CN108661297A - Compound computer room floor construction method - Google Patents

Compound computer room floor construction method Download PDF

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Publication number
CN108661297A
CN108661297A CN201810764648.4A CN201810764648A CN108661297A CN 108661297 A CN108661297 A CN 108661297A CN 201810764648 A CN201810764648 A CN 201810764648A CN 108661297 A CN108661297 A CN 108661297A
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CN
China
Prior art keywords
floor
thermal insulation
insulation board
computer room
construction method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810764648.4A
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Chinese (zh)
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CN108661297B (en
Inventor
陈佩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Dong Ren Polytron Technologies Inc
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Chongqing Dong Ren Polytron Technologies Inc
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Priority to CN201810764648.4A priority Critical patent/CN108661297B/en
Publication of CN108661297A publication Critical patent/CN108661297A/en
Application granted granted Critical
Publication of CN108661297B publication Critical patent/CN108661297B/en
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Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F21/00Implements for finishing work on buildings
    • E04F21/20Implements for finishing work on buildings for laying flooring
    • E04F21/22Implements for finishing work on buildings for laying flooring of single elements, e.g. flooring cramps ; flexible webs
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/024Sectional false floors, e.g. computer floors
    • E04F15/02447Supporting structures
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/18Separately-laid insulating layers; Other additional insulating measures; Floating floors
    • E04F15/181Insulating layers integrally formed with the flooring or the flooring elements

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Floor Finish (AREA)

Abstract

The invention discloses a kind of compound computer room floor construction methods, include the following steps:(a) land clearing;(b) snap the line positions;(c) fixed floor holder;(d) it is laid with thermal insulation board;(e) levelling;(f) it is laid with antistatic floor;(g) it repeats to install;(h) thermal insulation board corner is handled;(i) antistatic floor corner is handled;(j) gap filling.The invention avoids unnecessary workloads, and heat insulation effect is good, reduce the high request to ground flat degree, not only make floor covering layers neat, beautiful, and can be repaired more convenient with easy removal.

Description

Compound computer room floor construction method
Technical field
The present invention relates to the technical fields of construction, specifically, being a kind of compound computer room floor construction method.
Background technology
Modern computer room generally use is laid with antistatic floor and insulating layer and is interfered electronic equipment to avoid external magnetic field, and Keep the equipment inside computer room that there is suitable temperature.
The insulating layer being laid at present mainly adds face layer galvanized iron sheet scene processing and fabricating by rubber and plastic heat-preservation cotton, applies man-hour requirement Cutting drilling is carried out to rubber and plastic heat-preservation cotton and galvanized iron sheet in each floor stand base position, and antistatic floor is then erected at ground On board mount.
The defect of traditional construction mode is apparent, it is necessary first to ground flat degree is checked, if flatness is undesirable It then needs to add and fills and leads up process, on-site cutting insulating layer is also easily destroyed the heat insulation effect of insulating layer, while the one of insulating layer Change structure and be also unfavorable for repair replacement, secondly, the mode of integral installation causes to be needed when modular repair to a sheet of even whole Piece insulating layer is re-lay, time-consuming and laborious, and also is difficult to remove when needing transfer, and aesthetics is also destroyed.
Invention content
In view of the foregoing drawbacks, the object of the present invention is to provide a kind of compound computer room floor construction method, insulating layer is by pre- The metal sandwiched heat insulation board splicing first processed reduces the unnecessary cutting work in scene but also heat insulation effect is protected Barrier, meanwhile, by adjusting floor stand upper screw rod height can quickly levelling horizontal shelf, do height without the flatness to ground It is required that;Be clamped antistatic floor using limited post, not only make floor covering layers neat, beautiful, and can also easy removal, repair It is more convenient.
The present invention makes insulating layer avoid cutting now using splicing thermal insulation board, decreases unnecessary working strength; Antistatic floor is clamped using limited post, not only makes floor covering layers neat, beautiful, and can also easy removal, repair is more It is more convenient.
To achieve the goals above, specific technical solution of the present invention is as follows:
A kind of compound computer room floor construction method, key are to include the following steps:
(a) land clearing:Except dust and sundries, ensure floor cleaning, drying;
(b) snap the line positions:Length, the width of computer room are measured, and definitely according to the size of thermal insulation board and antistatic floor The reference position of board mount, and pop up grid lines on ground;
(c) fixed floor holder:The pedestal of the intersection fixed floor holder of grid lines in step (b);
(d) it is laid with thermal insulation board:Point is laid with thermal insulation board on the basis of the supporting rod in floor stand, utilizes the bottom of floor stand Seat supports thermal insulation board utilizes the notch on four angles of shaft clamping thermal insulation board of supporting rod;
(e) levelling:The height of lead screw is adjusted by adjusting adjusting nut, it is ensured that the horizontal shelf of lead screw upper end is in same On horizontal plane;
(f):It is laid with antistatic floor:The point on the basis of the limited post on horizontal shelf, on the horizontal shelf after levelling It is laid with antistatic floor;
(g) it repeats to install:After first row thermal insulation board and antistatic floor install, step (d), (e), (f) are repeated, Complete the laying on entire computer room ground;
(h) thermal insulation board corner is handled:The leftover pieces of thermal insulation board are cut according to corner size, are at least reserved on the leftover pieces One notch that can be clamped supporting rod, and be bonded it with metope by keeping the temperature alite paste;
(i) antistatic floor corner is handled:Installation and the highly consistent angle steel of horizontal shelf on metope, according to corner ruler The leftover pieces of very little cutting antistatic floor are simultaneously laid on angle steel;
(j) gap filling:Conductive adhesive tape is filled in the gap of antistatic floor edge.
Further, it when repeating to be laid with thermal insulation board, is mutually riveted between adjacent two pieces of thermal insulation boards.
Further, the thermal insulation board uses metal sandwiched heat insulation board, including rubber thermal insulation material and galvanized iron sheet, described Galvanized iron sheet front is generally rectangular shaped, and four sides are coated the rubber thermal insulation material by flange, at four angles of galvanized iron sheet On be preset with the floor stand (2) be adapted notch.
Further, the floor stand includes pedestal, elevating lever and horizontal shelf, and the elevating lever is located at the pedestal Between the horizontal shelf.
Further, the elevating lever includes that the supporting rod for the side of being fixed on the base is socketed in the screwed pipe of post upper And it is fixed on the lead screw below horizontal shelf, the lower end of the lead screw is connect with the threaded upper ends of the screwed pipe.
Further, the lower end of the screwed pipe is provided with the lock sleeve for connecting the supporting rod (221), described The upper end of screwed pipe is provided with the adjusting nut for adjusting the lead screw height.
Further, the limited post for being clamped the antistatic floor is provided with above the horizontal shelf.
Further, the floor stand is using cylindrical supporting rod, on four angles of the metal sandwiched heat insulation board The arc gap that the corresponding notch opened up is 90 °.
The present invention remarkable result be:
(1) present invention installs insulating layer in such a way that metal sandwiched heat insulation board jaggy is preset in splicing, avoids existing The a large amount of cuttings in field or drilling operating, improve heat insulation effect, and installation effectiveness is high.
(2) it by adjusting the levelling horizontal shelf of height of floor stand upper screw rod, does height without the flatness to ground and wants It asks, reduces unnecessary workload, shorten construction period.
(3) antistatic floor is clamped using limited post, not only makes floor covering layers neat, beautiful, and dismantle light, dimension It repaiies more convenient.
Description of the drawings
Fig. 1 is the floor panel structure schematic diagram of the present invention;
Fig. 2 is the floor panel structure upward view of the present invention;
Fig. 3 is the floor panel structure partial cutaway view of the present invention.
In figure:1- antistatic floors, 2- floor stands, 21- pedestals, 22- elevating levers, 221- supporting rods, 222- screwed pipes, 223- lead screws, 224- lock sleeves, 225- adjusting nuts, 23- horizontal shelfs, 231- limited posts, 3- thermal insulation boards, the heat preservation of 31- rubber Material, 32- galvanized iron sheets, 33- notches.
Specific implementation mode
The specific implementation mode of the present invention is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 3, a kind of compound computer room floor construction method, steps are as follows:
(a) land clearing:Except dust and sundries, floor cleaning, drying are kept;
(b) snap the line positions:Length, the width of computer room are measured, and is determined according to the size of antistatic floor 1 and thermal insulation board 3 The reference position of floor stand 2 determines and pops up grid lines on ground behind the reference position of floor stand 2;
(c) fixed floor holder 2:Floor stand 2 includes pedestal 21, elevating lever 22 and horizontal shelf 23, the elevating lever 22 between the pedestal 21 and the horizontal shelf 23, the intersection fixed floor holder 2 of grid lines in step (b) Pedestal 21;
(d) it is laid with thermal insulation board 3:Cylindrical supporting rod 221 is fixedly installed above pedestal 21, with the supporting rod Point is laid with thermal insulation board 3 on the basis of 221, and the thermal insulation board 3 uses metal sandwiched heat insulation board, including rubber thermal insulation material 31 and zinc-plated Iron sheet 32,32 front of the galvanized iron sheet is generally rectangular shaped, and four sides are coated the rubber thermal insulation material 31 by flange, in institute State the notch 33 for being preset on four angles of galvanized iron sheet 32 and being adapted with the floor stand 2, the circle that the notch 33 is 90 ° Arc notch supports the thermal insulation board 3 using the pedestal 21 of floor stand 2, and the notch is clamped using the shaft of supporting rod 221 33, mutually riveting is fixed between adjacent two pieces of thermal insulation boards 3;
(e) levelling:In ground relief, the out-of-flatness factor that elevating lever 22 eliminates ground, the liter can be adjusted Drop bar 22 includes the supporting rod 221 for being fixed on 21 top of pedestal, is socketed in the screwed pipe 222 of 221 upper end of supporting rod and fixes The lower end of the lead screw 223 is connect by the lead screw 223 below horizontal shelf 23 with the threaded upper ends of the screwed pipe 222, and The lock sleeve 224 being arranged by the lower end of the screwed pipe 222 connects the supporting rod 221, in the upper end of the screwed pipe 222 It is provided with adjusting nut 225, changes the height of lead screw 223 by adjusting the adjusting nut 225, to ensure 223 upper end of lead screw Horizontal shelf 23 be all in the same horizontal plane;
(f) it is laid with antistatic floor 1:It is provided in the top of the horizontal shelf 23 for being clamped the antistatic floor 1 limited post 231, the point on the basis of the limited post 231 on horizontal shelf 23,23 upper berth of horizontal shelf after levelling are set up defences quiet Electric floor 1;
(g) it repeats to install:After first row thermal insulation board 3 and antistatic floor 1 install, repeat step (d), (e), (f), the laying on entire computer room ground is completed;
(h) 3 corner of thermal insulation board is handled:The leftover pieces of thermal insulation board 3 are cut according to corner size, are at least reserved on the leftover pieces There are one the notches 33 that can be clamped supporting rod 221, and are bonded it with metope by keeping the temperature alite paste;
(i) 1 corner of antistatic floor is handled:Installation and the highly consistent angle steel of horizontal shelf 23 on metope, according to side The leftover pieces of angle square cun cutting antistatic floor 1 are simultaneously laid on angle steel;
(j) gap filling:Conductive adhesive tape is filled in the gap of 1 edge of antistatic floor.
The present invention is using splicing thermal insulation board 3 so that insulating layer reduces unnecessary without carrying out drilling cutting at the scene Working strength, heat insulation effect are also ensured;It can quickly levelling level be held in the palm by adjusting the height of 2 upper screw rod 223 of floor stand Plate 23 does high standard without the flatness to ground;Antistatic floor 1 is clamped using limited post 231, not only makes floor covering layers whole Together, beautiful, and can be with easy removal, repair is more convenient, and generally, the work progress period is short, installation effect by the present invention It is good.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations; Although present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that;Its It still can be with technical scheme described in the above embodiments is modified, either to which part or all technical features Carry out equivalent replacement;And these modifications or replacements, various embodiments of the present invention skill that it does not separate the essence of the corresponding technical solution The range of art scheme should all cover in the claim of the present invention and the range of specification.

Claims (8)

1. a kind of compound computer room floor construction method, it is characterised in that include the following steps:
(a) land clearing:Except dust and sundries;
(b) snap the line positions:Length, the width of computer room are measured, definitely according to the size of antistatic floor (1) and thermal insulation board (3) The reference position of board mount (2), and pop up grid lines on ground;
(c) fixed floor holder (2):The pedestal (21) of the intersection fixed floor holder (2) of grid lines in step (b);
(d) it is laid with thermal insulation board (3):Point is laid with thermal insulation board (3) on the basis of the supporting rod (221) in floor stand (2), utilizes ground Pedestal (21) supporting heat insulation plate (3) of board mount (2), using on (3) four angles of shaft clamping thermal insulation board of supporting rod (221) Notch (33);
(e) levelling:Change the height of lead screw (223) by adjusting adjusting nut (225), it is ensured that the level of lead screw (223) upper end Supporting plate (23) is in same level;
(f) it is laid with antistatic floor (1):The point on the basis of the limited post (231) on horizontal shelf (23), the level after levelling Supporting plate (23) upper berth is set up defences electrostatic floor (1);
(g) it repeats to install:After first row thermal insulation board (3) and antistatic floor (1) install, repeat step (d), (e), (f), the laying on entire computer room ground is completed;
(h) thermal insulation board (3) corner is handled:The leftover pieces of thermal insulation board (3) are cut according to corner size, are at least reserved on the leftover pieces There are one the notches (33) that can be clamped supporting rod (221), and are bonded it with metope by keeping the temperature alite paste;
(i) antistatic floor (1) corner is handled:Installation and the highly consistent angle steel of horizontal shelf (23) on metope, according to side The leftover pieces of angle square cun cutting antistatic floor (1) are simultaneously laid on angle steel;
(j) gap filling:Conductive adhesive tape is filled in the gap of antistatic floor (1) edge.
2. a kind of compound computer room floor construction method according to claim 1, it is characterised in that:It is repeating to be laid with heat preservation When plate (3), mutually riveted between adjacent two pieces of thermal insulation boards (3).
3. a kind of compound computer room floor construction method according to claim 1, it is characterised in that:The thermal insulation board (3) Using metal sandwiched heat insulation board, including rubber thermal insulation material (31) and galvanized iron sheet (32), galvanized iron sheet (32) front is big Cause rectangular, four sides are coated the rubber thermal insulation material (31) by flange, are preset on four angles of galvanized iron sheet (32) There is the notch (33) being adapted with the floor stand (2).
4. according to a kind of any compound computer room floor construction methods of claim 1-3, it is characterised in that:The floor Holder (2) includes pedestal (21), elevating lever (22) and horizontal shelf (23), the elevating lever (22) be located at the pedestal (21) with Between the horizontal shelf (23).
5. a kind of compound computer room floor construction method according to claim 4, it is characterised in that:The elevating lever (22) Including being fixed on supporting rod (221) above pedestal (21), being socketed in the screwed pipe (222) of supporting rod (221) upper end and solid The lead screw (223) being scheduled below horizontal shelf (23), the upper end spiral shell of the lower end and the screwed pipe (222) of the lead screw (223) Line connects.
6. a kind of compound computer room floor construction method according to claim 5, it is characterised in that:The screwed pipe (222) lower end is provided with the lock sleeve (224) for connecting the supporting rod (221), the upper end in the screwed pipe (222) It is provided with the adjusting nut (225) for adjusting the lead screw (223) height.
7. a kind of compound computer room floor construction method according to claim 4, it is characterised in that:In the horizontal shelf (23) limited post (231) for being clamped the antistatic floor is provided with above.
8. a kind of compound computer room floor construction method according to claim 3, it is characterised in that:The floor stand (2) cylindrical supporting rod (221) is used, corresponding to the notch (33) opened up on four angles of the metal sandwiched heat insulation board is 90 ° of arc gap.
CN201810764648.4A 2018-07-12 2018-07-12 Composite machine room floor construction method Active CN108661297B (en)

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Application Number Priority Date Filing Date Title
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CN108661297B CN108661297B (en) 2020-03-20

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110056161A (en) * 2019-05-30 2019-07-26 金螳螂精装科技(苏州)有限公司 A kind of the dry method entirety paving structure and method for paving on assembled ground
CN110067361A (en) * 2019-05-23 2019-07-30 金螳螂精装科技(苏州)有限公司 A kind of assembled facing horizontal splicing mounting structure and installation method
CN110145089A (en) * 2019-04-29 2019-08-20 上海想象家科技股份有限公司 It is a kind of to utilize the dotted leveling of elastomer, mute floor laying method
CN110374295A (en) * 2019-07-17 2019-10-25 金点石(北京)建筑设计咨询服务有限责任公司 Floor board mounting device and installation method
CN110439214A (en) * 2019-07-17 2019-11-12 中铁十二局集团有限公司 Conduit optimizes construction method of installation under subway antistatic floor
CN111851964A (en) * 2020-07-15 2020-10-30 温州东方装璜工程有限公司 Telescopic equipment for leveling tile adhesive surface

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CN110145089A (en) * 2019-04-29 2019-08-20 上海想象家科技股份有限公司 It is a kind of to utilize the dotted leveling of elastomer, mute floor laying method
CN110067361A (en) * 2019-05-23 2019-07-30 金螳螂精装科技(苏州)有限公司 A kind of assembled facing horizontal splicing mounting structure and installation method
CN110056161A (en) * 2019-05-30 2019-07-26 金螳螂精装科技(苏州)有限公司 A kind of the dry method entirety paving structure and method for paving on assembled ground
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CN110439214A (en) * 2019-07-17 2019-11-12 中铁十二局集团有限公司 Conduit optimizes construction method of installation under subway antistatic floor
CN110439214B (en) * 2019-07-17 2021-03-30 中铁十二局集团有限公司 Optimized installation construction method for underground antistatic floor lower channel
CN111851964A (en) * 2020-07-15 2020-10-30 温州东方装璜工程有限公司 Telescopic equipment for leveling tile adhesive surface

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