CN108641289A - A kind of preparation method of the special prepreg of the thickness high multilayer circuit board of copper - Google Patents
A kind of preparation method of the special prepreg of the thickness high multilayer circuit board of copper Download PDFInfo
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- CN108641289A CN108641289A CN201810389883.8A CN201810389883A CN108641289A CN 108641289 A CN108641289 A CN 108641289A CN 201810389883 A CN201810389883 A CN 201810389883A CN 108641289 A CN108641289 A CN 108641289A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, specific steps include being sent into the impregnating groove of cement dipping machine after each component in glue system to be carried out to proportioning thermalization in industrial stirred tank, prepare impregnation；The reinforcing material of well cutting is sent by conveying device in the impregnating groove containing immersion fluid；The reinforcing material for having soaked glue is subjected to drying and processing, then the complete reinforcing material with colloid of drying and processing is cooled down by cooling device, forms prepreg substrate；Reprocessing obtains the prepreg of the two-sided high fillibility of high resin content.The high fillibility prepreg that the present invention makes has high mobility, preferably meet thick copper PCB fillers requirement, filler deficiency to preferably solve current thick copper multilayer PCB product leads to a key technology difficulty for being layered plate bursting, easy to use, thick copper multilayer PCB product qualification rate and performance are all improved.
Description
Technical field
The present invention relates to wiring board manufacturing technology field, the special prepreg of specifically a kind of thickness high multilayer circuit board of copper
Preparation method.
Background technology
In recent years, conducting high current PCB be widely used in automobile, instrument and equipment, LCD, LED module and IPM, SPM and
HDI.As HDI technologies develop, the current density of all kinds of power panel design requirements is higher and higher, and calorific value is also increasing, because
This copper thickness is also more and more extensive more than or equal to the thick copper multilayer PCB applications of 3OZ (substance >=3OZ/ft2), and thick copper circuit board is made
It especially applies for automotive electronics component and grades high-power high electricity in engine power supply section, automobile central appliance power supply
Laminate section, it is desirable that there is wiring board heat-resistant aging, high-low temperature resistant to recycle contour reliability properties.However current thick copper multilayer
Usually there is the problems such as filler deficiency declines so as to cause heat resistance in using traditional prepreg manufacturing process in PCB.
In view of the above-mentioned problems, limitation of traditional prepreg due to equipment, with the resin of glass fabric dipping gluing
Content is restricted, and for example the highest resin content of 1080 specification prepregs can only generally accomplish 70%, 106 specification semi-solid preparations
The highest resin content of piece can only generally accomplish 80%.As thick copper multilayer PCB construction becomes increasingly complex, thick copper multilayer PCB's
In the case of internal layer copper foil increasingly thickness, traditional prepreg is increasingly difficult to meet the requirement of thick copper multilayer PCB fillers.
Invention content
The purpose of the present invention is to provide a kind of preparations for the special prepreg of the high multilayer circuit board of thick copper reducing cost
Method, to solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides the following technical solutions：
A kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, is as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：60-80 parts of epoxy resin, phenolic resin 30-
50 parts, 15-25 parts of bimaleimide resin, 12-18 parts of allyl compound, 3-5 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 160-180 DEG C of baking box and carries out drying and processing, then drying and processing is complete
Reinforcing material with colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 70-90 μm；
（5）This is coated with to the prepreg substrate of resin layer on one side, and to be put into temperature be dry 6-8min in 100-140 DEG C of baking oven, from
The prepreg substrate for being coated with resin layer on one side is taken out in baking oven to get to the half of the high fillibility of the single side of high resin content to consolidate
Change piece；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 70-90 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature to be done in 100-140 DEG C of baking oven
Dry 6-8min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to high resin content
The prepreg of two-sided high fillibility.
As a further solution of the present invention：
The glue system includes according to the raw material of parts by weight：65-75 parts of epoxy resin, 35-45 parts of phenolic resin, span carry out acyl
18-22 parts of imide resin, 14-16 parts of allyl compound, 3.5-4.5 parts of accelerating agent.
As a further solution of the present invention：
The glue system includes according to the raw material of parts by weight：70 parts of epoxy resin, 40 parts of phenolic resin, bismaleimide tree
20 parts of fat, 15 parts of allyl compound, 4 parts of accelerating agent.
As a further solution of the present invention：
The epoxy resin is selected from bisphenol A epoxide resin, bisphenol F epoxy resin, phosphorous epoxy resin, o-cresol formaldehyde asphalt mixtures modified by epoxy resin
Fat, bisphenol-A phenolic epoxy resin, phenol novolac epoxy resins, trifunctional phenol-type epoxy resin, tetraphenyl ethane epoxy resin,
Biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, aralkyl novolac epoxy resin, contracting
One or more of water glyceramine type epoxy resin, glycidyl ester type epoxy resin.
As a further solution of the present invention：
The accelerating agent is or mixtures thereof imidazoles, organic metal salt, wherein imidazoles is selected from 2-methylimidazole, 2- phenylimidazoles
Or 2-ethyl-4-methylimidazole；Organic metal salt be selected from zinc octoate, zinc Isoocatanoate, stannous octoate, dibutyl tin laurate,
Zinc naphthenate, cobalt naphthenate, aluminium acetylacetonate, acetylacetone cobalt or acetylacetone copper.
As further scheme of the invention：
The immersion fluid is amphiphilic block copolymer lotion, and wherein the hydrophilic section of amphiphilic block copolymer is polyethylene glycol or epoxy
The copolymer of ethane and propylene oxide, hydrophobic section selected from POSS, polystyrene, one kind in poly (glycidylmethacrylate--co-ethylene dimethacrylate).
Compared with prior art, the beneficial effects of the invention are as follows：
The high fillibility prepreg that the present invention makes has high mobility, and preferably meeting thick copper PCB, (copper thickness is more than or waits
In 3OZ, substance >=3OZ/ft2) filler requirement, so that preferably solving the filler deficiency of current thick copper multilayer PCB product causes
It is layered a key technology difficulty of plate bursting, and need not increase when making thickness copper PCB using high fillibility prepreg and appoint
What equipment need not also increase PCB production process, and easy to use, thick copper multilayer PCB product qualification rate and performance are all improved.
Specific implementation mode
The technical solution of this patent is described in more detail With reference to embodiment.
Embodiment 1
A kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, is as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：It is 60 parts of epoxy resin, 30 parts of phenolic resin, double
15 parts of maleimide resin, 12 parts of allyl compound, 3 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 160 DEG C of baking box and carries out drying and processing, then is carried drying and processing is complete
The reinforcing material of colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 70 μm；
（5）The prepreg substrate that this is coated with to resin layer on one side is put into temperature for dry 6min in 100 DEG C of baking ovens, from baking oven
The prepreg substrate for being coated with resin layer on one side is taken out to get to the prepreg of the high fillibility of the single side of high resin content；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 70 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature as drying in 100 DEG C of baking ovens
6min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to the two-sided of high resin content
The prepreg of high fillibility.
Embodiment 2
A kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, is as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：It is 65 parts of epoxy resin, 35 parts of phenolic resin, double
18 parts of maleimide resin, 14 parts of allyl compound, 3.5 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 165 DEG C of baking box and carries out drying and processing, then is carried drying and processing is complete
The reinforcing material of colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 75 μm；
（5）The prepreg substrate that this is coated with to resin layer on one side is put into temperature for dry 6.5min in 110 DEG C of baking ovens, from baking oven
It is middle to take out this and be coated with the prepreg substrate of resin layer on one side to get to the semi-solid preparation of the high fillibility of the single side of high resin content
Piece；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 75 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature as drying in 110 DEG C of baking ovens
6.5min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to the double of high resin content
The prepreg of the high fillibility in face.
Embodiment 3
A kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, is as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：It is 70 parts of epoxy resin, 40 parts of phenolic resin, double
20 parts of maleimide resin, 15 parts of allyl compound, 4 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 170 DEG C of baking box and carries out drying and processing, then is carried drying and processing is complete
The reinforcing material of colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 80 μm；
（5）The prepreg substrate that this is coated with to resin layer on one side is put into temperature for dry 7min in 120 DEG C of baking ovens, from baking oven
The prepreg substrate for being coated with resin layer on one side is taken out to get to the prepreg of the high fillibility of the single side of high resin content；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 80 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature as drying in 120 DEG C of baking ovens
7min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to the two-sided of high resin content
The prepreg of high fillibility.
Embodiment 4
A kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, is as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：It is 75 parts of epoxy resin, 45 parts of phenolic resin, double
22 parts of maleimide resin, 16 parts of allyl compound, 4.5 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 175 DEG C of baking box and carries out drying and processing, then is carried drying and processing is complete
The reinforcing material of colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 85 μm；
（5）The prepreg substrate that this is coated with to resin layer on one side is put into temperature for dry 7.5min in 130 DEG C of baking ovens, from baking oven
It is middle to take out this and be coated with the prepreg substrate of resin layer on one side to get to the semi-solid preparation of the high fillibility of the single side of high resin content
Piece；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 85 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature as drying in 130 DEG C of baking ovens
7.5min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to the double of high resin content
The prepreg of the high fillibility in face.
Embodiment 5
A kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, is as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：It is 80 parts of epoxy resin, 50 parts of phenolic resin, double
25 parts of maleimide resin, 18 parts of allyl compound, 5 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 180 DEG C of baking box and carries out drying and processing, then is carried drying and processing is complete
The reinforcing material of colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 90 μm；
（5）The prepreg substrate that this is coated with to resin layer on one side is put into temperature for dry 8min in 140 DEG C of baking ovens, from baking oven
The prepreg substrate for being coated with resin layer on one side is taken out to get to the prepreg of the high fillibility of the single side of high resin content；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 90 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature as drying in 140 DEG C of baking ovens
8min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to the two-sided of high resin content
The prepreg of high fillibility.
The epoxy resin is selected from bisphenol A epoxide resin, bisphenol F epoxy resin, phosphorous epoxy resin, o-cresol formaldehyde epoxy
Resin, bisphenol-A phenolic epoxy resin, phenol novolac epoxy resins, trifunctional phenol-type epoxy resin, tetraphenyl ethane epoxy tree
Fat, biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, aralkyl novolac epoxy resin,
One or more of glycidyl amine type epoxy resin, glycidyl ester type epoxy resin.The accelerating agent is imidazoles, organic
Or mixtures thereof metal salt, wherein imidazoles is selected from 2-methylimidazole, 2- phenylimidazoles or 2-ethyl-4-methylimidazole；Organic gold
Belong to salt and is selected from zinc octoate, zinc Isoocatanoate, stannous octoate, dibutyl tin laurate, zinc naphthenate, cobalt naphthenate, acetylacetone,2,4-pentanedione
Aluminium, acetylacetone cobalt or acetylacetone copper.The immersion fluid is amphiphilic block copolymer lotion, wherein amphiphilic block copolymer
Hydrophilic section is the copolymer of polyethylene glycol or ethylene oxide and propylene oxide, hydrophobic section be selected from POSS, polystyrene, poly- methyl
One kind in Glycidyl Acrylate.
The high fillibility prepreg that the present invention makes has high mobility, and preferably meeting thick copper PCB, (copper thickness is more than
Or equal to 3OZ, substance >=3OZ/ft2) filler requirement, to which the filler for preferably solving current thick copper multilayer PCB product is insufficient
Lead to a key technology difficulty for being layered plate bursting, and need not increase when making thickness copper PCB using high fillibility prepreg
Add any equipment, need not also increase PCB production process, easy to use, thick copper multilayer PCB product qualification rate and performance are all carried
It is high.
The better embodiment of this patent is explained in detail above, but this patent is not limited to above-mentioned embodiment party
Formula, one skilled in the relevant art within the scope of knowledge, can also be under the premise of not departing from this patent objective
Various changes can be made.
Claims (6)
1. a kind of preparation method for the special prepreg of the high multilayer circuit board of thick copper reducing cost, which is characterized in that specific step
It is rapid as follows：
（1）It is sent into containing for cement dipping machine after each component in glue system is carried out proportioning thermalization by recipe requirements in industrial stirred tank
In immersion trough, prepare impregnation；The glue system includes according to the raw material of parts by weight：60-80 parts of epoxy resin, phenolic resin 30-
50 parts, 15-25 parts of bimaleimide resin, 12-18 parts of allyl compound, 3-5 parts of accelerating agent；
（2）Reinforcing material is taken, the edge of undesirable reinforcing material is cut with laser, by the strengthening material of well cutting
Material is sent by conveying device in the impregnating groove containing immersion fluid；
（3）The reinforcing material for having soaked glue is sent into 160-180 DEG C of baking box and carries out drying and processing, then drying and processing is complete
Reinforcing material with colloid is cooled down by cooling device, forms prepreg substrate；
（4）By the one side of prepreg substrate by the compound release film of roll-in, the another side of prepreg substrate is in coating machine
Coat the resin layer that a layer thickness is 70-90 μm；
（5）This is coated with to the prepreg substrate of resin layer on one side, and to be put into temperature be dry 6-8min in 100-140 DEG C of baking oven, from
The prepreg substrate for being coated with resin layer on one side is taken out in baking oven to get to the half of the high fillibility of the single side of high resin content to consolidate
Change piece；
（6）The high fillibility prepreg of above-mentioned single side is coated with tree by the release film for removing the prepreg of the high fillibility of single side
The one side of lipid layer and release film are compound, and the another side that resin layer is not coated in the high fillibility prepreg of the single side coats a thickness
The resin layer that degree is 70-90 μm；
（7）The high fillibility prepreg of single side that the another side is coated with to resin layer is put into temperature to be done in 100-140 DEG C of baking oven
Dry 6-8min takes out the another side from baking oven and is coated with the single side prepreg substrate of resin layer to get to high resin content
The prepreg of two-sided high fillibility.
2. the preparation method of the high multilayer circuit board of the thick copper special prepreg according to claim 1 for reducing cost,
It is characterized in that, the glue system includes according to the raw material of parts by weight：It is 65-75 parts of epoxy resin, 35-45 parts of phenolic resin, double
18-22 parts of maleimide resin, 14-16 parts of allyl compound, 3.5-4.5 parts of accelerating agent.
3. the preparation method of the high multilayer circuit board of the thick copper special prepreg according to claim 1 for reducing cost,
It is characterized in that, the glue system includes according to the raw material of parts by weight：70 parts of epoxy resin, 40 parts of phenolic resin, span carry out acyl
20 parts of imide resin, 15 parts of allyl compound, 4 parts of accelerating agent.
4. the preparation method of the high multilayer circuit board of the thick copper special prepreg according to claim 1 for reducing cost,
It is characterized in that, the epoxy resin is selected from bisphenol A epoxide resin, bisphenol F epoxy resin, phosphorous epoxy resin, o-cresol formaldehyde ring
Oxygen resin, bisphenol-A phenolic epoxy resin, phenol novolac epoxy resins, trifunctional phenol-type epoxy resin, tetraphenyl ethane epoxy tree
Fat, biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, aralkyl novolac epoxy resin,
One or more of glycidyl amine type epoxy resin, glycidyl ester type epoxy resin.
5. the preparation method of the high multilayer circuit board of the thick copper special prepreg according to claim 1 for reducing cost,
It is characterized in that, the accelerating agent is or mixtures thereof imidazoles, organic metal salt, wherein imidazoles is selected from 2-methylimidazole, 2- phenyl
Imidazoles or 2-ethyl-4-methylimidazole；Organic metal salt is selected from zinc octoate, zinc Isoocatanoate, stannous octoate, di lauric dibutyl
Tin, zinc naphthenate, cobalt naphthenate, aluminium acetylacetonate, acetylacetone cobalt or acetylacetone copper.
6. the preparation method of the high multilayer circuit board of the thick copper special prepreg according to claim 1 for reducing cost,
It is characterized in that, the immersion fluid is amphiphilic block copolymer lotion, and wherein the hydrophilic section of amphiphilic block copolymer is polyethylene glycol
Or the copolymer of ethylene oxide and propylene oxide, hydrophobic section selected from POSS, polystyrene, in poly (glycidylmethacrylate--co-ethylene dimethacrylate)
One kind.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810389883.8A CN108641289A (en) | 2018-04-27 | 2018-04-27 | A kind of preparation method of the special prepreg of the thickness high multilayer circuit board of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810389883.8A CN108641289A (en) | 2018-04-27 | 2018-04-27 | A kind of preparation method of the special prepreg of the thickness high multilayer circuit board of copper |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1493610A (en) * | 2003-08-19 | 2004-05-05 | 梁国正 | Modified dimaleimide resin and its preparation method and application in cladding copper plate |
| CN101665016A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg |
| CN101664733A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg |
| CN101735456A (en) * | 2009-11-24 | 2010-06-16 | 广东生益科技股份有限公司 | High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby |
| CN107722316A (en) * | 2017-09-18 | 2018-02-23 | 乐凯特科技铜陵有限公司 | A kind of high-strength thin prepreg and preparation method thereof |
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2018
- 2018-04-27 CN CN201810389883.8A patent/CN108641289A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1493610A (en) * | 2003-08-19 | 2004-05-05 | 梁国正 | Modified dimaleimide resin and its preparation method and application in cladding copper plate |
| CN101665016A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg |
| CN101664733A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Method for making prepreg used for thick copper multilayer printed circuit board and prepreg |
| CN101735456A (en) * | 2009-11-24 | 2010-06-16 | 广东生益科技股份有限公司 | High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby |
| CN107722316A (en) * | 2017-09-18 | 2018-02-23 | 乐凯特科技铜陵有限公司 | A kind of high-strength thin prepreg and preparation method thereof |
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