CN108723614B - High-power laser processing device and processing method thereof - Google Patents

High-power laser processing device and processing method thereof Download PDF

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Publication number
CN108723614B
CN108723614B CN201810744093.7A CN201810744093A CN108723614B CN 108723614 B CN108723614 B CN 108723614B CN 201810744093 A CN201810744093 A CN 201810744093A CN 108723614 B CN108723614 B CN 108723614B
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China
Prior art keywords
laser
processing device
lens
driving cylinder
laser processing
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CN201810744093.7A
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CN108723614A (en
Inventor
李正
杨忠明
石志敏
张业芝
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Pentium Laser Zhejiang Co ltd
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Penta Laser Wenzhou Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring

Abstract

The invention discloses a high-power laser processing device and a processing method thereof, the high-power laser processing device comprises a high-power laser processing device body, a machine table, a processing base, a fulcrum, a microswitch, a spring, a vertical displacement sensor, a height adjusting separation card, a driving cylinder, a gas box, a nozzle, the driving cylinder, a quick scavenging valve, a guiding laser, a lens slide seat A, a lens slide seat B, a laser pulse generator, a lens support groove, a fixed support and an electric cabinet are arranged on the high-power laser processing device body, the quick scavenging valve is arranged on one side of a laser head on the high-power laser processing device body, the gas release valve is arranged on the other side of the laser head, the quick scavenging valve is connected with the gas box, the device can realize oxygen perforation by adding the quick scavenging valve and the gas release valve, stainless steel and carbon steel are cut by nitrogen or air about 2S, nitrogen perforation is performed by nitrogen or oxygen, air perforation, 2S or so nitrogen and oxygen cutting stainless steel and carbon steel, greatly improve the drilling speed and simultaneously can reduce the abrasion of the nozzle.

Description

High-power laser processing device and processing method thereof
Technical Field
The invention relates to the technical field of laser processing, in particular to a high-power laser processing device and a processing method thereof.
Background
Compared with a common medium-and-small power laser, the high-power laser cutting machine has a wider application range, and can be widely applied to large-scale engineering construction of steel, metallurgy, industrial manufacturing, ships, aerospace, railways and the like due to the high power and no problem in cutting plates and workpieces with various thicknesses.
The high-power laser processing equipment is an optical-mechanical-electrical integrated product integrated by functional components such as an optical fiber laser, a water chilling unit, an optical fiber cutting head, a cutting machine tool, a control system, an air draft system and the like.
Disclosure of Invention
The invention aims to provide a high-power laser processing device and a processing method thereof, which can realize oxygen perforation, about 2S nitrogen or air cutting of stainless steel and carbon steel, nitrogen perforation, about 2S oxygen and air cutting of stainless steel and carbon steel, air perforation, and about 2S nitrogen and oxygen cutting of stainless steel and carbon steel, greatly improve the drilling speed and simultaneously reduce the abrasion of a nozzle, and solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a high-power laser processing device comprises a high-power laser processing device body, wherein a machine table is arranged on the high-power laser processing device body, an electric cabinet is arranged on the right side wall of the machine table, a supporting point is arranged above the machine table, a driving cylinder is arranged above the supporting point, a processing base is arranged on the left side of the bottom of the driving cylinder, a vertical displacement sensor is arranged on the right side of the driving cylinder and fixed at the upper right end of the machine table, a fixing support is arranged on the left side upper side wall of the driving cylinder, a lens support groove is arranged on the left side of the fixing support, a laser pulse generator is arranged in the center of the top of the lens support groove, a guide laser is arranged below the lens support groove, a gas box is arranged between the guide laser and the fixing support, and a laser nozzle is arranged below the guide laser, the bottom of the laser nozzle is provided with a nozzle.
Preferably, a microswitch and a spring are arranged above the processing base.
Preferably, the inside in lens support groove is equipped with lens slide B, be equipped with lens slide A under lens slide B, be equipped with the wedge radiating groove between lens slide B and the lens slide A, all be equipped with laser adjusting mirror on lens slide B and the lens slide A.
Preferably, the top of the driving cylinder is provided with a height adjusting separation card.
Preferably, the left side of nozzle is equipped with the snuffle valve, and the right side of nozzle is equipped with quick scavenging air valve, snuffle valve and quick scavenging air valve symmetry installation, quick scavenging air valve passes through the pipe and is connected with the gas tank.
Preferably, the inside of gas tank is equipped with oxygen groove, nitrogen gas groove, air groove, and air groove department is equipped with the filter screen, is equipped with the opening on the air groove and communicates with the external world.
Preferably, a power supply is arranged in the electric cabinet, a CPU unit is arranged at the right end of the power supply, a storage is arranged at the lower connecting end of the CPU unit, an a/D converter is arranged at the right connecting end of the CPU unit, a current control circuit, a driving circuit and an on-off controller are arranged at the other connecting end of the a/D converter, and the current control circuit, the driving circuit and the on-off controller are connected in parallel.
Preferably, the ventilation time delay function of the high-power laser processing device body is larger than 6 KW.
Preferably, the use method of the high-power laser processing device comprises the following steps:
A. placing a device to be processed on a processing base, and fixing a processed piece;
B. the driving cylinder drives the laser nozzle below the lens support groove on the left side of the fixed support in the vertical direction, so that the nozzle of the laser head is aligned to the position needing drilling;
C. the vertical displacement sensor is used for detecting the displacement distance of the driving cylinder in the vertical direction and controlling the driving of the cylinder;
D. the electric cabinet energizes the laser pulse generator, the laser pulse generator emits laser beams, the lens support groove carries out focusing adjustment on the laser beams, and the output power of the laser is controlled to be more than 6 KW;
E. and the laser beam is emitted through the spray head, and the corresponding position of the workpiece to be processed is drilled.
Compared with the prior art, the invention has the beneficial effects that:
this device can realize that oxygen is perforated, and nitrogen gas or air cutting stainless steel and carbon steel about 2S, nitrogen gas perforation, oxygen and air cutting stainless steel and carbon steel about 2S, air perforation, nitrogen gas and oxygen cutting stainless steel and carbon steel about 2S, improve drilling speed greatly, also can reduce the wearing and tearing of nozzle simultaneously.
Drawings
FIG. 1 is a schematic structural diagram of a high power laser processing apparatus according to the present invention;
fig. 2 is a schematic diagram of a hardware control system of the electric cabinet.
In the figure: 1. a high-power laser processing device body; 2. a machine platform; 3. processing a base; 4. a fulcrum; 5. a microswitch; 6. a spring; 7. a vertical displacement sensor; 8. a height adjustment separation card; 9. a driving cylinder; 10. a gas box; 11. a nozzle; 12. a gas release valve; 13. a rapid ventilation valve; 14. a pilot laser; 15. a lens slider A; 16. a lens slider B; 17. a laser pulse generator; 18. a lens holder groove; 19. fixing a bracket; 20. an electric cabinet; 21. a power source; 22. a CPU unit; 23. a memory; 24. an A \ D converter; 25. a current control circuit; 26. a drive circuit; 27. an on-off controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a high-power laser processing device comprises a high-power laser processing device body 1, wherein the ventilation time delay function of the high-power laser processing device body 1 is larger than 6KW, a machine table 2 is arranged on the high-power laser processing device body 1, an electric cabinet 20 is arranged on the side wall of the right side of the machine table 2, a supporting point 4 is arranged above the machine table 2, a driving cylinder 9 is arranged above the supporting point 4, a height adjusting separation card 8 is arranged at the top of the driving cylinder 9, the height adjusting separation card 8 is used for adjusting the displacement position of the driving cylinder 9, a processing base 3 is arranged on the left side of the bottom of the driving cylinder 9, and a micro switch 5 and a spring 6; drive the right side of actuating cylinder 9 and be equipped with vertical displacement sensor 7, vertical displacement sensor 7 is fixed in the upper right end of board 2, vertical displacement sensor 7 is fixed on the right side of driving actuating cylinder 9, the left side top lateral wall that drives actuating cylinder 9 is equipped with fixed bolster 19, the left side of fixed bolster 19 is equipped with lens cradling groove 18, the inside of lens cradling groove 18 is equipped with lens slide B16, be equipped with lens slide A15 under lens slide B16, be equipped with the wedge radiating groove between lens slide B16 and lens slide A15, all be equipped with laser adjusting mirror on lens slide B16 and the lens slide A15.
In the invention, a laser pulse generator 17 is arranged in the center of the top of a lens bracket groove 18, a guide laser 14 is arranged below the lens bracket groove 18, a gas tank 10 is arranged between the guide laser 14 and a fixed bracket 19, a laser nozzle is arranged below the guide laser 14, a nozzle 11 is arranged at the bottom end of the laser nozzle, an air release valve 12 is arranged at the left side of the nozzle 11, a quick air change valve 13 is arranged at the right side of the nozzle 11, the air release valve 12 and the quick air change valve 13 are symmetrically arranged, the quick air change valve 13 is connected with the gas tank 10 through a conduit, an oxygen tank, a nitrogen tank and an air tank are arranged inside the gas tank 10, a filter screen is arranged at the air tank, an opening is arranged on the air tank and communicated with the outside, the quick air tank is continuously and quickly switched through the quick air change valve 13 to provide different cutting gases from the inside of the gas tank 10, the, and exhausting the original cutting gas.
In the invention, a power supply 21 is arranged in an electric cabinet 20, a CPU unit 22 is arranged at the right end of the power supply 21, a memory 23 is arranged at the lower connecting end of the CPU unit 22, an A \ D converter 24 is arranged at the right connecting end of the CPU unit 22, a current control circuit 25, a driving circuit 26 and an on-off controller 27 are arranged at the other connecting end of the A \ D converter 24, the current control circuit 25, the driving circuit 26 and the on-off controller 27 are connected in parallel, the current input into the laser pulse generator 17 is controlled through the current control circuit 26, so that the pulse generation frequency of the laser pulse generator 17 is controlled, the driving circuit 26 is connected with the driving cylinder 9, and the driving circuit 26 controls the operation of the driving cylinder 9.
When the high-power laser processing device body 1 is used for drilling a workpiece, a device to be processed is placed on a processing base 3, the workpiece is fixed, a driving cylinder 9 drives a laser nozzle below a lens support groove 18 on the left side of a fixed support 19 in the vertical direction, a nozzle 11 of the laser head is aligned to the position to be drilled, a vertical displacement sensor 7 detects the displacement distance of the driving cylinder 9 in the vertical direction and controls the driving of the cylinder, an electric cabinet 10 energizes a laser pulse generator 17, the laser pulse generator 17 emits a laser beam, the lens support groove 18 focuses and adjusts the laser beam, and the output power of the laser is controlled to be more than 6 KW.
The working principle is as follows: the use method of the high-power laser processing device comprises the following steps:
A. placing a device to be processed on the processing base 3, and fixing a processed piece;
B. the driving cylinder 9 drives the laser nozzle below the lens support groove 18 on the left side of the fixed support 19 in the vertical direction, so that the nozzle 11 of the laser head is aligned to the position needing drilling;
C. the vertical displacement sensor 7 is used for detecting the displacement distance of the driving cylinder 9 in the vertical direction and controlling the driving of the cylinder;
D. the electric cabinet 10 energizes the laser pulse generator 17, the laser pulse generator 17 emits laser beams, the lens support groove 18 carries out focusing adjustment on the laser beams, and the output power of the laser is controlled to be more than 6 KW;
E. the laser beam is emitted through the spray head 11, and the corresponding position of the workpiece to be processed is drilled.
This device can realize that oxygen is perforated, and nitrogen gas or air cutting stainless steel and carbon steel about 2S, nitrogen gas perforation, oxygen and air cutting stainless steel and carbon steel about 2S, air perforation, nitrogen gas and oxygen cutting stainless steel and carbon steel about 2S, improve drilling speed greatly, also can reduce the wearing and tearing of nozzle simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (1)

1. The utility model provides a high power laser processing device, includes high power laser processing device body, its characterized in that: the high-power laser processing device comprises a high-power laser processing device body, and is characterized in that a machine table is arranged on the high-power laser processing device body, an electric cabinet is arranged on the side wall of the right side of the machine table, a supporting point is arranged above the machine table, a driving cylinder is arranged above the supporting point, a processing base is arranged on the left side of the bottom of the driving cylinder, a vertical displacement sensor is arranged on the right side of the driving cylinder, the vertical displacement sensor is fixed at the upper right end of the machine table, the vertical displacement sensor is fixed on the right side of the driving cylinder, a fixed support is arranged on the side wall above the left side of the driving cylinder, a lens support groove is arranged on the left side of the fixed support, a laser pulse generator is arranged in the center of the top of the lens support groove, a guide laser; a microswitch and a spring are arranged above the processing base; a lens sliding seat B is arranged in the lens support groove, a lens sliding seat A is arranged right below the lens sliding seat B, a wedge-shaped heat dissipation groove is arranged between the lens sliding seat B and the lens sliding seat A, and laser adjusting mirrors are arranged on the lens sliding seat B and the lens sliding seat A; the top of the driving cylinder is provided with a height adjusting separation clamp; the left side of the nozzle is provided with an air escape valve, the right side of the nozzle is provided with a quick air exchange valve, the air escape valve and the quick air exchange valve are symmetrically arranged, and the quick air exchange valve is connected with a gas tank through a conduit; an oxygen tank, a nitrogen tank and an air tank are arranged in the gas box, a filter screen is arranged at the air tank, and an opening formed in the air tank is communicated with the outside; a power supply is arranged in the electric cabinet, a CPU unit is arranged at the right end of the power supply, a memory is arranged at the lower connecting end of the CPU unit, an A/D converter is arranged at the right connecting end of the CPU unit, a current control circuit, a driving circuit and an on-off controller are arranged at the other connecting end of the A/D converter, and the current control circuit, the driving circuit and the on-off controller are connected in parallel; the ventilation delay function of the high-power laser processing device body is more than 6 KW;
the use method of the high-power laser processing device comprises the following steps:
A. placing a device to be processed on a processing base, and fixing a processed piece;
B. the driving cylinder drives the laser nozzle below the lens support groove on the left side of the fixed support in the vertical direction, so that the nozzle of the laser head is aligned to the position needing drilling;
C. the vertical displacement sensor is used for detecting the displacement distance of the driving cylinder in the vertical direction and controlling the driving of the cylinder;
D. the electric cabinet energizes the laser pulse generator, the laser pulse generator emits laser beams, the lens support groove carries out focusing adjustment on the laser beams, and the output power of the laser is controlled to be more than 6 KW;
E. and the laser beam is emitted through the spray head, and the corresponding position of the workpiece to be processed is drilled.
CN201810744093.7A 2018-07-09 2018-07-09 High-power laser processing device and processing method thereof Active CN108723614B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810744093.7A CN108723614B (en) 2018-07-09 2018-07-09 High-power laser processing device and processing method thereof

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Application Number Priority Date Filing Date Title
CN201810744093.7A CN108723614B (en) 2018-07-09 2018-07-09 High-power laser processing device and processing method thereof

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CN108723614A CN108723614A (en) 2018-11-02
CN108723614B true CN108723614B (en) 2020-08-25

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060015024A (en) * 2004-08-13 2006-02-16 주식회사 이오테크닉스 Laser electrode cutting apparatus and its control method
CN105397304A (en) * 2015-12-25 2016-03-16 苏州智合源电子科技有限公司 Full-automatic laser mechanism of laser marking machine
CN207205561U (en) * 2017-05-17 2018-04-10 世纪镭杰明(北京)科技有限公司 Laser marking machine automatic focusing mechanism
JP2018061997A (en) * 2016-10-14 2018-04-19 ファナック株式会社 Laser processing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1393091B1 (en) * 2009-02-18 2012-04-11 Grassi HEAD FOR CONTINUOUS PRECISION MACHINING ON THREE-DIMENSIONAL BODIES AND MACHINING MACHINE INCLUDING THE HEAD

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060015024A (en) * 2004-08-13 2006-02-16 주식회사 이오테크닉스 Laser electrode cutting apparatus and its control method
CN105397304A (en) * 2015-12-25 2016-03-16 苏州智合源电子科技有限公司 Full-automatic laser mechanism of laser marking machine
JP2018061997A (en) * 2016-10-14 2018-04-19 ファナック株式会社 Laser processing device
CN207205561U (en) * 2017-05-17 2018-04-10 世纪镭杰明(北京)科技有限公司 Laser marking machine automatic focusing mechanism

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Address after: 325000 no.4258, 3rd road, Binhai Park, Wenzhou Economic and Technological Development Zone, Zhejiang Province

Patentee after: Pentium laser (Zhejiang) Co.,Ltd.

Address before: 325000 no.4258, 3rd road, Binhai Park, Wenzhou Economic and Technological Development Zone, Zhejiang Province

Patentee before: PENTA LASER (WENZHOU) Co.,Ltd.