixedly connected with the bottom of the folding rod (16) and the bottom of the cutting table (1) respectively, and one side, opposite to the magnetic block (30) in the inner cavity of the lifting groove (27), is a same-polarity surface.
CN201810562145.9A 2018-06-04 2018-06-04 Laser positioning ceramic tile cutting equipment Active CN108748723B (en)

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CN201810562145.9A CN108748723B (en) 2018-06-04 2018-06-04 Laser positioning ceramic tile cutting equipment

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Application Number Priority Date Filing Date Title
CN201810562145.9A CN108748723B (en) 2018-06-04 2018-06-04 Laser positioning ceramic tile cutting equipment

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CN108748723B true CN108748723B (en) 2020-08-18

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CN202037735U (en) * 2011-04-09 2011-11-16 徐君献 Tile cutter
CN204263376U (en) * 2014-11-07 2015-04-15 杭州一楠五金工具有限公司 Foldable self-locking formula manual ceramic-tile cutting device
CN105479528A (en) * 2015-11-30 2016-04-13 苏州市汇峰机械设备有限公司 Handle for cutting machine
CN205674372U (en) * 2016-06-17 2016-11-09 浙江龙威机械制造有限公司 A kind of ceramic tile cutter
CN205882515U (en) * 2016-07-12 2017-01-11 上海德力西集团有限公司 Soft female cutting machine of arranging of low pressure primary loop
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