CN108747049A - A kind of laser cutting machine and its implementation carrying out plank positioning using CCD - Google Patents
A kind of laser cutting machine and its implementation carrying out plank positioning using CCD Download PDFInfo
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- CN108747049A CN108747049A CN201810611173.5A CN201810611173A CN108747049A CN 108747049 A CN108747049 A CN 108747049A CN 201810611173 A CN201810611173 A CN 201810611173A CN 108747049 A CN108747049 A CN 108747049A
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- ccd
- plank
- laser cutting
- identification
- identification devices
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser cutting machines and implementation method carrying out plank positioning using CCD, belong to technical field, the relative position between the CCD devices accurately measured and cutting head is stored in angle information in the form of parameter to the data field of CCD devices.After CCD devices obtain the placement location and angle information of plank by shooting, result can be obtained into location information of the plank relative to cutting head with the offset information superposition relative to cutting head being stored in CCD devices before.Again by operation to location information digital control system is transferred to by network communication, digital control system can quickly obtain plank zero information.Under the premise of CCD maximum pixels determine, the pixel number of unit sizes can be increased to improve accuracy of identification by reducing shooting identification range.Therefore consider from economy and precision aspect, the CCD devices plank zero migration position range that artificial rapid material-feeding can ensure when needing to carry out the range of video identification according to batch working determines.
Description
Technical field
The invention belongs to technical field, more particularly to a kind of laser cutting carrying out plank positioning using CCD
Machine.The invention further relates to a kind of implementation methods for the laser cutting machine carrying out plank positioning using CCD.
Background technology
Plane laser cutting machine is typically to carry out pattern cut work using laser on a rectangular plate.Cutting pattern
Or machining path is by using the NC program files of CAM Software Creates to determine in advance.The position of machining path in NC program files
It sets coordinate and is relative to what the zero coordinate of plank determined, and the position coordinates of laser cutting machine are the opposite zeros with machine
What coordinate determined.In actual use especially for larger or thicker plate, if it is desired to which artificial loading realizes each piece
The zero and coordinate of processing plate overlap time-consuming and laborious with the zero of lathe and coordinate.So being usually required on laser cutting machine
Method is taken to determine that plank zero feeds back to digital control system, digital control system relative to the relative position and deflection angle of machine zero
It is desired value to carry out calculation process by actual motion track correct according to obtained data.To realize in processing program file
The unification of relative position coordinates and lathe absolute location coordinates.
It is illustrated in figure 6 the plank positioning principle of existing laser cutting machine, is generally used in laser cutting machine at present
Method be using laser cutting head in plank close to lathe dead-center position from being moved to outside plank in plank, when by plank side
When edge, the position that saltus step is assured that certain point on plank side occurs for the capacitive sensor signal in cutting head
Coordinate.The position coordinates and an adjacent short sides for determining two points in one long side of rectangle respectively are repeated 3 times using above-mentioned principle
On point coordinates, by the position at the angle that the long side and short side of rectangular plate are formed（That is plank dead-center position）And the deflection at angle
Angle is assured that.
Invention content
Goal of the invention：In order to overcome the above deficiency, plank positioning is carried out using CCD the object of the present invention is to provide a kind of
Laser cutting machine, although automatic identification plank dead-center position and plank deflection angle can be solved using capacitance sensor at present
The problem of but at present there is a problem in that needing to improve：
1, the time integrally identified is long：Finding plank boundary using capacitance sensor first needs cutting head close to plank table
Face is slowly moved so that when cutting head removes plank range, capacitance sensor has the enough reaction time to confirm plank boundary, past
Secondary-confirmation plank is removed with slower speed toward also needing to turn again within the scope of plank after first time removes plank range
Position.Along with entire identification process needs to complete the identification of three points, basic need 30 seconds or more is taken；
2, accuracy of identification is not high：When seeking side using capacitive way, circle of the numerical value from cutting head end of capacitance sensor reception
The inductance capacitance of shape nozzle body and plate surface.When generally requiring cutting head and being moved to the outer a distance of sheet edge, changing value
Just it is enough to be detected by a sensor, therefore seeking side precision substantially will be in 1mm or more；
3, it is easy to receive interference：It is reliable with the earth that the accurate feedback of capacitance needs plank finally to be realized by the contact with lathe
Connection.What it is to realize the capacitance real reaction between cutting head and plank is the capacitance between cutting head and the earth.By
In various reasons when plank connect bad with the earth, capacitance variation is unstable, seeks side precision and also will receive influence.
The processing efficiency of the process time of laser cutting machine especially thin plate is continuously improved, and original capacitance seeks side mode 30 seconds
The side time of seeking cannot meet the needs efficiently produced.From the point of view of improving laser cutting machine whole efficiency, side is sought
Time needs to shorten.In addition traditional capacitance seeks the machining accuracy on side under the background of the promotion of laser industry overall market demand,
Also gradually fall behind.In order to meet the market requirement, accuracy of identification needs to improve.
Technical solution：A kind of laser cutting machine carrying out plank positioning using CCD, including laser cutting head and CCD identifications
Device, the laser cutting head and CCD identification devices are separately mounted on laser cutting machine, and CCD identification devices are close to sharp
Light cutting head is arranged；Wherein, the CCD identification devices are equipped with annular light source, dustproof protecting cover and cylinder.The application of the present invention
CCD carries out the laser cutting machine of plank positioning, needs to install CCD identification devices beside cutting head using CCD technologies（Main dress
It sets, for carrying out plank identification）；Annular light source（Auxiliary device avoids CCD when insufficient light from filling for illuminating identified plank
The problem of setting None- identified）；Dustproof protecting cover and cylinder（Protective device is only opened in identification, avoids CCD devices long-term
Use in receive slag or dust pollution；Mounting and fixing support（Ensure that CCD is installed on cutting head in the opposite of cutting planes
Position is fixed）.
The present invention also provides a kind of implementation methods for the laser cutting machine carrying out plank positioning using CCD, including following step
Suddenly：
1）In X/Y planes the center of CCD identification devices between the center of laser cutting head at a distance from be to maintain
It is constant；
2）The center of CCD identification devices and the nozzle of laser cutting head are Xo, distance in the Y direction at a distance from X-direction
For Yo；
3）The nozzle of laser cutting head is moved to the plank zero crossings within the scope of plate first, and entire scope without departing from
CCD identification ranges；
4）Then origin recognizer is executed, digital control system will be according to Xo obtained above, and the value of Yo is automatically by CCD identification devices
Be moved to above rim charge origin nearby and shoot identification obtain plank relative to CCD identification devices placement location in X-direction
Position be Xc, position in the Y direction is Yc and plank deflection angle A；
5）Digital control system record X-axis physical location is Xa when CCD identification devices shooting simultaneously, and Y-axis physical location is Ya；
6）Plank can be obtained in the dead-center position coordinate Xz of X-direction and Yz points of the dead-center position coordinate of Y-direction in digital control system
It is not：
Xz=Xa+Xc-Xo
Yz=Ya+Yc-Y0；
7）Digital control system controls laser cutting head and is moved to zero coordinate position again, and entire origin identification process is completed.
Further, a kind of implementation method for the laser cutting machine carrying out plank positioning using CCD, further includes following step
Suddenly：
8）CCD identification devices keep the deflection angle with machine tool beam to fix when mounted, i.e., the coordinate of CCD devices is sat with lathe
Mark is fixed.
Further, a kind of implementation method for the laser cutting machine carrying out plank positioning using CCD, further includes following step
Suddenly：
9）CCD identification devices complete plank zero shooting after make CCD identification devices along the direction of plank a line move one section away from
From the position of any captured on this of plank side, and the deflection for calculating this side is combined with the angle of first time shooting identification
The deflection angle A of angle, that is, rim charge.
Further, a kind of implementation method for the laser cutting machine carrying out plank positioning using CCD, further includes following step
Suddenly：
10）Under the premise of CCD identification device maximum pixels determine, CCD identification devices, which reduce shooting identification range, to be increased
The pixel number of unit sizes is to improve accuracy of identification.
11）Artificial rapid material-feeding can be protected when CCD identification devices need to carry out the range of video identification according to batch working
The plank zero migration position range of card determines.
Further, a kind of implementation method for the laser cutting machine carrying out plank positioning using CCD, further includes following step
Suddenly：
12）Laser cutting head and CCD identification devices are vacantly set to above plank.
Further, a kind of laser cutting machine carrying out plank positioning using CCD, the CCD identification devices seek side essence
Degree is more than or equal to 0.01mm.
Further, a kind of implementation method for the laser cutting machine carrying out plank positioning using CCD, further includes following step
Suddenly：
13）When carrying out the identification of plank position, it is driven by the cylinder dustproof protecting cover opening, the work of CCD identification devices；
14）When plank position, identification finishes, and when carrying out sheet fabrication, the dustproof protecting cover of protection CCD identification devices restores to be closed
State.
When due to carrying out sheet fabrication, the metallic dust of generation is easy pollution CCD devices.When plank position, identification finishes,
The dustproof cover of CCD devices is protected to restore closed state.
Further, a kind of implementation method for the laser cutting machine carrying out plank positioning using CCD, further includes following step
Suddenly：
15）When insufficient light, annular light source, which is opened, carries out plank illumination.
Above-mentioned technical proposal can be seen that the present invention and have the advantages that：Application CCD of the present invention is into andante
The laser cutting machine of material positioning has the following advantages that：
1, the application, which improves, seeks side efficiency.In laser cutting machine field, with gradually popularizing for high power laser, cutting machine
Cutting efficiency also constantly promoted.In batch machining, it is required for completing to seek side work first each time before Sheet Metal Processing.Therefore
The promotion for seeking side efficiency is most important to the promotion of laser cutting machine integral cutting efficiency.It carries out seeking side using new CCD technologies
The time before cutting can greatly be shortened shortening to 3 to 5 seconds for 30 seconds or so when being sought from capacitance the time is sought.
2, it can be promoted using CCD technologies and seek side precision.In order to maximally utilize plank, lathe user is under normal conditions
The cutting pattern arranged on plank is all compact, or has secondary side of seeking to cut demand again.Traditional capacitance sensor millimeter
Grade seeks side precision and cannot meet the accuracy requirement constantly promoted at present.Using CCD technologies seek while can be seeking
Precision improvement is even higher to 0.01mm ranks.
3. the influence of interference can be avoided using CCD technologies.When seeking side using CCD technologies, cutting head is not necessarily to close to plank
Surface need to only keep CCD to be kept fixed distance with plate surface.No requirement (NR) is grounded to plank using visual imaging.
Description of the drawings
Fig. 1,2 for it is of the present invention using CCD carry out plank positioning laser cutting machine structural schematic diagram；
Fig. 3 is the structural schematic diagram of CCD identification devices of the present invention；
Fig. 4 is the location diagram of laser cutting head of the present invention and CCD identification devices；
Fig. 5 is the operation principle schematic diagram of the laser cutting machine of the present invention that plank positioning is carried out using CCD；
Fig. 6 is the operation principle schematic diagram of laser cutting machine positioning existing at present of the present invention.
In figure：1 laser cutting head, 2CCD identification devices, 3 annular light sources, 4 dustproof protecting covers, 5 cylinders.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", " clockwise ", " inverse
The orientation or positional relationship of the instructions such as hour hands " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description originally
Invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with specific side
Position construction and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two
It is a or more than two, unless otherwise restricted clearly.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be machine
Tool connects, and can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary two members
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this hair as the case may be
Concrete meaning in bright.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Embodiment
The laser cutting machine that plank positioning is carried out using CCD as shown in Figs 1-4, including laser cutting head 1 and CCD identifications
Device 2, the laser cutting head 1 and CCD identification devices 2 are separately mounted on laser cutting machine, and CCD identification devices 2
In 1 side of laser cutting head；Wherein, the CCD identification devices 2 are equipped with annular light source 3, dustproof protecting cover 4 and cylinder 5.Its
In, the side precision of seeking of the CCD identification devices 2 is more than or equal to 0.01mm.It realizes and carries out plank positioning using CCD technologies, need
CCD identification devices 2 are mounted on to the fixed position on 1 side of laser cutting head, when laser cutting head 1 moves in X/Y planes
When, the relative position and angle between CCD identification devices 2 and laser cutting head 1 are always constant.
On the basis of above structure, a kind of laser cutting machine carrying out plank positioning using CCD as shown in Figure 5
Implementation method includes the following steps：
1）In X/Y planes the center of CCD identification devices 2 between the center of laser cutting head 1 at a distance from be protect
It holds constant；
2）The nozzle of the center of CCD identification devices 2 and laser cutting head 1 is Xo at a distance from X-direction, in the Y direction away from
From for Yo；
3）The nozzle of laser cutting head 1 is moved to the plank zero crossings within the scope of plate first, and entire scope does not surpass
Go out CCD identification ranges；
4）Then origin recognizer is executed, digital control system will be according to Xo obtained above, and the value of Yo is automatically by CCD identification devices
2 be moved to above rim charge origin nearby and shoot identification obtain plank relative to CCD identification devices 2 placement location in X-axis side
To position be Xc, position in the Y direction is Yc and plank deflection angle A；
5）Digital control system record X-axis physical location is Xa when CCD identification devices 2 are shot simultaneously, and Y-axis physical location is Ya；
6）Plank can be obtained in the dead-center position coordinate Xz of X-direction and Yz points of the dead-center position coordinate of Y-direction in digital control system
It is not：
Xz=Xa+Xc-Xo
Yz=Ya+Yc-Y0；
7）Digital control system controls laser cutting head 1 and is moved to zero coordinate position again, and entire origin identification process is completed；
8）CCD identification devices 2 keep the deflection angle with machine tool beam to fix when mounted, i.e. the coordinate and lathe of CCD devices
Coordinate is fixed；
9）CCD identification devices 2 make CCD identification devices 2 move one section along the direction of plank a line after completing the shooting of plank zero
Distance captures the position of any on this of plank side, and is combined with the angle of first time shooting identification and calculate the inclined of this side
The deflection angle A of gyration, that is, rim charge；
10）Under the premise of 2 maximum pixel of CCD identification devices determines, CCD identification devices 2, which reduce shooting identification range, to be increased
Add the pixel number of unit sizes to improve accuracy of identification；
11）Artificial rapid material-feeding can ensure when CCD identification devices 2 need to carry out the range of video identification according to batch working
Plank zero migration position range determines；
12）Laser cutting head 1 and CCD identification devices 2 are vacantly set to above plank；
13）When carrying out the identification of plank position, dustproof protecting cover 4 is driven to open by cylinder 5, CCD identification devices 2 work；
14）When plank position, identification finishes, and when carrying out sheet fabrication, the recovery of dustproof protecting cover 4 of protection CCD identification devices 2 is closed
Conjunction state；
15）When insufficient light, annular light source 3, which is opened, carries out plank illumination.
The method that the application shoots identification plate dead-center position and deflection by CCD.Pass through mobile cutting head nozzle to plate
Then material zero crossings run recognizer come the method for determining CCD shooting identifications position.The a whole set of CCD of side function is sought in completion
Apparatus structure, including：CCD device bodies, Special industrial camera lens, annular light source can open the CCD protective devices being closed.This Shen
It please be mainly the application of image recognition and treatment technology on traditional processing lathe in the information processing technology；Original technology is main
The variation of capacitance is identified using electrical technology.The present invention relies on increased CCD devices with safeguard function and realizes, do not depend on
Cutting head producer；Original technology relies on the capacitance sensor realization for being built in cutting head, is limited to cutting head producer.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the principle of the present invention, several improvement can also be made, these improvement also should be regarded as the present invention's
Protection domain.
Claims (9)
1. a kind of laser cutting machine carrying out plank positioning using CCD, it is characterised in that：Including laser cutting head（1）Know with CCD
Other device（2）, the laser cutting head（1）With CCD identification devices（2）It is separately mounted on laser cutting machine, and CCD is identified
Device（2）Close to laser cutting head（1）Setting；Wherein, the CCD identification devices（2）It is equipped with annular light source（3）, dust-proof guarantor
Shield（4）And cylinder（5）.
2. the implementation method of the laser cutting machine according to claim 1 for carrying out plank positioning using CCD, feature exist
In：Include the following steps：
1）The CCD identification devices in X/Y planes（2）Center and laser cutting head（1）The distance between center
It is to maintain constant；
2）CCD identification devices（2）Center and laser cutting head（1）Nozzle X-direction distance be Xo, in the Y direction
Distance be Yo；
3）First by laser cutting head（1）Nozzle be moved to the plank zero crossings within the scope of plate, and entire scope is not
Beyond CCD identification ranges；
4）Then origin recognizer is executed, digital control system will be according to Xo obtained above, and the value of Yo is automatically by CCD identification devices
（2）It is moved to above rim charge origin nearby and shoots identification and obtain plank relative to CCD identification devices（2）Placement location in X
The position of axis direction is Xc, and position in the Y direction is Yc and plank deflection angle A；
5）CCD identification devices simultaneously（2）Digital control system record X-axis physical location is Xa when shooting, and Y-axis physical location is Ya；
6）Plank can be obtained in the dead-center position coordinate Xz of X-direction and Yz points of the dead-center position coordinate of Y-direction in digital control system
It is not：
Xz=Xa+Xc-Xo
Yz=Ya+Yc-Y0；
7）Digital control system controls laser cutting head again（1）It is moved to zero coordinate position, entire origin identification process is completed.
3. the implementation method of the laser cutting machine according to claim 2 for carrying out plank positioning using CCD, feature exist
In：It is further comprising the steps of：
8）CCD identification devices（2）The deflection angle with machine tool beam is kept to fix when mounted, i.e. the coordinate and machine of CCD devices
Bed coordinate is fixed.
4. the implementation method of the laser cutting machine according to claim 2 for carrying out plank positioning using CCD, feature exist
In：It is further comprising the steps of：
9）CCD identification devices（2）Make CCD identification devices after completing the shooting of plank zero（2）It is moved along the direction of plank a line
A distance captures the position of any on this of plank side, and is combined with the angle of first time shooting identification and calculate this side
Deflection angle, that is, rim charge deflection angle A.
5. the implementation method of the laser cutting machine according to claim 2 for carrying out plank positioning using CCD, feature exist
In：It is further comprising the steps of：
10）In CCD identification devices（2）Under the premise of maximum pixel determines, CCD identification devices（2）Reduce shooting identification range energy
Enough increase the pixel number of unit sizes to improve accuracy of identification；
11）CCD identification devices（2）Artificial rapid material-feeding can ensure when needing the range of progress video identification according to batch working
Plank zero migration position range determine.
6. the implementation method of the laser cutting machine according to claim 2 for carrying out plank positioning using CCD, feature exist
In：It is further comprising the steps of：
12）Laser cutting head（1）With CCD identification devices（2）It is hanging to be set to above plank.
7. the laser cutting machine according to claim 1 for carrying out plank positioning using CCD, it is characterised in that：The CCD
Identification device（2）Seek side precision be more than or equal to 0.01mm.
8. the implementation method of the laser cutting machine according to claim 2 for carrying out plank positioning using CCD, feature exist
In：It is further comprising the steps of：
13）When carrying out the identification of plank position, by cylinder（5）Drive dustproof protecting cover（4）It opens, CCD identification devices（2）Work
Make；
14）When plank position, identification finishes, and when carrying out sheet fabrication, protects CCD identification devices（2）Dustproof protecting cover（4）It is extensive
Reclosing conjunction state.
9. the implementation method of the laser cutting machine according to claim 2 for carrying out plank positioning using CCD, feature exist
In：It is further comprising the steps of：
15）When insufficient light, annular light source（3）It opens and carries out plank illumination.
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| CN201810611173.5A CN108747049B (en) | 2018-06-14 | 2018-06-14 | Implementation method of laser cutting machine for positioning plate by using CCD |
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| CN201810611173.5A CN108747049B (en) | 2018-06-14 | 2018-06-14 | Implementation method of laser cutting machine for positioning plate by using CCD |
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