CN108647669A - Display module and preparation method thereof and display device - Google Patents
Display module and preparation method thereof and display device Download PDFInfo
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- CN108647669A CN108647669A CN201810494205.8A CN201810494205A CN108647669A CN 108647669 A CN108647669 A CN 108647669A CN 201810494205 A CN201810494205 A CN 201810494205A CN 108647669 A CN108647669 A CN 108647669A
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- cabling
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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Abstract
The application discloses a kind of display module and preparation method thereof and display device, is related to display technology field, display module includes the fingerprint identification function layer being stacked and display function layer；Display function layer includes first substrate, setting organic light-emitting structure on the first substrate and what is be electrically connected with organic light-emitting structure first be fanned out to cabling, and first, which is fanned out to cabling, is located at stepped region；Fingerprint identification function layer includes second substrate, the fingerprint identification unit being arranged on second substrate and what is be electrically connected with fingerprint identification unit second be fanned out to cabling, and for fingerprint identification unit between second substrate and first substrate, second, which is fanned out to cabling, is located at stepped region；Display module further includes the driving chip positioned at non-display area, and first, which is fanned out to cabling and second, is fanned out to cabling and is electrically connected respectively with driving chip, and first, which is fanned out to cabling and second, is fanned out to cabling and is located at different film layers.Such scheme efficiently solves the problems, such as that stepped region wiring space is insufficient in the prior art.
Description
Technical field
This application involves display technology fields, specifically, being related to a kind of display module and preparation method thereof and display dress
It sets.
Background technology
Body fingerprint has uniqueness and indeformable so that and the safety of fingerprint recognition is stronger, simultaneously because its is easy to operate,
It is therefore widely used in every field, for example, display technology field.In display technology field, by taking mobile phone as an example, unlock or
When opening some specific application program, it can be completed by fingerprint recognition.
With the development of science and technology, occurring a variety of display devices with fingerprint identification function in the market, such as mobile phone, tablet
Computer and intelligent wearable device etc..In this way, user is before operating the display device with fingerprint identification function, it is only necessary to use
The fingerprint recognition module of finger touch display unit, so that it may to carry out Authority Verification, simplify Authority Verification process.
Since fingerprint recognition has higher requirement to the resolution of fingerprint identification unit, generally require in 500PPI
(Pixels Per Inch, pixel quantity that per inch is included) left and right, if being connected to driving by fingerprint identification unit is corresponding
The cabling of chip is directly wired to stepped region, since stepped region has been carried out the wiring of data signal line, if adding fingerprint knowledge
Other unit corresponds to cabling, then the space of stepped region is difficult to meet the requirements.
Invention content
In view of this, technical problems to be solved in this application are to provide a kind of display module and preparation method thereof and display
Device, it is positioned at different that fingerprint identification function layer corresponding second, which is fanned out to cabling corresponding from display function layer first and is fanned out to cabling,
Film layer, efficiently solve the problems, such as that stepped region wiring space is insufficient.
In order to solve the above-mentioned technical problem, the application has following technical solution：
In a first aspect, the application provides a kind of display module, it is provided with viewing area and non-display area, the display module packet
The fingerprint identification function layer being stacked and display function layer are included, the non-display area includes stepped region；
The display function layer include first substrate, setting organic light-emitting structure on the first substrate and with it is described organic
The first of light emitting structure electrical connection is fanned out to cabling, and the organic light-emitting structure is located at the viewing area, and described first is fanned out to cabling
Positioned at the stepped region；
The fingerprint identification function layer includes second substrate, is arranged on the second substrate fingerprint identification unit and with
The second of fingerprint identification unit electrical connection is fanned out to cabling, and the fingerprint identification unit is located at the second substrate and described the
Between one substrate, the fingerprint identification unit is located at the viewing area, and described second, which is fanned out to cabling, is located at the stepped region；
The display module further includes driving chip, and the driving chip is located at the stepped region far from the viewing area one
The non-display area of side, described first, which is fanned out to cabling and described second, is fanned out to cabling and is electrically connected respectively with the driving chip,
Described first, which is fanned out to cabling and described second, is fanned out to cabling and is located at different film layers.
Second aspect, the application provide a kind of preparation method of display module, the display module be provided with viewing area and
Non-display area, the non-display area include stepped region, and the preparation method includes：
Form second substrate on the rigid substrate, and formed on the second substrate fingerprint identification unit and with the finger
The second of line recognition unit electrical connection is fanned out to cabling, so that fingerprint identification unit is located at the viewing area, described second is fanned out to cabling
Positioned at the stepped region；
First substrate is formed in side of the fingerprint identification unit far from the first substrate, and in the first substrate
Upper first for forming organic light-emitting structure and being electrically connected with the organic light-emitting structure is fanned out to cabling, makes the organic light-emitting structure
Positioned at the viewing area, described first, which is fanned out to cabling, is located at the stepped region；
Driving chip is formed on the first substrate, and the driving chip is located at the stepped region far from the viewing area side
The non-display area, be fanned out to cabling and described second by described first and be fanned out to cabling and be electrically connected respectively with the driving chip；
Remove the rigid substrates.
The third aspect, the application provide a kind of display device, including display module provided herein.
Compared with prior art, display module described herein and preparation method thereof and display device have reached as follows
Effect：
In display module that the embodiment of the present application is provided and preparation method thereof and display device, display function layer is corresponding
First is fanned out to cabling is electrically connected with organic light-emitting structure, and fingerprint identification function layer corresponding second is fanned out to cabling and fingerprint recognition list
Member electrical connection, and above-mentioned first is fanned out to cabling and second and is fanned out to cabling and is located at different film layers, therefore, even if the two
It when being all located at stepped region, since the two is in different film layers, will not influence each other in wiring space, fingerprint is known
The normal wiring that the introducing of other unit will not be fanned out to cabling to first impacts, and efficiently solves and is introducing in the prior art
The problem of fingerprint identification unit backward step area wiring space deficiency.In addition, first is fanned out to cabling and second and is fanned out to cabling and sets respectively
When setting in different film layers, the size of stepped region will not be increased, be advantageously implemented the design of narrow frame.Moreover, in the application, show
Show that the fingerprint identification unit in organic light-emitting structure and the fingerprint identification function layer in functional layer is to be respectively formed at different bases
On plate, in process of production, be first complete fingerprint identification function layer making after again on the basis of fingerprint identification function layer
Upper formation display function layer, that is to say, that the processing procedure of the processing procedure of fingerprint identification function layer and display function layer is to separate progress
, the two will not influence each other, therefore be conducive to be promoted the production yield of display module and display device.
Description of the drawings
Attached drawing described herein is used for providing further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please do not constitute the improper restriction to the application for explaining the application.In the accompanying drawings：
Fig. 1 show a kind of vertical view for the display module that the embodiment of the present application is provided；
Fig. 2 show a kind of AA ' sectional views of display module in Fig. 1；
Fig. 3 show a kind of BB ' sectional views of display module in Fig. 1；
Fig. 4 show a kind of vertical view for the first substrate that the embodiment of the present application is provided；
Fig. 5 show a kind of sectional view for the first substrate that the embodiment of the present application is provided；
Fig. 6 show a kind of equivalent composition figure for the second substrate that the embodiment of the present application is provided；
Fig. 7 show a kind of sectional view for the fingerprint identification function layer that the embodiment of the present application is provided；
Fig. 8 show another sectional view for the fingerprint identification function layer that the embodiment of the present application is provided；
Fig. 9 show a kind of flow chart of the preparation method for the display module that the embodiment of the present application is provided；
Figure 10 show a kind of intermediate production that the preparation method of the display module provided using the embodiment of the present application is formed
A kind of sectional view of product；
The another kind that Figure 11 show the preparation method formation of the display module provided using the embodiment of the present application is intermediate
A kind of sectional view of product；
Figure 12 show a kind of structural schematic diagram for the display device that the embodiment of the present application is provided.
Specific implementation mode
Some vocabulary has such as been used to censure specific components in specification and claim.Those skilled in the art answer
It is understood that hardware manufacturer may call the same component with different nouns.This specification and claims are not with name
The difference of title is used as the mode for distinguishing component, but is used as the criterion of differentiation with the difference of component functionally.Such as logical
The "comprising" of piece specification and claim mentioned in is an open language, therefore should be construed to " include but do not limit
In "." substantially " refer in acceptable error range, those skilled in the art can be described within a certain error range solution
Technical problem basically reaches the technique effect.In addition, " coupling " word includes any direct and indirect electric property coupling herein
Means.Therefore, if it is described herein that a first device is coupled to a second device, then representing the first device can directly electrical coupling
It is connected to the second device, or the second device indirectly electrically coupled through other devices or coupling means.Specification
Subsequent descriptions be implement the application better embodiment, so it is described description be for the purpose of the rule for illustrating the application,
It is not limited to scope of the present application.The protection domain of the application is when subject to appended claims institute defender.
In the prior art, in the display device of integrating fingerprint identification function, since fingerprint recognition is to fingerprint identification unit
Resolution has higher requirement, generally requires on the left sides 500PPI (Pixels Per Inch, the pixel quantity that per inch is included)
The right side, if the corresponding cabling for being connected to driving chip of fingerprint identification unit is directly wired to stepped region, due to stepped region into
The wiring of data signal line is gone, if adding fingerprint identification unit corresponds to cabling, the space of stepped region is difficult to meet the requirements.
For example, when display resolution is 1920*1080 and uses full frame fingerprint recognition, then each main location of pixels needs to put a finger
The quantity of line recognition unit, the data line corresponding to such fingerprint identification unit is also 1080, directly existing stepped region into
When the wiring of the corresponding data line of row fingerprint recognition, effective spatial position is difficult to meet to be carried out at the same time the corresponding data line of pixel
The wiring space demand of data line corresponding with fingerprint recognition.
In view of this, a kind of display module of the embodiment of the present application offer and preparation method thereof and display device, fingerprint recognition
Functional layer corresponding second is fanned out to cabling corresponding from display function layer first and is fanned out to cabling positioned at different film layers, effectively solves
The problem for stepped region wiring space deficiency of having determined.
The principle of optical finger print identification is briefly described first.The light irradiation that light source is sent out in display panel is in one's hands
On finger, handles digital reflex and form transmitting light, be formed by reflected light pass to fingerprint Identification sensor, fingerprint Identification sensor
Optical signal incident thereon is acquired.Due on fingerprint there are specific lines, the ridge in finger and paddy position
The intensity for forming reflected light is different, finally so that the collected optical signal of each fingerprint Identification sensor institute is different, and then realizes and refers to
Line identification function can determine user real identification accordingly.
Fig. 1 show a kind of vertical view for the display module that the embodiment of the present application is provided, and Fig. 2 show in Fig. 1 and shows
A kind of AA ' sectional views of module, Fig. 3 show a kind of BB ' sectional views of display module in Fig. 1, in conjunction with Fig. 1, Fig. 2 and Fig. 3, originally
The display module 100 that application embodiment is provided, is provided with viewing area 121 and non-display area 122, and display module 100 includes layer
The fingerprint identification function layer 302 and display function layer 301 of folded setting, non-display area 122 include stepped region 401；
Referring to Fig. 2 and Fig. 3, display function layer 301 includes first substrate 311, the organic hair being arranged on first substrate 311
Photo structure 312 and what is be electrically connected with organic light-emitting structure 312 first be fanned out to cabling 331, organic light-emitting structure 312 is located at viewing area
121, first, which is fanned out to cabling 331, is located at stepped region 401；
With continued reference to Fig. 2 and Fig. 3, fingerprint identification function layer 302 includes second substrate 321, is arranged on second substrate 321
Fingerprint identification unit 322 and what is be electrically connected with fingerprint identification unit 322 second be fanned out to cabling 332, fingerprint identification unit 322
Between second substrate 321 and first substrate 311, fingerprint identification unit 322 is located at viewing area 121, and second is fanned out to cabling 332
In stepped region 401；
Referring to Fig. 1, display module 100 further includes driving chip 201, and driving chip is located at stepped region 401 far from viewing area
The non-display area 122 of 121 sides, first be fanned out to cabling 331 and second be fanned out to cabling 332 be electrically connected respectively with driving chip (figure
In be not shown), referring to Fig. 3, first, which is fanned out to cabling 331 and second, is fanned out to cabling 332 and is located at different film layers.
It should be noted that in embodiment provided herein, display module 100 may include a driving chip 201,
First, which is fanned out to cabling 331 and second, is fanned out to cabling 332 and is connected to same driving chip 201, requires the driving chip 201 same at this time
When integrative display function and fingerprint identification function be located at the second base when the driving chip 201 is bundled on first substrate 311
Second on plate 321 is fanned out to the needs of cabling 322 is realized by the via between first substrate 311 and second substrate 321
With being electrically connected for driving chip 201.Certainly, in some other embodiments, two driving cores are may also include in display module 100
Piece 201, two driving chips 201 are bundled on first substrate 311 respectively on second substrate 321, are bundled in first substrate 311
On driving chip 201 have display function, be electrically connected for being fanned out to cabling 331 with first；It is bundled on second substrate 321
Driving chip 201 has fingerprint identification function, is electrically connected for being fanned out to cabling 332 with second.Fig. 1 has been only shown schematically one
A driving chip 201, the quantity for the driving chip 201 that the application display module 100 is included and binding position can be according to reality
Demand determines that the application is to this without specifically limiting.
Specifically, continuing with referring to Fig. 1-Fig. 3, in the display module 100 that the embodiment of the present application is provided, organic light emission knot
Structure 312 and fingerprint identification unit 322 are respectively formed on different substrates, respectively first substrate 311 and second substrate
321, the second fan that first be electrically connected with organic light-emitting structure 312 is fanned out to cabling 331 and is electrically connected with fingerprint identification unit 322
Although going out cabling 332 is all located at stepped region 401, the two is to be located in different film layer structures, therefore connecting up sky
Between on will not influence each other, fingerprint identification unit 322 introduce will not to first be fanned out to cabling 331 it is normal connect up cause
It influences, efficiently solves the problems, such as insufficient in 322 backward step area wiring space of fingerprint identification unit in the prior art.In addition, the
One is fanned out to cabling 331 and second when being fanned out to cabling 332 and being separately positioned in different film layers, will not increase the size of stepped region 401,
It is advantageously implemented the design of the narrow frame of display module.Moreover, in the embodiment of the present application, due to having in display function layer 301
Fingerprint identification unit 322 in machine light emitting structure 312 and fingerprint identification function layer 302 is respectively formed on different substrates
, in process of production, the processing procedure of the processing procedure and display function layer 301 of fingerprint identification function layer 302 is carried out separately, the two
It will not influence each other, therefore be conducive to be promoted the production yield of display module 100.
Optionally, it is located at display work(continuing with the fingerprint identification function layer 302 that referring to Fig. 2, the embodiment of the present application is provided
Side of the ergosphere 301 far from 100 light-emitting surface of display module.At this point, fingerprint identification unit 322 is separate positioned at first substrate 311
The side of organic light-emitting structure 312, when light source of the light that organic light-emitting structure 312 is sent out as fingerprint identification unit 322
When, the light that light source is sent out is sent out from the top area of fingerprint identification unit 322, and such structure can be referred to as emission structure at top.
Certainly, in addition to such structure, bottom emitting structure is equally applicable, at this point, to be located at first substrate 311 close for fingerprint identification unit 322
The side (not shown) of organic light-emitting structure 312, when the light that organic light-emitting structure 312 is sent out is as fingerprint identification unit
When 322 light source, the light which sends out is sent out from the bottom section of fingerprint identification unit 322, the embodiment of the present application
The position of organic light-emitting structure 312 and fingerprint identification unit 322 is not specifically limited.
It should be noted that Fig. 2 has been only shown schematically the one of display function layer 301 and fingerprint identification function layer 302
Kind substantially film layer structure figure, about the detailed film layer structure of display function layer 301 and fingerprint identification function layer 302 in subsequent content
In will carry out it is bright.In addition, the touch main body mentioned in the embodiment of the present application is usually finger, the fingerprint of finger is referred to by being located at
The series of ridges and paddy composition for holding skin surface, since ridge and the glass of fingerprint are close to and refractive index is similar with glass, and light is not
Easily reflected at the interface of the ridge of fingerprint and glass, and between the paddy of fingerprint and glass and not in contact with medium is air, refraction
Rate is low.Light reaches glass and the interface of air is easy to happen reflection.Therefore, the ridge of fingerprint and paddy for light reflectivity not
Equally so that the intensity for the light that fingerprint Identification sensor is experienced is different, generates the image of fingerprint.In the position place of ridge
The current signal that the reflected light that the reflected light of formation is formed at the position of paddy is converted into is of different sizes, and then according to current signal
Size can carry out fingerprint recognition.It should be noted that it may be palm etc. to touch main body, palmmprint can also be utilized to realize and visited
Survey and identification function.
Optionally, Fig. 4 show a kind of vertical view for the first substrate that the embodiment of the present application is provided, the first substrate
311 include the first substrate 10, the first grid for extending in a first direction and arranging in a second direction in the first substrate 10 is set
Line 11 and the first data signal line 12 arranged along first direction and extended in a second direction, first direction and second direction are handed over
Fork, first grid polar curve 11 and the first data signal line 12, which intersect, limits multiple subpixel areas 20；
First is fanned out to cabling 331 is electrically connected with the first data signal line 12 one-to-one correspondence respectively.
Specifically, Fig. 4 is referred to, in the display stage, the first grid polar curve 11 being electrically connected is corresponded with pixel column successively
Scanning signal is received, when being scanned to a first grid polar curve 11, the data-signal that driving chip 201 exports passes through first
It is fanned out to cabling 331 and the first data signal line 12 is transmitted to a line subpixel area corresponding with this first grid polar curve 11 20
In, to realize the display function of information.
Fig. 5 show a kind of sectional view for the first substrate that the embodiment of the present application is provided, and first substrate 311 includes first
Substrate 10 and the thin film transistor array layer 123 set gradually in the first substrate 10 and organic light-emitting structure 312, film are brilliant
Body pipe array layer 123 includes the gate metal layer 109 being stacked and source-drain electrode metal layer 110, organic light-emitting structure 312 include
Along first anode layer 105, pixel defining layer 106, the You Jifa set gradually perpendicular to the direction of 10 place plane of the first substrate
Luminescent material 111 and the first cathode layer 107.Thin film transistor array layer 123 is provided with driving thin film transistor (TFT) 62, and driving film is brilliant
The drain electrode of body pipe 62 is electrically connected with the first anode layer 105 in organic light-emitting structure 312.Driving thin film transistor (TFT) in the application
After 62 conductings, outside under alive driving, hole and electronics are injected from first anode layer 105 and the first cathode layer 107 respectively
Into luminous organic material 111, hole and electronics meet in luminous organic material 111, are compound, give off energy, and then will
Energy transmission makes it from ground state transition to excitation state to the molecule of organic luminescent substance in luminous organic material 111.Excitation state is very
Unstable, excited molecule returns to ground state from excitation state, and radiation transistion generates luminescence phenomenon, is based on this luminescence phenomenon, can be by having
Machine light emitting diode realizes the display of picture.It should be noted that in the first substrate 10, be additionally provided with gate insulating layer 101,
First semiconductor active layer 102, is put down at metallic spacer 103 (for isolated gate metal layer 109 and source-drain electrode metal layer 110)
Smoothization layer 104 (for source-drain electrode metal layer 110 and first anode layer 105 to be isolated) and positioned at organic light-emitting structure 312 far from the
The encapsulated layer 108 of one substrate, 10 side.
Optionally, Fig. 2 is referred to, the first substrate 10 includes transparent material, and the first substrate 10 is in wave band λ 1 to the saturating of light
It crosses rate and is more than 75%, wherein 1≤700nm of 400nm≤λ.Specifically, in fingerprint identification process, due to anti-via main body is touched
The light penetrated, which needs to first pass through display function layer 301, to be got in fingerprint identification unit 322, usual fingerprint identification unit 322
Absorption spectrum be 2≤720nm of 300nm≤λ, when setting the first substrate 10 to transparent substrates, wave band 400nm≤λ 1≤
700nm will reach 75% or more to the transmitance of light, and so design is materially increased via touch main body
It is reflected into the amount light of fingerprint identification unit 322, so that the intensity for the optical signal that fingerprint identification unit 322 is experienced
With regard to bigger, therefore be conducive to be promoted accuracy and the sensitivity of fingerprint recognition.
Optionally, in embodiment provided herein, such as in embodiment illustrated in fig. 5, the thickness of the first substrate 10 is
D1, wherein 10 μm of 5 μm≤D1 ＜.It can be seen that the thickness very little of the first substrate 10, can meet and be formed on other films
The demand of layer, and the integral thickness of display module 100 will not be influenced too much.
Optionally, in embodiment provided herein, such as in embodiment illustrated in fig. 5, the thermal decomposition of the first substrate 10
Temperature is T, wherein 400 DEG C of T ＞.Due to after the production for completing the first substrate 10, needing to be formed in the first substrate 10 organic
Light emitting structure correlation film layer, these film layers are formed under higher temperature conditions, the first substrate 10 in the embodiment of the present application
400 DEG C of heat decomposition temperature T ＞ are conducive to that the performance of the first substrate of follow-up producing process pair 10 is avoided to impact, it is ensured that first
The stability of substrate 10.
Optionally, Fig. 6 show a kind of equivalent composition figure for the second substrate that the embodiment of the present application is provided, referring to Fig. 6,
Second substrate 321 includes the second substrate 310, the fingerprint identification unit 322 being arranged in the second substrate 310, prolongs along third direction
It stretches and the second gate line 33 arranged along fourth direction and the second data arranged along third direction and extended along fourth direction
Signal wire 34, third direction and fourth direction are intersected；
Each fingerprint identification unit 322 respectively includes light sensitive diode 31, switching thin-film transistor 32 and storage capacitance 35, sense
The anode of optical diode 31 is electrically connected with the first electrode of storage capacitance 35, cathode and the storage capacitance 35 of light sensitive diode 31
First pole 321 of second electrode and switching thin-film transistor 32 is electrically connected；
Grid positioned at the switching thin-film transistor 32 of same a line connects same second gate line 33, positioned at opening for same row
The second pole 322 for closing thin film transistor (TFT) 32 connects same second data signal line 34；
Second is fanned out to cabling 332 is electrically connected with the second data signal line 34 one-to-one correspondence respectively.
Specifically, Fig. 6 is referred to, the entire fingerprint recognition stage includes preparation stage, fingerprint signal acquisition phase and fingerprint
Phase detected signal.In the preparation stage, driving chip controls switching thin-film transistor 32 by second gate line 33 and is connected, storage
Capacitance 35 charges, until 35 charging complete of storage capacitance.In fingerprint signal acquisition phase, is controlled and switched using second gate line 33
Thin film transistor (TFT) 32 is closed.When user presses finger in display module 100, the illumination that organic light-emitting structure is sent out is mapped to hand
On finger, and reflected light is formed in the surface reflection of finger print.It is incident on photosensitive two through the reflected light that finger print reflects to form
Pole pipe 31 receives and is formed photoelectric current by light sensitive diode 31, and the direction of the photoelectric current is to be directed toward node H1 by node H2, in turn
So that the point of H2 changes.In fingerprint signal detection-phase, can the direct potential change amount of detection node H2, and then really
Determine the size of photoelectric current.
It should be noted that the fingerprint identification unit 322 that the embodiment of the present application is provided can be distributed in entire viewing area,
It can be distributed in the certain of viewing area or some specific position, the application is to this without specifically limiting.
Optionally, referring to Fig. 4 and Fig. 6, third direction is identical as first direction, and fourth direction is identical as second direction.
That is the arrangement mode of the second gate line 33 in fingerprint identification function layer 302 is designed as and in display function layer 301
One grid line 11 is identical, and the arrangement mode of the second data signal line 34 in fingerprint identification function layer 302 is designed as and is shown
Show that the first data signal line 12 in functional layer 301 is identical, in this way, completing each grid line and each data letter using identical process
The wiring of number line is conducive to save production process.Certainly, in addition to such mode, second gate line 33 and first grid polar curve
11 also can be used different wire laying modes, and different wirings can also be used in the first data signal line 12 and the second data signal line 34
Mode, the application is to this without specifically limiting.
Optionally, Fig. 7 show a kind of sectional view for the fingerprint identification function layer that the embodiment of the present application is provided, the second base
The thickness of the material identical at bottom 310 and the first substrate 10, the second substrate 310 is D2, wherein 10 μm≤D2≤15 μm.
Specifically, in conjunction with Fig. 5 and Fig. 7, the constituent material of the first substrate 10 and the second substrate 310 is set as identical, nothing
It need to be that the second substrate 310 and the first substrate 10 select different materials and technique respectively, therefore when constituent material is identical in technique
Easier to operate, the constituent material of the two is such as can be used polyimides, and the application is to this without specifically limiting.In addition, will
The thickness of second substrate 310 is designed as 10 μm≤D2≤15 μm, which is more than the thickness D1 of the first substrate 10.Referring to Fig. 2, figure
5 and Fig. 7, since the second substrate 310 is located at side of the first substrate 311 far from organic light-emitting structure 312, when by the second substrate
When 310 thickness are designed big compared with the first substrate 10, which is conducive to obstruct moisture and oxygen infiltrates through organic light emission
In structure 312, prevent organic light-emitting structure 312 from being damaged since water oxygen is penetrated into.
It should be noted that referring to Fig. 2, one layer is also introduced between fingerprint identification function layer 302 and display function layer 301
Inorganic layer 601 penetrates into so as to further obstruct water oxygen in the organic light-emitting structure 312 of display function layer 301.
Optionally, the first substrate 10 and the second substrate 310 include flexible material.That is, the embodiment of the present application is by
One substrate 10 and the second substrate 310 are both designed as flexible substrates, so that the display module 100 that the embodiment of the present application is provided
It can be applied in flexible screen.When two flexible substrates are arranged in flexible screen, the integral, flexible modulus of flexible screen can be made to become
Smaller is obtained, to more flexible.In addition, fingerprint identification unit 322 and its corresponding circuit structure are set in the embodiment of the present application
It sets between two sheets of flexible substrate, such design is so that fingerprint identification function layer 302 is not necessarily to share film layer with display function layer 301
Structure, therefore the introducing of fingerprint identification function layer 302 can't impact the aperture opening ratio of viewing area in the embodiment of the present application.
Although moreover, first being fanned out to cabling 331 and second in the embodiment of the present application and being fanned out to cabling 332 and be all located at stepped region, due to
One, which is fanned out to cabling 331 and second, is fanned out to cabling 332 and is located in different substrates, and wiring space will not influence each other, such
Mode also effectively reduces that stepped region wiring space is insufficient in the prior art asks while the space for efficiently using stepped region
Topic.
Optionally, referring to Fig. 7, light sensitive diode 31 includes PIN layers 312, anode layer 311 and cathode layer 313, storage capacitance
35 include first electrode layer 351 and the second electrode lay 352, and the second electrode lay 352 is multiplexed with cathode layer 313；The second electrode lay 352
With the setting of the source-drain electrode metal layer same layer of switching thin-film transistor 32 and with the first pole 321 of switching thin-film transistor 32 and PIN
Layer 312 is electrically connected, and PIN layers 312 and anode layer 311 are electrically connected and are stacked in the second electrode lay 352 far from gate metal layer
Side, first electrode layer 351 and 323 same layer of gate metal layer are arranged；
Anode layer 311 and first electrode layer 351 are electrically connected by the first via 501, the second electrode lay 352 and first electrode
Capacitance is formed between layer 351.
Specifically, Fig. 7 gives a kind of composition schematic diagram of fingerprint identification function layer 302, and light sensitive diode 31 includes sun
Pole layer 311, cathode layer 313 and the PIN layers 312 between anode layer 311 and cathode layer 313, in general, cathode is by opaque
Metal is formed, and the boundary of PIN layers 312 is no more than the convenient of cathode.PIN layers 312 have light sensitive characteristic, and have and unidirectionally lead
Electrically.When no light, PIN layers 312 have the saturation reverse leakage current of very little, i.e. dark current, and light sensitive diode 31 ends at this time.When
When by illumination, the saturation reverse current of PIN layers 312 greatly increases, formed photoelectric current, photoelectric current with incident intensity variation
And change.In embodiment illustrated in fig. 7, the cathode layer 313 of light sensitive diode 31 and the second electrode lay 352 of storage capacitance 35 are multiple
With, and be arranged with the source-drain electrode metal layer same layer of switching thin-film transistor 32；The first electrode layer 351 and grid of storage capacitance 35
Metal layer same layer is arranged, and such mode is as far as possible by light sensitive diode 31, the film of storage capacitance 35 and switching thin-film transistor 32
Layer structure is multiplexed, and film layer structure and production process are simplified, while also helping the thickness for reducing display module 100, from
And meet the slimming demand of display module 100.
Optionally, Fig. 8 show another sectional view for the fingerprint identification function layer that the embodiment of the present application is provided, referring to
Fig. 8, light sensitive diode 31 include PIN layers 312, anode layer 311 and cathode layer 313, and storage capacitance 35 includes first electrode layer 351
With the second electrode lay 352, the second electrode lay 352 is multiplexed with cathode layer 313；The second electrode lay 352, PIN layers 312 and anode layer
311 are stacked in side of the source-drain electrode metal layer far from gate metal layer of switching thin-film transistor 32, the second electrode lay 352
It is electrically connected with PIN layers 312, first electrode layer 351 is arranged with source-drain electrode metal layer same layer, the second electrode lay 352 and switch film
First pole 321 of transistor 32 is electrically connected by the second via 502；
Anode layer 311 and first electrode layer 351 are electrically connected by third via 503, the second electrode lay 352 and first electrode
Capacitance is formed between layer 351.
Specifically, in embodiment illustrated in fig. 8, draw between the second electrode lay 352 of source-drain electrode metal layer and storage capacitance 35
Insulating layer is entered, the second electrode lay 352 is electrically connected with the first pole 321 of switching thin-film transistor 32 by the second via 502, should
In embodiment, first electrode layer 351 and the source-drain electrode metal layer same layer of storage capacitance 35 are arranged, and such mode equally can be one
The thickness for determining reduction display module 100 in degree, meets the slimming demand of display module 100.
Based on same inventive concept, the embodiment of the present application also provides a kind of preparation method of display module, and Fig. 9 show this
A kind of flow chart of the preparation method for the display module that application embodiment is provided, the display module 100 are provided with viewing area 121
With non-display area 122, non-display area 122 includes stepped region 401, and referring to Fig. 9 and Fig. 1, above-mentioned preparation method includes：
Step 101 forms second substrate 321 on rigid substrates 400, and forms fingerprint recognition on second substrate 321
Unit 322 and what is be electrically connected with fingerprint identification unit 322 second be fanned out to cabling 332, refers to Fig. 1, Fig. 3 and Figure 10, makes fingerprint
Recognition unit 322 is located at stepped region 401, and second, which is fanned out to cabling 332, is located at non-display area 122, and Figure 10 is shown using the application
A kind of a kind of sectional view for intermediate products that the preparation method for the display module that embodiment is provided is formed；
Step 102 forms first substrate 311 in side of the fingerprint identification unit 322 far from second substrate 321, and the
First for forming organic light-emitting structure 312 on one substrate 311 and being electrically connected with organic light-emitting structure 312 is fanned out to cabling 331, referring to
Fig. 1, Fig. 3 and Figure 11 make organic light-emitting structure 312 be located at viewing area 121, and first, which is fanned out to cabling 331, is located at stepped region 401, figure
The one kind for another intermediate products that 11 preparation methods for showing the display module provided using the embodiment of the present application are formed
Sectional view；
Step 103 forms driving chip 201 on first substrate 311, and referring to Fig. 1, driving chip 201 is located at stepped region
401 non-display areas 122 far from 121 side of viewing area, by first be fanned out to cabling 331 and second be fanned out to cabling 332 respectively with drive
Dynamic chip 201 is electrically connected；
Step 104 removes rigid substrates 400.
Specifically, referring to Fig. 9-Figure 11, in the preparation method for the display module 100 that the embodiment of the present application is provided, first
Fingerprint identification function layer 302 is formed on rigid substrates 400, is then formed on the basis of fingerprint identification function layer 302 again aobvious
Show that functional layer 301, the processing procedure of the processing procedure and display function layer 301 of fingerprint identification function layer 302 are carried out separately, the two will not
It influences each other, therefore is conducive to be promoted the production yield of display module 100.In addition, the display module formed by the above method
In 100, first, which is fanned out to cabling 331 and second, is fanned out to cabling 332 and is located at different film layers, therefore, even if the two all positions
It when stepped region 401, since the two is in different film layers, will not influence each other in wiring space, fingerprint is known
The normal wiring that the introducing of other unit 322 will not be fanned out to cabling 331 to first impacts, and efficiently solves in the prior art
The problem of stepped region wiring space deficiency.In addition, first is fanned out to cabling 331 and second and is fanned out to cabling 332 and is separately positioned on difference
When in film layer, the size of stepped region will not be increased, be advantageously implemented the design of narrow frame.
Optionally, in above-mentioned steps 101, second substrate 321 is formed on rigid substrates 400, and on second substrate 321
Formed fingerprint identification unit 322, further for：
Fig. 7 is referred to, forms the second substrate 310 on rigid substrates 400, forming semiconductor in the second substrate 310 has
Active layer 333；
The first insulating layer 334 is formed in side of the semiconductor active layer 333 far from the second substrate 310；
Gate metal layer 323 and first insulated from each other is formed in side of first insulating layer 334 far from the second substrate 310
Electrode layer 351；
Second insulating layer 336 is formed in side of the gate metal layer 323 far from the second substrate 310；
Source-drain electrode metal layer 335 and the second electrode lay are formed in side of the second insulating layer 336 far from the second substrate 310
352, source-drain electrode metal layer 335 includes the first pole 321 and the second pole 322, and the second electrode lay 352 and the first pole 321 are electrically connected, will
First pole 321 and the second pole 322 are electrically connected by via with the formation of semiconductor active layer 333 respectively；
PIN layers 312 are formed in side of the second electrode lay 352 far from the second substrate 310, and in PIN layers 312 far from second
The side of substrate 310 forms anode layer 311, and anode layer 311 is electrically connected with first electrode layer 351 by the formation of the first via 501
It connects.
Specifically, by the above method formed fingerprint identification function layer 302 in, the cathode layer 313 of light sensitive diode 31
It is multiplexed with the second electrode lay 352 of storage capacitance 35, and is set with 335 same layer of source-drain electrode metal layer of switching thin-film transistor 32
It sets；The first electrode layer 351 of storage capacitance 35 is arranged with 323 same layer of gate metal layer, and such mode is as far as possible by photosensitive two pole
The film layer structure of pipe 31, storage capacitance 35 and switching thin-film transistor 32 is multiplexed, and film layer structure and production process are simplified,
The thickness for reducing display module 100 is also helped simultaneously, to meet the slimming demand of display module 100.
Optionally, in above-mentioned steps 101, second substrate 321 is formed on rigid substrates 400, and on second substrate 321
Formed fingerprint identification unit 322, further for：
Fig. 8 is referred to, forms the second substrate 310 on rigid substrates 400, forming semiconductor in the second substrate 310 has
Active layer 333；
The first insulating layer 334 is formed in side of the semiconductor active layer 333 far from the second substrate 310；
Gate metal layer 323 is formed in side of first insulating layer 334 far from the second substrate 310；
Second insulating layer 336 is formed in side of the gate metal layer 323 far from the second substrate 310；
Source-drain electrode metal layer 335 insulated from each other and are formed in side of the second insulating layer 336 far from the second substrate 310
One electrode layer 351, source-drain electrode metal layer 335 include the first pole 321 and the second pole 322, and the first pole 321 and the second pole 322 are divided
It is not electrically connected with the formation of semiconductor active layer 333 by via；
Third insulating layer is formed in the side of source-drain electrode metal layer 335 and first electrode layer 351 far from the second substrate 310
336；
The second electrode lay 352 is formed in side of the third insulating layer 336 far from the second substrate 310, by the second electrode lay 352
It is electrically connected by the formation of the second via 502 with the first pole 321；
PIN layers 312 are formed in side of the second electrode lay 352 far from the second substrate 310, and in PIN layers 312 far from second
The side of substrate 310 forms anode layer 311, and anode layer 311 is electrically connected with first electrode layer 351 by the formation of third via 503
It connects.
Specifically, in the fingerprint identification function layer 302 formed by the above method, drain metal layer and storage capacitance 35
Third insulating layer 338, the first pole of the second electrode lay 352 and switching thin-film transistor 32 are introduced between the second electrode lay 352
321 are electrically connected by the second via, and in the embodiment, the first electrode layer 351 and source-drain electrode metal layer 335 of storage capacitance 35 are same
Layer setting, such mode can equally reduce the thickness of display module 100, meet the thin of display module 100 to a certain extent
Type demand.
Based on same inventive concept, the embodiment of the present application also provides a kind of display device 200, referring to Figure 12, shown in Figure 12
By a kind of structural schematic diagram for the display device that the embodiment of the present application provides, which includes display module 100,
The display module 100 that the display module is provided by the embodiment of the present application.The embodiment of display device 200 can be found in the application
The embodiment of above-mentioned display module 100, repeating place, details are not described herein again.It should be noted that the embodiment of the present application is provided
Display device 200 can be：Mobile phone, tablet computer, television set, display, laptop, Digital Frame, navigator etc.
Any product or component with display function.
By the above various embodiments it is found that advantageous effect existing for the application is：
In display module that the embodiment of the present application is provided and preparation method thereof and display device, display function layer is corresponding
First is fanned out to cabling is electrically connected with organic light-emitting structure, and fingerprint identification function layer corresponding second is fanned out to cabling and fingerprint recognition list
Member electrical connection, and above-mentioned first is fanned out to cabling and second and is fanned out to cabling and is located at different film layers, therefore, even if the two
It when being all located at stepped region, since the two is in different film layers, will not influence each other in wiring space, fingerprint is known
The normal wiring that the introducing of other unit will not be fanned out to cabling to first impacts, and efficiently solves stepped region in the prior art
The problem of wiring space deficiency.In addition, first is fanned out to cabling and second when being fanned out to cabling and being separately positioned in different film layers, it will not
The size for increasing stepped region, is advantageously implemented the design of narrow frame.Moreover, in the application, the organic light emission in display function layer
Fingerprint identification unit in structure and fingerprint identification function layer is respectively formed on different substrates, in process of production,
Be first complete fingerprint identification function layer making after again on the basis of fingerprint identification function layer formed display function layer,
That is the processing procedure of fingerprint identification function layer and the processing procedure of display function layer are carried out separately, the two will not influence each other, because
This is conducive to the production yield for promoting display module and display device.
Several preferred embodiments of the application have shown and described in above description, but as previously described, it should be understood that the application
Be not limited to form disclosed herein, be not to be taken as excluding other embodiments, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through in the scope of the invention is set forth herein
It is modified.And changes and modifications made by those skilled in the art do not depart from spirit and scope, then it all should be in this Shen
It please be in the protection domain of appended claims.
Claims (16)
1. a kind of display module, is provided with viewing area and non-display area, which is characterized in that the display module includes being stacked
Fingerprint identification function layer and display function layer, the non-display area include stepped region；
The display function layer include first substrate, setting organic light-emitting structure on the first substrate and with the organic light emission
The first of structure electrical connection is fanned out to cabling, and the organic light-emitting structure is located at the viewing area, and described first, which is fanned out to cabling, is located at
The stepped region；
The fingerprint identification function layer includes second substrate, is arranged on the second substrate fingerprint identification unit and with it is described
The second of fingerprint identification unit electrical connection is fanned out to cabling, and the fingerprint identification unit is located at the second substrate and first base
Between plate, the fingerprint identification unit is located at the viewing area, and described second, which is fanned out to cabling, is located at the stepped region；
The display module further includes driving chip, and the driving chip is located at the stepped region far from the viewing area side
The non-display area, described first, which is fanned out to cabling and described second, is fanned out to cabling and is electrically connected respectively with the driving chip, described
First, which is fanned out to cabling and described second, is fanned out to cabling and is located at different film layers.
2. display module according to claim 1, which is characterized in that the fingerprint identification function layer is located at the display work(
Side of the ergosphere far from the display module light-emitting surface.
3. display module according to claim 1, which is characterized in that the first substrate exists including the first substrate, setting
Extended in a first direction in first substrate and the first grid polar curve arranged in a second direction and along first direction arrangement simultaneously
The first data signal line extended in a second direction, the first direction and the second direction are intersected, the first grid polar curve
Intersect with first data signal line and limits multiple subpixel areas；
Described first is fanned out to cabling is electrically connected with first data signal line one-to-one correspondence respectively.
4. display module according to claim 3, which is characterized in that first substrate includes transparent material, and described
One substrate is more than 75% in wave band λ 1 to the transmitance of light, wherein 1≤700nm of 400nm≤λ.
5. display module according to claim 3, which is characterized in that the thickness of first substrate is D1, wherein 5 μm
10 μm of≤D1 ＜.
6. display module according to claim 3, which is characterized in that the heat decomposition temperature of first substrate is T,
In, 400 DEG C of T ＞.
7. display module according to claim 3, which is characterized in that the second substrate exists including the second substrate, setting
The fingerprint identification unit in second substrate, extend along third direction and along the second gate line of fourth direction arrangement with
And it arranges along third direction and is handed over along the second data signal line that fourth direction extends, the third direction and the fourth direction
Fork；
Each fingerprint identification unit respectively includes light sensitive diode, switching thin-film transistor and storage capacitance, and described photosensitive two
The anode of pole pipe is electrically connected with the first electrode of the storage capacitance, the cathode of the light sensitive diode and the storage capacitance
First pole of second electrode and the switching thin-film transistor is electrically connected；
Grid positioned at the switching thin-film transistor of same a line connects the same second gate line, is located at the institute of same row
The second pole for stating switching thin-film transistor connects same second data signal line；
Described second is fanned out to cabling is electrically connected with second data signal line one-to-one correspondence respectively.
8. display module according to claim 7, which is characterized in that the third direction is identical as the first direction,
The fourth direction is identical as the second direction.
9. display module according to claim 7, which is characterized in that the material of second substrate and first substrate
Identical, the thickness of second substrate is D2, wherein 10 μm≤D2≤15 μm.
10. display module according to claim 9, which is characterized in that first substrate and second substrate include
Flexible material.
11. display module according to claim 7, which is characterized in that the light sensitive diode includes PIN layers, anode layer
And cathode layer, the storage capacitance include first electrode layer and the second electrode lay, the second electrode lay is multiple with the cathode layer
With；The source-drain electrode metal layer same layer setting of the second electrode lay and the switching thin-film transistor and with switch film crystalline substance
First pole of body pipe and the PIN layers of electrical connection, described PIN layers is electrically connected and is stacked described second with the anode layer
Side of the electrode layer far from the gate metal layer, the first electrode layer are arranged with the gate metal layer same layer；
The anode layer and the first electrode layer are electrically connected by the first via, the second electrode lay and the first electrode
Capacitance is formed between layer.
12. display module according to claim 7, which is characterized in that the light sensitive diode includes PIN layers, anode layer
And cathode layer, the storage capacitance include first electrode layer and the second electrode lay, the second electrode lay is multiple with the cathode layer
With；The second electrode lay, PIN layers and the anode layer are stacked the source-drain electrode gold in the switching thin-film transistor
Belong to side of the layer far from the gate metal layer, the second electrode lay is electrically connected with described PIN layers, the first electrode layer and
Source-drain electrode metal layer same layer setting, first pole of the second electrode lay and the switching thin-film transistor pass through the
Two vias are electrically connected；
The anode layer and the first electrode layer are electrically connected by third via, the second electrode lay and the first electrode
Capacitance is formed between layer.
13. a kind of preparation method of display module, which is characterized in that the display module is provided with viewing area and non-display area,
The non-display area includes stepped region, and the preparation method includes：
Second substrate is formed on the rigid substrate, and is formed fingerprint identification unit on the second substrate and known with the fingerprint
The second of other unit electrical connection is fanned out to cabling, so that fingerprint identification unit is located at the viewing area, described second, which is fanned out to cabling, is located at
The stepped region；
First substrate, and the shape on the first substrate are formed in side of the fingerprint identification unit far from the first substrate
First be electrically connected at organic light-emitting structure and with the organic light-emitting structure is fanned out to cabling, and the organic light-emitting structure is made to be located at
The viewing area, described first, which is fanned out to cabling, is located at the stepped region；
Driving chip is formed on the first substrate, and the driving chip is located at institute of the stepped region far from the viewing area side
Non-display area is stated, being fanned out to cabling and described second by described first is fanned out to cabling and is electrically connected respectively with the driving chip；
Remove the rigid substrates.
14. the preparation method of display module according to claim 13, which is characterized in that form second on the rigid substrate
Substrate, and fingerprint identification unit is formed on the second substrate, further for：
The second substrate is formed on the rigid substrate, and semiconductor active layer is formed in the second substrate；
The first insulating layer is formed in side of the semiconductor active layer far from second substrate；
Gate metal layer and first electrode insulated from each other are formed in side of first insulating layer far from second substrate
Layer；
Second insulating layer is formed in side of the gate metal layer far from second substrate；
Source-drain electrode metal layer and the second electrode lay, the source are formed in side of the second insulating layer far from second substrate
Drain metal layer include the first pole and the second pole, the second electrode lay and first pole electrical connection, will first pole with
Second pole is electrically connected by via with semiconductor active layer formation respectively；
PIN layers are formed in side of the second electrode lay far from second substrate, and at PIN layers far from second substrate
Side form anode layer, the anode layer and the first electrode layer are formed by the first via and are electrically connected.
15. the preparation method of display module according to claim 13, which is characterized in that form second on the rigid substrate
Substrate, and fingerprint identification unit is formed on the second substrate, further for：
The second substrate is formed on the rigid substrate, and semiconductor active layer is formed in the second substrate；
The first insulating layer is formed in side of the semiconductor active layer far from second substrate；
Gate metal layer is formed in side of first insulating layer far from second substrate；
Second insulating layer is formed in side of the gate metal layer far from second substrate；
Source-drain electrode metal layer insulated from each other and the first electricity are formed in side of the second insulating layer far from second substrate
Pole layer, the source-drain electrode metal layer include the first pole and the second pole, and first pole and second pole are passed through via respectively
It is electrically connected with semiconductor active layer formation；
Third insulating layer is formed in the side of the source-drain electrode metal layer and the first electrode layer far from second substrate；
The second electrode lay is formed in side of the third insulating layer far from second substrate, by the second electrode lay and institute
It states the first pole and electrical connection is formed by the second via；
PIN layers are formed in side of the second electrode lay far from second substrate, and at PIN layers far from second substrate
Side form anode layer, the anode layer and the first electrode layer are formed by third via and are electrically connected.
16. a kind of display device, which is characterized in that any display module including claim 1 to 12.
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| CN201810494205.8A CN108647669A (en) | 2018-05-22 | 2018-05-22 | Display module and preparation method thereof and display device |
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Application publication date: 20181012 |