Disclosure of Invention
The invention provides a dustproof network security device capable of improving heat dissipation performance, aiming at the problems in the related art, so as to overcome the technical problems in the prior related art.
The technical scheme of the invention is realized as follows:
a dustproof network security device capable of improving heat dissipation performance comprises a shell, a main board is arranged in the middle of the interior of the shell, a processor is arranged in the middle of the main board, a first heat dissipation fin is arranged on the main board, a data storage module, a data backup module and a data encryption module are sequentially arranged on one side of the main board, a second heat dissipation fin is sequentially arranged on the data storage module, the data backup module and the data encryption module respectively, a security evaluation module, an anti-virus module and an intrusion detection module are sequentially arranged on the other side of the main board, a third heat dissipation fin is sequentially arranged on the security evaluation module, the anti-virus module and the intrusion detection module respectively, a fourth heat dissipation fin connected with the first heat dissipation fin, the second heat dissipation fin and the third heat dissipation fin is arranged at one end of the main board, the other end of the mainboard is provided with a first radiating fin connected with the first radiating fin, a second radiating fin and a fifth radiating fin connected with the third radiating fin, one end of the shell is provided with a first protective cover, two ends in the first protective cover are respectively provided with a first radiating fan, the first protective cover is internally provided with a first radiating plate connected with the fourth radiating fin, the first radiating plate is provided with a plurality of first radiating fins, the other end of the shell is provided with a second protective cover, two ends in the second protective cover are respectively provided with a second radiating fan, the second protective cover is internally provided with a second radiating plate connected with the fifth radiating fin, the second radiating plate is provided with a plurality of second radiating fins, one side of the shell is provided with a panel, the panel is provided with a switch, an indicator light and a plurality of data communication interfaces, and the data communication interfaces comprise VGA, and a shell cover is arranged at the top end of the shell.
Furthermore, a first sealing ring is arranged at the joint of the first heat dissipation plate and the four heat dissipation plates, which are located on one side of the shell.
Furthermore, a sealing ring II is arranged at the joint of the second heat dissipation plate and the fifth heat dissipation plate, which is positioned at the other side of the shell.
Furthermore, the VGA interface, the RJ interface and the joint of the USB interface and the shell are provided with a first sealing gasket.
Furthermore, a second sealing gasket is arranged at the joint of the shell cover and the shell.
Furthermore, a honeycomb alarm is arranged on the panel.
Furthermore, a temperature sensor is arranged on the main board.
Furthermore, a plurality of round holes are formed in the first protective cover and the second protective cover respectively.
The invention has the beneficial effects that: through setting up fin one, thereby can be for mainboard and treater heat dissipation, through setting up fin two, thereby can be for the data storage module, data backup module and data encryption module heat dissipation, through setting up fin three, thereby can be for the safety assessment module, antivirus module and invasion detection module heat dissipation, through setting up fin four and fin five, thereby can be with heat transfer to on heating panel one and the heating panel two, through setting up fin one, fin two, fan one and fan two, thereby more do benefit to the heat dissipation, and then play good radiating effect to equipment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
According to the embodiment of the invention, the dustproof network security equipment capable of improving the heat dissipation performance is provided.
As shown in fig. 1-3, the dustproof network security device capable of improving heat dissipation according to the embodiment of the present invention includes a housing 1, a main board 2 is disposed at a middle position inside the housing 1, a processor 3 is disposed at a middle position on the main board 2, a first heat sink 4 is disposed on the main board 2, a data storage module 5, a data backup module 6 and a data encryption module 7 are sequentially disposed on one side of the main board 2, a second heat sink 8 is sequentially disposed on the data storage module 5, the data backup module 6 and the data encryption module 7, a security evaluation module 9, an anti-virus module 10 and an intrusion detection module 11 are sequentially disposed on the other side of the main board 2, a third heat sink 12 is sequentially disposed on the security evaluation module 9, the anti-virus module 10 and the intrusion detection module 11, one end of the mainboard 2 is provided with a fourth heat sink 13 connected with the first heat sink 4, the second heat sink 8 and the third heat sink 12, the other end of the mainboard 2 is provided with a fifth heat sink 14 connected with the first heat sink 4, the second heat sink 8 and the third heat sink 12, one end of the shell 1 is provided with a first protective cover 15, two ends in the first protective cover 15 are respectively provided with a first heat dissipation fan 16, a first heat dissipation plate 17 connected with the fourth heat sink 13 is arranged in the first protective cover 15, the first heat dissipation plate 17 is provided with a plurality of first heat dissipation fins 18, the other end of the shell 1 is provided with a second protective cover 19, two ends in the second protective cover 19 are respectively provided with a second heat dissipation fan 20, a second heat dissipation plate 21 connected with the fifth heat sink 14 is arranged in the second protective cover 19, and a plurality of second heat dissipation fins 22 are arranged on, one side of casing 1 is provided with panel 23, be equipped with switch 24, pilot lamp 25 and a plurality of data communication interface on the panel 23, data communication interface include VGA interface 26, RJ45 interface 27 and USB interface 28, the top of casing 1 is provided with cap 29.
By means of the above technical scheme, through setting up fin one 4, thereby can dispel the heat for mainboard 2 and treater 3, through setting up fin two 8, thereby can be for data storage module 5, the heat dissipation of data backup module 6 and data encryption module 7, through setting up fin three 12, thereby can be for safety assessment module 9, antivirus module 10 and intrusion detection module 11 dispel the heat, through setting up fin four 13 and fin five 14, thereby can be with heat transfer to on heat dissipation plate one 17 and the heat dissipation plate two 21, through setting up fin one 18, fin two 22, radiator fan one 16 and radiator fan two 20, thereby more do benefit to the heat dissipation, and then play good radiating effect to equipment.
In one embodiment, for the above-mentioned heat dissipation plate 17, heat dissipation plate four 13 and housing 1, a sealing ring 30 is disposed at the connection position of the heat dissipation plate 17 and the heat dissipation plate four 13 on the side of the housing 1, so as to prevent dust from entering the housing 1. In addition, the first seal ring 30 may be a rubber seal ring.
In one embodiment, for the second heat dissipation plate 21, the fifth heat dissipation plate 14 and the housing 1, a second sealing ring 31 is disposed at a connection position of the second heat dissipation plate 21 and the fifth heat dissipation plate 14 on the other side of the housing 1, so as to prevent dust from entering the housing 1. In addition, in a specific application, the second seal ring 31 may be a rubber seal ring.
In one embodiment, for the VGA interface 26, the RJ45 interface 27, the USB interface 28 and the housing 1, a first sealing pad 32 is disposed at the connection between the VGA interface 26, the RJ45 interface 27 and the USB interface 28 and the housing 1, so as to prevent dust from entering the housing 1. In addition, in a specific application, the first seal 32 may be a rubber seal.
In one embodiment, for the case cover 29 and the case 1, a second sealing pad 33 is disposed at the joint of the case cover 29 and the case 1, so as to prevent dust from entering the case 1. In addition, in a specific application, the second gasket 33 may be a rubber gasket.
In one embodiment, the panel 23 is provided with a cellular alarm 34, so that the panel 23 can give an alarm in time when the network is attacked.
In an embodiment, for the motherboard 2, the temperature sensor 35 is disposed on the motherboard 2, so that the temperature of the motherboard 2 can be monitored in real time, and damage to the motherboard 2 due to an excessively high temperature can be prevented.
In an embodiment, for the first protection cover 15 and the second protection cover 19, a plurality of circular holes 36 are respectively formed on the first protection cover 15 and the second protection cover 19, so as to facilitate heat dissipation of the apparatus. In addition, the first protection cover 15 and the second protection cover 19 may be detachably disposed.
The working principle is as follows: when the intelligent anti-virus system is used, heat generated by the mainboard 2 and the processor 3 is transmitted to the first radiating fin 4, heat generated by the data storage module 5, the data backup module 6 and the data encryption module 7 is transmitted to the second radiating fin 8, heat generated by the safety evaluation module 9, the anti-virus module 10 and the intrusion detection module 11 is transmitted to the third radiating fin 12, then heat on the first radiating fin 4, the second radiating fin 8 and the third radiating fin 12 is transmitted to the first radiating fin 17 and the second radiating fin 21 through the fourth radiating fin 13 and the fifth radiating fin 14, heat is further transmitted to the first radiating fin 18 and the second radiating fin 22, and then heat on the first radiating fin 18 and the second radiating fin 22 is discharged through rotation of the first radiating fan 16 and the second radiating fan 20.
In summary, according to the technical solution of the present invention, by setting the first heat sink 4, heat can be dissipated from the motherboard 2 and the processor 3, by setting the second heat sink 8, heat can be dissipated from the data storage module 5, the data backup module 6, and the data encryption module 7, by setting the third heat sink 12, heat can be dissipated from the security evaluation module 9, the anti-virus module 10, and the intrusion detection module 11, by setting the fourth heat sink 13 and the fifth heat sink 14, heat can be transferred to the first heat sink 17 and the second heat sink 21, and by setting the first heat sink 18, the second heat sink 22, the first heat sink fan 16, and the second heat sink fan 20, heat dissipation is facilitated, and a good heat dissipation effect can be achieved for the device.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.