CN108667448B - Interface conversion device with isolation unit - Google Patents
Interface conversion device with isolation unit Download PDFInfo
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- CN108667448B CN108667448B CN201710202464.4A CN201710202464A CN108667448B CN 108667448 B CN108667448 B CN 108667448B CN 201710202464 A CN201710202464 A CN 201710202464A CN 108667448 B CN108667448 B CN 108667448B
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- interface
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0175—Coupling arrangements; Interface arrangements
- H03K19/017509—Interface arrangements
Abstract
The invention discloses an interface conversion device with an isolation unit, which comprises a first interface module, an interface signal conversion module and a second interface module. The first interface module transmits a first data signal and a first frequency signal, and the first data signal and the first frequency signal are converted into a second data signal and a second frequency signal through an isolation unit respectively. The interface signal conversion module outputs at least one second interface signal according to the second data signal and the second frequency signal; the second interface module is electrically connected with the interface signal conversion module and transmits at least one second interface signal to an electronic device.
Description
Technical Field
The present invention relates to an interface conversion apparatus, and more particularly, to an interface conversion apparatus having an isolation unit.
Background
Since electronic devices are easily damaged by personal and physical properties if they are improperly used, safety regulations in various regions have been classified into protection classes of electronic devices, including a first Class (Class I), a second Class (Class II), and a third Class (Class III). The first Class (Class I) of electronic devices is the one that provides the ground protection means, i.e. in short the terminals of the input terminals have a ground connection. The second Class (Class II) electronic equipment is equipment that is not provided with a ground protection device, so the input terminal can be an ac connector without a ground line. The electronic devices in the third Class (Class III) are mostly low-voltage products, such as dc/dc conversion modules.
In the safety regulations, there is a primary side or a secondary side, and the main purpose is to isolate the primary side and the secondary side by an isolation component, so that the damage caused by electric shock or other problems on the primary side or the secondary side can be limited to a single side and will not spread along with the circuit. However, in low voltage products, especially in interface conversion devices, the isolation element is mostly in an optical coupling or electromagnetic coupling manner as a signal transmission manner of the isolation element, and the optical coupling or electromagnetic coupling isolation element performs conversion of optical, electrical and electrical signals by using two elements with a certain distance, that is, a primary side signal passing through the isolation element is transmitted in a discontinuous manner rather than a continuous manner, and further, at least one signal implementation manner is performed between the primary side signal and a secondary side signal.
Such an electromagnetic element, which is coupled optically or electromagnetically, is not only complicated in manufacturing process but also expensive in cost. In addition, if higher isolation voltage is required (e.g., 6KV, 10KV), the cost is more expensive.
Therefore, it is an important issue in the industry today to provide an interface conversion device with low-cost isolation components.
Disclosure of Invention
The invention discloses an interface conversion device with an isolation unit, which is used for electrically connecting a control device and an electronic device, wherein the control device transmits a first data signal and a first frequency signal to the interface conversion device, and the interface conversion device comprises: a first interface module, receiving a transmission from a first control device transmitted from the control device, comprising: the first interface primary side unit is electrically connected with the control device and used for receiving the first data signal and the first frequency signal; the first data signal and the first frequency signal are respectively converted into a second data signal and a second frequency signal through the isolation unit; the interface signal conversion module receives the isolation unit which is electrically connected with the first interface module and receives a second data signal and a second frequency signal, wherein the interface signal conversion module outputs at least one second interface signal according to the second data signal and the second frequency signal; the second interface module is electrically connected with the interface signal conversion module and transmits at least one second interface signal to the electronic device.
Preferably, the isolation unit further includes a first isolation circuit electrically connected to the first interface primary side unit for receiving the first data signal; and the second isolation circuit is electrically connected with the first interface primary side unit and used for receiving the first frequency signal.
Preferably, the first isolation circuit comprises a first high voltage capacitor, and the second isolation circuit comprises a second high voltage capacitor.
Preferably, the first high voltage capacitor and the second high voltage capacitor are high voltage capacitors with withstand voltage larger than 0.5 kilovolt respectively.
Preferably, the first interface primary-side unit further comprises: a first interface; and the first amplifying circuit is arranged between the first interface and the second isolating circuit and is used for receiving and amplifying the first data signal.
Preferably, the first interface module further includes a second amplifying circuit, disposed between the second isolating circuit and the interface signal converting module, for receiving and amplifying the second data signal.
Preferably, the first frequency signal and the first data signal are transmitted to the interface signal conversion module through the first isolation circuit and the second isolation circuit in a continuous manner.
Preferably, the first data signal and the second data signal are peripheral component interconnect express data signals, and the first frequency signal and the second frequency signal are peripheral component interconnect express frequency signals.
Preferably, the second interface signal is a third generation universal serial bus interface signal.
Preferably, the first interface module, the interface signal conversion module and the second interface module are disposed on a circuit board.
In summary, the interface conversion apparatus of the embodiment of the invention has an isolation unit with an adjustable withstand voltage, which includes a first high-voltage capacitor and a second high-voltage capacitor, so that the frequency signal and the data signal are transmitted through the first high-voltage capacitor and the second high-voltage capacitor in a signal-continuous manner, thereby reducing the cost of the isolation unit, and also reducing the time and cost of research and development.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic diagram of an interface conversion apparatus according to an embodiment of the present invention.
Fig. 2 is a partial schematic diagram of an interface conversion apparatus according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings in which some exemplary embodiments are shown. The inventive concept may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the embodiments to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like numbers refer to like elements throughout.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first component discussed below could be termed a second component without departing from the teachings of the present concepts. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The interface conversion apparatus will be described with reference to the accompanying drawings by way of at least one embodiment, which is not intended to limit the disclosure.
[ embodiment of interface conversion device of the present invention ]
Referring to fig. 1 and fig. 2, fig. 1 is a schematic diagram of an interface conversion apparatus according to an embodiment of the present invention. Fig. 2 is a partial schematic diagram of an interface conversion apparatus according to an embodiment of the present invention.
In the embodiment of the present invention, the interface conversion apparatus 1 is electrically connected to a control apparatus 2 and an electronic apparatus (not shown).
The interface conversion apparatus 1 includes a first interface module 11, a second interface module 12 and an interface signal conversion module 13. The first interface module 11 has a first interface primary side unit 111 and an isolation unit 113. The first interface primary side unit 111 includes a first interface 1110, a first amplifier 1111, and a second amplifier 1112. In this embodiment, the isolation unit 113 includes a first isolation circuit 1131 and a second isolation circuit 1132. In the present embodiment, the interface conversion apparatus 1 further includes a circuit board (not shown), and the first interface module 11, the second interface module 12 and the interface signal conversion module 13 are disposed on the circuit board (not shown).
In the present embodiment, the interface conversion apparatus 1 is electrically connected to the control apparatus 2 through the first interface 1110 of the first interface module 11. The first interface module 11 is electrically connected to the interface signal conversion module 13. The interface signal conversion module 13 is electrically connected to the second interface module 12. The interface conversion apparatus 1 is electrically connected to an electronic apparatus (not shown) through the second interface module 12. The first interface primary side unit 111 of the first interface module 11 is electrically connected to the isolation unit 113. The isolation unit 113 is electrically connected to the interface signal conversion module 13.
In the present embodiment, the control device 2 provides a first data signal S1 and a first clock signal CLK1 to the interface conversion device 1. In this embodiment, the control device 2 is an electronic device having a Peripheral Component Interconnect Express (PCIE), and in this embodiment, the control device 2 is a computer device having a PCIE.
After receiving the first clock signal CLK1 and the first data signal S1, the first interface 1110 transmits the first clock signal CLK1 and the first data signal S1 to the interface signal conversion module 13 through the first isolation circuit 113.
The first clock signal CLK1 may pass through a first filter circuit (not shown) and then be transmitted to a first high-voltage capacitor (not shown) of the first isolation circuit 113 for signal conversion.
In this embodiment, the first data signal S1 may be filtered by a second filter circuit (not shown), amplified by the first amplifier circuit 1111, and then transmitted to the second isolation circuit 1132 for signal conversion. In the present embodiment, the first isolation circuit 1131 and the second isolation circuit 1132 respectively include a first high voltage capacitor (not shown) and a second high voltage capacitor (not shown).
In the present embodiment, the first clock signal CLK1 passes through one side of the first high-voltage capacitor (not shown) of the first isolation circuit 1131, passes through the other side of the first high-voltage capacitor (not shown), and is converted into the second clock signal CLK 2. Similar to the first clock signal CLK1, the first data signal S1 passes through one side of the second high voltage capacitor (not shown) of the second isolation circuit 1132, passes through the other side of the second high voltage capacitor (not shown), and is converted into the second data signal S2.
In the present embodiment, the first clock signal CLK1 and the first data signal S1 are electrical signals having a high frequency carrier, so that the first clock signal CLK1 and the first data signal S1 can be respectively switched to the other side of the isolation circuit in a signal continuous manner through the first high voltage capacitor (not shown) and the second high voltage capacitor (not shown), rather than in a signal discontinuous manner.
In the embodiment, the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) are high-voltage capacitors that have undergone safety specification verification, that is, the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) both conform to safety specification verification in structure and withstand voltage. Since the first clock signal CLK1 and the first data signal S1 are both signals with high frequency carriers, a second clock signal CLK2 and a second data signal S2 can be generated in a signal-sequential manner by passing through the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown), respectively.
In this embodiment, the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) include a patch-type high-voltage capacitor or a ceramic-type high-voltage capacitor, which is not limited in the present invention. In this embodiment, the withstand voltage specifications of the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) include: the specification is different specifications such as 100V, 200V, 500V, 0.75KV, 1KV, 2KV, 3KV, 4KV, 5KV, 6KV, 8KV, 10KV, etc., the listed specifications are only part of common specifications, and the invention is not limited in the invention.
In addition, in the present embodiment, the first isolation circuit 1131 further includes a trench structure (not shown) disposed below the first high-voltage capacitor (not shown) for increasing the safety distance, that is, the circuit board below the first high-voltage capacitor (not shown) is hollowed out in the circuit board area. Similarly, the second isolation circuit 1132 also includes a trench structure (not shown) disposed below the second high-voltage capacitor (not shown) for increasing a safety distance, that is, a circuit board region where the second high-voltage capacitor (not shown) is disposed, and is hollowed out below the circuit board region. In this embodiment, the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) are high-voltage capacitors with a withstand voltage of 6KV, and the widths of the trench structures below the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) are respectively 6mm, that is, the spatial distance in the safety specification is 6mm, which can correspond to the withstand voltage of 6 KV. In this embodiment, the design of the trench structures (not shown) of the first isolation circuit 1131 and the second isolation circuit 1132 is determined according to the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown), that is, the isolation voltage specification of the interface conversion apparatus 1 can quickly meet the safety specification requirements of different isolation voltages by appropriately replacing the first high-voltage capacitor (not shown) and the second high-voltage capacitor (not shown) with different withstand voltages and the trench structures (not shown).
The first clock signal CLK1 is converted by the first isolation circuit 1131 to generate a second clock signal CLK2, and the second clock signal CLK2 may be further filtered by a third filter circuit (not shown) or amplified by a third amplifier circuit (not shown) before being transmitted to the interface signal conversion module 13. Similarly, the first data signal S1 is converted by the second isolation circuit 1132 to generate a second data signal S2, and in this embodiment, the second data signal S2 is amplified by a second amplifying circuit 1112 and then transmitted to the interface signal converting module 13. In other embodiments, the second data signal S2 may be further filtered by a fourth filtering circuit (not shown). The fourth filter circuit (not shown) may be disposed between the second isolation circuit 1132 and the second amplifier circuit 1112 or between the second amplifier circuit 1112 and the interface signal conversion module 13, which is not limited in the disclosure.
In the present embodiment, the interface signal conversion module 13 receives the second clock signal CLK2 and the second data signal S2 to perform conversion of different interface signals, and in the present embodiment, the first clock signal CLK1, the second clock signal CLK2, the first data signal S1 and the second data signal S2 are all interface signals in an interface signal format of Peripheral Component Interconnect Express (PCIE). The first clock signal CLK1 and the second clock signal CLK2 are clock signals of Peripheral Component Interconnect Express (PCIE). The first data signal S1 and the second data signal S2 are Peripheral Component Interconnect Express (PCIE) data signals.
In this embodiment, the interface signal conversion module 13 is configured to convert an interface signal format of a Peripheral Component Interconnect Express (PCIE) into an interface signal format of a third generation Universal Serial Bus (USB 3. X). In other embodiments, the interface signal conversion module 13 may convert an interface signal format of a Peripheral Component Interconnect Express (PCIE) interface into an interface signal format of a second generation Universal Serial Bus (USB 2.0), which is not limited in the present invention.
The interface signal conversion module 13 performs interface format conversion on a second frequency signal CLK2 and a second data signal S2 in an interface signal format of a Peripheral Component Interconnect Express (PCIE) interface signal format, and converts the interface signal format into an interface signal format of a third generation Universal Serial Bus (USB 3.0, USB 3.X), that is, a second generation Universal Serial Bus differential signal positive signal D +, a second generation Universal Serial Bus differential signal negative signal D-, an ultra high speed transmission end differential signal positive signal TX +, an ultra high speed transmission end differential signal negative signal TX-, an ultra high speed receiving end differential signal positive signal RX +, and a receiving end ultra high speed differential signal negative signal RX-.
The interface signal conversion module 13 transmits the converted signal in the third generation usb interface signal format to the second interface module 12. And transmitted to the electronic device (not shown) through the second interface module 12.
In this embodiment, the first interface 1110 is a Peripheral Component Interconnect Express (PCIE) connector, and includes a PCIE male connector or a PCIE female connector. The second interface module is a connector of a third generation Universal Serial Bus (USB 3. X).
In this embodiment, the interface conversion apparatus 1 further includes a memory unit 14, and the memory unit 14 is electrically connected to the interface signal conversion module 13 and is used for storing the related data of the interface signal conversion module 13.
[ possible technical effects of the embodiment ]
In summary, the interface conversion apparatus of the embodiment of the invention has an isolation unit with an adjustable withstand voltage, which includes a first high-voltage capacitor and a second high-voltage capacitor, so that the frequency signal and the data signal are transmitted through the first high-voltage capacitor and the second high-voltage capacitor in a signal-continuous manner, thereby reducing the cost of the isolation unit, and also reducing the time and cost of research and development.
The above description is only an example of the present invention, and is not intended to limit the scope of the claims of the present invention.
Claims (8)
1. An interface conversion device with an isolation unit, for electrically connecting a control device and an electronic device, wherein the control device transmits a first data signal and a first frequency signal to the interface conversion device, the interface conversion device comprising:
a first interface module, configured to receive the first data signal and the first frequency signal transmitted from the control device, where the first interface module has a first interface primary side unit and an isolation unit, the first interface primary side unit is electrically connected to the control device and configured to receive the first data signal and the first frequency signal, the isolation unit is electrically connected to the first interface primary side unit, and the first data signal and the first frequency signal are converted into a second data signal and a second frequency signal through the isolation unit, respectively;
an interface signal conversion module, electrically connected to the isolation unit of the first interface module, for receiving the second data signal and the second frequency signal, wherein the interface signal conversion module outputs at least one second interface signal according to the second data signal and the second frequency signal; and
the second interface module is electrically connected with the interface signal conversion module and transmits the at least one second interface signal to the electronic device;
wherein the isolation unit further comprises:
the first isolation circuit is electrically connected with the first interface primary side unit and used for receiving the first frequency signal; and
the second isolation circuit is electrically connected with the first interface primary side unit and used for receiving the first data signal;
wherein the first isolation circuit comprises a first high-voltage capacitor, and the second isolation circuit comprises a second high-voltage capacitor;
the first frequency signal and the first data signal are signals with high-frequency carriers, and the second frequency signal and the second data signal are respectively generated by respectively passing through the first high-voltage capacitor and the second high-voltage capacitor in a signal continuous mode and are transmitted to the interface signal conversion module.
2. The interface converting apparatus of claim 1, wherein the first isolation circuit and the second isolation circuit each comprise a trench structure disposed below the first high voltage capacitor and the second high voltage capacitor, respectively.
3. The interface converting apparatus as claimed in claim 1, wherein the first high voltage capacitor and the second high voltage capacitor are high voltage capacitors having a withstand voltage greater than 0.5 kv, respectively.
4. The interface converting apparatus of claim 1, wherein the first interface-primary-side unit further comprises:
a first interface; and
and the first amplifying circuit is arranged between the first interface and the second isolating circuit and is used for receiving and amplifying the first data signal.
5. The interface converting apparatus of claim 4, wherein the first interface module further comprises:
and the second amplifying circuit is arranged between the second isolating circuit and the interface signal conversion module and is used for receiving and amplifying the second data signal.
6. The interface converting apparatus according to claim 1, wherein the first data signal and the second data signal are peripheral component interconnect express data signals, and the first frequency signal and the second frequency signal are peripheral component interconnect express frequency signals.
7. The interface conversion apparatus of claim 1, wherein said second interface signal is a third generation universal serial bus signal.
8. The interface converting apparatus as claimed in claim 1, wherein the first interface module, the interface signal converting module and the second interface module are disposed on a circuit board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710202464.4A CN108667448B (en) | 2017-03-30 | 2017-03-30 | Interface conversion device with isolation unit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710202464.4A CN108667448B (en) | 2017-03-30 | 2017-03-30 | Interface conversion device with isolation unit |
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| CN108667448A CN108667448A (en) | 2018-10-16 |
| CN108667448B true CN108667448B (en) | 2022-02-18 |
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| CN104050126A (en) * | 2013-03-15 | 2014-09-17 | 美国亚德诺半导体公司 | Integrated delayed clock for high speed isolated spi communication |
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| US5870046A (en) * | 1997-04-22 | 1999-02-09 | Silicon Laboratories Inc. | Analog isolation system with digital communication across a capacitive barrier |
| US7490187B2 (en) * | 2002-05-15 | 2009-02-10 | Broadcom Corporation | Hypertransport/SPI-4 interface supporting configurable deskewing |
| US8154880B1 (en) * | 2008-10-17 | 2012-04-10 | Integrated Device Technology, Inc. | Method and apparatus for active line interface isolation |
| KR101571278B1 (en) * | 2011-07-01 | 2015-11-24 | 퀄컴 인코포레이티드 | System and method for standby power reduction in a serial communication system |
| CN102904789B (en) * | 2012-08-30 | 2015-09-09 | 深圳市英威腾电气股份有限公司 | RS485 isolates communicating circuit and control method thereof |
| JP2017504898A (en) * | 2014-01-07 | 2017-02-09 | ザ・シランナ・グループ・プロプライエタリー・リミテッドＴｈｅ Ｓｉｌａｎｎａ Ｇｒｏｕｐ Ｐｔｙ Ｌｉｍｉｔｅｄ | Electrical isolation in serial communications |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1131481A (en) * | 1994-08-01 | 1996-09-18 | 摩托罗拉公司 | Line interface apparatus and method for isolating data terminal equipment from the line |
| CN1333971A (en) * | 1998-11-16 | 2002-01-30 | 科内森特系统公司 | Modem having digital high voltage isolation barrier |
| CN102778927A (en) * | 2011-05-13 | 2012-11-14 | 建碁股份有限公司 | Electronic device and universal serial bus 3.0 module |
| CN104050126A (en) * | 2013-03-15 | 2014-09-17 | 美国亚德诺半导体公司 | Integrated delayed clock for high speed isolated spi communication |
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