CN108732873A - Developer solution supply system and developer solution fill method - Google Patents
Developer solution supply system and developer solution fill method Download PDFInfo
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- CN108732873A CN108732873A CN201710242987.1A CN201710242987A CN108732873A CN 108732873 A CN108732873 A CN 108732873A CN 201710242987 A CN201710242987 A CN 201710242987A CN 108732873 A CN108732873 A CN 108732873A
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- developer solution
- accumulator tank
- preset time
- developer
- filled
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3071—Process control means, e.g. for replenishing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The disclosure provides a kind of developer solution fill method, and this method includes being inserted a developer solution in the accumulator tank of one developer solution supply system in one first preset time.This method further includes stopping inserting developer solution in accumulator tank in one second preset time for connecting the first preset time.This method includes judging that the whether developed liquid of accumulator tank fills up again, if otherwise repeating above-mentioned and etc..
Description
Technical field
The embodiment of the present invention is supplied about a kind of semiconductor fabrication especially in regard to a kind of developer solution that micro-photographing process uses
It answers system and fills developer solution to the method in the accumulator tank of developer solution supply system.
Background technology
In semiconductor element manufacture, micro-photographing process (lithography) plays considerable role, is used for
Required specific pattern is formed on chip.The basic step of micro-photographing process includes, and forms photoresist layer in wafer surface, marking or
Exposure for example have particular electrical circuit layout pattern on the photoresist layer, and by supply developer solution to the photoresist layer to remove
The unwanted part of this layer, and then required specific pattern can be formed on chip.In addition, for example, by a flusher
Before developer solution is supplied on the photoresist layer of chip, developer solution is transported to spray through a series of pipe-line system by factory service end
An accumulator tank of device is spilt to be kept in.
Although existing developer solution supply system (including pipe-line system and flusher) may conform to above-mentioned general mesh
, but still cannot be satisfied all aspects.
Invention content
The one of the disclosure is designed to provide a kind of developer solution supply system that micro-photographing process uses and fills out developer solution
The method being charged in the accumulator tank of developer solution supply system, it is possible to reduce it is generated with pipe-line system because rubbing when conveying developer solution
Electrostatic, and then avoid pipe-line system by the injury of the spark of static discharge (electrostatic discharge, ESD).
Some embodiments of the disclosure provide a kind of developer solution fill method, including in one first preset time, one is shown
Shadow liquid is inserted in the accumulator tank of a developer solution supply system.This method further includes default in connect the first preset time one second
In time, stop inserting developer solution in accumulator tank.This method again include judge whether the accumulator tank is filled up by the developer solution, if
Otherwise above-mentioned be somebody's turn to do is repeated.
The disclosure some embodiments provide a kind of developer solution fill method, including by multiple fill cycle by a developer solution
It inserts in an accumulator tank of a developer solution supply system, until accumulator tank is filled.This method further includes being filled out in adjacent
It fills between the period, stops inserting developer solution in accumulator tank, and continue a preset time.
Some embodiments of the disclosure provide a kind of developer solution supply system, including a flusher and a control device.
Flusher is for supplying a developer solution a to chip, and flusher has an accumulator tank, for storing developer solution.Control dress
It sets and is received in accumulator tank by multiple fill cycle for controlling developer solution, until accumulator tank is filled, and is used for
Control developer solution is stopped between adjacent fill cycle in filling accumulator tank, and continues a preset time.
Description of the drawings
Fig. 1 shows the method schematic diagram in accordance with some embodiments supplied in micro-photographing process on developer solution to chip.
Fig. 2 shows the block diagram of developer solution supply system in accordance with some embodiments.
Fig. 3, which is shown, in accordance with some embodiments fills a developer solution flow diagram into accumulator tank.
Fig. 4 A and 4B show the electrostatic potential result of the voltage stabilizing valve surface measured via different developer solution fill methods.
Fig. 5 shows the first, second preset time of the different developer solutions stored by storage element in accordance with some embodiments
Look-up table part.
Fig. 6 is shown fills a developer solution flow diagram into accumulator tank according to other embodiments.
Fig. 7 shows the flow chart of developer solution fill method in accordance with some embodiments.
【Symbol description】
1~flusher；
2~pipe-line system；
3~control device；
10~nozzle；
11~turntable；
12~chip；
13~accumulator tank；
14~pipeline；
15~switch valve；
16~the first level sensors；
17~the second level sensors；
21~the first pipelines；
22~the second pipelines；
23~switch valve；
24~suction pump；
25~filter element；
26~pressure maintaining valve；
30~storage element；
100~developer solution supply system；
700~developer solution fill method；
701,702~step；
D~developer solution；
H~liquid level；
T1~the first preset time；
T2~the second preset time；
T3~third the time；
TS~filling sart point in time；
TE~end-of-fill time point.
Specific implementation mode
Following disclosure provides many different embodiments or example to implement the different characteristic of this case.In following discloses
Hold the particular example for describing each component and its arrangement mode, to simplify explanation.Certainly, these specific examples are not to limit
It is fixed.If being formed in above a second feature for example, describing a fisrt feature in embodiment, that is, indicate that it may include
Above-mentioned fisrt feature and above-mentioned second feature are also to have may included supplementary features to be formed in above-mentioned the case where being in direct contact
Between one feature and above-mentioned second feature, and so that the case where above-mentioned fisrt feature is not in direct contact with second feature.
The space correlation word being used below, for example, " in ... lower section ", " lower section ", " lower ", " top ", " compared with
It is high " and similar word, be for ease of description in diagram an elements or features and another (a little) elements or features it
Between relationship.Other than the orientation being painted in the accompanying drawings, these space correlation words also mean to be possibly comprised in different orientation
Device in lower use or operation attached drawing.
Identical element numbers and/or word may be reused in following difference embodiment, these repeat to be for letter
Change and clearly purpose, are not limited to have specific relationship between the different embodiments discussed and/or structure.
Be used below first and second equal vocabulary, only as the purpose of clear interpretation, not to correspondence with
And limitation the scope of the claims.In addition, the vocabulary such as fisrt feature and second feature, are not limited to identical or are different feature.
In the accompanying drawings, the shape of structure or thickness may expand, to simplify or convenient for indicating.It will be appreciated that not special
The element that Miao Shu or not illustrate can exist with the various forms known to art technology personage.
In addition, it is necessary to understand, additional operation can be provided before and after, during method in embodiment,
And for the method in different embodiments, the operation of some descriptions can be replaced or eliminated.
The embodiment of the present disclosure provides a kind of developer solution supply system, for the development needed for supplying semiconductor micro-photographing process
Liquid.Please referring initially to Fig. 1, the method signal in accordance with some embodiments supplied in micro-photographing process on developer solution to chip is shown
Figure.In Fig. 1, a flat nozzle 10 is set to 12 top of chip being fixed on a turntable 11, can be by developer solution profit
It is supplied on chip 12 with spray pattern so that the developed liquid of photoresist layer (not shown) on 12 surface of chip is covered.Then,
Generated centrifugal force when being rotated using turntable 11 so that developer solution is evenly distributed on photoresist layer, and then can pass through development
Liquid goes to the unwanted part of removing photoresistance layer.
The sprinkling that above-mentioned developing technique is often used for current industry/puddle (spray/puddle) formula developing method.But
In some other embodiments, other developing techniques, such as impregnated or rock type developing method can also be used to come to chip
Photoresist layer on 12 surfaces develops.In addition, though not shown, the developer solution for throwing away or falling from chip 12 can be by a shell
It is collected, and lead the way via a waste liquid and be emitted into a liquid waste treatment system to be handled.
According to some embodiments, chip 12 is made by silicon, germanium or other semi-conducting materials.It is brilliant according to some embodiments
Piece 12 is made by composite semiconductor, such as silicon carbide (SiC), GaAs (GaAs), indium arsenide (InAs) or indium phosphide (InP).
According to some embodiments, chip 12 is made by alloy semiconductor, such as SiGe (SiGe), Germanium carbon (SiGeC), gallium arsenide phosphide
(GaAsP) or InGaP (GaInP).According to some embodiments, chip 12 includes a hyaline layer.For example, chip 12 has
There is a hyaline layer to be covered on large-scale semiconductor (bulk semiconductor).According to some embodiments, chip 12 can be silicon
Insulator (silicon-on-insulator；) or germanium insulator (germanium-on-insulator SOI；GOI) substrate.
Fig. 2 shows the block diagram of developer solution supply system 100 in accordance with some embodiments.Developer solution supply system 100
For supplying the developer solution needed for micro-photographing process, including a flusher 1, a pipe-line system 2 and a control device 3.
As shown in Fig. 2, flusher 1 includes a nozzle 10, for developer solution to be utilized spray pattern in micro-photographing process
Supplied on chip 12 (Fig. 1).The structure of nozzle 10 can be found in Fig. 1.Flusher 1 also includes an accumulator tank 13, for storing
Developer solution D from factory service end (not shown), and connect nozzle 10 through a pipeline 14.A switch valve is provided on pipeline 14
15, for example, pneumatic operated valve or solenoid valve, the circulation for selectively closing off developer solution D in pipeline 14.When switch valve 15 is opened
When, the developer solution D in accumulator tank 13 can be supplied on chip 12 by nozzle 10 via pipeline 14.
Pipe-line system 2 is connected between factory service end (not shown) and flusher 1, for starting to spray in flusher 1
Before developer solution, the deployed developer solution of factory service end is delivered to the accumulator tank 13 of flusher 1.
According to some embodiments, the solvent of developer solution includes water or organic solvent, wherein organic solvent can be selected from alcohol, ketone,
The solvent of ester, ether, hydrocarbon and its mixture.According to some embodiments, developer solution is a minus developer solution (negative tone
Developer, NTD), solvent is butyl acetate, such as n-butyl acetate (NBA), and with the ratio of 90wt%-100wt%
It is present in developer solution, is for example, more than 95wt%, is more than 98wt%, is more than 99wt% or 100wt%, based on the total of developer solution
Weight.
According to some embodiments, the composition of developer solution includes alkali compounds, can be divided into organic basic compound and nothing
Machine alkali compounds, wherein organic basic compound include, such as tetramethyl ammonium hydroxide (TMAH) or hydroxide second
Alcohol ammonium (trimethylmonoethyl ammonium hydroxide), and inorganic alkaline compound includes, such as calcium hydroxide
(Ca(OH)2), sodium hydroxide (NaOH), potassium hydroxide (KOH), sodium carbonate (Na2CO3) and sodium metasilicate (Na2SiO3) etc. compounds
At least one or two more than mixture.
According to some embodiments, the composition of developer solution also includes surfactant, for example, Pluronic F-127 alkyl ether
(polyoxyethylene alkyl ether), Pluronic F-127 alkyl aryl ether (polyoxyethylene
Alkylphenyl ether) or Pluronic F-127 propylene oxide copolymer (polyoxyethylene polyoxypropylene
The anionic properties surfactant such as ether).
As shown in Fig. 2, pipe-line system 2 includes multiple first pipelines 21, one end (left side in such as figure of each first pipeline 21
End) it is connected to the supply tank (not shown) for storing deployed different developer solutions of factory service end.For simplicity, Fig. 2
In only draw two the first pipelines 21, but the quantity of the developer solution supply tank based on factory service end, pipe-line system 2 can also include
More first pipelines 21.In addition, being provided with a switch valve 23, for example, pneumatic operated valve or solenoid valve on each first pipeline 21, use
In the circulation for selectively closing off developer solution in the first pipeline 21.The other end (right end in such as figure) of aforementioned each first pipeline 21
It mutually intersects together, and connects one second pipeline 22.When the switch valve 23 in the one of which of such first pipeline 21 is opened,
The developer solution stored in the correspondence supply tank of permissible factory service end flow to the second pipeline 22.
Second pipeline 22 is connected to the accumulator tank 13 of flusher 1 again.In addition, being configured with a suction pump on the second pipeline 22
24, a filter element 25 and a pressure maintaining valve 26.Using water extraction way, suction pump 24 can will store in the supply tank of factory service end
Developer solution is delivered to the accumulator tank 13 of flusher 1, and the stream of controllable developer solution via the first pipeline 21 and the second pipeline 22
Amount.Filter element 25 is used to remove contained in developer solution impurity or exotic.Pressure maintaining valve 26 is used to adjust the stream of developer solution
Amount, and valve outlet pressure is kept in a certain range.According to some embodiments, pressure maintaining valve 26 is mainly by adjustment spring, film
The parts such as piece, piston, valve seat and flap form, and downstream pressure and driving flap are directly sensed using diaphragm, can control flap
Aperture is to reach voltage stabilizing and adjust the function of fluid flow.
As shown in Fig. 2, control device 3 (being, for example, a computer, but not limited thereto) is electrically connected pipe-line system 2 and sprinkling
Device 1 is used for the running of control piping system 2 and flusher 1.
Specifically, control device 3 can be electrically connected the suction pump 24 of pipe-line system 2, and suction pump 24 is controlled by factory service
The developer solution stored in the supply tank at end is delivered to the accumulator tank 13 of flusher 1 via the first pipeline 21 and the second pipeline 22
All processes (including starting, time point for stopping pumping and pressure of drawing water (flow of corresponding developer solution)).Control device 3 can
The switch valve 23 on each first pipeline 21 of pipe-line system 2 is electrically connected to control its opening and closing so that factory service end is provided more
Kind development liquid energy is selectively transported to the accumulator tank 13 of flusher 1 via 21 and second pipeline 22 of each first pipeline.
The switch valve 15 that control device 3 can be also electrically connected on the pipeline 14 of flusher 1 is to control its opening and closing so that storage
Depositing the developer solution D in slot 13 can be provided on chip 12 (Fig. 1) via nozzle 10.More specifically, when flusher 1 is in
Standby mode (that is, when not supplying on developer solution D to chip 12), 3 controllable switch valve 15 of control device is to blind off a line in 14
The circulation of developer solution D, and when flusher 1 is in running order (that is, supply developer solution D to chip 12 on when), control device
3 controllable switch valves 15 so that the developer solution D in accumulator tank 13 can be via spray to allow the circulation of developer solution D in pipeline 14
Mouth 10 is provided on chip 12.Control device 3 can be electrically connected the motor (not shown) in the nozzle 10 of flusher 1, with
Control the flow of 10 spray developing liquid D of nozzle.
Furthermore as shown in Fig. 2, flusher 1 also includes one first level sensor 16.First level sensor 16 is used for
Whether the liquid level H for sensing the developer solution D in accumulator tank 13 is higher than a maximum preset value, such as the height of accumulator tank 13
95%, and control device 3 can be electrically connected the first level sensor 16, and showing in accumulator tank 13 is learnt according to its output signal
Whether shadow liquid D amounts have reached preset maximum capacity (that is, whether accumulator tank 13 has been filled with).In some embodiments, it stores
When the liquid level H of developer solution D in slot 13 reaches first preset value, that is, indicate that the developer solution D amounts in accumulator tank 13 reach
One first preset value amount, that is, accumulator tank 13 have been filled with.When control device 3 is believed according to the output of the first level sensor 16
Number and when learning that accumulator tank 13 has been filled, can further control suction pump 24, and it is made to stop developer solution being delivered to storage
It deposits in slot 13.
Flusher 1 also includes one second level sensor 17.Second level sensor 17 is for sensing in accumulator tank 13
Developer solution D liquid level H whether less than the 5% or 10% of a minimum preset value, such as 13 height of accumulator tank, and control dress
The second level sensor 17 can be electrically connected by setting 3, and whether learn the developer solution D amounts in accumulator tank 13 according to its output signal
Reach the capacity for the operation for being not enough to supply micro-photographing process.In some embodiments, the liquid level of the developer solution D in accumulator tank 13 is high
When spending H as low as second preset value, that is, the developer solution D amounts in accumulator tank 13 are indicated as low as one second predetermined amount, that is, store
The developer solution D amounts of slot 13 have reached the capacity for the operation for being not enough to supply micro-photographing process.Second preset value is first default less than this
Value, and second predetermined amount is less than first predetermined amount.When control device 3 is according to the output signal of the second level sensor 17
And when learning that the liquid level of the developer solution D in accumulator tank 13 has been less than minimum preset value, suction pump 24 can be further controlled,
And make its start by developer solution D with one both constant flow be delivered in accumulator tank 13.Both constant flow was set based on actual needs for this.
According to some embodiments, 16 and 17 usable differential pressure type of the first, second level sensor, float-type, optoelectronic induction
Type, Supersonic wave mode etc. are various to sense the measurement machine of liquid level and output signal, and may be disposed at the outside of accumulator tank 13
Or in which.
Then it shows and in accordance with some embodiments fills a developer solution D to accumulator tank 13 also referring to Fig. 2 and 3, Fig. 3
In flow diagram, wherein developer solution D is a pure n-butyl acetate (NBA), that is, the n-butyl acetate containing 100wt%.
When flusher 1 is in standby and the second level sensor 17 senses developer solution D's in accumulator tank 13
When liquid level H is less than a preset value (that is, the filling sart point in time T in Fig. 3S), control device 3 can be according to the second liquid level
The output signal control suction pump 24 of sensor 17 starts to draw water so that developer solution D is in one first preset time T1(such as 15
Second) in one both constant flow be received in accumulator tank 13.Then, control device 3 can control suction pump 24 to stop pumping so that aobvious
Shadow liquid D is connecting the first preset time T1One second preset time T2Stop in (such as 60 seconds) in filling accumulator tank 13.And
Second preset time T2Afterwards, the first level sensor 16 can judge that the whether developed liquid D of accumulator tank 13 is filled up, if otherwise control dress
It sets 3 controllable suction pumps 24 to start to draw water once again so that developer solution D is in another first preset time T1More than in (such as 15 seconds)
It states both constant flows to continue to be received in accumulator tank 13, and accumulator tank 13 is enabled to reach the state of filling up.At this time (that is, the filling in Fig. 3
End time point TE), when the first level sensor 16 sense accumulator tank 13 have reached fill up state when an exportable signal, and
Control device 3 can control suction pump 24 according to this signal to be stopped continuing to insert in accumulator tank 13 by developer solution D.Later, control dress
Set 3 automatically or manually controlling switch valve 15 can enter work with the circulation and control flusher 1 that allow developer solution D in pipeline 14
Make state.
It is to be understood that since the resistivity (resistivity) of the developer solution D of pure n-butyl acetate (NBA) is quite high
(that is, conductivity is at a fairly low), for example, 5 × 108Ohm meter (Ω m), therefore when it is in the first, second pipeline of pipe-line system 2
When 21 and 22 conveying, it is easy and with polytetrafluoroethylene (PTFE) (PTFE) or tetrafluoroethene-perfluorinated alkoxy vinyl ether copolymer
(PFA) it (is, for example, 1 × 10 that same resistivity is high made of22Ohm meter) the first, second pipeline 21 and 22 produced because of friction
Raw electrostatic, and then cause the diaphragm, filter element 25 or other component of the pressure maintaining valve 26 of pipe-line system 2 may be by static discharge
Spark injury, and pipe-line system 2 is made to have the risk that developer solution D leakage occurs, in particular, aobvious with high resistivity
Shadow liquid D by for a long time, continuous conveying in the way of be filled to storage via the first, second pipeline 21 and 22 of pipe-line system 2
In the case of in slot 13.
In embodiment of the disclosure, pass through above-mentioned developer solution fill method (Fig. 3), it is possible to reduce when conveying developer solution D
The electrostatic that first, second pipeline 21 and 22 of itself and pipe-line system 2 is generated by friction, and then avoid pipe-line system 2 by electrostatic
The injury of the spark of electric discharge (electrostatic discharge, ESD).
Conveying developer solution D can be reduced refering to Fig. 4 A and 4B explanation via developer solution fill method disclosed in Fig. 3 by coordinating below
The mechanism for the electrostatic that Shi Qiyu pipe-line systems 2 are generated by friction, wherein Fig. 4 A are shown via developer solution fill method disclosed in Fig. 3
The electrostatic potential on 26 surface of pressure maintaining valve measured is as a result, and Fig. 4 B are shown via continuous continual developer solution filling mode
The electrostatic potential result on 26 surface of pressure maintaining valve measured.The electrostatic potential on 26 surface of pressure maintaining valve is available can to measure object
The electrometer of the electrostatic potential on surface measures.
Twice by developer solution D in one first preset time T it can be seen from Fig. 4 A1With both constant currents in (15 seconds)
In the process (also known as fill cycle) of amount filling accumulator tank 13, maximum electrostatic potential can be measured by 26 surface of pressure maintaining valve
About 0.25 volt, and not by (the second preset time T during developer solution filling accumulator tank 13 D between fill cycle twice2
In (60 seconds)), the electrostatic potential measured by 26 surface of pressure maintaining valve is 0 volt.And in Fig. 4 B it can be seen from if will development
Liquid D is in a third time T3In (such as twice of T1 length, that is, T3=2T1) by one it is continuous it is continual in a manner of fill to storage
Slot 13 is deposited, can measure maximum electrostatic potential by 26 surface of pressure maintaining valve can increase to about 0.50 volt.It can be seen that
For a long time, by way of continuous conveying developer solution D is filled up accumulator tank 13 in the case of, developer solution D and pipe-line system 2 because
The electrostatic (such as accumulating on the electrostatic on 26 surface of pressure maintaining valve) that friction generates is more, relatively, passes through repeatedly (such as two
It is secondary) fill cycle in such a way that developer solution D is filled up accumulator tank 13 (Fig. 3), then may make in each fill cycle developer solution D with
Pipe-line system 2 is because the electrostatic that friction generates is reduced, and dwell time designed between adjacent fill cycle (that is, second
Preset time T2) loss for the electrostatic that 2 surface of pipe-line system is accumulated also is can help to, and then avoid pipe-line system 2 by quiet
The injury of the spark of discharge of electricity.
Above-mentioned first preset time T1And second preset time T2Can by user empirically or experimental result determining and
Control device 3 is set.For example, for various developer solutions, because the difference of resistivity can make friction generate quiet
Electricity is different, therefore user can empirically or experimental result determines suitable first preset time T1(that is, it is each
The time of fill cycle) and the second preset time T2(that is, stopping filling time between adjacent fill cycle), and to control
Device 3 is set.
Control device 3 can with a storage element 30 (Fig. 2) with store set by user about various developer solutions
First, second preset time T1And T2.For example, Fig. 5 shows the difference stored by storage element 30 in accordance with some embodiments
First, second preset time T of developer solution1And T2Look-up table part.Control device 3 can determine to correspond to according to this look-up table
In the first preset time T of (at present needed for micro-photographing process) developer solution1And second preset time T2, and then control developer solution and supply
Answer the running of system 100.
Need to first it illustrate, the 5th figure is only that the height for the resistivity for showing developer solution is to consider the first, second preset time
The illustration of the look-up table of one of the parameter of T1 and T2, look-up table also may include other developer solution supplies operating parameters (such as
The filling flow of each fill cycle).It can be seen from Fig. 5 the first of the higher developer solution of resistivity (such as NBA) it is default when
Between the shorter than lower developer solution of resistivity (such as isopropanol (IPA)) the first preset time, that is, the first preset time
The size of length and the resistivity of developer solution is inversely proportional, and can so reduce in each fill cycle developer solution with pipe-line system because rubbing
Wipe the electrostatic generated.By that can also find out in Fig. 5, the second preset time of the higher developer solution of resistivity (such as NBA) is longer
In second preset time of the lower developer solution of resistivity (such as isopropanol (IPA)), that is, the length of the second preset time with
The size of the resistivity of developer solution is directly proportional, so may make that generated electrostatic can be in the second preset time in fill cycle
Loss inside is effectively performed and avoids accumulating on the surface of pipe-line system.
Although it is not shown, can be by the first preset time T of some developer solutions1It is set greater than, is equal to or less than second
Preset time T2, to achieve the purpose that the electrostatic generated by friction with pipe-line system 2 in continuous conveying such as above-mentioned reduction developer solution
?.
Then referring to Fig. 6, its display fills a developer solution D to the stream in accumulator tank 13 according to other embodiments
Journey schematic diagram.The liquid level that the developer solution D in accumulator tank 13 is sensed from the second level sensor 17 it can be seen from Fig. 6 is high
Time point (that is, filling sart point in time T in figure of the degree less than a preset valueS) start, control device 3 (Fig. 2) can be according to the
The output signal control suction pump 24 (Fig. 2) of two level sensors 17 starts to draw water so that developer solution D is in one first preset time
T1It is interior with one both constant flow be received in accumulator tank 13.Then, control device 3 can control suction pump 24 to stop pumping so that aobvious
Shadow liquid D is connecting the first preset time T1One second preset time T2In interior stopping filling accumulator tank 13.Wherein, it is disclosed with Fig. 3
Embodiment between the difference lies in that in the second preset time T2Afterwards, control device 3 is according to 6 storage of the first level sensor 1 sensing
Depositing the result that the whether developed liquid D of slot 13 is filled up can control suction pump 24 to operate, and the step of repeating above-mentioned filling developer solution D
(corresponding first preset time T1) repeatedly (two or more times) and stop the step of filling developer solution D between adjacent fill cycle
Suddenly (corresponding second preset time T2), until accumulator tank 13 is filled (that is, the end-of-fill time point T in figureE).First
Preset time T1Length may be set greater than, be equal to or less than the second preset time T2。
It is noted that in the 3rd and 6 figures, although end-of-fill time point TEWeek is filled in last time in lucky position
The time point that phase terminates, but its also may position before last time fill cycle terminates.As long as the first level sensor 16 is felt
It measures accumulator tank 13 and has reached the state of filling up, control device 3 can be controlled according to the output signal of the first level sensor 16 and be drawn water
Pump 24 stops pumping immediately.In addition, according to some embodiments, the filling flow of the developer solution of each fill cycle may not also phase
Together, this can be adjusted and control according to actual demand.
The time of method by above-mentioned multiple fill cycle developer solution is filled up accumulator tank, each fill cycle can contract
It is short so that developer solution and pipe-line system 2 (Fig. 2) are because the electrostatic that friction generates efficiently reduces, and between adjacent fill cycle
Stopping fill cycle (time) also can help to the loss for the electrostatic that 2 surface of pipe-line system is accumulated, and then avoid pipeline system
System 2 is injured by the spark of static discharge.It is to be understood that in the premise for not influencing and postponing follow-up micro-photographing process progress
Under, more multiple fill cycle can more reduce the electrostatic that developer solution is generated with pipe-line system 2 by friction, and stop fill cycle
The time longer electrostatic that 2 surface of pipe-line system can also be contributed to be accumulated loss.
Fig. 7 shows the flow chart of developer solution fill method 700 in accordance with some embodiments.In step 701, by multiple
Fill cycle is inserted a developer solution in one accumulator tank of one developer solution supply system, until accumulator tank is filled.In step
In rapid 702, between adjacent fill cycle, stop inserting developer solution in accumulator tank, and continue a preset time.
In conclusion the embodiment of the present disclosure has the following advantages：By multiple fill cycle and adjacent fill cycle it
Between configuration stop fill cycle (time) method developer solution is filled up accumulator tank, can effectively avoid pipe-line system by electrostatic
The injury of the spark of electric discharge.In addition, the control device of developer solution supply system adds the fill cycle for being available for users to setting
The control parameters such as time (that is, first preset time) and stopping fill cycle time (that is, second preset time), so also have
Such control parameter is adjusted conducive to condition (resistivity) according to different developer solutions, to optimize the efficiency of developer solution supply system
Performance.
According to some embodiments, a kind of developer solution fill method is provided.This method includes being incited somebody to action in one first preset time
One developer solution is inserted in the accumulator tank of a developer solution supply system.This method further includes connecting the one second of the first preset time
In preset time, stop inserting developer solution in accumulator tank.This method includes judging whether the accumulator tank is filled out by the developer solution again
It is full, if otherwise repeating above-mentioned be somebody's turn to do.
According to some embodiments, above-mentioned judgment step is felt by one first level sensor of developer solution supply system
It surveys whether accumulator tank is filled, when the first level sensor sensing accumulator tank is filled, stops developer solution inserting accumulator tank
In.
According to some embodiments, above-mentioned developer solution fill method further includes one second liquid level by developer solution supply system
Whether the liquid level that sensor senses the developer solution in accumulator tank is less than a predicted value, is stored when the second level sensor senses
When the liquid level of developer solution in slot is less than preset value, beginning is above-mentioned in the first preset time, and developer solution is inserted and is stored
Step in slot.
According to some embodiments, above-mentioned developer solution fill method further includes the control device by developer solution supply system
The first preset time and the second preset time corresponding to developer solution are determined according to the look-up table stored by a storage element.
According to some embodiments, in the situation that different developer solutions is filled up to accumulator tank, the length of the first preset time with
The size of the resistivity of developer solution is inversely proportional.
According to some embodiments, in the situation that different developer solutions is filled up to accumulator tank, the length of the second preset time with
The size of the resistivity of developer solution is directly proportional.
According to some embodiments, the first predetermined time period is different from the second preset time.
According to some embodiments, a kind of developer solution fill method is provided.This method includes passing through multiple fill cycle by one
Developer solution is inserted in an accumulator tank of a developer solution supply system, until accumulator tank is filled.This method further includes in phase
Between adjacent fill cycle, stop inserting developer solution in accumulator tank, and continue a preset time.
According to some embodiments, in the situation that different developer solutions is filled up to accumulator tank, the length of above-mentioned preset time with
The size of the resistivity of developer solution is directly proportional.
According to some embodiments, a kind of developer solution supply system, including a flusher and a control device are provided.Spray
Spill device for supply a developer solution a to chip, and flusher is with an accumulator tank, for storing developer solution.Control device
It is received in accumulator tank by multiple fill cycle for controlling developer solution, until accumulator tank is filled, and for controlling
Developer solution processed is stopped between adjacent fill cycle in filling accumulator tank, and continues a preset time.
Although embodiment and their advantage are described in detail above, it is to be understood that being applied for a patent without departing substantially from appended
In the case of the spirit and scope of the present disclosure that range limits, to the disclosure can various changes can be made, alternatives and modifications.In addition,
Scope of the present application is not intended to be limited to processing procedure described in the specification, machine, manufacture, material composition, tool, method and steps
Specific embodiment.To easily it understand from the disclosure as those skilled in the art, according to the disclosure, Ke Yili
With it is existing or from now on by it is being developed, execute the function essentially identical with corresponding embodiment described in the disclosure or realize base
The processing procedure of this identical result, machine, manufacture, material composition, tool, method or step.Therefore, appended claim purport
In the range of including them by these processing procedures, machine, manufacture, material composition, tool, method or step.In addition, each Shen
Please the scope of the claims constitute an individual embodiment, and the combination of different claim and embodiment is all in the model of the disclosure
In enclosing.
Claims (10)
1. a kind of developer solution fill method, including：
In one first preset time, a developer solution is inserted in an accumulator tank of a developer solution supply system；
In one second preset time for connecting first preset time, stopping inserts the developer solution in the accumulator tank；And
Judge whether the accumulator tank is filled up by the developer solution, if otherwise repeating above-mentioned be somebody's turn to do.
2. developer solution fill method as described in claim 1, the wherein judgment step are by the developer solution supply system
One first level sensor senses whether the accumulator tank is filled, and is filled when first level sensor senses the accumulator tank
When, stopping inserts the developer solution in the accumulator tank.
3. developer solution fill method as claimed in claim 2 further includes one second liquid level by the developer solution supply system
Whether the liquid level that sensor senses the developer solution in the accumulator tank is less than a predicted value, when the second level sensor sense
When surveying the liquid level of the developer solution in the accumulator tank less than the preset value, beginning is above-mentioned in first preset time, will
The developer solution inserts the step in the accumulator tank.
4. developer solution fill method as described in claim 1 further includes the control device by the developer solution supply system
It is determined corresponding to first preset time of the developer solution according to the look-up table stored by a storage element and this is second default
Time.
5. the developer solution fill method as described in any one in Claims 1-4, wherein different developer solutions is filled up the storage
The situation of slot is deposited, the length of first preset time and the size of the resistivity of the developer solution are inversely proportional.
6. the developer solution fill method as described in any one in Claims 1-4, wherein different developer solutions is filled up the storage
The situation of slot is deposited, the length of second preset time is directly proportional to the size of the resistivity of the developer solution.
7. the developer solution fill method as described in any one in Claims 1-4, wherein first predetermined time period are different from
Second preset time.
8. a kind of developer solution fill method, including：
One developer solution is inserted in an accumulator tank of a developer solution supply system by multiple fill cycle, until the accumulator tank quilt
Until filling up；And
Between adjacent such fill cycle, stopping inserts the developer solution in the accumulator tank, and continues a preset time.
9. developer solution fill method as claimed in claim 8, wherein in the situation that different developer solutions is filled up to the accumulator tank,
The length of the preset time is directly proportional to the size of the resistivity of the developer solution.
10. a kind of developer solution supply system, including：
One flusher, for supplying a developer solution a to chip, which has an accumulator tank, for storing the development
Liquid；And
One control device is received in the accumulator tank for controlling the developer solution by multiple fill cycle, until the accumulator tank
Until being filled, and it is stopped for controlling the developer solution between adjacent such fill cycle and inserts in the accumulator tank,
And continue a preset time.
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| US4098431A (en) * | 1977-01-13 | 1978-07-04 | Cine Magnetics Inc. | Chemical replenishing system |
| US5868278A (en) * | 1996-12-09 | 1999-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Eliminating microbubbles in developer solutions to reduce photoresist residues |
| CN1312490A (en) * | 2000-01-31 | 2001-09-12 | 富士胶片株式会社 | Automatic developing device and method for supplementing developing liquid |
| CN1517801A (en) * | 2003-01-09 | 2004-08-04 | 富士胶片株式会社 | Method for adding developer to automatic developing device for photosensitive lithographic printing plate |
| CN105511237A (en) * | 2015-12-04 | 2016-04-20 | 深圳市华星光电技术有限公司 | Developing solution supply system |
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| US4098431A (en) * | 1977-01-13 | 1978-07-04 | Cine Magnetics Inc. | Chemical replenishing system |
| US5868278A (en) * | 1996-12-09 | 1999-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Eliminating microbubbles in developer solutions to reduce photoresist residues |
| CN1312490A (en) * | 2000-01-31 | 2001-09-12 | 富士胶片株式会社 | Automatic developing device and method for supplementing developing liquid |
| CN1517801A (en) * | 2003-01-09 | 2004-08-04 | 富士胶片株式会社 | Method for adding developer to automatic developing device for photosensitive lithographic printing plate |
| CN105511237A (en) * | 2015-12-04 | 2016-04-20 | 深圳市华星光电技术有限公司 | Developing solution supply system |
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