CN108731728A - Nozzle bore checks system and method - Google Patents
Nozzle bore checks system and method Download PDFInfo
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- CN108731728A CN108731728A CN201710271062.XA CN201710271062A CN108731728A CN 108731728 A CN108731728 A CN 108731728A CN 201710271062 A CN201710271062 A CN 201710271062A CN 108731728 A CN108731728 A CN 108731728A
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- nozzle bore
- image
- multiple nozzle
- hole
- blast tube
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The disclosure provides a kind of nozzle bore inspection system and method.Above system includes multiple support bases, is configured to support a blast tube on a first direction.Above system further includes a backlight, the multiple nozzle bores being configured on projecting beam to blast tube.Above system further includes a video capturing device, is configured to obtain the image of each nozzle bore.In addition, above system includes a processing unit, it is configured to obtain an at least hole parameter for each nozzle bore according to the image accessed by video capturing device.
Description
Technical field
The embodiment of the present invention checks system and method about a kind of nozzle bore.
Background technology
Semiconductor device is used for a variety of electronic applications, such as PC, mobile phone, digital camera and other electricity
Sub- equipment.The manufacture of semiconductor device is typically by sequentially depositing insulation or dielectric layer material, conduction on a semiconductor substrate
Layer material and semiconductor layer material are then formed by a variety of materials layer, to form circuit group using micro-photographing process patterning
Part and part are on this semiconductor substrate.With the technological progress on the material and its design of integrated circuit, have been developed more
The integrated circuit of a generation.Compared to the previous generation, each generation has smaller and more complicated circuit.However, these are sent out
Exhibition improves processing and manufactures the complexity of integrated circuit.In order to make these development be achieved, integrated circuit manufacture with
And the upper similar development of production is also necessary.
In the manufacture of semiconductor device, multiple fabrication steps be used to manufacture integrated circuit semiconductor crystal wafer it
On.In lasting evolution to smaller volume and the development of higher current densities, it is multiple it is difficult become because one of into continuity exist
The circuit with smaller critical size is formed in set error range.For example, technique for atomic layer deposition (Atomic
Layer Deposition, ALD) it is a kind of chemical vapour deposition technique (Chemical Vapor Deposition, CVD),
Compared with traditional CVD technology, using self limitation (self-limiting) caused by precursor gas and substrate surface
Cross reaction, to form thickness control severalThe single tunic of (i.e. 10-10 meters) grade, and uniformity is splendid.Therefore in recent years
Carry out the manufacture that atomic layer deposition processing procedure is widely used in the oxide dielectric layer of such as transistor.
Although existing deposition technique and equipment have been enough to deal with its demand, do not meet comprehensively yet.Therefore, it is necessary to
A kind of scheme for the yield improving deposition manufacture process is provided.
Invention content
Some embodiments of the disclosure provide a kind of nozzle hole inspection system.Said nozzle hole inspection system includes multiple supports
Seat, is configured to support a blast tube on a first direction.Said nozzle hole inspection system further includes a backlight, and configuration is used
In multiple nozzle bores on projecting beam to blast tube.Said nozzle hole inspection system further includes a video capturing device, configuration
Image for obtaining each nozzle bore.In addition, said nozzle hole inspection system includes a processing unit, it is configured to according to image
Image accessed by acquisition device and obtain an at least hole parameter for each nozzle bore.
Some embodiments of the disclosure provide a kind of nozzle hole inspection system.Said nozzle hole inspection system includes multiple supports
Seat, is configured to support a blast tube on a first direction.Said nozzle hole inspection system further includes a positioning seat, and configuration is used
In the one end of fixed nozzle pipe.Said nozzle hole inspection system further includes a backlight, is configured to projecting beam to nozzle
Multiple nozzle bores on pipe.Said nozzle hole inspection system further includes a video capturing device, is configured to obtain each nozzle bore
Image.In addition, said nozzle hole inspection system includes a processing unit, it is configured to according to accessed by video capturing device
Image and obtain an at least hole parameter for each nozzle bore.
Some embodiments of the disclosure provide a kind of nozzle bore inspection method.Said nozzle hole inspection method includes fixing a spray
Mouth pipe has multiple nozzle bores thereon.Said nozzle hole inspection method further includes each nozzle bore on projecting beam to blast tube.
Said nozzle hole inspection method further includes obtaining the image of each nozzle bore.In addition, said nozzle hole inspection method includes according to each
The image of nozzle bore and obtain an at least hole parameter for each nozzle bore.
Description of the drawings
Fig. 1 shows the schematic diagram of deposition manufacture process equipment in accordance with some embodiments.
Fig. 2 shows the schematic side view of the first component in the part of nozzle hole inspection system in accordance with some embodiments.
Fig. 3 shows the upper schematic diagram of the nozzle hole inspection system in Fig. 2.
Fig. 4 shows the schematic diagram of the groove on support base in accordance with some embodiments.
Fig. 5 shows the schematic diagram of the position limiting structure on positioning seat in accordance with some embodiments.
Fig. 6 shows the video capturing device of nozzle hole inspection system in accordance with some embodiments and the box of processing unit
Figure.
Fig. 7 shows the flow chart of nozzle bore inspection method in accordance with some embodiments.
Fig. 8 shows the image in accordance with some embodiments according to nozzle bore and the method for the hole diameter that obtains nozzle bore is shown
It is intended to.
Fig. 9 shows the image in accordance with some embodiments according to nozzle bore and the method for the hole out of roundness that obtains nozzle bore
Schematic diagram
Figure 10 shows the image in accordance with some embodiments according to nozzle bore and obtains the side of the flash degree on nozzle bore
Method schematic diagram.
Figure 11 shows the image in accordance with some embodiments according to nozzle bore and obtains the periphery of nozzle bore with the presence or absence of scraping
The method schematic diagram of wound or foreign matter.
Reference sign：
10~deposition manufacture process equipment/equipment；
11~processing chamber housing；
11A, 11B~open connection；
12~pedestal；
12A~open connection；
13~upright cassette；
14~heater；
15~rotating platform；
16~predecessor feed unit；
16A, 16B~supply source；
16C, 16D~switch valve；
17~blast tube；
17A~bending part；
17B~nozzle bore；
18A~inert gas source；
18B~switch valve；
20~nozzle hole inspection system；
21~carrying platform；
22~support base；
22A~groove；
23~backlight；
24~positioning seat；
24A~part；
24B~position limiting structure；
25~video capturing device；
25A~Image Sensor；
25B~camera lens；
25C~X-direction driving part；
25D~Z-direction driving part；
25E~pedestal；
251~the first driving units；
252~the second driving units；
26~processing unit；
27~processing unit；
271~control circuit；
272~storage circuit；
28~display unit；
29~operation interface unit；
70~nozzle bore inspection method；
71~74~operation；
B~sliding block；
D1~first direction；
D2~second direction；
D3~third direction；
C~theory the center of circle；
E~nozzle bore end position；
F~flash normal value；
G~scratch or foreign matter；
I~image；
MI~internal image；
MO~external image；
P~nozzle pitch of holes；
RE~flash；
RE1~RE4~flash defect；
RL~contour line；
RR~actual profile radius；
S~nozzle bore initial position；
SP~sample point；
T~sliding rail；
TD~theoretical diameter；
TL~theoretical circle；
TR~principal radii；
L1, L2~spacing；
W~semiconductor crystal wafer；
W1~W4~angle；
Δ R~departure；
α, β~angle.
Specific implementation mode
Following disclosure provides many different embodiments or example to implement the different characteristic of the disclosure.Following discloses
The particular example of each component of description and its arrangement mode, to simplify explanation.Certainly, these specific examples not to
It limits.If being formed in above a second feature for example, describing a fisrt feature in embodiment, that is, indicate that it may be wrapped
The case where being in direct contact containing above-mentioned fisrt feature and above-mentioned second feature has also may included supplementary features and has been formed in above-mentioned the
Between one feature and above-mentioned second feature, and so that the case where above-mentioned fisrt feature is not in direct contact with second feature.
The space correlation word being used below, for example, " in ... lower section ", " lower section ", " lower ", " top ", " compared with
High " and similar word, in illustrating for ease of description between an elements or features and another (a little) elements or features
Relationship.Other than the orientation being shown in the accompanying drawings, these space correlation words also mean to be possibly comprised in different orientation
Device in lower use or operation attached drawing.
Identical element numbers and/or word may be reused in following difference embodiment, these are repeated for simplification
With clearly purpose, it is not limited to have specific relationship between the different embodiments discussed and/or structure.
Be used below first and second equal vocabulary only explain it purpose as clear, not to
Corresponding and limitation claim.In addition, the vocabulary such as fisrt feature and second feature, are not limited to identical or are different
Feature.
In the accompanying drawings, the shape of structure or thickness may expand, to simplify or convenient for indicating.It will be appreciated that not special
The element that Miao Shu or not illustrate can exist with the various forms known to art technology personage.
In addition, it is necessary to understand, additional operation can be provided before and after, during method in embodiment,
And for the method in different embodiments, the operation of some descriptions can be replaced or eliminated.
Embodiment of the disclosure provides a kind of nozzle hole inspection system, is set suitable for effectively and quickly detecting deposition manufacture process
Multiple tiny nozzle holes on a blast tube used in standby an at least hole parameter (such as hole diameter, hole spacing,
Hole out of roundness (roundness), flash (raw edge) degree and/or scratch degree etc.), nozzle can be so found early
The defect of nozzle bore on pipe, and then be conducive to improve the yield of deposition manufacture process.
Please referring initially to Fig. 1, the schematic diagram of deposition manufacture process equipment 10 in accordance with some embodiments is shown.Such as institute in figure
Show, equipment 10 is a upright batch depositing device, can be used for such as atomic layer deposition processing procedure (ALD).Equipment 10 includes a bottom
The cylindrical processing chamber housing 11 and one that portion opens is used to combine the pedestal 12 with Seal treatment chamber 11.Processing chamber housing 11 for example by
Quartz material is formed.Multiple semiconductor crystal wafer W (such as Silicon Wafer, but not limited to this) as processing target are set in entrance
After standby 10 it is positioned in a horizontal manner in multiple support trenches (not shown) of a upright cassette 13.Upright cassette 13 is to pass through
One such as quartz material is formed by heater 14 and is placed on a rotating platform 15.In deposition manufacture process, rotating platform 15 is used
In rotating upright cassette 13 so that the deposit uniformity of semiconductor crystal wafer W can be preferable.
As shown in fig. 1, an open connection 11A is formed in processing chamber housing 11, for connecting the forerunner outside one
Object feed unit 16.Predecessor feed unit 16 is for sequentially supplying at least one first predecessor and at least one second predecessor
Into processing chamber housing 11.Predecessor feed unit 16 is respectively used to storage including multiple (such as two, but not limited to this)
One, supply source 16A, 16B of the second predecessor and multiple (such as two, but not limited to this) are respectively used to control supply source
Switch valve 16C, 16D that 16A, 16B are connect with open connection 11A.
One blast tube 17 is set in processing chamber housing 11, in deposition manufacture process by predecessor by being formed by thereon
Multiple nozzle bore (not shown) are supplied into processing chamber housing 11, to carry out deposition manufacture process in semiconductor crystal wafer W surface.Such as Fig. 1
Shown in, blast tube 17 is the open connection for the bending part 17A coupling processing chamber housings 11 for being approximately perpendicular to tube body by one
11A, and then predecessor feed unit 16 can be connected.Blast tube 17 is formed by such as quartz material.
As shown in fig. 1, another open connection 11B is also formed in processing chamber housing 11, for connecting outside one
Inert gas source 18A.According to some embodiments, in deposition manufacture process, when the first predecessor generates list in semiconductor crystal wafer W surface
The chemisorption of one atomic layer, and after so that semiconductor crystal wafer W surface is generated functional group (Functional groups), indifferent gas
Body source 18A can be supplied in an inert gas to processing chamber housing 11 (at this point, controlling inert gas source 18A and open connection 11B's
One switch valve 18B of connection can be opened), to take away the first extra predecessor for remaining on semiconductor crystal wafer W surface.
In addition, being formed with an open connection 12A on pedestal 12, (scheme not for connecting the pumping cells outside one
Show), which can be by aforementioned inert gas and extra first predecessor pump-and-treat system chamber 11.Later, predecessor supplies
Unit 16 is again supplied the second predecessor in processing chamber housing 11 by blast tube 17, with the official in semiconductor crystal wafer W surface
Energy base reacts and forms single atomic layer.Thus, realize an atomic layer deposition.
It is to be understood that the defect of the nozzle bore on former nozzle pipe 17 may cause the yield of deposition manufacture process to reduce.It lifts
For example, when the size difference of multiple nozzle bores on blast tube 17 is larger or void shape is inconsistent, it is easy so that same
The deposition results (such as deposition thickness) of a batch of semiconductor crystal wafer W generate difference.Either, when the flash journey on nozzle bore
When spending more serious or hole periphery in the presence of scratching, the clast of blast tube 17 is also brought to such as the air-flow of predecessor
In semiconductor crystal wafer W surface, and then influence the yield of deposition manufacture process.
Industry checks the nozzle bore of blast tube 17 using manual type mostly at present, such as passes through destructive detection mode
(that is, cutting nozzles pipe 17) and cooperation scanning electron microscope (Scanning Electron Microscopy, SEM) figure
It whether there is defect to observe nozzle bore, but the inspection efficiency of such mode is bad, and also held in the way of artificial interpretation
Easily cause detection error.
A kind of nozzle hole inspection system of operational standardization and automation is provided in Examples below, it can quickly, accurately
Ground detects the defect of the nozzle bore of blast tube 17, and then is conducive to improve the yield of subsequent deposition processing procedure.It should be appreciated that this
Nozzle hole inspection system in open embodiment does not limit for checking the spray on the blast tube used in deposition manufacture process equipment
Nozzle aperture can be used for checking on the blast tube used in other processing procedure (such as the processing procedures such as diffusion, etching, cleaning) equipment
Nozzle bore.
Fig. 2 shows the schematic side view of the part member component of nozzle hole inspection system 20 in accordance with some embodiments, Fig. 3
Show the upper schematic diagram of the nozzle hole inspection system 20 in Fig. 2.As shown in Fig. 2 and Fig. 3, nozzle hole inspection system 20 includes
One carrying platform 21, multiple support bases 22, a backlight 23, a positioning seat 24 and a video capturing device 25.
Multiple (such as two, but not limited to this) support bases 22 are set on carrying platform 21, in a first party
One blast tube 17 to be checked of support is (such as in preceding deposition process apparatus 10 (Fig. 1) on D1 (that is, X-direction in figure)
Used blast tube 17, but not limited to this).According to some embodiments, as shown in Fig. 2 and Fig. 3, two support bases 22 can
Structure having the same, and configured in compartment of terrain on first direction D1, blast tube 17 is flatly supported in carrying platform 21
On.It according to some embodiments, please refers to shown in Fig. 4, the groove 22A in a V-shape section, both sides can be formed on support base 22
The angle α of wall is, for example, the unspecified angle between 45 to 90 degree so that the blast tube 17 of different sizes (caliber) can be placed in V-shape
In groove 22A.According to some embodiments, groove 22A can also have other cross sectional shapes, such as semicircle, U-shaped and rectangular
Deng.
In addition, in order to be suitable for the blast tube 17 of different sizes (length), the spacing of two support bases 22 is adjustable
Whole.For example, as shown in Fig. 2 and Fig. 3, slide block B and sliding rail T are configured between support base 22 and carrying platform 21,
Enable support base 22 relative to the D1 movements along a first direction of carrying platform 21, and then can be according to the different rulers of blast tube 17
It is very little to adjust the spacing L1 of two support bases 22.
Backlight 23 is set on carrying platform 21, for emitting (the figures of multiple nozzle bore 17B on light beam to blast tube 17
3).According to some embodiments, as shown in Fig. 2 and Fig. 3, backlight 23 is an elongated backlight, and D1 matches along a first direction
It sets, each nozzle bore 17B on light beam to blast tube 17 can be emitted from lower section.According to some embodiments, backlight 23 is for sending out
White light, but not limited to this (for example, backlight 23 can also send out feux rouges, green light or other be suitable as subsequent images analysis
Background coloured light).In addition, in order to avoid the light beam that blocking backlight 23 is sent out reaches blast tube 17, aforementioned support base 22 can
It is formed by the acrylic material of such as light transmission.
Positioning seat 24 is set on carrying platform 21, is used for the one end of fixed nozzle pipe 17.According to some embodiments, such as
Shown in Fig. 2 and 3, positioning seat 24 is configured at multiple support bases 22 along the side of first direction D1, and its position corresponds to nozzle
The position of the bending part 17A of pipe 17, can be by method of clamping come the one end (bending part 17A) of fixed nozzle pipe 17.
For example, please refer to Fig. 2, Fig. 3 and Fig. 5, positioning seat 24 a second direction D2 (that is, the Y direction in figure,
Perpendicular to first direction D1) on there is separated two part 24A, wherein two part 24A and carrying platform 21 it
Between also be configured with slide block B and sliding rail T so that two part 24A can relative to carrying platform 21 along second direction D2 move
It is dynamic, and then the spacing L2 of two part 24A can be adjusted according to the different sizes (caliber) of the bending part 17A of blast tube 17.
In addition, according to some embodiments, as shown in figure 5, the sides adjacent of two part 24A of positioning seat 24 is respectively formed with a V-shape
The position limiting structure 24B in section, the angle β of two side are, for example, the unspecified angle between 45 to 90 degree.According to some embodiments, limit
Bit architecture 24B can also have other cross sectional shapes, such as semicircle, arc and rectangular etc..
By above-mentioned design, it may make that various sizes of bending part 17A is clamped and is limited to two portions of positioning seat 24
Divide in the position limiting structure 24B of 24A, and then blast tube 17 can be avoided to rotate in the groove 22A of aforementioned support base 22
Situation.In other words, positioning seat 24 can also keep the nozzle bore of blast tube 17 other than can be with the one end of fixed nozzle pipe 17
17B is upward and in face of the camera lens (as shown in Figure 3) of video capturing device 25.According to some embodiments, the part of positioning seat 24
24A can also be formed by such as acrylic material (but not limited to this).
Video capturing device 25 is set on carrying platform 21, the image for obtaining each nozzle bore 17B on blast tube 17.
According to some embodiments, as shown in Fig. 2 and Fig. 3, video capturing device 25 include an Image Sensor 25A, a camera lens 25B,
One X-direction driving part 25C, a Z-direction driving part 25D and a pedestal 25E.
Image Sensor 25A is used to sense the image of each nozzle bore 17B on blast tube 17.According to some embodiments, image
Sensor 25A can be a photosensitive coupling element (Charge-coupled Device, CCD) or a complementary metal-oxide half
Conductor (Complementary Metal-Oxide-Semiconductor, CMOS).Camera lens 25B is coupled in Image Sensor
25A, for Image Sensor 25A will to be focused on by the light beam of nozzle bore 17B.According to some embodiments, camera lens 25B is
One rectangular (but not limited to this) telecentric lens (telecentric lens) only receive and allow parallel light focusing in image
On sensing element 25A, be so conducive to the accurate image that video capturing device 25 obtains each nozzle bore 17B, and can be to avoid
Visual angle error and the case where cause image distortion.
Pedestal 25E is set on carrying platform 21 and with an elongated structure that D1 extends along a first direction.X-direction
Driving part 25C coupling pedestal 25E simultaneously can be relative to pedestal 25E D1 (that is, X-direction) movements along a first direction.Z axis side
To driving part 25D coupling X-direction driving part 25C and can be relative to X-direction driving part 25C along a third direction
D3 (that is, Z-direction in figure, perpendicular to first direction D1 and second direction D2) is mobile.In addition, Image Sensor 25A and with
Its camera lens 25B being connected fixedly couples Z-direction driving part 25D.
According to some embodiments, X-direction driving part 25C can (such as servo motor, figure be not by a servo-driver
Show) it drives and is moved relative to pedestal 25E, wherein X-direction driving part 25C constitutes one first driving list with servo-driver
First 251 (please referring to Fig. 6) drive Image Sensor 25A and camera lens 25B for D1 along a first direction.Similarly, Z-direction
Driving part 25D is can be relative to X-direction driving portion by a servo-driver (such as servo motor, not shown) driving
Part 25C movements, wherein Z-direction driving part 25D constitute one second driving unit 252 (please referring to Fig. 6) with servo-driver,
For driving Image Sensor 25A and camera lens 25B along third direction D3.
By above-mentioned design, video capturing device 25 continuously can obtain each spray on blast tube 17 by D1 along a first direction
The image of nozzle aperture 17B, while different height can be obtained on third direction D3 (because of quartz material by auto-focusing mode
Tolerance of the blast tube 17 in manufacture caused by) each nozzle bore 17B sharp image.
Then referring to Fig. 6, according to some embodiments, nozzle hole inspection system 20 further includes a coupling video capturing device
25 processing unit 26, for control the operation of video capturing device 25 with handle it is each acquired in the video capturing device 25
The image of nozzle bore 17B.For example, processing unit 26 includes a processing unit 27, a display unit 28 and an operation interface
Unit 29.
According to some embodiments, operation interface unit 29 is, for example, a keyboard (but not limited to this), defeated for operator
Enter blast tube 17 to be checked nozzle orifice parameters (such as nozzle bore initial position S, nozzle pitch of holes P shown in Fig. 3 and
Nozzle bore end position E etc.) to processing unit 27.Processing unit 27 is, for example, a computer (but not limited to this), can be according to this
A little nozzle orifice parameters simultaneously control each spray on the acquisition blast tube 17 of video capturing device 25 by a built-in control circuit 271
Nozzle aperture 17B image (such as control the first, second driving unit 251 and 252 with drive Image Sensor 25A and camera lens 25B,
And the operations such as image for controlling Image Sensor 25A to sense nozzle bore 17B).Meanwhile the nozzle bore ginseng of input processing unit 27
Number can be stored by a built-in storage circuit 272.
In addition, the image of each nozzle bore 17B sensed by the Image Sensor 25A of video capturing device 25 can return
To processing unit 27, then each nozzle can be obtained according to these images and the calculation method by being discussed below in processing unit 27
Hole 17B an at least hole parameter (such as hole diameter, hole spacing, hole out of roundness, flash degree and/or scratch degree
Deng), and by these cavity detection results (such as meeting or do not meet the hole specification ordered by operator) with data, chart, face
Color or other possible forms are presented in real time on display unit 28 (such as screen, but not limited to this).
Thus, a kind of operational standardization, automation and can continuously, rapidly detect blast tube nozzle bore hole
The nozzle hole inspection system of hole parameter (or defect) can be provided that, and then be conducive to improve the processing procedure for subsequently using the blast tube
Yield.
Embodiment of the disclosure also provides a kind of nozzle bore inspection method.Fig. 7 shows a nozzle in accordance with some embodiments
The flow chart of hole inspection method 70.First, in operation 1, a blast tube is fixed, there are multiple nozzle bores thereon, such as aforementioned
Embodiment in Fig. 2 and Fig. 3 fixes a blast tube 17 using support base 22 and positioning seat 24.In operation 72, projecting beam is extremely
The multiple nozzle bore on blast tube, such as embodiment in earlier figures 2 and Fig. 3 utilize 23 projecting beam of backlight to nozzle
Nozzle bore 17B on pipe 17.In operation 73, the embodiment profit in the image of each nozzle bore, such as earlier figures 2 and Fig. 3 is obtained
The image of each nozzle bore 17B on blast tube 17 is obtained with video capturing device 25.According to some embodiments (Fig. 6), image obtains
It takes device 25 also can obtain automatically and continuously the image of each nozzle bore 17B according to the control of a processing unit 26, and handles
Device 26 inputs and sets the nozzle pore parameter of blast tube 17 to be checked for operator (such as including nozzle bore start bit
It sets, nozzle pitch of holes and nozzle bore end position etc.).In operation 74, each nozzle bore is obtained according to the image of each nozzle bore
An at least hole parameter (such as hole diameter, hole spacing, hole out of roundness, flash degree and/or scratch degree etc.).
Further, cooperation illustrates the image according to each nozzle bore refering to Fig. 8 to Figure 11 and obtains the various of each nozzle bore
The method of hole parameter.Following image calculation methods for obtaining various hole parameters can pass through an image processing of processing unit 26
Program program executes automatically.
Fig. 8 shows the image in accordance with some embodiments according to nozzle bore and the method for the hole diameter that obtains nozzle bore is shown
It is intended to.It need to first illustrate, be rectangular by each image I accessed by video capturing device 25 (Fig. 2 and Fig. 3) in fig. 8
(because rectangular telecentric lens 25B (Fig. 2) caused by), and the image of each nozzle bore 17B can position in image I.
According to some embodiments, as shown in figure 8, the hole diameter of each nozzle bore 17B in order to obtain, it first can be according to each shadow
As the nozzle bore 17B in I image and (such as found out maximum and complete with surrounding image contrast by image calculation method
Contour line) obtain the actual profile line RL (solid line expression) of nozzle bore 17B.Then, multiple samplings are obtained from contour line RL
Point SP (such as totally 200 sample point SP being obtained from contour line RL, but not limited to this), and it is theoretical at circle for example, by 3 points
And obtain the theoretical circle TL (dotted line expression) and its theory center of circle C of an equalization.The method of this multidraw can be by nozzle bore
Flash RE on 17B is effectively filtered out, and avoids the judgement of the hole diameter of flash RE influence nozzle bores 17B.Thus, can be through
The theoretical diameter TD (and principal radii) of each theoretical circle TL is obtained by aforementioned calculation method, that is, obtains the hole of each nozzle bore 17B
Hole dia (and radius).
It can be further after obtaining multiple theoretical circle TL via the image of multiple nozzle bore 17B according to some embodiments
The hole spacing of adjacent nozzle bore 17B is obtained according to the distance of the theoretical center of circle C of adjacent theoretical circle TL.
Fig. 9 shows the image in accordance with some embodiments according to nozzle bore and the method for the hole out of roundness that obtains nozzle bore
Schematic diagram (Fig. 9 is also the enlarged drawing of X section in Fig. 8).According to some embodiments, the hole of each nozzle bore 17B is true in order to obtain
Circularity (roundness) can first obtain the theoretical circle TL of each nozzle bore 17B according to aforementioned calculation method.Then according to nozzle bore
The reason of multiple sample point SP (for simplicity, Subsampling point SP is only drawn in Fig. 9) and theoretical circle TL on the contour line RL of 17B
Multiple actual profile radius RR can be obtained by the distance of center of circle C.Finally, then according to the multiple true wheels for corresponding to aforementioned sample point SP
The hole of each nozzle bore 17B can be obtained in the average value of the departure Δ R of multiple principal radii TR of wide radius RR and theoretical circle TL
Out of roundness.
Above-mentioned hole out of roundness formula can indicate as follows：
It is noted that being to take the departure Δ R of aforementioned actual profile radius RR and principal radii TR absolutely herein
Value, no matter therefore the flash RE on nozzle bore 17B is the form of convex or concave, be included in the calculating of hole out of roundness.
Then referring to Fig. 10, it shows the image in accordance with some embodiments according to nozzle bore and obtains on nozzle bore
The method schematic diagram of flash degree.By the result figure of the available such as Figure 10 of aforementioned image calculation method, wherein X-axis shows nozzle bore
0 to 360 angle of the actual profile line RL of 17B, and Y-axis shows the deviation of aforementioned actual profile radius RR and principal radii TR
Measure Δ R (unit is micron (μm)).According to some embodiments, operator can voluntarily stipulate flash normal value F (predetermined threshold value), when
(convex or concave) flash RE (refering to the 8th and 9 figures) on nozzle bore 17B be more than flash normal value F (such as 10 microns) i.e.
Be identified as defect, thus by Figure 10 it is observed that sharing how many a flash defects (such as four flashes on nozzle bore 17B
Defect RE1, RE2, RE3 and RE4).In addition, because the circumference of each nozzle bore 17B is known, therefore lacked by each flash in Figure 10
Angle W1, W2, W3, the W4 for falling into the circumference of nozzle bore 17B shared by parts of the RE1 to RE4 beyond flash normal value F also can be obtained respectively
The width summation of each flash defect on the width and nozzle bore 17B of flash defect RE1 to RE4.Thus, can be obtained each spray
Flash degree on nozzle aperture 17B.
Figure 11 shows the image in accordance with some embodiments according to nozzle bore and obtains the periphery of nozzle bore with the presence or absence of scraping
The method schematic diagram of wound or foreign matter.As shown in figure 11, nozzle bore 17B is obtained in the image according to the nozzle bore 17B in image I
Actual profile line RL after, can be according further to the internal image MI's and/or external image MO of the contour line RL of nozzle bore 17B
Shade of gray (gray level) and obtain the periphery of nozzle bore 17B with the presence or absence of scratching or foreign matter.For example, when scratch or it is different
When object G is appeared in the range of internal image MI and/or external image MO, the gray scale contrast with surrounding image will be larger,
Therefore can interpretation be thus scratch or foreign matter G.In addition, can also learn scratch by image algorithm (such as calculating shared pixel)
Or the length of foreign matter G.
Based on above-mentioned, the nozzle bore inspection method of the embodiment of the present disclosure can quickly and accurately detect each on blast tube
A variety of hole parameters of nozzle bore.In addition, according to some embodiments, these cavity detection results can also be presented in real time as
On display unit 28 in Fig. 6, the foundation whether to be suitable for follow-up process as operator's interpretation blast tube.
In conclusion the nozzle bore of the embodiment of the present disclosure checks system and method, a processing procedure can be effectively and quickly detected
Multiple tiny nozzle holes on a blast tube used in equipment (such as deposition manufacture process equipment, but not limited to this) lack
It falls into, and then is conducive to improve the yield of the processing procedure.
According to some embodiments, a kind of nozzle hole inspection system is provided.Above system includes multiple support bases, is configured to
A blast tube is supported on a first direction.Above system further includes a backlight, is configured on projecting beam to blast tube
Multiple nozzle bores.Above system further includes a video capturing device, is configured to obtain the image of each nozzle bore.On in addition,
It includes a processing unit to state system, is configured to obtain each nozzle bore extremely according to the image accessed by video capturing device
A few hole parameter.
According to some embodiments, said nozzle hole inspection system further includes a positioning seat, is configured to method of clamping
The one end of fixed nozzle pipe.Positioning seat has in a second direction to be separated from each other and relatively-movable two parts, and
The sides adjacent of two parts is respectively formed with a position limiting structure, and wherein second direction is perpendicular to first direction.
According to some embodiments, it is formed with a groove on above-mentioned each support base, for housing blast tube.
According to some embodiments, above-mentioned video capturing device includes an Image Sensor, is configured to sensing nozzle bore
Image.Above-mentioned video capturing device further includes a camera lens, is configured to that image sensing will be focused on by the light beam of nozzle bore
On element.Above-mentioned video capturing device further includes one first driving unit, is configured to drive image sensing along a first direction
Element and camera lens.In addition, above-mentioned video capturing device includes one second driving unit, it is configured to drive along a third direction
Image Sensor and camera lens, wherein third direction is perpendicular to first direction.
According to some embodiments, a kind of nozzle hole inspection system is provided.Above system includes multiple support bases, is configured to
A blast tube is supported on a first direction.Above system further includes a positioning seat, is configured to the one end of fixed nozzle pipe.
Above system further includes a backlight, the multiple nozzle bores being configured on projecting beam to blast tube.Above system further includes
One video capturing device is configured to obtain the image of each nozzle bore.In addition, above system includes a processing unit, configuration is used
In obtaining an at least hole parameter for each nozzle bore according to the image accessed by video capturing device.
According to some embodiments, a kind of nozzle bore inspection method is provided.The above method includes fixing a blast tube, is had thereon
There are multiple nozzle bores.The above method further includes each nozzle bore on projecting beam to blast tube.The above method further includes obtaining respectively
The image of nozzle bore.In addition, the above method includes obtaining at least hole ginseng of each nozzle bore according to the image of each nozzle bore
Number.
According to some embodiments, the above-mentioned image according to each nozzle bore and at least hole parameter that obtains each nozzle bore
Further include in step：The contour line of each nozzle bore is obtained according to the image of each nozzle bore；On contour line according to each nozzle bore
Multiple sample points and obtain a theoretical circle；The hole diameter of each nozzle bore is obtained according to the theoretical diameter of each theoretical circle；With
And the theoretical center of circle of the theoretical circle according to adjacent nozzle bore distance and obtain the hole spacing of adjacent nozzle bore.
According to some embodiments, the above-mentioned image according to each nozzle bore and at least hole parameter that obtains each nozzle bore
Further include in step：The contour line of each nozzle bore is obtained according to the image of each nozzle bore；On contour line according to each nozzle bore
Multiple sample points and obtain a theoretical circle；It is obtained at a distance from the theoretical center of circle of theoretical circle according to the sample point on contour line
Multiple actual profile radiuses；And the deviation of the principal radii of the actual profile radius and theoretical circle according to the aforementioned sample point of correspondence
The average value of amount and obtain the hole out of roundness of each nozzle bore.
According to some embodiments, the above-mentioned image according to each nozzle bore and at least hole parameter that obtains each nozzle bore
Further include in step：The contour line of each nozzle bore is obtained according to the image of each nozzle bore；On contour line according to each nozzle bore
Multiple sample points and obtain a theoretical circle；It is obtained at a distance from the theoretical center of circle of theoretical circle according to the sample point on contour line
Multiple actual profile radiuses；And the deviation of the principal radii of the actual profile radius and theoretical circle according to the aforementioned sample point of correspondence
Whether amount more than a predetermined threshold value obtains the flash degree of each nozzle bore.
According to some embodiments, the above-mentioned image according to each nozzle bore and at least hole parameter that obtains each nozzle bore
Further include in step：The contour line of each nozzle bore is obtained according to the image of each nozzle bore；And the profile according to each nozzle bore
The internal image of line and/or the shade of gray of external image and obtain the periphery of each nozzle bore with the presence or absence of scratching or foreign matter.
Although embodiment and their advantage are described in detail above, it is to be understood that without departing substantially from appended claims
In the case of the design conception and scope of the disclosure of restriction, to the disclosure can various changes can be made, alternatives and modifications.In addition,
Scope of the present application is not intended to be limited to processing procedure described in the specification, machine, manufacture, material composition, tool, method and steps
Specific embodiment.To easily it understand from the disclosure as those skilled in the art, according to the disclosure, Ke Yili
With it is existing or from now on by it is being developed, execute the function essentially identical with corresponding embodiment described in the disclosure or realize base
The processing procedure of this identical result, machine, manufacture, material composition, tool, method or step.Therefore, appended claims be intended to by
In the range of these processing procedures, machine, manufacture, material composition, tool, method or step include them.In addition, each right is wanted
It asks and constitutes an individual embodiment, and the combination of different claims and embodiment is within the scope of this disclosure.
Claims (10)
1. a kind of nozzle hole inspection system, including：
Multiple support bases are configured to support a blast tube on a first direction；
One backlight, the multiple nozzle bores being configured on projecting beam to the blast tube；
One video capturing device is configured to obtain the image of each the multiple nozzle bore；And
One processing unit is configured to obtain each described more according to the multiple image accessed by the video capturing device
An at least hole parameter for a nozzle bore.
2. nozzle hole inspection system as described in claim 1, further includes a positioning seat, it is configured to method of clamping and fixes
The one end of the blast tube, which has in a second direction is separated from each other and relatively-movable two parts, and
The sides adjacent of two parts is respectively formed with a position limiting structure, and wherein the second direction is perpendicular to the first direction.
3. nozzle hole inspection system as described in claim 1 is used for wherein being formed with a groove on each the multiple support base
House the blast tube.
4. the nozzle hole inspection system as described in any one in claims 1 to 3 item, the wherein video capturing device include：
One Image Sensor is configured to sense the image of the multiple nozzle bore；
One camera lens is configured to focus on the Image Sensor by the light beam of the multiple nozzle bore；
One first driving unit is configured to drive the Image Sensor and the camera lens along the first direction；And
One second driving unit is configured to drive the Image Sensor and the camera lens along a third direction, wherein this
Three directions are perpendicular to the first direction.
5. a kind of nozzle hole inspection system, including：
Multiple support bases are configured to support a blast tube on a first direction；
One positioning seat is configured to fix the one end of the blast tube；
One backlight, the multiple nozzle bores being configured on projecting beam to the blast tube；
One video capturing device is configured to obtain the image of each the multiple nozzle bore；And
One processing unit is configured to obtain each described more according to the multiple image accessed by the video capturing device
An at least hole parameter for a nozzle bore.
6. a kind of nozzle bore inspection method, including：
A blast tube is fixed, there are multiple nozzle bores thereon；
The multiple nozzle bore on projecting beam to the blast tube；
Obtain the image of each the multiple nozzle bore；And
An at least hole parameter for each the multiple nozzle bore is obtained according to the image of each the multiple nozzle bore.
7. nozzle bore inspection method as claimed in claim 6, wherein the above-mentioned image according to each the multiple nozzle bore and obtain
To each the multiple nozzle bore an at least hole parameter the step of in further include：
The contour line of each the multiple nozzle bore is obtained according to the image of each the multiple nozzle bore；
A theoretical circle is obtained according to multiple sample points on the contour line of each the multiple nozzle bore；
The hole diameter of each the multiple nozzle bore is obtained according to the theoretical diameter of each the multiple theoretical circle；And
The distance in the theoretical center of circle of the multiple theoretical circle according to adjacent the multiple nozzle bore and obtain it is adjacent described in
The hole spacing of multiple nozzle bores.
8. nozzle bore inspection method as claimed in claim 6, wherein the above-mentioned image according to each the multiple nozzle bore and obtain
To each the multiple nozzle bore an at least hole parameter the step of in further include：
The contour line of each the multiple nozzle bore is obtained according to the image of each the multiple nozzle bore；
A theoretical circle is obtained according to multiple sample points on the contour line of each the multiple nozzle bore；
According to the multiple sample point on the contour line multiple true wheels are obtained at a distance from the theoretical center of circle of the theoretical circle
Wide radius；And
The departure of the multiple actual profile radius and the principal radii of the theoretical circle according to corresponding the multiple sample point
Average value and obtain the hole out of roundness of each the multiple nozzle bore.
9. nozzle bore inspection method as claimed in claim 6, wherein the above-mentioned image according to each the multiple nozzle bore and obtain
To each the multiple nozzle bore an at least hole parameter the step of in further include：
The contour line of each the multiple nozzle bore is obtained according to the image of each the multiple nozzle bore；
A theoretical circle is obtained according to multiple sample points on the contour line of each the multiple nozzle bore；
According to the multiple sample point on the contour line multiple true wheels are obtained at a distance from the theoretical center of circle of the theoretical circle
Wide radius；And
The deviation of principal radii according to the multiple actual profile radius and the theoretical circle for corresponding to the multiple sample point
Whether amount more than a predetermined threshold value obtains the flash degree of each the multiple nozzle bore.
10. nozzle bore inspection method as claimed in claim 7, wherein the above-mentioned image according to each the multiple nozzle bore and obtain
To each the multiple nozzle bore an at least hole parameter the step of in further include：
The contour line of each the multiple nozzle bore is obtained according to the image of each the multiple nozzle bore；And
It is obtained according to the internal image of the contour line and/or the shade of gray of external image of each the multiple nozzle bore each described
The periphery of multiple nozzle bores is with the presence or absence of scratch or foreign matter.
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|---|---|---|---|
| CN201710271062.XA CN108731728A (en) | 2017-04-24 | 2017-04-24 | Nozzle bore checks system and method |
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| CN201710271062.XA CN108731728A (en) | 2017-04-24 | 2017-04-24 | Nozzle bore checks system and method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701902A (en) * | 2004-05-26 | 2005-11-30 | 山崎马扎克公司 | Nozzle checker for laser beam machine |
| JP2008111695A (en) * | 2006-10-30 | 2008-05-15 | Seiko Epson Corp | Visual inspection method |
| CN101279310A (en) * | 2007-04-03 | 2008-10-08 | 中外炉工业株式会社 | Substrate coating apparatus and coating method thereof |
| JP2010175491A (en) * | 2009-02-02 | 2010-08-12 | Seiko Epson Corp | Apparatus and method for inspecting nozzle plate |
| CN102286731A (en) * | 2010-06-18 | 2011-12-21 | 东京毅力科创株式会社 | Processing apparatus and film forming method |
| CN202671651U (en) * | 2010-12-23 | 2013-01-16 | 森托塞姆硅技术有限公司 | Nozzle device and chemical gas phase sedimentary reactor |
-
2017
- 2017-04-24 CN CN201710271062.XA patent/CN108731728A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701902A (en) * | 2004-05-26 | 2005-11-30 | 山崎马扎克公司 | Nozzle checker for laser beam machine |
| JP2008111695A (en) * | 2006-10-30 | 2008-05-15 | Seiko Epson Corp | Visual inspection method |
| CN101279310A (en) * | 2007-04-03 | 2008-10-08 | 中外炉工业株式会社 | Substrate coating apparatus and coating method thereof |
| JP2010175491A (en) * | 2009-02-02 | 2010-08-12 | Seiko Epson Corp | Apparatus and method for inspecting nozzle plate |
| CN102286731A (en) * | 2010-06-18 | 2011-12-21 | 东京毅力科创株式会社 | Processing apparatus and film forming method |
| CN202671651U (en) * | 2010-12-23 | 2013-01-16 | 森托塞姆硅技术有限公司 | Nozzle device and chemical gas phase sedimentary reactor |
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Application publication date: 20181102 |