CN108718352A - Center production method, center and electronic equipment - Google Patents
Center production method, center and electronic equipment Download PDFInfo
- Publication number
- CN108718352A CN108718352A CN201810697709.XA CN201810697709A CN108718352A CN 108718352 A CN108718352 A CN 108718352A CN 201810697709 A CN201810697709 A CN 201810697709A CN 108718352 A CN108718352 A CN 108718352A
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- China
- Prior art keywords
- frame
- column
- mounting hole
- center
- face
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
This application provides a kind of center production methods.The center production method includes making frame, and the inside of the frame is equipped with mounting hole；The periphery of plate in making, the middle plate has riveting column；Splice the frame and the middle plate, so that the riveting column stretches into the mounting hole；Pin column is caught between the riveting column and the hole wall of the mounting hole, so that the hole wall of the riveting column and the mounting hole is interference fitted.The cost of the center production method is low.Present invention also provides a kind of center and electronic equipments.
Description
Technical field
This application involves a kind of a kind of electronic equipment field more particularly to center production method, center and electronic equipments.
Background technology
Mobile phone includes center, and center carries the device of interior of mobile phone.Traditional center includes frame and middle plate.Side
Frame mostly uses greatly welding manner with middle plate and is fixed, however, welding manner is of high cost.
Invention content
This application provides a kind of center production methods that processing cost is low, and a kind of center of offer and electronic equipment.
The embodiment of the present application provides a kind of center production method.The center production method includes making frame, described
The inside of frame is equipped with mounting hole；The periphery of plate in making, the middle plate has riveting column；Splice the frame with it is described in
Plate, so that the riveting column stretches into the mounting hole；Pin column is caught between the riveting column and the hole wall of the mounting hole,
So that the hole wall of the riveting column and the mounting hole is interference fitted.
Present invention also provides a kind of centers.The center is made of above-mentioned center production method.
Present invention also provides a kind of centers.The center includes frame, middle plate and pin column, is set on the inside of the frame
There are mounting hole, the periphery of the middle plate that there is riveting column, the riveting column to be set in the mounting hole, the pin column is connected in
Between the riveting column and the hole wall of the mounting hole, so that the hole wall of the riveting column and the mounting hole is interference fitted.
Present invention also provides a kind of electronic equipment.The electronic equipment includes above-mentioned center and display screen, described aobvious
Display screen is installed on the center.
In the present embodiment, by the way that the riveting column is stretched into the mounting hole, then by the way that the pin column is caught in institute
It states between riveting column and the hole wall of the mounting hole, so that the hole wall of the riveting column and the mounting hole is interference fitted, to
Realize the secured splicing of the middle plate and the frame.The center production method eliminate by weld centering plate and frame into
The fixed process of row, to reduce the cost of manufacture of center.
Description of the drawings
In order to illustrate more clearly of the technical solution of the application, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the application, general for this field
For logical technical staff, without having to pay creative labor, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of flow diagram of embodiment of center production method provided in this embodiment；
Fig. 2 is structural schematic diagram of the center production method shown in FIG. 1 in preparation process；
Fig. 3 is the schematic diagram of structure of the center production method shown in FIG. 1 in preparation process；
Fig. 4 is schematic diagram of the frame shown in Fig. 3 in a kind of structure of embodiment of line A-A；
Fig. 5 is the schematic diagram of structure of the center production method shown in FIG. 1 in preparation process；
Fig. 6 is the schematic diagram of structure of the center production method shown in FIG. 1 in preparation process；
Fig. 7 is schematic diagram of the center shown in fig. 6 in a kind of structure of embodiment of line B-B；
Fig. 8 is schematic diagram of the center shown in fig. 6 in the structure of the another embodiment of line B-B, and the center includes
Pin column；
Fig. 9 is the part flow diagram of center production method shown in FIG. 1；
Figure 10 is schematic diagram of the center shown in fig. 6 in the structure of the another embodiment of line B-B, and the center includes
Pin column；
Figure 11 is schematic diagram of the center shown in fig. 6 in the structure of the another embodiment of line B-B, and the center includes
Pin column；
Figure 12 is schematic diagram of the center shown in fig. 6 in the structure of the another embodiment of line B-B, and the center includes
Pin column；
Figure 13 is schematic diagram of the center shown in fig. 6 in the structure of the another embodiment of line B-B, and the center includes
Pin column；
Figure 14 is the signal of the another embodiment of structure of the center production method shown in FIG. 1 in preparation process
Figure；
Figure 15 is the signal of the another embodiment of structure of the center production method shown in FIG. 1 in preparation process
Figure；
Figure 16 is a kind of structural schematic diagram of embodiment of electronic equipment provided in this embodiment.
Specific implementation mode
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu is fully described by.
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features, and advantages of the application
Mode is applied the application is described in detail.It should be noted that in the absence of conflict, presently filed embodiment and reality
The feature applied in mode can be combined with each other.
Many details are elaborated in the following description in order to fully understand the application, described embodiment
Only a part of embodiment of the application, rather than whole embodiments.Based on the embodiment in the application, this field
The every other embodiment that those of ordinary skill is obtained without making creative work belongs to the application guarantor
The range of shield.
In addition, the explanation of following embodiment is referred to the additional illustration, to illustrate the spy that the application can be used to implement
Determine embodiment.The direction term being previously mentioned in the application, for example, " length ", " width ", " thickness " etc., are only to refer to appended drawings
The direction of formula, therefore, the direction term used be in order to it is more preferable, be illustrated more clearly that and understand the application, rather than indicate or
It implies signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as
Limitation to the application.Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense,
Can also be detachably connected, or be integrally connected for example, it may be being fixedly connected；It can be mechanical connection；Can be
It is connected directly, can also can be indirectly connected through an intermediary the connection inside two elements.For the common of this field
For technical staff, it can understand that the tool of above-mentioned term in this application illustrates body meaning with concrete condition.
As shown in Figure 1, the present embodiment provides a kind of center production methods.Center production method includes：
Step 101：As shown in Figures 2 to 4, frame 20 is made, the inside 21 of frame 20 is equipped with mounting hole 221；In this reality
It applies in example, provides frame blank material 10, and frame blank material 10 is processed into frame 20.Frame blank material 10 is aluminum alloy materials.Aluminium closes
Gold utensil has the advantages that density is small, ductility is good and easy to process.Frame blank material 10 is hollow structure, and frame blank material 10 includes phase
Carry on the back outside 11 and the inside 12 of setting.The outside 11 of frame blank material 10 and inside 12 are plane.Process frame blank material 10
Inside 12 is to form the inside 21 of frame 20.The outside 11 for processing frame blank material 10, to form the appearance 23 of frame 20.Pass through
Milling tool or boring bar tool process mounting hole 221 on the inside of frame 20 21.Mounting hole 221 can be but be not limited to
For circular hole, strip-shaped hole or slotted eye.
In other embodiments, frame blank material 10 or stainless steel or titanium alloy etc..In addition, frame blank material 10
Shape may be the blank material of plate.Furthermore the outside 11 of frame blank material 10 and inside 12 or planar or bending
Shape.Specific the application is not restricted.
Step 102：As depicted in figs. 3 and 5, the periphery of plate 40 in making, middle plate 40 has riveting column 41.The present embodiment
In, middle slab material 30 is provided, and middle slab material 30 is processed into middle plate 40.Middle slab material 40 is aluminum alloy materials, and middle slab
Material 40 is platy structure.The middle slab material 30 includes the first 31 and second face 32 to be processed of face to be processed being disposed opposite to each other.The
Two plate faces being disposed opposite to each other of slab material 30 during one 31 and second face 32 to be processed of face to be processed is constituted, i.e., in slab material 40
Maximum two surfaces of area.The plate face of the middle slab material 40 can be round rectangle, or rectangle or curved surface, tool
Shape the application of body does not restrict.
Specifically, middle slab material 30 is processed middle plate 40.Middle plate 40 includes the first face 42 and the second face being disposed opposite to each other
43.First face 42 of middle plate 40 is equipped with riveting column 41.The second face 43 and the inside 21 of frame 20 of middle plate 40 form receiving space,
The receiving space is for accommodating electronic component.At this point, when the first face 31 to be processed of slab material 30 in processing, in formation
First face 42 of plate 40.When the second face 32 to be processed of slab material 30 in processing, with the second face 43 of plate in formation.In addition,
In formation when the first face 42 of plate 40, the peripheral position in the first face 42 is formed with riveting column 41.The outer diameter of riveting column 41 is less than solid
Determine the aperture in hole 221.Riveting column 41 is convexly equipped in the first face 42.In other embodiments, middle slab material 30 or stainless steel
Or titanium alloy etc..Specifically it is arranged according to actual conditions.
Step 103：As shown in FIG. 6 and 7, splicing frame 20 and middle plate 40, so that riveting column 41 stretches into mounting hole 221；
In the present embodiment, the middle plate 40 machined is spliced in the inside of frame 20 21.Specifically, the riveting column 41 by middle plate 40 is right
The mounting hole 221 of quasi- frame 20, and stretch into mounting hole 221, so that middle plate 40 is connected to the inside 21 of frame 20.Work as riveting column
When 41 outer diameter is far smaller than the aperture of mounting hole 221, riveting column 41 stretches into mounting hole 221, and is moved to mounting hole 221
Side, so as to reserve fixed area 224 between riveting column 41 and mounting hole 221.When the outer diameter of riveting column 41 is slightly less than mounting hole
When 221 aperture, riveting column 41 stretches into mounting hole 221, and coordinates with the hole wall transition of mounting hole 221.At this point, riveting column 41
Fixed area 224 is still flowed out with the hole wall of mounting hole 221.
Step 104：As shown in figure 8, by pin column 50 be caught in the riveting column 41 and the mounting hole 221 hole wall it
Between, so that the riveting column 41 and the hole wall of the mounting hole 221 are interference fitted.In the present embodiment, pass through squeeze pin post 50
Or rotating dog post 50, pin column 50 is caught between riveting column 41 and the hole wall of mounting hole 221, i.e., is blocked pin column 50
Enter into fixed area 224.At this point, 50 squeezed riveting column 41 of pin column, so that riveting column 41 and the hole wall of mounting hole 221 paste
Tightly, so that plate 40 will not be relatively moved with frame 20 in ensureing, with the firmness of the connection of plate in raising 40 and frame 20.?
In other embodiment, pin column 50 is caught in the mode between riveting column 41 and the hole wall of mounting hole 221 and does not make specific limitation.
In the present embodiment, by stretching into riveting column 41 in mounting hole 221, then the riveting column is caught in by pin column 50
Between 41 and the hole wall of the mounting hole 221, so that the riveting column 41 and the hole wall of the mounting hole 221 are interference fitted, from
And realize in plate 40 and frame 20 secured splicing.Center production method, which is eliminated, to be carried out by welding centering plate 40 with frame 20
Fixed process, to reduce the cost of manufacture of center.
In the present embodiment, as shown in figure 9, the making frame 20 includes：
Step 1011：Referring to Fig. 2 to Fig. 4.Interconnecting piece 22 is milled out in the inside of frame blank material 10 12；This implementation
In example, interconnecting piece 22 is milled out to the inside 12 of frame blank material 10 by milling cutter.Interconnecting piece 22 includes the top being disposed opposite to each other
Portion 222 and bottom 223.Specifically, milling tool is rose cutter.Rose cutter is moved to the inside 12 of frame blank material 10,
Milling cutter carries out milling along scheduled track in the inside of frame blank material 10 12, convex to be processed in the inside of frame blank material 10 12
Interconnecting piece 22 set on inside 12.Further, by NC Milling Technology, the inside 12 of frame blank material 10 is milled out into indent
Circular arc camber, to improve the volume of the inside of frame 20 12, to increase the volume of the receiving space.It is understood that
Indent indicate be processing formed after frame 20 inside 21 it is recessed to appearance 23.
Step 1012：Referring again to Fig. 3, mounting hole 221 is milled out on interconnecting piece 22；In the present embodiment, pass through milling
Knife mills out mounting hole 221 on interconnecting piece 22.Specifically, milling cutter is carried out along desired trajectory at the top of interconnecting piece 22 222
It goes to expect, to form mounting hole 221 at the top of interconnecting piece 22 222.Mounting hole 221 can run through the bottom 223 of interconnecting piece 22,
It can be not through the bottom 223 of interconnecting piece 22.It in other embodiments, can also be by boring bar tool to the top of interconnecting piece 22
222 drill, to form mounting hole 221.Or at the top of interconnecting piece 22 222, abrasion goes material to obtain by metal grinding head
Mounting hole 221.Specifically it is arranged according to actual conditions.
Step 1013：Appearance 23 is milled out in the outside of frame blank material 10 11, to form frame 20.In the present embodiment,
Referring to Fig. 3, when by NC Milling Technology, frame 20 is outer described in the size ratio in the outside 11 of the frame blank material 10
23 geomery of sight face has reserved allowance more, and after ensureing to process the frame blank material 10, acquisition meets shape need
Frame 20, reduce the rework rate of the frame 20, to reduce the processing cost of the frame blank material 10.At this point, when that will count
When controlling milling process, the appearance 23 forms circular arc camber.The outside 11 that the circular arc camber increases the frame 20 is round and smooth
Degree meets appearance diversification requirement.
Further, the formation appearance 23 further includes：The outside 11 of frame blank material 10 is surface-treated.
Specifically, the outside 11 to frame blank material 10 is surface-treated.The surface treatment includes to frame blank material 10 4
Zhou Jinhang sandblastings, surrounding oxidation, positive and negative overall height light chamfering and bloom chamfering carry out anodic oxidation.Optionally, to bloom chamfering
It is three times to carry out anodic oxidation number.The texture of frame 20, aesthetics are not only increased by being surface-treated the frame 20 formed
And practicability, it is thus also avoided that frame 20 is influenced the case where its performance by oxidation in use to be occurred.So when right
After the outside 11 of frame blank material 10 is surface-treated, the appearance 23 of frame 20 is formed, to meet the appearance consistency of center.
In the present embodiment, by first processing the inside 12 of frame blank material 10 to form interconnecting piece 22 and the shape on interconnecting piece 22
At mounting hole 221, the outside 11 of reprocessing frame blank material 10 is to form appearance 23, to which guarantee will not be because first processing frame base
The outside 11 of material 10, the inside 12 of reprocessing frame blank material 10 and the appearance 23 for damaging center.
In the present embodiment, plate 40 includes in the making：
Referring to Fig. 3 and Fig. 5.Described the first of middle slab material 30 face 31 to be processed described in die casting, described in formation
Riveting column 41.In the present embodiment, pass through the first forming part of die casting formation on the first face 31 to be processed of middle slab material 30.First
The surface of forming part is the first face 42 of middle plate 40.The periphery in the first face 42 is formed with riveting column 41.So passing through plate in die casting
Plate 40 during blank material 30 is formed can save the middle plate 40 formed by complicated NC milling process, in improving
The producing efficiency of frame.In addition, the middle plate 40 that die-casting process is formed has surface roughness good, the big advantage of mechanical strength, simultaneously
The allowance for reducing numerical control milling process has saved the cost of aluminum alloy materials.
Further, the present embodiment can be by the first 31 and second face 32 to be processed of face to be processed of die casting simultaneously, with same
When form the first forming part and the second forming part, to reduce molding in plate 40 process costs.The surface of second forming part is
Second face 43 of middle plate 40.Second forming part of attached drawing 3 has multiple accommodation spaces, for accommodating electronic component.Specifically
, the first mold and the second mold that are arranged by face while the first 31 and second face 32 to be processed of face to be processed of die casting, from
And it is formed simultaneously the first forming part and the second forming part.First mold can have different patterns from the second mold, can also
Pattern having the same.
In the present embodiment, by different processing modes to form the riveting column 41 of different structure：
Embodiment one：Riveting column 41 includes the top end face 411 of the separate middle plate 40 and is set around the top end face 411
The all sides 412 set, after die casting goes out riveting column 41 in the plate face of middle slab material 30, plate 40 further includes in the making：
As shown in Figure 10, groove 413 is milled out in all sides 412 of riveting column 41, groove 413 runs through top end face 411, recessed
The cell wall of slot 413 is interference fitted with the surface of pin column 50.
In the present embodiment, milling is carried out to all sides 412 of riveting column 41 by milling tool.Specifically, milling tool
For milling cutter.Milling cutter is moved to the top end face 411 of riveting column 41.Milling cutter is from the top end face 411 of riveting column 41 to close middle slab
The direction in the first face 31 to be processed of material 30 carries out milling, to process groove 413.Groove 413 runs through the side of riveting column 41
Face 412.At this point, when subsequently pin column 50 is connected in mounting hole 221, part pin column 50 is connected in groove 413.By
In the surface of groove 413 be curved so that fitting area between pin column 50 and the cell wall of groove 413 increases, into
The firmness of the connection of the increase riveting column 41 and pin column 50 of one step.
Embodiment two, unlike embodiment one：In the plate face of middle slab material 30 die casting go out riveting column 41 it
Afterwards, plate 40 further includes in the making：
As shown in figure 11, hook portion 414, the hook portion are milled out in the end far from the middle plate 40 of the riveting column 41
414 hooks are set to the surface far from middle plate 40 of interconnecting piece 22, the i.e. bottom 223 of interconnecting piece 22.
In the present embodiment, milling is carried out to the top end face 411 of riveting column 41 by milling tool.Specifically, milling work
Tool is milling cutter.Milling cutter is moved to the top end face 411 of riveting column 41.Milling cutter carries out milling to the top end face 411 of riveting column 41, with
Process hook portion 414.At this point, when subsequently splicing middle plate 40 in the inside 21 of frame 20, riveting column 41 stretches into mounting hole
221, and 414 hook of hook portion of rivet column is set to the bottom 223 of interconnecting piece 22, to avoid middle plate 40 from the inside of the frame 20
21 abjections, and then when pin column 50 is caught between riveting column 41 and the hole wall of mounting hole 221, with plate 40 in further ensureing
It will not deviate from from the inside of frame 20 21.
Embodiment three, unlike embodiment two：In the plate face of middle slab material 30 die casting go out riveting column 41 it
Afterwards, plate 40 further includes in the making：
As shown in figure 12, riveting column 41 is milled out in all sides 412 of riveting column 41, the outer diameter of riveting column 41 is along third party
To successively decreasing.Third direction be middle plate 40 direction from the second face 43 to the first face 42.
Milling is carried out to all sides 412 of riveting column 41 by milling tool.Specifically, milling tool is milling cutter.By milling
Knife is moved to all sides 412 of riveting column 41, and carries out material to all sides 412 and gradually successively decreased along first direction with obtaining outer diameter
Riveting column 41.At this point, when subsequently pin column 50 is connected in mounting hole 221, due to the contact plug post of riveting column 41
50 surface is tapered plane shape so that the fitting area between pin column 50 and riveting column 41 increases, to further increase
The firmness of the connection of riveting column 41 and pin column 50.
Embodiment four, unlike embodiment three：In the plate face of middle slab material 30 die casting go out riveting column 41 it
Afterwards, plate 40 further includes in the making：
As shown in figure 13, location hole 44 is processed in the plate face of the middle plate 40, the location hole 44 is set to the riveting
The periphery of column 41, location hole 44 are interference fitted with pin column 50.
In the present embodiment, by while die casting forms the first forming part on the first face 31 to be processed, forming location hole
44.Location hole 44 is located at the periphery of riveting column 41.When pin column 50 is caught in riveting column 41 and mounting hole 221 in subsequent handling
When between hole wall, pin column 50 passes through mounting hole 221, and is sticked in location hole 44.At this time pin column 50 both with mounting hole 221
Hole wall be bonded to each other, and be bonded to each other with the hole wall of location hole 44, to the company of plate 40 and frame 20 in further increasing
Connect firmness.
Embodiment five, unlike embodiment one, embodiment two, embodiment three and embodiment four：This
While the riveting column 41 of embodiment can be by the first forming part of plate in being formed in die casting 40, formation and embodiment
One, the structure of riveting column 41 is consistent in embodiment two, embodiment three and embodiment four.
Embodiment six, the matching relationship between the riveting column 41 and mounting hole 221 of above five kinds of embodiments can phase
Mutually combine.
In the present embodiment, the top 222 of the interconnecting piece 22 is used to support middle plate 40, and the frame 20 that splices is in
Plate 40 includes：
The riveting column 41 is stretched into the mounting hole 221 along first direction, the first direction is the interconnecting piece 22
Direction from the top 222 to the bottom 223.
In the present embodiment, by the first face 42 of middle plate 40 towards the top 222 of interconnecting piece 22, so that the riveting column of middle plate 40
The mounting hole 221 of the interconnecting piece 22 of 41 alignment frames 20.Again by the way that riveting column 41 is stretched into mounting hole 221 in a second direction, from
And realize in plate 40 and frame 20 preliminary connection.At this point, the first face 42 of middle plate 40 is bonded with the top 222 of interconnecting piece 22.
The second face 43 and 12 face of inside of frame 20 of middle plate 40 form receiving space.
It is described to include pin column 50 to be caught between the riveting column 41 and the hole wall of the mounting hole 221：
The pin column 50 is caught in the mounting hole 221 in a second direction, the second direction is the interconnecting piece 22
Direction from the bottom 223 to the top 222.
In the present embodiment, the riveting column 41 of plate 40 stretches into after the mounting hole 221 of frame 20 in the middle, by middle plate 40 and frame
20 overturn together, and are positioned over plummer.Plummer stretches into receiving space, and is held in middle plate 40, to avoid middle plate 40 from
It is detached from frame 20.Furthermore pin column 50 is caught in along third direction in mounting hole 221 by compression tool, so that pin column
50 are extruded in riveting column 41 on the hole wall of mounting hole 221.In addition, when pin column 50 is caught in along third direction in mounting hole 221,
Both can be to avoid when pin column 50 be caught in from second direction in mounting hole 221, pin column 50 or compression tool destroy second
The structure of forming part, and can ensure, when mounting hole 221 is exposed in 50 part of pin column, to be not take up the volume of receiving space, from
And ensures frame 20 and accommodate more electronic components with middle plate 40.
In the present embodiment, pin column 50 is caught between the riveting column 41 and the hole wall of the mounting hole 221 described
Later, the center production method further includes：
Non-signal shielding material 60 is filled in gap between the frame 20 and the middle plate 40.
In the present embodiment, as shown in figure 12.Non-signal shielding material 60 is plastic material.Will splicing complete middle plate 40 and
Frame 20 is fixed in mold cavity, then the plastic cement of melting is infused in the gap between frame 20 and middle plate 40 by injector
In.At this point, the plastic cement of melting is penetrated into the gap between frame 20 and middle plate 40 simultaneously, it is frozen into the plastic cement when melting solid
After the plastic cement of state, plastic cement closely connects 40 frame 20 of middle plate.
Further, non-signal shielding material 60 is filled in the gap of the frame 20, to improve the outer of the center
Effect is seen, that is, covers the open defect of the center, and the antenna headroom region of antenna system can be filled up, forms the center
Insulation system, ensure the normal work of antenna.
In the present embodiment, non-signal shielding material 60 is filled in the gap between the frame 20 and the middle plate 40
After step, further include：
The present embodiment provides a kind of centers.Center is made by above-mentioned center production method.
The present embodiment also provides a kind of center 100.Referring again to Fig. 6 and Fig. 7, the center 100 includes：Frame 20,
The inside 21 of middle plate 40 and pin column 50, the frame 20 is equipped with mounting hole 221, and the periphery of the middle plate 40 has riveting column
41, the riveting column 41 is set in the mounting hole 221, and the pin column 50 is connected in the riveting column 41 and the mounting hole
Between 221 hole wall, so that the riveting column 41 and the hole wall of the mounting hole 221 are interference fitted.
In the present embodiment, 20 inside 21 of the frame is equipped with interconnecting piece 22, and the mounting hole 221 is set to the interconnecting piece
22, the interconnecting piece 22 is for carrying the middle plate 40.Interconnecting piece 22 includes top 222 and bottom 223.Mounting hole 221 runs through
Top 222 and bottom 223.The splicing of plate 40 is at the inside 21 of frame 20 in the middle, the first face 42 and the interconnecting piece 22 of middle plate 40
Top is bonded.
In the present embodiment, riveting column 41 has a variety of set-up modes：
Embodiment one：Referring again to Figure 10, the riveting column 41 include top end face 411 far from the middle plate 40 and
Around all sides 412 that the top end face 411 is arranged, the week side 412 is equipped with groove 413, and the groove 413 is through described
Top end face 411, the cell wall of the groove 413 are bonded with the surface of the pin column 50.At this point, solid when pin column 50 to be connected to
When determining in hole 221, part pin column 50 is connected in groove 413.Since the surface of groove 413 is curved so that pin column
Fitting area between 50 and the cell wall of groove 413 increases, to further increase the connection of riveting column 41 and pin column 50
Firmness.
Embodiment two, unlike embodiment one：Referring again to Figure 11, the riveting column 41 includes fixed part
And bending connects the hook portion 414 of the fixed part, the fixed part is contained in the mounting hole 221, and the hook portion 414 is stretched out
The mounting hole 221, hook are set to the bottom 223 of the interconnecting piece 22.At this point, ought be subsequently by the splicing of middle plate 40 in frame 20
When side 21, riveting column 41 stretches into mounting hole 221, and 414 hook of hook portion of rivet column is set to the bottom 223 of interconnecting piece 22, to keep away
Exempt from middle plate 40 from the inside of the frame 20 21 to deviate from, and then when pin column 50 is caught in the hole wall of riveting column 41 and mounting hole 221
Between when, will not be deviate from from the inside of frame 20 21 with plate 40 in further ensureing.
Embodiment three, unlike embodiment two：Referring again to Figure 12, the middle plate 40 includes being disposed opposite to each other
The first face 42 and the second face 43, part first face 42 is bonded with the surface of the interconnecting piece 22, the riveting column 41
Outer diameter gradually successively decreases along first direction, and the first direction is second face 43 of the middle plate 40 to first face 42
Direction.At this point, when pin column 50 to be connected in mounting hole 221, since the surface of riveting column 41 is tapered plane shape so that pin
Fitting area between post 50 and riveting column 41 increases, to further increase connection jail of the riveting column 41 with pin column 50
Soundness.
Embodiment four, unlike embodiment three：Referring again to Figure 13, the surface of the middle plate 40, which is equipped with, determines
Position hole 44, the location hole 44 are set to the periphery of the riveting column 41, and the pin column 50 passes through the mounting hole 221, and blocks
Enter in the location hole 44.At this point, pin column 50 and the hole wall of location hole 44 are interference fitted.
In the present embodiment, when location hole 44 is arranged on the surface of the middle plate 40, pin column 50 is caught in riveting column
Between 41 and the hole wall of mounting hole 221, pin column 50 passes through mounting hole 221, and is sticked in location hole 44.Pin column 50 at this time
Not only it was mutually interference fitted with the hole wall of mounting hole 221, but also was mutually interference fitted with the hole wall of location hole 44, to further increase
Add the firmness of the connection of middle plate 40 and frame 20.
Above-mentioned four kinds of embodiments can be combined with each other, and be arranged with specific reference to actual conditions.
In the present embodiment, referring again to Figure 12, the riveting column 41 has the first supporting surface 415, the pin column 50
With the second supporting surface 51, first supporting surface 415 is bonded to each other with second supporting surface 51, first supporting surface
415 shape is adapted with the shape of second supporting surface 51.At this point, when pin column 50 to be connected in mounting hole 221,
Since the shape of the second supporting surface 51 of the first supporting surface 415 and pin column 50 of riveting column 41 is adapted so that pin column 50
Fitting area between riveting column 41 increases, to further increase the firmness of the connection of riveting column 41 and pin column 50.
In other embodiments, the frame 20 includes dismountable first frame 24, the second frame 25, third frame 26
And the 4th frame 27, the first frame 24, the second frame 25, third frame 26 and the 4th frame 27 are arranged along the periphery of the middle plate 40
Row, have gap between two neighboring frame, and the gap is forming antenna headroom region.As shown in figure 15, the first frame
24, the second frame 25, third frame 26 and the 4th frame 27 are equipped with interconnecting piece 22, and each interconnecting piece 22 is equipped with mounting hole
221.The mounting hole 221 of first frame 24, the second frame 25, third frame 26 and the 4th frame 27 is nested in middle plate 40 successively
Riveting column 41 on.The first frame 24, the second frame 25, third frame 26 and the 4th frame are sequentially clamped in by pin column 50 again
In mounting hole 221 on 27, in the first frame 24, the second frame 25, third frame 26 and the 4th frame 27 are fixed on
On plate 40.By splicing dismountable first frame 24, the second frame 25, third frame 26 and the 4th frame 27 in successively
The periphery of plate 40, so that the slit-shaped between two neighboring frame is used at antenna empty regions to reduce additional cutting gap
In antenna headroom region process, and then reduce the cost of manufacture of center.
As shown in figure 16, the present embodiment provides a kind of electronic equipment 200.Electronic equipment 200 include above-mentioned center 100 and
Display screen 300.Display screen 300 is installed on center 100.In the present embodiment, display screen 300 is that electricity is shown in electronic equipment 200
The region of subgraph.Display screen 300 is to shield comprehensively.300 rectangular plate of display screen.Display screen 300 can be organic electroluminescence hair
Light display screen can also be liquid crystal display.Center 100 can be metal shell.Display screen 300 is covered on center 100, to protect
It demonstrate,proves the firmness of electronic equipment 200 and display screen 300 is avoided to be damaged because falling.
It is the optional embodiment of the application above, it is noted that for those skilled in the art,
Under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also considered as this Shen
Protection domain please.
Claims (18)
1. a kind of center production method, which is characterized in that including：
Frame is made, the inside of the frame is equipped with mounting hole；
The periphery of plate in making, the middle plate has riveting column；
Splice the frame and the middle plate, so that the riveting column stretches into the mounting hole；And
Pin column is caught between the riveting column and the hole wall of the mounting hole, so that the riveting column and the mounting hole
Hole wall is interference fitted.
2. center production method according to claim 1, which is characterized in that the making frame includes：
Interconnecting piece is milled out on the inside of frame blank material；
Mounting hole is milled out on the interconnecting piece；And
Appearance is milled out on the outside of the frame blank material, to form the frame.
3. center production method according to claim 1, which is characterized in that plate includes in the making：
Die casting goes out the riveting column in the plate face of the middle slab material.
4. center production method according to claim 3, which is characterized in that the riveting column includes far from the middle plate
Top end face and around the top end face setting all sides, go out the riveting in the die casting in the plate face of the middle slab material
After column, plate further includes in the making：
Groove is cut out in the side facing cut of the riveting column, the groove runs through the top end face, the cell wall of the groove and institute
State pin column interference fit.
5. center production method according to claim 3, which is characterized in that described in the plate face of the middle slab material
Die casting goes out after the riveting column, and plate further includes in the making：
Hook portion is milled out in the end far from the middle plate of the riveting column, the hook portion sets the remote of the interconnecting piece for hook
Surface from the middle plate.
6. center production method according to claim 3, which is characterized in that described in the plate face of the middle slab material
Die casting goes out after the riveting column, and plate further includes in the making：
Process location hole in the plate face of the middle plate, the location hole is set to the periphery of the riveting column, the location hole with
The pin column interference fit.
7. center production method according to any one of claims 1 to 6, which is characterized in that the interconnecting piece includes opposite
The top and bottom of setting, the top are used to support the middle plate, the splicing frame and the middle plate, including：
The riveting column is stretched into the mounting hole along first direction, the first direction be the interconnecting piece the top to
The direction of the bottom.
8. center production method according to claim 7, which is characterized in that it is described by pin column be caught in the riveting column with
Include between the hole wall of the mounting hole：
The pin column is caught in the mounting hole in a second direction, the second direction be the interconnecting piece the bottom to
The direction at the top.
9. center production method according to any one of claims 1 to 6, which is characterized in that be caught in pin column described
After between the riveting column and the hole wall of the mounting hole, the center production method further includes：
Non-signal shielding material is filled in gap between the frame and the middle plate.
10. a kind of center, which is characterized in that the center is made by claim 1 to 9 any one of them center production method
At.
11. a kind of center, which is characterized in that including frame, middle plate and pin column, the inside of the frame is equipped with mounting hole, institute
There is the periphery for stating middle plate riveting column, the riveting column to be set in the mounting hole, and the pin column is connected in the riveting column
Between the hole wall of the mounting hole, so that the hole wall of the riveting column and the mounting hole is interference fitted.
12. center according to claim 11, which is characterized in that the scuncheon is equipped with interconnecting piece, the mounting hole
Set on the interconnecting piece, the interconnecting piece is for carrying the middle plate.
13. center according to claim 12, which is characterized in that the middle plate includes the first face and second being disposed opposite to each other
Face, part first face are bonded with the surface of the interconnecting piece, and the outer diameter of the riveting column gradually successively decreases along third direction, institute
State the described second direction towards first face that third direction is the middle plate.
14. center according to claim 12, which is characterized in that the riveting column includes the top end face far from the middle plate
And around all sides of top end face setting, the week side is equipped with groove, and the groove runs through the top end face, described recessed
The cell wall of slot is interference fitted with the pin column.
15. center according to claim 12, which is characterized in that the riveting column includes described in fixed part and bending connection
The hook portion of fixed part, the fixed part are contained in the mounting hole, and the hook portion is set to the company through the mounting hole and hook
The surface far from the middle plate of socket part.
16. according to claim 11 to 15 any one of them center, which is characterized in that the riveting column has first to support
There is the second supporting surface, first supporting surface to be bonded to each other with second supporting surface for face, the pin column, and described first supports
The shape for holding face is adapted with the shape of second supporting surface.
17. according to claim 11 to 15 any one of them center, which is characterized in that the frame includes dismountable first
Frame, the second frame, third frame and the 4th frame, first frame, second frame, the third frame and described
4th frame is arranged along the periphery of the middle plate, has gap, the gap net to form antenna between two neighboring frame
Empty region.
18. a kind of electronic equipment, which is characterized in that the electronic equipment includes claim 10 to 17 any one of them center
And display screen, the display screen are installed on the center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697709.XA CN108718352A (en) | 2018-06-29 | 2018-06-29 | Center production method, center and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697709.XA CN108718352A (en) | 2018-06-29 | 2018-06-29 | Center production method, center and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108718352A true CN108718352A (en) | 2018-10-30 |
Family
ID=63912276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810697709.XA Pending CN108718352A (en) | 2018-06-29 | 2018-06-29 | Center production method, center and electronic equipment |
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| Country | Link |
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| CN (1) | CN108718352A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110732839A (en) * | 2019-09-29 | 2020-01-31 | 广东长盈精密技术有限公司 | Middle frame processing method, middle frame and electronic equipment |
| CN113726927A (en) * | 2021-08-11 | 2021-11-30 | 荣耀终端有限公司 | Middle frame, terminal equipment and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106862399A (en) * | 2016-12-28 | 2017-06-20 | 深圳天珑无线科技有限公司 | The manufacture method and its component of mobile terminal metal center |
| KR20170114888A (en) * | 2016-04-04 | 2017-10-16 | 주식회사 아이피빌리지 | Method of manufacturing metal frame for middle frame of electronic device and metal frame for middle frame of electronic device |
| CN108188287A (en) * | 2018-02-05 | 2018-06-22 | 广东欧珀移动通信有限公司 | Center component, center module processing method and electronic device |
-
2018
- 2018-06-29 CN CN201810697709.XA patent/CN108718352A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170114888A (en) * | 2016-04-04 | 2017-10-16 | 주식회사 아이피빌리지 | Method of manufacturing metal frame for middle frame of electronic device and metal frame for middle frame of electronic device |
| CN106862399A (en) * | 2016-12-28 | 2017-06-20 | 深圳天珑无线科技有限公司 | The manufacture method and its component of mobile terminal metal center |
| CN108188287A (en) * | 2018-02-05 | 2018-06-22 | 广东欧珀移动通信有限公司 | Center component, center module processing method and electronic device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110732839A (en) * | 2019-09-29 | 2020-01-31 | 广东长盈精密技术有限公司 | Middle frame processing method, middle frame and electronic equipment |
| CN113726927A (en) * | 2021-08-11 | 2021-11-30 | 荣耀终端有限公司 | Middle frame, terminal equipment and manufacturing method thereof |
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