CN108722805A - Glue pot type hot melt glue supply device - Google Patents
Glue pot type hot melt glue supply device Download PDFInfo
- Publication number
- CN108722805A CN108722805A CN201710295666.8A CN201710295666A CN108722805A CN 108722805 A CN108722805 A CN 108722805A CN 201710295666 A CN201710295666 A CN 201710295666A CN 108722805 A CN108722805 A CN 108722805A
- Authority
- CN
- China
- Prior art keywords
- glue
- hot melt
- melt adhesive
- hole
- pot type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003292 glue Substances 0.000 title claims abstract description 220
- 239000012943 hotmelt Substances 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 239000004831 Hot glue Substances 0.000 claims description 88
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000004026 adhesive bonding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
Abstract
The invention provides a glue pot type hot melt glue supply device, which comprises a heating jig arranged on a machine body, at least two heating cylinders arranged on the heating jig and used for accommodating hot melt glue pots, glue pushers arranged at the tops of the heating cylinders respectively, and a glue supply flow channel formed in the heating jig; the glue pusher can alternately push the hot melt glue in the hot melt glue tank one by one, so that the hot melt glue in the hot melt glue tank can be supplied one by one and sequentially through the glue supply flow channel to drain, thereby facilitating the continuous supply of the hot melt glue with smaller flow, and being beneficial to the application of adhesive coating.
Description
Technical field
The present invention relates on miniaturization panel coated hot melt adhesive for glue technology, particularly with regard to a kind of sustainable for glue
Glue pot type heat glue feeder.
Background technology
Known general panel can generally be distinguished into the solar energy film panel of enlargement, television panels, and miniaturization
Mobile phone faceplate, PDA panels, wrist-watch panel etc., these described panels usually require during production system in glued on substrate
The structures such as circuit layer, insulating layer fill.
Since the area of the larger panel is larger, in glued manufacturing process, it is general using can larger flow for glue
Press disc type glue feeder is generally also, for example, in the surrounding architrave coating hot-melt adhesive of substrate surface, this press disc type glue feeder
The gluing or assembling process of vehicle glass or metal plate part etc. are used, but since it is larger for flow adhesive, it is smaller to be not appropriate for area
The smaller gluing for flow adhesive of the only demand such as small handsets panel, PDA panels or wrist-watch panel make.Therefore, by mesh
In preceding traditional panel manufacture craft, the hot melt adhesive suitable for minimizing panel is yet there are no for glue or gluing technology.
Based on this because of, the panel that generally minimizes on the market (being, for example, mobile phone faceplate), the glued circuit layer on substrate
Or it when the structures such as insulating layer dress, can only be pasted mostly using double faced adhesive tape;But compared to hot melt adhesive for, after sticking double faced adhesive tape
Air-tightness, weatherability and durability etc. it is all comparatively bad.
Invention content
In view of this, the technical task of the invention to be solved is:Allow miniaturization panel can use smaller flow and
The hot melt adhesive that can continue supply carrys out the layers bit unit such as glued circuit layer or insulating layer.
For this purpose, the present invention pushes away the known conditions of the dedicated hot melt adhesive tank of glue device manually according to commercially available, and then research and create one kind
Glue pot type heats glue feeder, which is characterized in that including:
One body;
One heating tool is configured at the bottom of the body, and the top surface of the heating tool is formed at least two and enters glue hole;
At least two cartridge heaters hang down be placed in the top of the heating tool respectively, described respectively to house a hot melt adhesive tank
Enter glue hole to be connected to via the bottom of cartridge heater in hot melt adhesive tank respectively;
One for glue runner, is formed in the heating tool, the bottom of the multiple glue tank respectively via it is described enter glue hole connect
Lead to this for glue runner, and the heating tool one end forms a plastic hole and is connected to this for glue runner;
One pushes away glue unit, include be equal to the hot melt adhesive tank quantity push away glue device, the glue device that pushes away respectively symmetrically is matched
It is placed on the body at the top of the cartridge heater;
Wherein, this, which pushes away glue unit, can be sequentially driven the heat pressed and pushed away in the hot melt adhesive tank that exerts a force for pushing away glue device alternative expression
Melten gel, enable the hot melt adhesive in the hot melt adhesive tank sequentially via it is described enter glue hole, this for glue runner drain to the plastic hole supply
Glue.
According to this, the technical effects of the invention are that:
1. allow multiple commercially available hot melt adhesive tanks can in an alternating manner the lasting hot melt adhesive supplied in its tank to gum outlet.Its
In, since the multiple hot melt adhesive tank is to adopt sequentially to carry out for the mode of glue one by one, when one of them is for the heat in glue tank
When melten gel is used up, can remaining for glue tank also continue for glue during by self-gripping jaws or artificially from the cartridge heater
Interior taking-up, and load it is new and be it is interior be loaded with entering in the cartridge heater for glue tank for hot melt adhesive, implement repeatedly, can reach
The effect of continuing for glue to gum outlet.
2. for capable of generating the larger press disc type glue feeder for flow adhesive compared to tradition, the present invention uses hot melt adhesive tank
Alternating can be generated for glue mode it is relatively small for flow adhesive, therefore pole be appropriate to be applied to miniaturization panel on needed for
On the glued coating operations asked.
In addition to this, the further implementation detail of the present invention further includes:
It is described enter glue hole be respectively formed in the entering in glue mouth of an angle shape, it is described enter glue hole via it is described enter Jiao Zui pierce through institute
The bottom surface of hot melt adhesive tank is stated, and guides the hot melt adhesive in the hot melt adhesive tank and drains to the plastic hole for glue via for glue runner.
The cartridge heater respectively by being combined into the form of conjunction by two stack shells of the symmetrical subdivision in central axes by that can raise and cover,
In favor of the unloading in the cartridge heater and filling hot melt adhesive tank.Wherein, it is embedded with electricity respectively in the cartridge heater and heating tool
Hot type heating element.
The glue device that pushes away is connected a platen respectively, and the glue device energy band dynamic pressure disk that pushes away is pressed in the top of the cartridge heater
Portion.Wherein, be each configured in the platen connection pressure-air supply line for gas nozzle, and it is described push away glue unit via
Being penetrated in the hot melt adhesive tank for gas nozzle on glue device driving platen is pushed away, and then is pushed away via the pressure-air for gas nozzle supply
Power and the pressure that sequentially exerts a force pushes away hot melt adhesive in the hot melt adhesive tank.Wherein, it is described for gas nozzle be in angle shape, with profit pierce through hot melt adhesive
The top surface of tank.Thus, which the hot melt adhesive in hot melt adhesive tank can bear the pressure thrust of pressure-air, relatively can ensure that for glue
When smoothness and stability.Wherein, platen also can be configured not, and allow it is described push away glue device and directly drive penetrate hot melt for gas nozzle
In glue tank, and guides the hot melt adhesive that pressure-air force pushes in hot melt adhesive tank and drain to this and enter Jiao Zui.
Also include a configuration at least gumming pump on the body, and enters between glue hole and the plastic hole described in gumming pump connection
For glue runner.Wherein, the configuration quantity of the gumming pump be equal to it is described enter glue hole.
It is also embedded with multiple pressure sensors in the heating tool and is implanted in this in glue runner.The pressure sensor packet
Containing it is multiple it is neighbouring described enter glue hole site enter glue pressure sensor and one adjacent to the plastic emitting hole site plastic emitting pressure sensor.
This for glue runner in discrimination shape be distributed in it is described enter between glue hole, gumming pump, pressure sensor and plastic hole.
The vent connection being equal into glue hole number is also configured on the heating tool, the vent connection is implanted in respectively
It is neighbouring described enter glue hole site in glue runner.Wherein, it is respectively equipped with an air discharge cook on the vent connection.Accordingly, institute
State vent connection can before each hot melt adhesive tank is for glue, first exclude it is neighbouring enter glue hole site for the air in glue runner, with
Exempt to hinder for glue.
According to above-mentioned, the present invention is extremely properly applied to the structure dress adhesion of miniaturization panel, viscous to improve miniaturization panel
Paste air-tightness, weatherability and durable usability after molding.
The technological means of apparatus described above and its specific implementation details for generating efficiency, please refer to the following example and figure
Formula is illustrated.
Description of the drawings
Fig. 1 is the stereoscopic configurations schematic diagram of a preferred embodiment of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the front view of Fig. 1;
Fig. 4 is mounted in the cut-away view of the hot melt adhesive tank in Fig. 1;
Fig. 5 is the amplification cut-away view of A-A sections in Fig. 2;
Fig. 6 is the action key diagram of Fig. 5;
Fig. 7 is the cut-away view of B-B sections in Fig. 3;
Fig. 8 is the cut-away view of C-C sections in Fig. 7.
Reference sign:10 bodies;11 footstocks;12 pedestals;13 metopes;20 heating tools;21 enter glue hole;22 enter glue
Mouth;25 for glue runner;26 plastic holes;27 electrothermal heating elements;28 vent connections;29 air discharge cooks;30 cartridge heaters;31,32
Stack shell;33 fasteners;34 electrothermal heating elements;40,40a, 40b hot melt adhesive tank;41 top surfaces;42 bottom surfaces;43 hot melt adhesive;50 push away glue
Unit;51 push away glue device;52 platens;53 air supply channels;54 for gas nozzle;55 pressure-air supply lines;60 gumming pumps;61 pump housings;
70 pressure sensors;71 enter glue pressure sensor;72 plastic emitting pressure sensors.
Specific implementation mode
Referring initially to Fig. 1 to Fig. 3, the stereogram of a preferred embodiment of the present invention, vertical view and preceding are disclosed respectively
View, to illustrate the present invention glue pot type hot melt glue feeder include:One body 10, a heating tool 20, equivalent arrangements
The cartridge heater 30 of quantity pushes away glue unit 50 with hot melt adhesive tank 40 and one.Wherein:
The body 10 can make the footstock 11 and pedestal 12 by combining a footstock 11 and pedestal 12 to be made between bilateral metope 13
Between be formed with accommodating space.The made of metal that the heating tool 20 can utilize heat conductivity good is fixedly arranged on bottom at block shape
On seat 12 so that heating tool 20 can be configured in the bottom of body 10, and the accommodating sky between footstock 11 and pedestal 12
In.
In this embodiment, explanation of the citing using two cartridge heaters 30 and two hot melt adhesive tanks 40 as on configuring.It is described to add
Hot cylinder 30 is fixedly arranged on the top of the heating tool 20 respectively, and respectively to an accommodating hot melt adhesive tank 40 in the cartridge heater 30.
Further referring to Fig. 4, the cylinder shape container that the hot melt adhesive tank 40 is acquirement purchased in market, and hot melt adhesive tank 40 are disclosed
It is inside filled with hot melt adhesive 43, the both-end of hot melt adhesive tank 40 is utilized respectively e.g. aluminium foil or glued membrane etc. and is used as top surface 41 and bottom surface 42
And encapsulate its opening so that hot melt adhesive 43 can be stored in hot melt adhesive tank 40.
Further referring to Fig. 5, two cartridge heaters 30 vertical top for being placed in the heating tool 20 respectively, and two are disclosed
Hot melt adhesive tank 40a, 40b can be placed in positioning in two cartridge heaters 30 taking human as mode or self-gripping jaws.
Again as shown in Figure 1, the cartridge heater 30 can be respectively by two stack shells 31,32 with the symmetrical subdivision in central axes with hinge
Bridging mode, which combines, can raise and cover conjunction form;Two stack shells 31,32 are raised for putting cartridge heater 30, and two stack shells
31,32 lid is equipped with fastener 33 between closing interface, which can provide fixed make when the opposite lid of two stack shells 31,32 closes
With.Wherein, it is embedded with electrothermal heating element 34 respectively in two stack shells 31,32 of the cartridge heater 30, to cartridge heater
Hot melt adhesive tank 40a, 40b in 30 provide heat source, and the hot melt adhesive 43 in tank is made to be easy to be pushed for glue in molten (as schemed
Shown in 6).
Wherein, the top surface of the heating tool 20 is formed with two of 30 installation number of corresponding cartridge heater and enters glue hole 21, and
Entering glue hole 21 described in enabling can be connected to via the bottom of cartridge heater 30 in hot melt adhesive tank 40a, 40b respectively.
Further, what the top of the heating tool 20 was each configured with two angle shapes enters glue mouth 22, it is described enter
Glue hole 21 is respectively formed in this and enters in glue mouth 22 so that it is described enter glue hole 21 can via it is described enter glue mouth 22 angle feature, and
Pierce through the bottom surface 42 of described hot melt adhesive tank 40a, 40b respectively, so guide the hot melt adhesive 43 in the hot melt adhesive tank 40 flow into
In glue hole 21.
Please refer to Fig. 1 and Fig. 5, disclose this push away glue unit 50 include be equal to the hot melt adhesive tank quantity push away glue
Device 51, and the glue device 51 that pushes away respectively symmetrically is configured on the body 10 at 30 top of the cartridge heater.More specifically, described push away
Glue device 51 is to select the power cylinder of air pressure or hydraulic-driven, and erected on the footstock 11 of body 10.
Please refer to Fig. 5 and Fig. 6, Fig. 5 ranks show that the cylinder rod output end for pushing away glue device 51 is connected has a platen respectively
52, Fig. 6, which disclose the glue device energy band dynamic pressure disk 52 that pushes away, presses in the top of described hot melt adhesive tank 40a, 40b, described in stabilization
Hot melt adhesive tank 40a, 40b in cartridge heater 30.An air supply channel 53 is respectively formed in the platen 52, the platen 52 is simultaneously held in the mouth
One is connect for gas nozzle 54, this connects a pressure-air supply line 55 for gas nozzle 54 via steam line 52.Wherein, the gas supply
Mouth 54 can be made into tool angle shape feature mouthpiece, it is described push away glue unit 50 can via push away glue device 51 drive platen 52 on for gas nozzle
54 and pierce through the top surface 41 of hot melt adhesive tank 40a, 40b so that the pressure-air thrust supplied for gas nozzle 54 can be with the side of pressure
Formula force pressure pushes away the hot melt adhesive 43 in described hot melt adhesive tank 40a, 40b so that hot melt adhesive 43 can smoothly drain to the heating and control
20 top of tool enters in glue mouth 22.
In above-mentioned implementation, the cylinder rod output end for pushing away glue device 51 also can divergence platen 52 and be directly connected and drive
It is dynamic to be penetrated in hot melt adhesive tank 40 for gas nozzle 54, and guide pressure-air force pushing hot melt adhesive 43 and drain in glue mouth 22.
It please continue refering to Fig. 7 and Fig. 8, disclose and be formed with one in the heating tool 20 for glue runner 25.Two hot melt adhesive tanks
The bottom of 40a, 40b respectively via it is described enter glue hole 21 be connected to this for glue runner 25, and 20 one end of heating tool forms one to go out
Glue hole 26 is connected to this for glue runner 25.The plastic hole 26 can be connected a gluing head (figure is not painted) and fill layer to the structure for minimizing panel
The surface that demand is adhered on part carries out gluing.It also discloses in the figure 7 and is embedded with branched electrothermal heating unit in the heating tool 20
Part 27 makes the electrothermal heating element 27 be adjacent to the nearside for glue runner 25, to for the hot melt adhesive in glue runner 25
Heat source is provided, maintains for the hot melt adhesive in glue runner 25 to be in readily flowed molten condition, in favor of for glue.
Also disclose in figs. 1 to 3 on the body 10 also includes to be configured with to be equal to cartridge heater 30 (or entering glue hole 21) number
The gumming pump 60 of amount, further discloses in the pump housing 61 of the gumming pump 60 and is connected respectively with for glue runner 25 in fig. 8;
More specifically, the pump housing 61 of gumming pump 60 be connected to it is described enter between glue hole 21 and the plastic hole 26 for glue runner 25.Accordingly,
The gumming pump 60 can be for pushing the hot melt adhesive of molten to drain to plastic hole 26 for glue by entering glue hole 21 in glue runner 25.
Referring back to Fig. 7 and Fig. 8, illustrate also to be embedded with multiple pressure sensors 70 in the heating tool 20, and makes described
Pressure sensor 70 is implanted in this in glue runner 25.Further, the pressure sensor 70 includes to enter glue described in
The plastic emitting pressure sensor 72 for entering glue pressure sensor 71 and neighbouring 26 position of plastic hole of 21 position of hole, to detection for glue
Enter glue laminated power and plastic emitting pressure, and the driving force for pushing away glue laminated power and gumming pump 60 of line control pressure-air in runner 25,
In favor of smoothness and smoothly for glue.
Be also shown by Fig. 7 and Fig. 5 know this for glue runner 25 in discrimination shape be distributed in it is described enter glue hole 21, gumming pump 60, pressure
Between power sensor 70 and plastic hole 26.Wherein, it is also configured with the exhaust being equal into 21 quantity of glue hole on the heating tool 20
Take over 28, the vent connection 28 be implanted in respectively it is neighbouring described enter glue hole site in glue runner 26.The vent connection
28 are respectively equipped with an air discharge cook 29, and the air discharge cook 29 can be a cock, and spiral shell group engages between vent connection 28,
And it is in adjustable gas bleeder valve form.The effect of the air discharge cook 29 is before each hot melt adhesive tank 40 is for glue, first excludes
It is neighbouring enter 21 position of glue hole for the air in glue runner 25, in order to avoid hinder to be drained in glue runner 26 by hot melt adhesive tank 40
For glue smoothness.
According to the above description, it should be not difficult to know, the present invention can enable this push away glue unit 50 and gradually drive and described two push away glue
In device 51 for gas nozzle 54, the offer pressure-air of alternative expression pushes away the hot melt adhesive 43 in the hot melt adhesive tank 40 come the pressure that exerts a force;Example
It pushes away as disclosed the pressure-air that first provided for gas nozzle 54 above hot melt adhesive tank 40b in figure 6 and draws the decline of hot melt adhesive 43 for glue, at this time
Not supplied for gas nozzle 54 above hot melt adhesive tank 40a pushes away glue, until the hot melt adhesive 43 in hot melt adhesive tank 40b for glue when most, will
, for glue, so alternately implemented by hot melt adhesive tank 40a from turn for glue operation, the heat in described hot melt adhesive tank 40a, 40b can be made
Melten gel sequentially via it is described enter glue hole 21, this drain to the plastic hole 26 for glue for glue runner 25, reach not fracture for the effect of glue
With.
Above example is only to express the preferable specific implementation mode of the present invention, but can not therefore be interpreted as to this
The limitation of patent of invention range.
Claims (15)
1. a kind of glue pot type heats glue feeder, which is characterized in that including:
One body;
One heating tool is configured at the bottom of the body, and the top surface of the heating tool is formed at least two and enters glue hole;
At least two cartridge heaters hang down be placed in the top of the heating tool respectively, respectively to house a hot melt adhesive tank, it is described enter glue
Hole is connected in hot melt adhesive tank respectively via the bottom of cartridge heater;
One for glue runner, is formed in the heating tool, the bottom of the multiple glue tank respectively via it is described enter the connection of glue hole should
For glue runner, and the heating tool one end forms a plastic hole and is connected to this for glue runner;
One pushes away glue unit, include be equal to the hot melt adhesive tank quantity push away glue device, the glue device that pushes away respectively symmetrically is configured at
On body at the top of the cartridge heater;
Wherein, this, which pushes away glue unit, can be sequentially driven the hot melt pressed and pushed away in the hot melt adhesive tank that exerts a force for pushing away glue device alternative expression
Glue, enable the hot melt adhesive in the hot melt adhesive tank sequentially via it is described enter glue hole, this drain to the plastic hole for glue for glue runner.
2. glue pot type according to claim 1 heats glue feeder, which is characterized in that it is described enter glue hole be respectively formed in one
Angle shape enters in glue mouth, it is described enter glue hole via it is described enter Jiao Zui pierce through the bottom surface of the hot melt adhesive tank, and guide the heat
Hot melt adhesive in melten gel tank drains to the plastic hole for glue via for glue runner.
3. glue pot type according to claim 1 heats glue feeder, which is characterized in that the cartridge heater is respectively by with axis
Two stack shells of the symmetrical subdivision of line are combined by that can raise and cover in the form of conjunction.
4. glue pot type according to claim 1 or 3 heats glue feeder, which is characterized in that the cartridge heater and the heating
Electrothermal heating element is embedded in jig respectively.
5. glue pot type according to claim 1 heats glue feeder, which is characterized in that the glue device that pushes away is connected a confession respectively
Gas nozzle, it is described to connect a pressure-air supply line for gas nozzle, it is described to push away glue unit and for gas nozzle penetrate institute via the driving of glue device is pushed away
State in hot melt adhesive tank, so via it is described for gas nozzle supply pressure-air thrust and the pressure that sequentially exerts a force pushes away in the hot melt adhesive tank
Hot melt adhesive.
6. glue pot type according to claim 1 heats glue feeder, which is characterized in that the glue device that pushes away is connected a pressure respectively
Disk, and the glue device energy band dynamic pressure disk that pushes away is pressed in the top of the hot melt adhesive tank.
7. glue pot type according to claim 6 heats glue feeder, which is characterized in that be each configured with one in the platen
Connect pressure-air supply line for gas nozzle, and described push away glue unit and penetrate institute for gas nozzle on glue device driving platen via pushing away
State in hot melt adhesive tank, so via it is described for gas nozzle supply pressure-air thrust and the pressure that sequentially exerts a force pushes away in the hot melt adhesive tank
Hot melt adhesive.
8. glue pot type according to claim 5 or 7 heats glue feeder, which is characterized in that described for gas nozzle is in angle shape.
9. glue pot type according to claim 1 heats glue feeder, which is characterized in that also configure at least one confession on the body
Glue pump, and the gumming pump connection described in enter between glue hole and the plastic hole for glue runner.
10. glue pot type according to claim 9 heats glue feeder, which is characterized in that the configuration quantity phase of the gumming pump
Equal to it is described enter glue hole.
11. the glue pot type according to claim 1 or 9 heats glue feeder, which is characterized in that also embedded in the heating tool
There are multiple pressure sensors, multiple pressure sensor to be implanted in this in glue runner.
12. glue pot type according to claim 11 heats glue feeder, which is characterized in that the pressure sensor includes more
It is a it is neighbouring described enter glue hole site enter glue pressure sensor and one adjacent to the plastic emitting hole site plastic emitting pressure sensor.
13. glue pot type according to claim 11 heats glue feeder, which is characterized in that this is distributed for glue runner in discrimination shape
In it is described enter between glue hole, gumming pump, pressure sensor and plastic hole.
14. glue pot type according to claim 1 heats glue feeder, which is characterized in that be also configured on the heating tool
Be equal to the vent connection into glue hole number, the vent connection be implanted in respectively it is neighbouring it is described enter glue hole site for glue runner
It is interior.
15. glue pot type according to claim 14 heats glue feeder, which is characterized in that set respectively on the vent connection
There is an air discharge cook.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106112489A TWI679066B (en) | 2017-04-14 | 2017-04-14 | Glue tank type hot melt glue supply device |
TW106112489 | 2017-04-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108722805A true CN108722805A (en) | 2018-11-02 |
Family
ID=63940173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710295666.8A Withdrawn CN108722805A (en) | 2017-04-14 | 2017-04-28 | Glue pot type hot melt glue supply device |
Country Status (2)
Country | Link |
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CN (1) | CN108722805A (en) |
TW (1) | TWI679066B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110152947A (en) * | 2019-06-19 | 2019-08-23 | 广州信邦智能装备股份有限公司 | A kind of metering-type glue feeder |
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TWM464315U (en) * | 2013-06-20 | 2013-11-01 | Wei Kuang Automation Co Ltd | Adhesive supply pressure control device of hot melt adhesive |
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CN101537404A (en) * | 2008-03-18 | 2009-09-23 | 钰衡科技股份有限公司 | Constant pressure type glue feeder |
TWM388375U (en) * | 2010-03-19 | 2010-09-11 | Hwang Sun Enterprise Co Ltd | Horizontal hot adhesive machine for adhesive spraying and material discharging |
JP5321726B1 (en) * | 2012-12-20 | 2013-10-23 | 横浜ゴム株式会社 | Puncture repair equipment |
CN105728270A (en) * | 2014-12-01 | 2016-07-06 | 威光自动化科技股份有限公司 | Multiphase glue supply device of glue spreader |
CN106168291A (en) * | 2015-05-21 | 2016-11-30 | 诺信公司 | Hand-held valve allotter and correlation technique |
CN205892155U (en) * | 2016-07-14 | 2017-01-18 | 北京英斯派克科技有限公司 | A stabilize feeding system in succession for powder in bags |
CN206854014U (en) * | 2017-04-14 | 2018-01-09 | 威光自动化科技股份有限公司 | Glue pot type hot melt glue supply device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110152947A (en) * | 2019-06-19 | 2019-08-23 | 广州信邦智能装备股份有限公司 | A kind of metering-type glue feeder |
Also Published As
Publication number | Publication date |
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TWI679066B (en) | 2019-12-11 |
TW201836715A (en) | 2018-10-16 |
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