CN108694002B - Manufacturing method of flexible capacitive touch screen - Google Patents
Manufacturing method of flexible capacitive touch screen Download PDFInfo
- Publication number
- CN108694002B CN108694002B CN201810329007.6A CN201810329007A CN108694002B CN 108694002 B CN108694002 B CN 108694002B CN 201810329007 A CN201810329007 A CN 201810329007A CN 108694002 B CN108694002 B CN 108694002B
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- polyimide film
- carrier plate
- touch screen
- capacitive touch
- manufacturing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
A manufacturing method of a flexible capacitive touch screen comprises the steps of arranging an adhesive layer on the inner side surface of a polyimide film or the outer side surface of a carrier plate, pasting the polyimide film on the carrier plate, applying an air curtain during pasting, manufacturing a touch circuit layer of the capacitive touch screen on the polyimide film, peeling the polyimide film from the carrier plate and the like. The polyimide film formed into the film material by polymerization is pasted on the carrier plate to manufacture the touch circuit layer, so that the thickness of the capacitive touch screen can be made larger, and the subsequent processing is facilitated; the stripping is easily realized by controlling the adhesive force of the adhesive layer, and the molecular chain at the adhesive interface is not required to be broken by laser, so that the manufacturing cost is reduced; when pasting the polyimide film, exert a decurrent air curtain at the lateral surface of polyimide film, under the soft, even pressure effect of air curtain, the polyimide film can flatly develop and attached on the support plate, avoids the polyimide film to corrugate, provides basis and assurance for the good touch-control circuit layer of follow-up preparation.
Description
Technical Field
The invention relates to a manufacturing method of a touch screen, in particular to a manufacturing method of a flexible capacitive touch screen.
Background
The flexible capacitive touch screen is a capacitive touch screen which is manufactured by manufacturing a touch sensing circuit on a flexible substrate, in particular a flexible plastic substrate, and can be attached to a curved supporting surface to form a curved touch terminal or be matched with a flexible display screen to form a flexible curved touch display.
In recent years, a flexible capacitive touch screen is manufactured by taking advantage of a process method for manufacturing a display device (such as an OLED) on a polyimide film, and the method generally comprises the following steps:
coating a polyamic acid solution on the outer side surface of a carrier plate, and polymerizing to obtain a polyimide film;
step two, manufacturing a touch sensing circuit of the capacitive touch screen on the polyimide film;
and step three, peeling the polyimide film from the support plate to obtain the flexible capacitive touch screen based on the polyimide film.
In the first step of the above process, the thickness of the liquid film after the polyamic acid solution is coated is generally within 100 μm, and the thickness of the polyimide film formed after the solvent evaporation and polymerization is generally only within 10 μm, so the tensile strength of the film layer is very low, and the polyimide film is directly adhered to the carrier plate, and the adhesion force thereof is difficult to control. However, the laser method needs to use a very expensive ultraviolet laser device, and the carrier plate needs to use a very expensive quartz glass (with high ultraviolet transmittance), so that the method for manufacturing the flexible touch screen has a very high investment threshold, which is not favorable for the popularization of the flexible capacitive touch screen.
In addition, since the above method can only form a flexible capacitive touch screen with a thickness of 10 μm or less, the too thin substrate thickness makes the touch screen difficult to operate in subsequent processing (e.g. handling and fixing are difficult).
Disclosure of Invention
The invention aims to provide a manufacturing method of a flexible capacitive touch screen, which does not need laser stripping, reduces the manufacturing cost, can manufacture the thickness of the flexible capacitive touch screen to be larger and is convenient for subsequent processing. The technical scheme is as follows:
a manufacturing method of a flexible capacitive touch screen is characterized by comprising the following steps:
performing corona treatment on the inner side surface of the polyimide film or the outer side surface of the carrier plate, and then arranging an adhesive layer on the inner side surface of the polyimide film or the outer side surface of the carrier plate;
step (2), the polyimide film is pasted on the carrier plate through the glue layer, when the polyimide film is pasted, a downward air curtain is applied to the outer side surface of the polyimide film, and the width of the air curtain is larger than that of the polyimide film;
step (3), manufacturing a touch circuit layer of the capacitive touch screen on the polyimide film;
and (4) peeling the polyimide film from the carrier plate to obtain the polyimide film-based capacitive touch screen.
As a preferable aspect of the present invention, when the glue layer is disposed on the inner side surface of the polyimide film, in the step (1), a low-adhesion layer is further disposed on the carrier, and an adhesion force of the low-adhesion layer is smaller than that of the glue layer. By providing a low-adhesion layer on the carrier plate, the polyimide film can be more easily peeled off from the carrier plate in step (4), and the low-adhesion layer can be a fluorine-containing or silicon-containing polymer film layer coated or plated on the carrier plate.
In a preferred embodiment of the present invention, the polyimide film is mechanically peeled off, and the carrier is heated during the peeling process. If the carrier plate is placed on the heating table, the carrier plate is heated to 60-200 ℃, so that the adhesive force of the adhesive layer can be reduced (the mechanical property of the polyimide film is generally not changed greatly in the temperature range), the polyimide film can be more easily peeled, and the tensile force applied to the polyimide film is reduced to be smaller, so that the manufactured touch control circuit layer is prevented from being damaged in the peeling process.
Compared with the prior art, the invention has the following advantages:
the polyimide film formed into the film material by polymerization is pasted on the carrier plate to manufacture the touch circuit layer, so that the polyimide film with larger thickness can be selected, the thickness of the capacitive touch screen can be made larger, and the subsequent processing is convenient; the binding force between the polyimide film and the carrier plate depends on the adhesive force of the adhesive layer, and the peeling is easily realized by controlling the adhesive force of the adhesive layer, and a molecular chain at an adhesive interface is not required to be broken by laser, so that the manufacturing cost is reduced; before the adhesive layer is arranged, the inner side surface of the polyimide film or the outer side surface of the carrier plate is subjected to corona treatment, and the bonding force between the adhesive layer and the contact surface (the inner side surface of the polyimide film or the outer side surface of the carrier plate) is enhanced in a one-way mode, so that the adhesive layer is prevented from being transferred in the stripping process in the step (4), for example, the adhesive layer is transferred from the polyimide film to the carrier plate or from the carrier plate to the polyimide film; when the polyimide film is pasted, a downward air curtain is applied to the outer side surface of the polyimide film, the polyimide film can be flatly unfolded and attached to the support plate under the soft and uniform pressure action of the air curtain, air between the polyimide film and the support plate is squeezed, wrinkling of the polyimide film is avoided, and a foundation and guarantee are provided for a good touch circuit layer to be manufactured subsequently; further, when the glue layer is arranged on the inner side surface of the polyimide film, in the step (1), the low-viscosity layer is also arranged on the carrier plate, so that the polyimide film is easier to peel off from the carrier plate; furthermore, the carrier plate is heated in the stripping process, so that the adhesive force of the adhesive layer can be reduced, the polyimide film can be more easily stripped, and simultaneously, the stretching force applied to the polyimide film is reduced to be smaller, so that the manufactured touch circuit layer is prevented from being damaged in the stripping process.
Drawings
Fig. 1 is a schematic structural diagram of a first preferred embodiment of the present invention.
Detailed Description
The following further describes the preferred embodiments of the present invention with reference to the accompanying drawings.
Example one
As shown in fig. 1, the method for manufacturing the flexible capacitive touch screen includes the following steps:
step (1), as shown in figure 1-a, performing corona treatment on the inner side surface of a polyimide film 1, and then arranging an adhesive layer 2 on the inner side surface of the polyimide film 1;
step (2), as shown in fig. 1-b, the polyimide film 1 is pasted on the carrier plate 3 through the glue layer 2, when the polyimide film 1 is pasted, a downward air curtain is applied to the outer side surface of the polyimide film 1, and the width of the air curtain is greater than that of the polyimide film 1;
step (3), as shown in fig. 1-c, a touch circuit layer 4 of the capacitive touch screen is manufactured on the polyimide film 1;
and (4) peeling the polyimide film 1 from the carrier plate 3 in a mechanical mode, and heating the carrier plate 3 in the peeling process to obtain the capacitive touch screen based on the polyimide film 1, as shown in the figure 1-d.
The thickness of the polyimide film 1, i.e., a polyimide film previously formed into a film material by polymerization, particularly a colorless polyimide film (1 polyimide film having a yellowness index of less than 20), is preferably 10 to 200 μm (the thickness can be achieved by a process such as casting in a film manufacturing plant).
The carrier plate 3 can be a metal plate or a glass plate resistant to acid and alkali corrosion, preferably, the carrier plate 3 is a glass substrate, and the glass substrate can be well adapted to a manufacturing line of an existing capacitive touch screen (i.e., a capacitive touch screen based on the glass substrate); since the polyimide film 1 may be thick, the carrier 3 is preferably a glass substrate having a large thickness, for example, 1.0 to 2.5mm, in order to reduce deformation of the polyimide film 1 caused by shrinkage at a high temperature.
The adhesive layer 2 may preferably be a high temperature resistant silicone pressure sensitive adhesive, and in step (1), the adhesive layer 2 may be disposed on the inner side of the polyimide film 1 by coating or spraying.
The touch circuit layer 4 generally includes a plurality of transparent sensing electrodes and a peripheral circuit for connecting the sensing electrodes, the sensing electrodes may be two-dimensionally arranged block electrodes or strip electrodes intersecting with each other to form a matrix, and the sensing electrodes may be made of transparent conductive materials, such as transparent conductive oxide films of Indium Tin Oxide (ITO), zinc aluminum oxide (AZO), or metal or nano silver conductive grids, or nano silver wires, carbon nanotubes, graphene coatings, or transparent conductive polymer materials, such as PEDOT and modifications thereof. The peripheral circuit generally includes a lead, an external terminal, and the like, which can connect the sensing electrode, and the lead, the external terminal, and the like can be formed by patterning a metal film layer, such as a copper film, a silver film, or a three-layer alloy film of mo-nb-al-nd-mo-nb, or can be formed by using a conductive material such as silver paste. When the touch circuit layer is fabricated in step (3), the transparent conductive oxide film layer and the metal film layer may be fabricated by a vacuum coating method, particularly a magnetron sputtering method, and patterned by photolithography, and the film layers such as silver nanowires, carbon nanotubes, graphene coatings, and transparent conductive polymers are more likely to be fabricated by printing or coating (e.g., flat coating or spin coating), and the patterning may be implemented by photolithography, development, printing, and other methods in combination with specific materials.
Generally, in the manufacturing process of the touch control circuit layer 4, the polyimide film 1 and the adhesive layer 2 often need to undergo processes such as high-temperature baking (within 300 ℃), vacuum, soaking in acid-base solution and organic solvent, and ultraviolet irradiation, and the polyimide film 1 can generally better withstand the harsh conditions of the processes, and when the adhesive layer 2 is preferably a high-temperature-resistant silicone pressure-sensitive adhesive, the adhesive layer 2 can also be better prevented from being damaged by the processes.
Example two
In the case that the other parts are the same as the first embodiment, the difference is only that: a low-viscosity layer is also arranged on the carrier plate 3, and the adhesive force of the low-viscosity layer is smaller than that of the adhesive layer 2.
EXAMPLE III
In the case that the other parts are the same as the first embodiment, the difference is only that: in the step (1), the outer side surface of the carrier plate 3 is subjected to corona treatment, and then the outer side surface of the carrier plate 3 is provided with the glue layer 2.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and the equivalent or simple change of the structure, the characteristics and the principle described in the present patent idea is included in the protection scope of the present patent. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (3)
1. A manufacturing method of a flexible capacitive touch screen is characterized by comprising the following steps:
performing corona treatment on the inner side surface of the polyimide film or the outer side surface of the carrier plate, and then arranging an adhesive layer on the inner side surface of the polyimide film or the outer side surface of the carrier plate;
step (2), the polyimide film is pasted on the carrier plate through the glue layer, when the polyimide film is pasted, a downward air curtain is applied to the outer side surface of the polyimide film, and the width of the air curtain is larger than that of the polyimide film;
step (3), manufacturing a touch circuit layer of the capacitive touch screen on the polyimide film;
and (4) peeling the polyimide film from the carrier plate to obtain the polyimide film-based capacitive touch screen.
2. The method of manufacturing a flexible capacitive touch screen according to claim 1, wherein: when the glue layer is arranged on the inner side surface of the polyimide film, in the step (1), a low-viscosity layer is further arranged on the carrier plate, and the adhesive force of the low-viscosity layer is smaller than that of the glue layer.
3. The method of manufacturing a flexible capacitive touch screen according to claim 1, wherein: the polyimide film is peeled off in a mechanical mode, and the carrier plate is heated in the peeling process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810329007.6A CN108694002B (en) | 2018-04-13 | 2018-04-13 | Manufacturing method of flexible capacitive touch screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810329007.6A CN108694002B (en) | 2018-04-13 | 2018-04-13 | Manufacturing method of flexible capacitive touch screen |
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| Publication Number | Publication Date |
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| CN108694002A CN108694002A (en) | 2018-10-23 |
| CN108694002B true CN108694002B (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810329007.6A Active CN108694002B (en) | 2018-04-13 | 2018-04-13 | Manufacturing method of flexible capacitive touch screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114213658B (en) * | 2022-02-21 | 2022-05-03 | 汕头超声显示器技术有限公司 | Polyimide film and manufacturing method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2228199Y (en) * | 1995-06-23 | 1996-05-29 | 李东 | Air-screen cooking fume remover |
| CN101226450A (en) * | 2007-01-18 | 2008-07-23 | 日东电工株式会社 | Transparent conductive film, method for production thereof and touch panel therewith |
| CN102099203A (en) * | 2008-09-30 | 2011-06-15 | 日本写真印刷株式会社 | Decorative material, method for producing decorative material, and molded article |
| CN103870086A (en) * | 2014-03-12 | 2014-06-18 | 汕头超声显示器技术有限公司 | Manufacturing method of capacitive touch screen |
| CN104063107A (en) * | 2014-06-30 | 2014-09-24 | 汕头超声显示器技术有限公司 | Manufacturing method of touch circuit layer based on plastic film |
| CN206541282U (en) * | 2017-02-07 | 2017-10-03 | 信利（惠州）智能显示有限公司 | A kind of flexible AMOLED touch displays |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI432838B (en) * | 2011-02-25 | 2014-04-01 | Innolux Corp | Display and method for manufacturing the same |
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- 2018-04-13 CN CN201810329007.6A patent/CN108694002B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2228199Y (en) * | 1995-06-23 | 1996-05-29 | 李东 | Air-screen cooking fume remover |
| CN101226450A (en) * | 2007-01-18 | 2008-07-23 | 日东电工株式会社 | Transparent conductive film, method for production thereof and touch panel therewith |
| CN102099203A (en) * | 2008-09-30 | 2011-06-15 | 日本写真印刷株式会社 | Decorative material, method for producing decorative material, and molded article |
| CN103870086A (en) * | 2014-03-12 | 2014-06-18 | 汕头超声显示器技术有限公司 | Manufacturing method of capacitive touch screen |
| CN104063107A (en) * | 2014-06-30 | 2014-09-24 | 汕头超声显示器技术有限公司 | Manufacturing method of touch circuit layer based on plastic film |
| CN206541282U (en) * | 2017-02-07 | 2017-10-03 | 信利（惠州）智能显示有限公司 | A kind of flexible AMOLED touch displays |
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| CN108694002A (en) | 2018-10-23 |
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