CN108664102A - A kind of electronic equipment and heat dissipating method - Google Patents
A kind of electronic equipment and heat dissipating method Download PDFInfo
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- CN108664102A CN108664102A CN201810371972.XA CN201810371972A CN108664102A CN 108664102 A CN108664102 A CN 108664102A CN 201810371972 A CN201810371972 A CN 201810371972A CN 108664102 A CN108664102 A CN 108664102A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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Abstract
The invention discloses a kind of electronic equipment and heat dissipating methods.The electronic equipment includes radiating piece, heat generating member and control device.Wherein, radiating piece has multiple heat dissipation regions, and control device can be used for obtaining the temperature of multiple heat dissipation regions, and after the temperature that the temperature for determining the first heat dissipation region is more than the second heat dissipation region, by the second heat dissipation region to preset the position where axis turns to the first heat dissipation region as rotary shaft.Using this structure, since radiating piece has multiple heat dissipation regions, therefore, when the temperature of one of heat dissipation region is higher, the lower heat dissipation region of temperature in other heat dissipation regions can be turned to the corresponding position of the higher heat dissipation region of temperature, it to accelerate the conduction of velocity of heat, can radiate in time to the hardware in electronic equipment, effectively prevent the case where hardware temperatures are excessively high, mainboard breaks down.
Description
Technical field
The present invention relates to field of terminal technology more particularly to a kind of electronic equipment and heat dissipating methods.
Background technology
With the development of science and technology and social progress, electronic equipment such as tablet computer, smart mobile phone, smart television are
As an indispensable part in people's live and work.Existing electronic equipment is usually provided with mainboard, electronic component etc.
Heat generating member, with the continuous improvement of the dominant frequency of electronic equipment, the heat that these heat generating members distribute is also higher and higher.It is actually using
During electronic equipment, if cannot conduct the heat that heat generating member in electronic equipment distributes in time, it is easy to cause hard
Part temperature is excessively high, or even mainboard is caused to break down.
Based on this, there is an urgent need for a kind of electronic equipment at present, for solving electronic equipment in the prior art since heat cannot
It conducts in time, leads to the problem of hardware temperatures are excessively high, mainboard breaks down.
Invention content
The embodiment of the present invention provides a kind of electronic equipment and heat dissipating method, with solve electronic equipment in the prior art due to
Heat cannot conduct in time, lead to the technical issues of hardware temperatures are excessively high, mainboard breaks down.
The embodiment of the present invention provides a kind of electronic equipment, and the electronic equipment includes radiating piece, heat generating member and control device,
The radiating piece at least covers the subregion of the heat generating member；The radiating piece has multiple heat dissipation regions；
The control device is used to obtain the temperature of the multiple heat dissipation region, and in the temperature for determining the first heat dissipation region
After temperature more than the second heat dissipation region, second heat dissipation region is turned to described first as rotary shaft using default axis and is dissipated
Position where thermal region；First heat dissipation region and second heat dissipation region are two in the multiple heat dissipation region
Different heat dissipation regions；The default axis is perpendicular to the top surface of the radiating piece.
Using this structure, since radiating piece has multiple heat dissipation regions, when the temperature of one of heat dissipation region
When higher, the lower heat dissipation region of temperature in other heat dissipation regions can be turned to the corresponding position of the higher heat dissipation region of temperature
It sets, to accelerate the conduction of velocity of heat, can radiate in time to the hardware in electronic equipment, effectively prevent hardware temperature
Spend the case where high, mainboard breaks down.
In one possible implementation, first heat dissipation region is that temperature is highest in the multiple heat dissipation region
Heat dissipation region；Second heat dissipation region is the heat dissipation region that temperature is minimum in the multiple heat dissipation region.
In this way, after determining the minimum heat dissipation region of temperature and the highest heat dissipation region of temperature, it can be minimum by temperature
Heat dissipation region turn on the position of the highest heat dissipation region of temperature, and then effectively improve radiating efficiency.
In one possible implementation, the electronic equipment further includes multiple temperature-detecting devices, the multiple temperature
Degree detection device is separately positioned in the multiple heat dissipation region；
The control device obtains the temperature of the multiple heat dissipation region, including：
The control device by be arranged the multiple heat dissipation region multiple temperature-detecting devices obtain it is the multiple
The temperature of heat dissipation region.
In this way, detecting the temperature of each heat dissipation region respectively by multiple temperature-detecting devices, temperature detection can be improved
Accuracy, and then improve electronic equipment radiating efficiency.
In one possible implementation, the electronic equipment further includes the driving device being connect with the radiating piece；
Second heat dissipation region is turned to the position where first heat dissipation region by the control device, including：
The control device determines institute according to the position of the position and second heat dissipation region of first heat dissipation region
The rotation direction and rotational angle of radiating piece are stated, and the rotation direction and rotational angle are sent to the driving device, with
Make the driving device that second heat dissipation region be turned to first heat dissipation according to the rotation direction and rotational angle
Position where region.
In one possible implementation, the driving device is drive motor；
The drive motor is set to the lower section of the radiating piece, the central axis of the drive motor and the radiating piece
Central axis overlapping；Alternatively,
The drive motor is set to the side of the radiating piece, and the central axis upright of the drive motor is dissipated in described
The central axis of warmware.
In the embodiment of the present invention, if being arranged drive motor in the side of radiating piece, drive motor can be reduced in electricity
Height in sub- equipment, and the thickness of electronic equipment is reduced, meet the development trend of ultrathin electronic equipment.
In one possible implementation, the electronic equipment further includes the shell for having void region；
The radiating piece is embedded in the void region, and is connect with the shell by snap part.
In this way, the design method that radiating piece is embedded in void region can be reduced to the thickness of electronic equipment, meet ultra-thin
The development trend of type electronic equipment；And by the way of snap part connection, the connection jail of radiating piece and shell can be increased
Soundness.
The embodiment of the present invention provides a kind of heat dissipating method, and the method is applied to electronic equipment, and the electronic equipment includes
Radiating piece, heat generating member, the radiating piece at least cover the subregion of the heat generating member；The radiating piece has multiple radiating areas
Domain；The method includes：
Obtain the temperature of the multiple heat dissipation region；
After determining that the temperature of the first heat dissipation region is more than the temperature of the second heat dissipation region, second heat dissipation region is rotated
Position to where first heat dissipation region；First heat dissipation region and second heat dissipation region are the multiple heat dissipation
Two different heat dissipation regions in region.
In this way, since radiating piece has multiple heat dissipation regions, when the temperature of one of heat dissipation region is higher,
The lower heat dissipation region of temperature in other heat dissipation regions can be turned to the corresponding position of the higher heat dissipation region of temperature, to
Accelerate heat conduction of velocity, can radiate in time to the hardware in electronic equipment, effectively prevent hardware temperatures it is excessively high,
The case where mainboard breaks down.
In one possible implementation, first heat dissipation region is that temperature is highest in the multiple heat dissipation region
Heat dissipation region；Second heat dissipation region is the heat dissipation region that temperature is minimum in the multiple heat dissipation region.
In this way, after determining the minimum heat dissipation region of temperature and the highest heat dissipation region of temperature, so as to by temperature
Minimum heat dissipation region turns on the position of the highest heat dissipation region of temperature, and then can effectively improve radiating efficiency.
In one possible implementation, the temperature of the multiple heat dissipation region is obtained, including：
The temperature of the multiple heat dissipation region is obtained according to the setting period.
In the embodiment of the present invention, setting the time span in period can be arranged according to actual needs, reasonable by being arranged
Time span, can effectively avoid excessively continually obtaining the temperature of multiple heat dissipation regions and cause system operation burden compared with
Greatly, the higher problem of operation power consumption of electronic equipment.
In one possible implementation, second heat dissipation region is turned to where first heat dissipation region
Before position, the method further includes：
Determine that the temperature of first heat dissipation region is more than the first temperature threshold, and/or, the temperature of first heat dissipation region
The difference of the temperature of degree and second heat dissipation region is more than second temperature threshold value.
It so, it is possible to improve radiating efficiency, avoid excessively continually rotating radiating piece.
The embodiment of the present invention also provides a kind of computer storage media, stores software program in the storage medium, this is soft
Part program realizes above-mentioned various possible heat dissipating methods when being read and executed by one or more processors.
The embodiment of the present invention also provides a kind of computer program product including instruction, when run on a computer,
So that computer executes the heat dissipating method described in above-mentioned various possible realization methods.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly introduced.
Fig. 1 is the structural schematic diagram of a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of radiating piece provided in an embodiment of the present invention；
Fig. 3 is a kind of scheme of installation of temperature-detecting device provided in an embodiment of the present invention；
Fig. 4 is the schematic diagram that a kind of control device provided in an embodiment of the present invention controls radiating piece；
Fig. 5 is the structural schematic diagram of another electronic equipment provided in an embodiment of the present invention；
Fig. 6 is a kind of schematic top plan view of the rotation direction and rotational angle of radiating piece provided in an embodiment of the present invention；
Fig. 7 a are a kind of structural schematic diagram of drive motor provided in an embodiment of the present invention；
Fig. 7 b are the structural schematic diagram of another drive motor provided in an embodiment of the present invention；
Fig. 8 is the flow diagram corresponding to a kind of heat dissipating method provided in an embodiment of the present invention.
Specific implementation mode
The application is specifically described with reference to the accompanying drawings of the specification, the concrete operation method in embodiment of the method also may be used
To be applied in device embodiment.
Fig. 1 illustrates the structural schematic diagram of a kind of electronic equipment provided in an embodiment of the present invention, as shown in Figure 1,
The electronic equipment 100 includes radiating piece 101, heat generating member 102, control device 103 and shell 104；Wherein, radiating piece 101 is at least
Cover the subregion of heat generating member 102；Control device 103 is used to obtain the temperature of radiating piece 101, and according to radiating piece 101
Temperature controls the rotation of radiating piece 101.
In structure shown in figure 1, shell 104 can be closed shell, using this structure, radiating piece 101, fever
Part 102 and control device 103 may be provided inside shell 104, so, it is possible the seal for improving electronic equipment.Other
In possible realization method, shell 104 or the shell with void region, using this structure, radiating piece 101 can be with
The embedded void region, and connect with shell 104 by bayonet component.In this way, the design side in radiating piece insertion void region
Formula can reduce the thickness of electronic equipment, meet the development trend of ultrathin electronic equipment；And using snap part connection
Mode can increase the firmness of the connection of radiating piece and shell.
Specifically, radiating piece 101 can have multiple heat dissipation regions.As shown in Fig. 2, being provided in an embodiment of the present invention
A kind of structural schematic diagram of radiating piece.Wherein, radiating piece 101 is circle, including the first heat dissipation region 1011, the second heat dissipation region
1012, third heat dissipation region 1013 and the 4th heat dissipation region 1014.
It should be noted that the structure of radiating piece 101 shown in Fig. 2 is only a kind of example, in other possible implementations
In example, radiating piece 101 or oval or other shapes；Also, the embodiment of the present invention is to heat dissipation region in radiating piece 101
Number and the area of each heat dissipation region be not specifically limited, those skilled in the art can rule of thumb and actual conditions
Increase and decrease the number of heat dissipation region and/or changes the area of each heat dissipation region.
Further, according to content as described above, control device 103 can obtain the temperature of multiple heat dissipation regions,
For example, the temperature that control device 103 can get the first heat dissipation region 1011 is W1, the temperature of the second heat dissipation region 1012 is
The temperature of W2, third heat dissipation region 1013 are W3, and the temperature of the 4th heat dissipation region 1014 is W4.
In specific implementation process, control device can obtain the temperature of multiple heat dissipation regions by temperature-detecting device.
When it is implemented, multiple temperature-detecting devices can be provided in electronic equipment 100, and, multiple temperature sensors can be distinguished
It is arranged in multiple heat dissipation regions.Fig. 3 illustrates a kind of installation of temperature-detecting device provided in an embodiment of the present invention
Schematic diagram, as shown in figure 3, electronic equipment 100 include the first temperature-detecting device 1051, second temperature detection device 1052,
Third temperature-detecting device 1053, the 4th temperature-detecting device 1054；Wherein, the first temperature-detecting device 1051 is arranged first
In heat dissipation region 1011, second temperature detection device 1052 is arranged in the second heat dissipation region 1012, third temperature-detecting device
1053 are arranged in third heat dissipation region 1013, and the 4th temperature-detecting device 1054 is arranged in the 4th heat dissipation region 1014.Such as
This, control device 103 can obtain multiple heat dissipation regions by the way that multiple temperature-detecting devices in multiple heat dissipation regions are arranged
Temperature, i.e. control device 103 can obtain by the way that the first temperature-detecting device 1051 in the first heat dissipation region 1011 is arranged
The temperature of the first heat dissipation region 1011 is taken, and can be by the way that the second temperature detection device in the second heat dissipation region 1012 is arranged
1052 obtain the temperature of the second heat dissipation region 1012, and can by the way that the third temperature inspection in third heat dissipation region 1013 is arranged
Device 1053 is surveyed to obtain the temperature of third heat dissipation region 1013, and can be by the way that the 4th in the 4th heat dissipation region 1014 is arranged
Temperature-detecting device 1054 obtains the temperature of the 4th heat dissipation region 1014.
In this way, control device 103 obtain radiating piece 101 multiple heat dissipation regions temperature after, can be to radiating piece
101 rotation is controlled.As shown in figure 4, for a kind of signal of control device control radiating piece provided in an embodiment of the present invention
Figure.Control device 103 is if it is determined that the temperature (i.e. W1) of the first heat dissipation region 1011 is more than the temperature of the second heat dissipation region 1012 (i.e.
It W2), then can be by the second heat dissipation region 1012 to preset the position where axis L turns to the first heat dissipation region 1011 as rotary shaft
It sets.Wherein, from figure 3, it can be seen that the first heat dissipation region 1011 and the second heat dissipation region 1012 are the multiple scattered of radiating piece 101
Two different heat dissipation regions in thermal region；Also, default axis is the axis perpendicular to the top surface of radiating piece 101.
It should be noted that：(1) according to common knowledge, can have perpendicular to the straight line of a plane it is a plurality of, therefore, Fig. 4
Shown in preset the position of axis L be only a kind of example, those skilled in the art can rule of thumb set with actual conditions
Default axis L1 is not limited specifically for example, default axis L to be set as to the central axis of radiating piece 101.(2) Fig. 4 is shown
The control mode of control device be only a kind of possible embodiment, in other possible embodiments, control device 103
The highest heat dissipation region of temperature in being multiple heat dissipation regions determining the first heat dissipation region 1011, and, the second heat dissipation region
After 1012 is the minimum heat dissipation regions of temperature in multiple heat dissipation regions, by the second heat dissipation region 1012 using default axis as rotary shaft
Turn to the position where the first heat dissipation region 1011.Wherein, axis is preset perpendicular to the top surface of radiating piece 101.
In the embodiment of the present invention, control device 103 can directly control the rotation of radiating piece, or can also pass through driving
Device controls the rotation of radiating piece.As shown in figure 5, for the structural representation of another electronic equipment provided in an embodiment of the present invention
Figure.Electronic equipment 100 includes radiating piece 101, heat generating member 102, control device 103 and driving device 106.Wherein, driving device
106 are connected with radiating piece 101 and control device 103.Using this structure, control device 103 is determining the first heat dissipation region
After the second heat dissipation region, heat dissipation can be determined according to the position of the position and second heat dissipation region of the first heat dissipation region
The rotation direction and rotational angle of part 101, and rotation direction and rotational angle are sent to driving device 106, so that driving fills
It sets 106 and second heat dissipation region is turned to the position where the first heat dissipation region 1011 according to rotation direction and rotational angle.
For example, as shown in fig. 6, being a kind of rotation direction and rotational angle of radiating piece provided in an embodiment of the present invention
Schematic top plan view.It is found that the location of first heat dissipation region 1011 is location A, second dissipates the content gone out according to Fig.6,
The location of thermal region 1012 is B location, and the angle between location A and B location is α (or 360 ° of-α), then can determine
The rotation direction of radiating piece 101 is counter clockwise direction, and rotational angle is α；Alternatively, the rotation of radiating piece 101 can also be determined
Direction is clockwise direction, and rotational angle is 360 ° of-α.
Further, control device 103 can also analyze rotation direction and rotational angle described above, if really
Determine α be less than or equal to 360 ° of-α, can be by the rotation direction of radiating piece 101 counterclockwise, rotational angle be that α is sent to
Driving device 106, so that driving device 106 is counterclockwise according to rotation direction and rotational angle is α, by the second radiating area
Domain 1012 turns to the position where the first heat dissipation region 1011；Correspondingly, however, it is determined that α is more than 360 ° of-α, can be by rotation side
To being that 360 ° of-α are sent to driving device 106 for clockwise direction, rotational angle, so that driving device 106 is according to side clockwise
To and rotational angle be 360 ° of-α, the second heat dissipation region 1012 is turned to the position where the first heat dissipation region 1011.
In the embodiment of the present invention, driving device may include multiple types, for example, drive motor, solenoid actuated machine etc..
By taking drive motor as an example, there are many set-up mode of the drive motor in electronic equipment 100.A kind of possible realization method is,
As shown in Figure 7a, it is a kind of structural schematic diagram of drive motor provided in an embodiment of the present invention.Electronic equipment 100 includes radiating piece
101, heat generating member 102, control device 103 and drive motor 1061.Wherein, drive motor 1061 is set under radiating piece 101
Side, also, the central axis (not shown) of the central axis H of drive motor 1061 and radiating piece 101 is overlapped.
In alternatively possible realization method, as shown in Figure 7b, for another drive motor provided in an embodiment of the present invention
Structural schematic diagram.Electronic equipment 100 includes radiating piece 101, heat generating member 102, control device 103 and drive motor 1061.Its
In, drive motor 1061 is set to the side of radiating piece 101, also, the central axis H of drive motor 1061 is perpendicular to radiating piece
101 central axis (not shown).In the embodiment of the present invention, if being arranged drive motor 1061 in the side of radiating piece 101
Face can then reduce height of the drive motor 1061 in electronic equipment 100, and reduce the thickness of electronic equipment, meet ultra-thin
The development trend of type electronic equipment.
Based on same inventive concept, the embodiment of the present invention also provides a kind of heat dissipating method, and this method can be applied to
Electronic equipment 100 described in text, specifically, the executive agent of this method is control device 103 described above.Wherein, electric
Sub- equipment 100 includes radiating piece 101, heat generating member 102, and, radiating piece 101 at least covers the subregion of heat generating member 102, dissipates
Warmware 101 has multiple heat dissipation regions.As shown in figure 8, being the stream corresponding to a kind of heat dissipating method provided in an embodiment of the present invention
Journey schematic diagram, includes the following steps：
Step 801, the temperature of multiple heat dissipation regions is obtained.
Step 802, after determining that the temperature of the first heat dissipation region is more than the temperature of the second heat dissipation region, by the second heat dissipation region
Turn to the position where the first heat dissipation region.
In this way, since radiating piece has multiple heat dissipation regions, when the temperature of one of heat dissipation region is higher,
The lower heat dissipation region of temperature in other heat dissipation regions can be turned to the corresponding position of the higher heat dissipation region of temperature, to
Accelerate heat conduction of velocity, can radiate in time to the hardware in electronic equipment, effectively prevent hardware temperatures it is excessively high,
The case where mainboard breaks down.
In the embodiment of the present invention, the first heat dissipation region and the second heat dissipation region are that two in multiple heat dissipation regions difference dissipate
Thermal region.Further, the first heat dissipation region can be the highest heat dissipation region of temperature in multiple heat dissipation regions, the second radiating area
Domain is the heat dissipation region that temperature is minimum in multiple heat dissipation regions.In this way, determining the minimum heat dissipation region of temperature and temperature most
After high heat dissipation region, the minimum heat dissipation region of temperature can be turned on the position of the highest heat dissipation region of temperature, in turn
Effectively improve radiating efficiency.
In specific implementation process, the temperature of multiple heat dissipation regions can be obtained in real time；Alternatively, can also be according to setting week
Phase obtains the temperature of multiple heat dissipation regions.In the embodiment of the present invention, setting the time span in period can come according to actual needs
Setting can effectively avoid excessively continually obtaining the temperature of multiple heat dissipation regions and leading by the way that rational time span is arranged
System operation is caused to bear larger, electronic equipment the higher problem of operation power consumption.Specifically, the temperature of multiple heat dissipation regions is obtained
The device of degree can be various temperature-detecting devices, for example, temperature-detecting device can be infrared temperature sensor, voltage temperature
Sensor etc., does not limit specifically.
Further, it in order to improve radiating efficiency, avoids excessively continually rotating radiating piece, it is provided in an embodiment of the present invention
A kind of possible realization method is to judge that the temperature of the first heat dissipation region is more than the first temperature threshold, and determining the first heat dissipation
After the temperature in region is more than the first temperature threshold, however, it is determined that the temperature of the first heat dissipation region is more than the temperature of the second heat dissipation region,
Second heat dissipation region can then be turned to the position where the first heat dissipation region.Wherein, the first temperature threshold can be this field
Technical staff with actual conditions setting, does not limit specifically rule of thumb.
In alternatively possible realization method, the difference of the temperature of the first heat dissipation region and the temperature of the second heat dissipation region is judged
Whether value is more than second temperature threshold value, and after determining that the difference is more than second temperature threshold value, however, it is determined that the first heat dissipation region
Temperature is more than the temperature of the second heat dissipation region, then the second heat dissipation region can be turned to the position where the first heat dissipation region.Its
In, second temperature threshold value can be that those skilled in the art rule of thumb set with actual conditions, not limit specifically.It lifts a
Example sets second temperature threshold value as 5 DEG C, if the first heat dissipation region is 30 DEG C, the second heat dissipation region is 20 DEG C, it is seen then that first
The difference of the temperature of the temperature of heat dissipation region and the second heat dissipation region is 10 DEG C, this difference is more than 5 DEG C, then can be dissipated second
Thermal region turns to the position where the first heat dissipation region.
It should be noted that above two mode is merely illustrative, can also be to determine that first dissipates in the application
The temperature of thermal region is more than the first temperature threshold, and, the difference of the temperature of the temperature of the first heat dissipation region and the second heat dissipation region
After second temperature threshold value, however, it is determined that the temperature of the first heat dissipation region is more than the temperature of the second heat dissipation region, then can be by second
Heat dissipation region turns to the position where the first heat dissipation region.
It should be understood by those skilled in the art that, the embodiment of the present invention can be provided as method, system or computer program
Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the present invention
Apply the form of example.Moreover, the present invention can be used in one or more wherein include computer usable program code computer
The computer program production implemented in usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The present invention be with reference to according to the method for the embodiment of the present invention, the flow of equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided
Instruct the processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine so that the instruction executed by computer or the processor of other programmable data processing devices is generated for real
The device for the function of being specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that instruction generation stored in the computer readable memory includes referring to
Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device so that count
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, in computer or
The instruction executed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a box or multiple boxes.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of electronic equipment, which is characterized in that the electronic equipment includes radiating piece, heat generating member and control device, described to dissipate
Warmware at least covers the subregion of the heat generating member；The radiating piece has multiple heat dissipation regions；
The control device is used to obtain the temperature of the multiple heat dissipation region, and is determining that the temperature of the first heat dissipation region is more than
After the temperature of second heat dissipation region, second heat dissipation region is turned into first radiating area using default axis as rotary shaft
Position where domain；First heat dissipation region and second heat dissipation region are two differences in the multiple heat dissipation region
Heat dissipation region；The default axis is perpendicular to the top surface of the radiating piece.
2. electronic equipment according to claim 1, which is characterized in that first heat dissipation region is the multiple radiating area
The highest heat dissipation region of temperature in domain；Second heat dissipation region is the radiating area that temperature is minimum in the multiple heat dissipation region
Domain.
3. electronic equipment according to claim 1 or 2, which is characterized in that the electronic equipment further includes multiple temperature inspections
Device is surveyed, the multiple temperature-detecting device is separately positioned in the multiple heat dissipation region；
The control device obtains the temperature of the multiple heat dissipation region, including：
The control device is by being arranged the multiple heat dissipation of multiple temperature-detecting devices acquisition in the multiple heat dissipation region
The temperature in region.
4. electronic equipment according to claim 1 or 2, which is characterized in that the electronic equipment further includes and the heat dissipation
The driving device of part connection；
Second heat dissipation region is turned to the position where first heat dissipation region by the control device, including：
The control device determines described dissipate according to the position of the position and second heat dissipation region of first heat dissipation region
The rotation direction and rotational angle of warmware, and the rotation direction and rotational angle are sent to the driving device, so that institute
It states driving device and second heat dissipation region is turned to by first heat dissipation region according to the rotation direction and rotational angle
The position at place.
5. electronic equipment according to claim 4, which is characterized in that the driving device is drive motor；
The drive motor is set to the lower section of the radiating piece, in the central axis of the drive motor and the radiating piece
Mandrel line overlap；Alternatively,
The drive motor is set to the side of the radiating piece, and the central axis upright of the drive motor is in the radiating piece
Central axis.
6. electronic equipment according to claim 1 or 2, which is characterized in that the electronic equipment further includes with vacancy section
The shell in domain；
The radiating piece is embedded in the void region, and is connect with the shell by snap part.
7. a kind of heat dissipating method, which is characterized in that the method be applied to electronic equipment, the electronic equipment include radiating piece,
Heat generating member, the radiating piece at least cover the subregion of the heat generating member；The radiating piece has multiple heat dissipation regions；It is described
Method includes：
Obtain the temperature of the multiple heat dissipation region；
After determining that the temperature of the first heat dissipation region is more than the temperature of the second heat dissipation region, second heat dissipation region is turned into institute
State the position where the first heat dissipation region；First heat dissipation region and second heat dissipation region are the multiple heat dissipation region
In two different heat dissipation regions.
8. the method according to the description of claim 7 is characterized in that first heat dissipation region is in the multiple heat dissipation region
The highest heat dissipation region of temperature；Second heat dissipation region is the heat dissipation region that temperature is minimum in the multiple heat dissipation region.
9. the method according to the description of claim 7 is characterized in that obtain the temperature of the multiple heat dissipation region, including：
The temperature of the multiple heat dissipation region is obtained according to the setting period.
10. method according to claim 8 or claim 9, which is characterized in that second heat dissipation region is turned to described first
Before position where heat dissipation region, the method further includes：
Determine first heat dissipation region temperature be more than the first temperature threshold, and/or, the temperature of first heat dissipation region and
The difference of the temperature of second heat dissipation region is more than second temperature threshold value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810371972.XA CN108664102B (en) | 2018-04-24 | 2018-04-24 | Electronic equipment and heat dissipation method |
Applications Claiming Priority (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109782827A (en) * | 2019-02-14 | 2019-05-21 | 西安易朴通讯技术有限公司 | Cooling control method and equipment, electronic equipment and computer readable storage medium |
| CN111587027A (en) * | 2019-02-18 | 2020-08-25 | 维沃移动通信有限公司 | Terminal and heat dissipation control method |
| CN113692154A (en) * | 2021-07-23 | 2021-11-23 | 维沃移动通信（杭州）有限公司 | Electronic device |
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| CN109782827A (en) * | 2019-02-14 | 2019-05-21 | 西安易朴通讯技术有限公司 | Cooling control method and equipment, electronic equipment and computer readable storage medium |
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| CN113692154A (en) * | 2021-07-23 | 2021-11-23 | 维沃移动通信（杭州）有限公司 | Electronic device |
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| CN108664102B (en) | 2021-08-17 |
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