CN108677021A - A method of recycling fine copper from useless circuit board - Google Patents
A method of recycling fine copper from useless circuit board Download PDFInfo
- Publication number
- CN108677021A CN108677021A CN201810667242.4A CN201810667242A CN108677021A CN 108677021 A CN108677021 A CN 108677021A CN 201810667242 A CN201810667242 A CN 201810667242A CN 108677021 A CN108677021 A CN 108677021A
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- Prior art keywords
- copper
- circuit board
- useless circuit
- fine copper
- segregation body
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
A method of from useless circuit board recycle fine copper, including from useless circuit board FLOTATION SEPARATION copper segregation body, by electrodeposition process from copper segregation body extract two steps of fine copper：FLOTATION SEPARATION copper segregation body is that useless circuit board is crushed to 0.3mm or less from useless circuit board, broken particle flotation detaches nonmetallic and metal, the metal concentrate that FLOTATION SEPARATION obtains is milled to 0.074mm and following rear progress vulcanizing treatment, then the FLOTATION SEPARATION copper segregation body from the metal concentrate after vulcanization；It is the H-type electrolytic cell separated using amberplex to extract fine copper from copper segregation body by electrodeposition process, and the copper segregation body that flotation is obtained is in anode used for electroplating bag as deposition raw material, and recycling obtains fine copper from cathode plate after a certain period of time for electrolysis.
Description
Technical field
The present invention relates to recycling of WEEE fields, and in particular to the technology of fine copper is recycled in useless circuit board.
Background technology
Electronic product（Such as mobile phone, computer）Update speed constantly accelerate, if useless circuit board is without secondary
It utilizes, not only causes the great wasting of resources, but also deal with improperly and can also cause great threat to environment for human survival.Useless circuit
Contain a large amount of metal and nonmetallic materials in plate, certain materials have great harmfulness, not only right such as fire retardant bromo element
Environment and to health also great threat, the heavy metal substance in useless circuit board can be to the body of people after entering soil water body
Body health generates significant threat.But useless circuit board is excellent available resources again simultaneously, metal in the element of built-up circuit plate
Content may be up to 49%, and wherein copper accounts for the overwhelming majority.And existing copper ore resource in the world, according to current consumption, standing crop can
It it is only 26 years for mining time, if so the imbalance between supply and demand of mineral resources is by delaying the recycling of electronic waste
Solution can generate important meaning to developing a circular economy.
Fine copper is also known as red copper, and copper content is 99.5 ~ 99.95%, major impurity member be known as phosphorus, bismuth, antimony, arsenic, iron, nickel, lead,
Tin, sulphur, zinc, oxygen etc..The conductivity and thermal conductivity of red copper are only second to silver, are widely used in and manufacture conductive equipment, advanced copper alloy, copper
Based alloy, market demand are huge.
In view of the finiteness of the resource of useless circuit board, harmfulness, vast number and Global Mineral, a kind of environment
Close friend is of great significance suitable for commercial Application, by the fine copper recovery process of raw material of useless circuit board.
Invention content
The purpose of the present invention is to provide a kind of methods that fine copper is recycled in useless circuit board.
The present invention is a kind of process integration recycling fine copper from useless circuit board, and step is：The flotation from useless circuit board
It detaches copper segregation body, fine copper is extracted from copper segregation body by electrodeposition process, the specific steps are：
（1）The FLOTATION SEPARATION copper segregation body from useless circuit board：It is 0.3mm and hereinafter, after broken that useless circuit board, which is crushed to grain size,
Particle flotation detach nonmetallic and metal, the metal concentrate that FLOTATION SEPARATION obtains is milled to 0.074mm and following laggard
Row vulcanizing treatment, then the FLOTATION SEPARATION copper segregation body from the metal concentrate after vulcanization, this step can obtain copper content and be
92% or more copper segregation body；
（2）By electrodeposition process fine copper is extracted from copper segregation body：The H-type electrolytic cell separated using amberplex, flotation is obtained
To copper segregation body as deposition raw material be in anode to be sleeved on anode plate and is placed in anode in the anode used for electroplating bag
Then area connects DC power supply, purity can be obtained and be by being electrolysed after 10-20min recycling deposition copper, this step from cathode plate
99.5% or more fine copper.
The beneficial effects of the invention are as follows：Useless circuit board can be efficiently obtained the higher copper of grade after floatation separation is broken
Be enriched with body, then can be reduced using these copper segregation bodies as electro-deposition raw material other metals be electrolysed in electro-deposition it is several
Rate ensures that recycling obtains the copper of high-purity, and this combined recovery process efficiency is high, low energy consumption, environmental pollution is small.
Description of the drawings
Fig. 1 be the present invention useless circuit board in recycling fine copper process integration flow chart.
Specific implementation mode
As shown in Figure 1, the present invention is a kind of method recycling fine copper from useless circuit board, step is divided into from useless circuit board
FLOTATION SEPARATION copper segregation body extracts fine copper by electrodeposition process from copper segregation body；Its specific steps are：
（1）Copper in floating and enriching useless circuit board：It is 0.3mm and hereinafter, broken particle that useless circuit board, which is crushed to grain size,
FLOTATION SEPARATION is nonmetallic and metal, by the metal concentrate that FLOTATION SEPARATION obtains be milled to 0.074mm and it is following after vulcanize
Processing, the then FLOTATION SEPARATION copper segregation body from the metal concentrate after vulcanization, this step can obtain copper purity be 92% and with
On copper segregation body；
（2）Electrodeposition process detaches copper from copper segregation body：The H-type electrolytic cell separated using amberplex, flotation is obtained
Copper segregation body is in that anode is sleeved on anode plate and is placed in anode region, so in anode used for electroplating bag as deposition raw material
After connect DC power supply, be electrolysed after 10-20min the recycling deposition copper from cathode plate, this step can obtain purity be 99.5% and
Above fine copper.
The method that fine copper is recycled in above-described useless circuit board, the FLOTATION SEPARATION copper segregation body from useless circuit board
In step, vulcanizing treatment technique is by the metal concentrate after ball milling according to liquid-solid ratio 1:1 is modulated to ore pulp, according to metal enrichment
Weight is 1 with vulcanizing agent mass ratio:0.5-1:0.3 addition vulcanizing agent vulcanizes 2- in the case where temperature is 150 DEG C of -200 DEG C of environment
3 hours.
The method that fine copper is recycled in above-described useless circuit board, the FLOTATION SEPARATION copper segregation body from useless circuit board
In step, the floatation process parameter of FLOTATION SEPARATION copper segregation body is mixing speed 1600rpm- in the metal concentrate after vulcanization
1700rpm, aeration quantity 100L/h, pulp density 100g/L.
The method that fine copper is recycled in above-described useless circuit board, it is described that fine copper is extracted from copper segregation body by electrodeposition process
The step of in, anode plate material is that titanium applies iridium electrode, and cathode plate is fine copper plate, a kind of in stainless steel plate, supply voltage 5-
10V, the ratio between electrolyte dosage and powder dosage are 40ml:0.5g-40ml:3g.
The method that fine copper is recycled in above-described useless circuit board, it is described that fine copper is extracted from copper segregation body by electrodeposition process
The step of in, anode region electrolyte select and proportioning is：20% dense H2SO4, 10% H2O2, 50g/L CuSO4·5H2O、
70% distilled water；Cathodic region electrolyte is selected and proportioning is：The dense H of 150g/L2SO4, 100g/L CuSO4·5H2O, 100%
Distilled water.
The present invention is further elaborated with reference to the accompanying drawings and examples, but protection scope of the present invention is not limited to reality
Apply example.
Embodiment 1：
Useless circuit board is crushed to grain size as 0.3mm and hereinafter, broken particle flotation detaches nonmetallic and metal, by flotation
Isolated metal concentrate is milled to 0.074mm and hereinafter, is according to metal enrichment weight and vulcanizing agent mass ratio
1:0.5 addition vulcanizing agent vulcanizes 2 hours in the case where temperature is 150 DEG C of environment, then according to mixing speed 1600rpm, aeration quantity
100L/h, pulp density the 100g/L FLOTATION SEPARATION from the metal concentrate after vulcanization obtain copper segregation body；Copper segregation body is made
It is in anode used for electroplating bag for electro-deposition raw material, wherein the ratio between electrolyte dosage and powder dosage are 40ml:0.5g, then
Anode is sleeved on anode plate and is placed in anode region, DC power supply is connected and voltage 10V is provided, cathode plate selects stainless steel plate,
It is electrolysed after 10min the recycling deposition copper from cathode plate, obtains the fine copper that purity is 99.67%.
Embodiment 2：
Useless circuit board is crushed to grain size as 0.3mm and hereinafter, broken particle flotation detaches nonmetallic and metal, by flotation
Isolated metal concentrate is milled to 0.074mm and hereinafter, is according to metal enrichment weight and vulcanizing agent mass ratio
1:0.5 addition vulcanizing agent vulcanizes 2 hours in the case where temperature is 150 DEG C of environment, then according to mixing speed 1650rpm, aeration quantity
100L/h, pulp density the 100g/L FLOTATION SEPARATION from the metal concentrate after vulcanization obtain copper segregation body；Copper segregation body is made
It is in anode used for electroplating bag for electro-deposition raw material, wherein the ratio between electrolyte dosage and powder dosage are 40ml:Then 1g will
Anode, which is sleeved on anode plate, is placed in anode region, connects DC power supply and provides voltage 10V, cathode plate selects fine copper plate, electrolysis
Recycling deposits copper from cathode plate after 10min, obtains the fine copper that purity is 99.81%.
Embodiment 3：
Useless circuit board is crushed to grain size as 0.3mm and hereinafter, broken particle flotation detaches nonmetallic and metal, by flotation
Isolated metal concentrate is milled to 0.074mm and hereinafter, is according to metal enrichment weight and vulcanizing agent mass ratio
1:0.5 addition vulcanizing agent vulcanizes 2 hours in the case where temperature is 150 DEG C of environment, then according to mixing speed 1650rpm, aeration quantity
100L/h, pulp density the 100g/L FLOTATION SEPARATION from the metal concentrate after vulcanization obtain copper segregation body；Copper segregation body is made
It is in anode used for electroplating bag for electro-deposition raw material, wherein the ratio between electrolyte dosage and powder dosage are 40ml:Then 1g will
Anode, which is sleeved on anode plate, is placed in anode region, connects DC power supply and provides voltage 5V, cathode plate selects fine copper plate, electrolysis
Recycling deposits copper from cathode plate after 10min, obtains the fine copper that purity is 99.92%.
Claims (5)
1. a kind of method recycling fine copper from useless circuit board, it is characterised in that：Its step is：The FLOTATION SEPARATION from useless circuit board
Copper segregation body extracts fine copper by electrodeposition process from copper segregation body, the specific steps are：
（1）The FLOTATION SEPARATION copper segregation body from useless circuit board：It is 0.3mm and hereinafter, after broken that useless circuit board, which is crushed to grain size,
Particle flotation detach nonmetallic and metal, the metal concentrate that FLOTATION SEPARATION obtains is milled to 0.074mm and following laggard
Row vulcanizing treatment, then the FLOTATION SEPARATION copper segregation body from the metal concentrate after vulcanization, this step can obtain copper content and be
92% or more copper segregation body；
（2）By electrodeposition process fine copper is extracted from copper segregation body：The H-type electrolytic cell separated using amberplex, flotation is obtained
To copper segregation body as deposition raw material be in anode to be sleeved on anode plate and is placed in anode in the anode used for electroplating bag
Then area connects DC power supply, purity can be obtained and be by being electrolysed after 10-20min recycling deposition copper, this step from cathode plate
99.5% or more fine copper.
2. the method for recycling fine copper in useless circuit board according to claim 1, which is characterized in that described from useless circuit board
In the step of FLOTATION SEPARATION copper segregation body, vulcanizing treatment technique is by the metal concentrate after ball milling according to liquid-solid ratio 1:1 modulation
It is 1 according to metal enrichment weight and vulcanizing agent mass ratio for ore pulp:0.5~1:0.3 addition vulcanizing agent is 150 in temperature
DEG C ~ 200 DEG C of environment under vulcanize 2 ~ 3 hours.
3. the method for recycling fine copper in useless circuit board according to claim 1, which is characterized in that described from useless circuit board
In the step of FLOTATION SEPARATION copper segregation body, the floatation process parameter of FLOTATION SEPARATION copper segregation body is in the metal concentrate after vulcanization
Mixing speed 1600rpm ~ 1700rpm, aeration quantity 100L/h, pulp density 100g/L.
4. the method for recycling fine copper in useless circuit board according to claim 1, which is characterized in that described to pass through electrodeposition process
In the step of extracting fine copper from copper segregation body, anode plate material is that titanium applies iridium electrode, and cathode plate is fine copper plate or stainless steel plate
Middle one kind, supply voltage are 5 ~ 10V, and the ratio between electrolyte dosage and powder dosage are 40ml:0.5g~40ml:3g.
5. the method for recycling fine copper in useless circuit board according to claim 1, which is characterized in that described to pass through electrodeposition process
In the step of extracting fine copper from copper segregation body, anode region electrolyte is selected and proportioning is：20% dense H2SO4, 10% H2O2、
The CuSO of 50g/L4·5H2O, 70% distilled water；Cathodic region electrolyte is selected and proportioning is：The dense H of 150g/L2SO4、100g/
The CuSO of L4·5H2O, 100% distilled water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810667242.4A CN108677021B (en) | 2018-06-26 | 2018-06-26 | Method for recovering pure copper from waste circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810667242.4A CN108677021B (en) | 2018-06-26 | 2018-06-26 | Method for recovering pure copper from waste circuit board |
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| Publication Number | Publication Date |
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| CN108677021A true CN108677021A (en) | 2018-10-19 |
| CN108677021B CN108677021B (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810667242.4A Active CN108677021B (en) | 2018-06-26 | 2018-06-26 | Method for recovering pure copper from waste circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109482335A (en) * | 2018-11-28 | 2019-03-19 | 中南大学 | A kind of method of copper and tin in FLOTATION SEPARATION discarded circuit board |
| CN110453076A (en) * | 2019-08-26 | 2019-11-15 | 华南理工大学 | A kind of method of waste printed circuit board metal concentrate recycling preparation regeneration copper alloy |
| CN113399440A (en) * | 2021-07-19 | 2021-09-17 | 安徽绿洲危险废物综合利用有限公司 | Treatment process for preparing pure copper powder by using waste circuit board |
| CN113718106A (en) * | 2021-07-30 | 2021-11-30 | 中南大学 | Harmless and recycling treatment method for waste circuit board resin powder |
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2018
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109482335A (en) * | 2018-11-28 | 2019-03-19 | 中南大学 | A kind of method of copper and tin in FLOTATION SEPARATION discarded circuit board |
| CN110453076A (en) * | 2019-08-26 | 2019-11-15 | 华南理工大学 | A kind of method of waste printed circuit board metal concentrate recycling preparation regeneration copper alloy |
| CN113399440A (en) * | 2021-07-19 | 2021-09-17 | 安徽绿洲危险废物综合利用有限公司 | Treatment process for preparing pure copper powder by using waste circuit board |
| CN113399440B (en) * | 2021-07-19 | 2023-12-05 | 安徽绿洲危险废物综合利用有限公司 | Treatment process for preparing pure copper powder by using waste circuit board |
| CN113718106A (en) * | 2021-07-30 | 2021-11-30 | 中南大学 | Harmless and recycling treatment method for waste circuit board resin powder |
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| Publication number | Publication date |
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| CN108677021B (en) | 2020-01-14 |
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