CN108637879A - A kind of sapphire processing polished device - Google Patents
A kind of sapphire processing polished device Download PDFInfo
- Publication number
- CN108637879A CN108637879A CN201810724124.2A CN201810724124A CN108637879A CN 108637879 A CN108637879 A CN 108637879A CN 201810724124 A CN201810724124 A CN 201810724124A CN 108637879 A CN108637879 A CN 108637879A
- Authority
- CN
- China
- Prior art keywords
- sapphire
- limiting slot
- support pad
- pedestal
- supporting rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of sapphire processing polished devices, are related to jewelry processing technique field.Sapphire processing polished device proposed by the present invention includes：Pedestal, supporting rod and polishing machine；Pedestal is equipped with limiting slot, and support pad is equipped in limiting slot, and the lower section of support pad is equipped with resilient snubber, and limiting slot is for fixing sapphire；Supporting rod is set on pedestal；Polishing machine is arranged on the supporting rod, and polishing machine includes polishing disk, polishing disk face limiting slot.Technical solution by applying this embodiment; limiting slot is equipped on pedestal; support pad is equipped in limiting slot; the lower section of support pad is equipped with resilient snubber; sapphire is fixed by limiting slot; the lower section of the support pad and support pad that are arranged in limiting slot can be good at carrying out protective effect to sapphire equipped with resilient snubber, is destroyed in process so as to avoid sapphire.
Description
Technical field
The present invention relates to jewelry processing technique field more particularly to a kind of sapphire processing polished devices.
Background technology
Sapphire is the common name of other color sapphires in sapphire in addition to red ruby, main component
It is aluminium oxide (Al2O3).The sapphire of blue, is caused by being wherein mixed with a small amount of titanium (Ti) and iron (Fe) impurity；Sapphire
Color, can have that powder red, yellow, and green, white, even there are many colors in same coccolith.The feature of sapphire maximum be color not
, it is seen that parallel hexagonal prism face arrangement, the different straight colour band of the depth and growth line.Multiple twin is developed, common shutter
Formula twin crystal line.Rift is mostly along twin crystal facial cleft.Dichroism is strong, the sapphires of world's different sources except above-mentioned common feature it
Outside, also because the place of production is different with their own characteristics.The eighties in last century in the basalt of one band of China east coastal waters, is found that perhaps in succession
More Sapphire Deposits.
Sapphire is needed in process with polishing, however in the prior art, when being polished to sapphire due to
It is inadequate to sapphire protection, it is easily damaged sapphire.
Invention content
The technical problem to be solved by the present invention is to how avoid sapphire from being damaged in polishing process.
To solve the above-mentioned problems, the present invention proposes following technical scheme：
A kind of sapphire processing polished device, including：Pedestal, the pedestal are equipped with limiting slot, are set in the limiting slot
There are support pad, the lower section of the support pad to be equipped with resilient snubber, the limiting slot is for fixing sapphire；Supporting rod,
The supporting rod is set on the pedestal；Polishing machine, the polishing machine are arranged on the supporting rod, and the polishing machine includes throwing
CD, limiting slot described in the polishing disk face.
Further technical solution is for it：Resilient snubber is spring.
Further technical solution is for it：The material of support pad is microporous polyurethane elastomer.
Further technical solution is for it：The material of supporting rod is stainless steel.
Further technical solution is for it：The density of support pad is 150kg/m3-850kg/m3。
Compared with prior art, the attainable technique effect of present invention institute includes：
Technical solution by applying this embodiment is equipped with limiting slot on pedestal, support pad, branch is equipped in limiting slot
The lower section of stake pad piece is equipped with resilient snubber, and sapphire, the support pad and branch being arranged in limiting slot are fixed by limiting slot
The lower section of stake pad piece can be good at carrying out protective effect to sapphire equipped with resilient snubber, add so as to avoid sapphire
It is destroyed during work.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to needed in embodiment description
Attached drawing is briefly described, it should be apparent that, drawings in the following description are some embodiments of the invention, general for this field
For logical technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of structural schematic diagram for sapphire processing polished device that the embodiment of the present invention proposes；And
Fig. 2 is a kind of structural schematic diagram of the pedestal for sapphire processing polished device that the embodiment of the present invention proposes.
Reference numeral
Pedestal 10；Limiting slot 20；Support pad 30；Resilient snubber 40；Supporting rod 50；Polishing machine 60 and polishing disk
70。
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, is clearly and completely retouched to the technical solution in embodiment
It states, similar reference numerals represent similar component in attached drawing.Obviously, will be described below embodiment is only the present invention one
Divide embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
The every other embodiment obtained under the premise of creative work, shall fall within the protection scope of the present invention.
It should be appreciated that ought use in this specification and in the appended claims, term " comprising " and "comprising" instruction
Described feature, entirety, step, operation, the presence of element and/or component, but one or more of the other feature, whole is not precluded
Body, step, operation, element, component and/or its presence or addition gathered.
It is also understood that in this embodiment of the present invention term used in the description merely for the sake of description particular implementation
Example purpose and be not intended to limit the embodiment of the present invention.Such as the institute in specification and appended book of the embodiment of the present invention
As use, other situations unless the context is clearly specified, otherwise " one " of singulative, "one" and "the" are intended to wrap
Include plural form.
Referring to Fig. 1-Fig. 2, a kind of sapphire processing polished device that the embodiment of the present invention proposes, as seen from the figure comprising：
Pedestal 10, supporting rod 50 and polishing machine 60；Pedestal 10 is equipped with limiting slot 20, and support pad 30, branch are equipped in limiting slot 20
The lower section of stake pad piece 30 is equipped with resilient snubber 40, and limiting slot 20 is for fixing sapphire；Supporting rod 50 is set on pedestal 10；It throws
Ray machine 60 is arranged on the supporting rod 50, and polishing machine 60 includes polishing disk 70,70 face limiting slot 20 of polishing disk.
Technical solution by applying this embodiment is equipped with limiting slot 20 on pedestal 10, support is equipped in limiting slot 20
The lower section of gasket 30, support pad 30 is equipped with resilient snubber 40, fixes sapphire by limiting slot 20, is arranged in limiting slot 20
Support pad 30 and the lower section of support pad 30 can be good at carrying out protection work to sapphire equipped with resilient snubber 40
With being destroyed in process so as to avoid sapphire.
In one embodiment, resilient snubber 40 is spring.
In one embodiment, the material of support pad 30 is microporous polyurethane elastomer.
In one embodiment, the material of supporting rod 50 is stainless steel.
In certain embodiments, the density of support pad 30 is 150kg/m3-850kg/m3。
For example, in one embodiment, the density of support pad 30 is 150kg/m3。
In one embodiment, the density of support pad 30 is 250kg/m3。
In one embodiment, the density of support pad 30 is 350kg/m3。
In one embodiment, the density of support pad 30 is 450kg/m3。
In one embodiment, the density of support pad 30 is 550kg/m3。
In one embodiment, the density of support pad 30 is 650kg/m3。
In one embodiment, the density of support pad 30 is 750kg/m3。
In one embodiment, the density of support pad 30 is 850kg/m3。
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiment.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, even these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
The above is the specific implementation mode of the present invention, but scope of protection of the present invention is not limited thereto, any ripe
It knows those skilled in the art in the technical scope disclosed by the present invention, various equivalent modifications can be readily occurred in or replaces
It changes, these modifications or substitutions should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with right
It is required that protection domain subject to.
Claims (5)
1. a kind of sapphire processing polished device, which is characterized in that including：
Pedestal, the pedestal are equipped with limiting slot, are equipped with support pad in the limiting slot, the lower section of the support pad is equipped with
Resilient snubber, the limiting slot is for fixing sapphire；
Supporting rod, the supporting rod are set on the pedestal；
Polishing machine, the polishing machine are arranged on the supporting rod, and the polishing machine includes polishing disk, the polishing disk face institute
State limiting slot.
2. sapphire processing polished device according to claim 1, which is characterized in that the resilient snubber is spring.
3. sapphire processing polished device according to claim 1 or 2, which is characterized in that the material of the support pad
For microporous polyurethane elastomer.
4. sapphire processing polished device according to claim 1, which is characterized in that the material of the supporting rod is stainless
Steel.
5. sapphire processing polished device according to claim 3, which is characterized in that the density of the support pad is
150kg/m3-850kg/m3。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810724124.2A CN108637879A (en) | 2018-07-04 | 2018-07-04 | A kind of sapphire processing polished device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810724124.2A CN108637879A (en) | 2018-07-04 | 2018-07-04 | A kind of sapphire processing polished device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108637879A true CN108637879A (en) | 2018-10-12 |
Family
ID=63751023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810724124.2A Withdrawn CN108637879A (en) | 2018-07-04 | 2018-07-04 | A kind of sapphire processing polished device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108637879A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090060688A1 (en) * | 2005-03-28 | 2009-03-05 | Naoki Asada | Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device |
| US20100267317A1 (en) * | 2008-12-25 | 2010-10-21 | Ebara Corporation | Substrate holder and substrate holding method |
| CN205380505U (en) * | 2016-01-04 | 2016-07-13 | 江苏鑫斯达精密机械有限公司 | Damping device of machine tool |
| CN205705382U (en) * | 2016-03-22 | 2016-11-23 | 山东太德自动化技术有限公司 | A kind of friction pressure machine worktable |
| CN106224427A (en) * | 2016-09-21 | 2016-12-14 | 太仓德力高机电科技有限公司 | A kind of industry buffer |
| CN205968586U (en) * | 2016-08-27 | 2017-02-22 | 福建晶安光电有限公司 | Sapphire substrate polishing device |
| CN107649889A (en) * | 2017-10-27 | 2018-02-02 | 无锡智谷锐拓技术服务有限公司 | A kind of machining amortization work bench |
-
2018
- 2018-07-04 CN CN201810724124.2A patent/CN108637879A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090060688A1 (en) * | 2005-03-28 | 2009-03-05 | Naoki Asada | Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device |
| US20100267317A1 (en) * | 2008-12-25 | 2010-10-21 | Ebara Corporation | Substrate holder and substrate holding method |
| CN205380505U (en) * | 2016-01-04 | 2016-07-13 | 江苏鑫斯达精密机械有限公司 | Damping device of machine tool |
| CN205705382U (en) * | 2016-03-22 | 2016-11-23 | 山东太德自动化技术有限公司 | A kind of friction pressure machine worktable |
| CN205968586U (en) * | 2016-08-27 | 2017-02-22 | 福建晶安光电有限公司 | Sapphire substrate polishing device |
| CN106224427A (en) * | 2016-09-21 | 2016-12-14 | 太仓德力高机电科技有限公司 | A kind of industry buffer |
| CN107649889A (en) * | 2017-10-27 | 2018-02-02 | 无锡智谷锐拓技术服务有限公司 | A kind of machining amortization work bench |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181012 |