CN108636719B - A kind of diode lead sizer - Google Patents
A kind of diode lead sizer Download PDFInfo
- Publication number
- CN108636719B CN108636719B CN201810491045.1A CN201810491045A CN108636719B CN 108636719 B CN108636719 B CN 108636719B CN 201810491045 A CN201810491045 A CN 201810491045A CN 108636719 B CN108636719 B CN 108636719B
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- Prior art keywords
- module
- glue
- pallet
- diode
- gluing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
Abstract
The invention belongs to diode manufacturing technology fields, specifically a kind of diode lead sizer, it further include that gluing head module, pallet module and drying module, glue tank module are fixedly mounted on fixed frame including fixed frame, feed opening, glue tank module, belt and belt pulley；Glue tank module is for containing glue；Belt is located at the lower section of glue tank module, and belt sleeve is over pulleys carried；Belt pulley is mounted on motor shaft；Gluing head module is for gluing diode lead；Pallet module is mounted on belt；Drying module is mounted on the lower surface of glue tank module, and drying module is located at the right side of gluing head module.Present invention is mainly used for the continuous gluing of batch is carried out to diode, the efficiency of diode gluing is improved, market use demand is met, while the glue for guaranteeing to avoid when gluing diode in glue case solidifies, later period cleaning is inconvenient.
Description
Technical field
The invention belongs to diode manufacturing technology field, specifically a kind of diode lead sizer.
Background technique
Diode, (English: Diode), in electronic component, there are two the devices of electrode for a kind of tool, only allow electric current by
Single direction flows through, and many uses are the functions using its rectification.And varactor (VaricapDiode) is then used to work as
Make the adjustable condenser of electronic type.The current direction that most of diode has we normally referred to as " rectification
(Rectifying) " function.The most common function of diode is exactly only electric current to be allowed to be passed through (referred to as forward partially by single direction
Pressure), (referred to as reverse bias) is blocked when reversed.
Diode is that there are two the devices of electrode for a kind of tool, only an electric current is allowed to be flowed through by single direction, many uses are
Using the function that it is rectified, need to glue diode using to gluing machine during diode production.But it is traditional
Diode gluing machine all there is a series of defects, such as diode disposably to glue to multiple diodes, this
Sample results in the gluing efficiency of diode too low, so that diode production amount is too low, it is bad for the heat insulation effect of glue, and in this way
It will lead to that the glue solidifies, not convenient enough the problem of the cleaning for gluing machine, the presence of these problems all affects traditional upper
Glue machine can not meet the demand used to the gluing efficiency of diode.
Also occurs the technical solution of some diode gluings in the prior art, such as application No. is CN201710635316.1
A Chinese patent disclose a kind of diode gluing machine for capableing of proper alignment diode, including glue case, motor and on
Glue groove is provided with import above the glue case, and is mounted with water tank on the outside of glue case, and the back side of the water tank is equipped with
Heater strip, the bottom end of the glue case is connected with rubber head, and telescopic rod, institute are respectively and fixedly provided at left and right sides of glue water tank bottom
It states and adjusting bolt is installed on telescopic rod, and be socketed with lower telescopic rod below upper telescopic rod, the right side setting of the motor
There is lower telescopic rod, and the right end of motor is connected by belt with idler wheel, carrying roller is provided between the idler wheel, and pacify on carrying roller
Equipped with upper rubber base, pallet is provided on the upper rubber base, and the upper end of pallet is fixed with pull ring, is mounted with support in the upper glue groove
Disk.The diode gluing machine for capableing of proper alignment diode is provided with water tank, the heating of heater strip feed-tank, water tank to glue into
Row heating and thermal insulation, the effect that the mode of heating water bath heats are more preferable.But glue is more unrestrained when the technical solution glues diode
Take, furthermore the equipment does not dry up the diode after gluing, so that the production efficiency of diode slows down.
Summary of the invention
In order to make up for the deficiencies of the prior art, the invention proposes a kind of diode lead sizer, the present invention is main
For carrying out continuous gluing in batches to diode, the efficiency of diode gluing is improved, market use demand, while guarantee pair are met
Diode avoids the glue solidification in glue case when gluing, later period cleaning is inconvenient, and increased drying module is to gluing
Each diode afterwards is individually dried up, and excellent in efficiency is dried up, and reduces the necessary labor time of production diode.
The technical solution adopted by the present invention to solve the technical problems is: a kind of diode lead gluing of the present invention
Device, including fixed frame, feed opening, glue tank module, belt and belt pulley further include gluing head module, pallet module and are blown
Dry module, the glue tank module are fixedly mounted on fixed frame；The feed opening is located at the top of glue tank module, glue
Water tank module is for containing glue；The belt pulley is mounted on motor shaft；The belt is located under glue tank module
Side, belt sleeve is over pulleys carried；The gluing head module is mounted on the lower section of glue case, and gluing head module is used for diode
Lead is glued；The pallet module is located at the lower section of glue tank module, and pallet module is mounted on belt；Described blows
Dry module is mounted on the lower surface of glue tank module, and drying module is located at the right side of gluing head module.
The glue tank module includes water tank, glue case and heater strip, and the water tank is mounted on fixed frame；It is described
Heater strip be located in the inner wall of water tank；The glue case is located at the inside of water tank.After glue is added in glue case, water
Heater strip in chamber interior wall starts to heat the water in water tank, and the water in water tank heats the glue in glue case,
So that glue is constantly in fluid state, glue is avoided to solidify.
The gluing head module includes upper sebific duct, hemispherical Shell, shaft, micromotor, circular cone plate and rubber membrane, described
Upper sebific duct is mounted on the lower section of glue tank module, and upper sebific duct and glue case communicate；The micromotor is mounted on sebific duct
Lower end；The shaft is mounted on the motor shaft of micromotor；The hemispherical Shell is mounted in shaft, the bottom of hemispherical Shell
Circular hole one is offered, hemispherical Shell is with shaft swing；The circular cone plate is mounted on the lower section of hemispherical Shell, and the centre of circular cone plate is opened
Equipped with through-hole；The rubber membrane is connected on hemispherical Shell and upper sebific duct, and rubber membrane is for being sealed upper sebific duct lower end.Work
When making, micromotor drives hemispherical Shell to swing back and forth by shaft, and hemispherical Shell, which is swung, drives circular cone plate to swing, and circular cone plate is back and forth
It swings the quick drippage for being conducive to glue and is uniformly taped against on diode lead, glue is flowed into hemispherical Shell by upper sebific duct
It is interior, then be flowed into circular cone plate from the circular hole one of hemispherical Shell, it is added drop-wise on diode lead finally by the through-hole on circular cone plate.
The hemispherical Shell is also equipped with plectane, rope, ball and electromagnetism locking bearing, and the plectane is located at hemispherical Shell
Circular hole one in, plectane is movably arranged on hemispherical Shell by rotation axis one；The rope is mounted on plectane；The circle
Ball is mounted on rope；The electromagnetism locking bearing is mounted in rotation axis one, and electromagnetism locking bearing is used for locking rotation axis
One.When minitype motor driving hemispherical Shell is swung, ball is swung with hemispherical Shell, and ball swings by rope and pulls plectane pendulum
It is dynamic, the circular hole one of hemispherical Shell is opened, flows out glue from circular hole one；When micromotor stops working, electromagnetism locking axis
Starting is held, locking rotation axis one makes plectane stop swinging, and realizes and blocks to circular hole one.
The pallet module includes pallet, vibration motor, shakes spring, fixed plate, brushing board and plugging block, described
Fixed plate is mounted on belt；The vibration spring is fixedly mounted in fixed plate；The pallet is mounted on vibration spring
The other end, open up inside pallet fluted；The vibration motor is mounted on the lower section of pallet；The brushing board is located at support
In groove inside disk, brushing board is mounted on pallet by helical axis；The plugging block is located in tray slots, plugging block
Centre offers wire lead slot.When work, diode is put into placement plate, the lead of diode is passed through from plugging block, two poles
Two leads of pipe are respectively put into two pallets, different according to the wire length of diode, and mobile brushing board is in pallet
The groove in portion is truncated, and the usage amount of glue is saved, and after glue drips on diode lead, vibration motor starting makes to hold in the palm
Disk vibration allows the glue in pallet evenly and rapidly to glue to diode lead；After diode lead gluing, diode
It is placed plate to lift, helical axis makes brushing board mobile driven by the motor, extra glue is brought together, utility tray
It is poured out when turning to below belt.
It is also provided with groove one and groove two in the pallet, rack gear, gear, motor one are installed on pallet and places
Plate；Rack gear is installed in the groove one；Gear, gear and rack gear engagement are installed in the groove two；The electricity
The gear axis connection of machine one and gear；The placement plate is fixedly connected with rack gear.When work, pallet is arrived with belt-conveying
The lower section of module is dried up, gear rotates under the drive of motor one, and gear rotation band carry-over bar rises, and rack gear, which moves up, to be made to place
Plate moves up, and placement plate drives diode to move up, convenient to dry up to diode lead.
The drying module includes telescopic cylinder two, fan cup, rotation axis, semi-circular tube, heating coil, magnetic patch, flexible gas
Cylinder three and strut, the telescopic cylinder two are mounted on the lower section of glue tank module；The rotation axis is mounted on telescopic cylinder
Two inside, rotation axis are driven by motor；The fan cup is installed on the rotating shaft by cross bar；The semi-circular tube is hinged
In the front end of telescopic cylinder two；The heating coil is located at the inner wall of semi-circular tube；Before the magnetic patch is mounted on semi-circular tube
End；The telescopic cylinder three is mounted on two outer wall of telescopic cylinder；Described strut one end connects telescopic cylinder three, strut
The other end is connected on semi-circular tube.When work, telescopic cylinder two is moved down, and telescopic cylinder three works, and semi-circular tube is by diode
Lead encase, magnetic patch facilitates the closure of semi-circular tube, and fan cup is rotated driven by the motor, while heating coil works,
Quickly diode lead is dried up, improves the glue setting rate of diode lead.
The beneficial effects of the present invention are:
1. a kind of diode lead sizer of the present invention, this equipment is mainly used for carrying out connecting in batches to diode
Continuous gluing, improves the efficiency of diode gluing, meets market use demand, in glue tank module while gluing to diode
Glue kept the temperature, avoid glue from solidifying, drying module each diode after gluing is individually dried up, drying efficiency
It is good, reduce the necessary labor time of production diode.
2. drying module of the present invention is realized by the cooperation of fan cup, semi-circular tube and heating coil to two poles
The drying time is saved in the independent drying of pipe lead, improves drying quality, improves drying efficiency, realizes rapid production, shorten enterprise
Time production cycle of industry.
3. gluing head module of the present invention passes through the mutual of upper sebific duct, hemispherical Shell, shaft, micromotor and circular cone plate
Cooperation realizes the uniform quick gluing to diode lead, while being equipped with brushing board and being brought together extra glue, convenient
Extra glue being poured out and collecting, and the amount of glue is saved, and reduces cost.
Detailed description of the invention
The present invention will be further explained below with reference to the attached drawings.
Fig. 1 is main view of the invention；
Fig. 2 is the enlarged drawing in Fig. 2 of the present invention at A；
Fig. 3 is the enlarged drawing in Fig. 1 of the present invention at B；
Fig. 4 is the sectional view in Fig. 1 of the present invention at C-C；
In figure: fixed frame 1, feed opening 2, glue tank module 3, water tank 31, glue case 32, belt 4, belt pulley 5, upper rubber head
Module 6, upper sebific duct 61, hemispherical Shell 62, shaft 63, micromotor 64, circular cone plate 65, plectane 67, rope 68, ball 69, electromagnetism
Locking bearing 70, pallet module 7, pallet 71, vibration motor 72, vibration spring 73, fixed plate 74, brushing board 75, plugging block 76,
Rack gear 77, gear 78, placement plate 79, drying module 8, telescopic cylinder 2 81, fan cup 82, rotation axis 83, semi-circular tube 84, heater wire
Enclose 85, telescopic cylinder 3 86, strut 87.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As shown in Figures 1 to 4, a kind of diode lead sizer of the present invention, including fixed frame 1, feed opening
2, glue tank module 3, belt 4 and belt pulley 5 further include gluing head module 6, pallet module 7 and drying module 8, the glue
Water tank module 3 is fixedly mounted on fixed frame 1；The feed opening 2 is located at the top of glue tank module 3, and glue tank module 3 is used
In splendid attire glue；The belt pulley 5 is mounted on motor shaft；The belt 4 is located at the lower section of glue tank module 3, belt 4
It covers on belt pulley 5；The gluing head module 6 is mounted on the lower section of glue case 32, and gluing head module 6 is for drawing diode
Line is glued；The pallet module 7 is located at the lower section of glue tank module 3, and pallet module 7 is mounted on belt 4；Described
Drying module 8 is mounted on the lower surface of glue tank module 3, and drying module 8 is located at the right side of gluing head module 6.
As one embodiment of the present invention, the glue tank module 3 includes water tank 31, glue case 32 and heating
Silk, the water tank 31 are mounted on fixed frame 1；The heater strip is located in the inner wall of water tank 31；The glue case 32
Positioned at the inside of water tank 31.After glue is added in glue case 32, the heater strip in 31 inner wall of water tank starts in water tank 31
Water heated, the water in water tank 31 heats the glue in glue case 32, and glue is made to be constantly in fluid state, keeps away
Exempt from glue solidification.
As one embodiment of the present invention, the gluing head module 6 includes upper sebific duct 61, hemispherical Shell 62, shaft
63, micromotor 64, circular cone plate 65 and rubber membrane, the upper sebific duct 61 are mounted on the lower section of glue tank module 3, upper sebific duct 61
It is communicated with glue case 32；The micromotor 64 is mounted on the lower end of sebific duct 61；The shaft 63 is mounted on micro electric
On the motor shaft of machine 64；The hemispherical Shell 62 is mounted in shaft 63, and the bottom of hemispherical Shell 62 offers circular hole one, hemispherical Shell
62 swing with shaft 63；The circular cone plate 65 is mounted on the lower section of hemispherical Shell 62, and the centre of circular cone plate 65 offers through-hole；
The rubber membrane is connected on hemispherical Shell 62 and upper sebific duct 61, and rubber membrane is for being sealed upper 61 lower end of sebific duct.Work
When, micromotor 64 drives hemispherical Shell 62 to swing back and forth by shaft 63, and hemispherical Shell 62, which is swung, drives circular cone plate 65 to swing, circular cone
Swinging back and forth for plate 65 is conducive to the quick drippage of glue and is uniformly taped against on diode lead, and glue is flowed by upper sebific duct 61
Enter into hemispherical Shell 62, then be flowed into circular cone plate 65 from the circular hole one of hemispherical Shell 62, finally by the through-hole on circular cone plate 65
It is added drop-wise on diode lead.
As one embodiment of the present invention, the hemispherical Shell 62 is also equipped with plectane 67, rope 68,69 and of ball
Electromagnetism locking bearing 70, the plectane 67 are located in the circular hole one of hemispherical Shell 62, and plectane 67 passes through one activity installation of rotation axis
On hemispherical Shell 62；The rope 68 is mounted on plectane 67；The ball 69 is mounted on rope 68；The electromagnetism
Locking bearing 70 is mounted in rotation axis one, and electromagnetism locking bearing 70 is used for locking rotation axis one.When micromotor 64 drives half
When spherical shell 62 is swung, ball 69 is swung with hemispherical Shell 62, and ball 69 swings by rope 68 and plectane 67 is pulled to swing, by hemisphere
The circular hole one of shell 62 is opened, and flows out glue from circular hole one；When micromotor 64 stops working, electromagnetism locking bearing 70 is opened
Dynamic, locking rotation axis one makes plectane 67 stop swinging, and realizes and blocks to circular hole one.
As one embodiment of the present invention, the pallet module 7 includes pallet 71, vibration motor 72, vibration bullet
Spring 73, fixed plate 74, brushing board 75 and plugging block 76, the fixed plate 74 are mounted on belt 4；The vibration spring 73
It is fixedly mounted in fixed plate 74；The pallet 71 is mounted on the other end of vibration spring 73, offers inside pallet 71 recessed
Slot；The vibration motor 72 is mounted on the lower section of pallet 71；The brushing board 75 is located in the groove inside pallet 71, brush
Board-washing 75 is mounted on pallet 71 by helical axis；The plugging block 76 is located in 71 groove of pallet, opens among plugging block 76
Equipped with wire lead slot.When work, diode is put into placement plate 79, the lead of diode is passed through from plugging block 76, diode
Two leads be respectively put into two pallets 71, different according to the wire length of diode, mobile brushing board 75 is to pallet
Groove inside 71 is truncated, and the usage amount of glue is saved, and after glue drips on diode lead, vibration motor 72 is opened
It is dynamic, pallet 71 is shaken, the glue in pallet 71 is allowed evenly and rapidly to glue to diode lead；When diode lead has glued
Bi Hou, diode are placed plate 79 and lift, and helical axis makes brushing board 75 mobile driven by the motor, and extra glue is concentrated
To together, utility tray 71 is poured out when turning to 4 lower section of belt.
As one embodiment of the present invention, groove one and groove two, pallet 71 are also provided in the pallet 71
On rack gear 77, gear 78, motor one and placement plate 79 are installed；Rack gear 77 is installed in the groove one；The groove
Gear 78 is installed, gear 78 and rack gear 77 engage in two；The gear axis connection of the motor one and gear 78；Described puts
Plate 79 is set to be fixedly connected with rack gear 77.When work, pallet 71 has transported the lower section of drying module 8 with belt 4, and gear 78 exists
Motor one drives lower rotation, and the rotation band carry-over bar 77 of gear 78 rises, and rack gear 77, which moves up, moves up placement plate 79, puts
Setting plate 79 drives diode to move up, convenient to dry up to diode lead.
As one embodiment of the present invention, the drying module 8 includes telescopic cylinder 2 81, fan cup 82, rotation
Axis 83, semi-circular tube 84, heating coil 85, magnetic patch, telescopic cylinder 3 86 and strut 87, the telescopic cylinder 2 81 are mounted on glue
The lower section of water tank module 3；The rotation axis 83 is mounted on the inside of telescopic cylinder 2 81, and rotation axis 83 is driven by motor；
The fan cup 82 is mounted in rotation axis 83 by cross bar；The semi-circular tube 84 is hinged on the front end of telescopic cylinder 2 81；
The heating coil 85 is located at the inner wall of semi-circular tube 84；The magnetic patch is mounted on the front end of semi-circular tube 84；Described is flexible
Cylinder 3 86 is mounted on 2 81 outer wall of telescopic cylinder；Described 87 one end of strut connects telescopic cylinder 3 86, strut 87 it is another
One end is connected on semi-circular tube 84.When work, telescopic cylinder 2 81 is moved down, and telescopic cylinder 3 86 works, and semi-circular tube 84 will
The lead of diode encases, and magnetic patch facilitates the closure of semi-circular tube 84, and fan cup 82 is rotated driven by the motor, heated simultaneously
Coil 85 works, and quickly dries up to diode lead, improves the glue setting rate of diode lead.
Specific workflow is as follows:
Glue is added in glue tank module 3 from feed opening 2, after glue is added in glue case 32, in water tank 31
Heater strip in wall starts to heat the water in water tank 31, and the water in water tank 31 adds the glue in glue case 32
Heat makes glue be constantly in fluid state, and glue is avoided to solidify；Diode is put into pallet module 7, diode is put into
In placement plate 79, the lead of diode is passed through from plugging block 76, and two leads of diode are respectively put into two pallets 71
Interior, different according to the wire length of diode, the groove inside pallet 71 is truncated in mobile brushing board 75, saves glue
Usage amount, after glue drips on diode lead, vibration motor 72 starts, and shakes pallet 71, allows glue in pallet 71
Evenly and rapidly glued to diode lead；After diode is put into pallet 71, by gluing head module 6 to diode lead into
Row gluing, micromotor 64 drive hemispherical Shell 62 to swing back and forth by shaft 63, and hemispherical Shell 62, which is swung, drives circular cone plate 65 to swing,
Swinging back and forth for circular cone plate 65 is conducive to the quick drippage of glue and is uniformly taped against on diode lead, and glue passes through upper sebific duct
61 are flowed into hemispherical Shell 62, then are flowed into circular cone plate 65 from the circular hole one of hemispherical Shell 62, finally by circular cone plate 65
Through-hole is added drop-wise on diode lead；After the completion of diode lead gluing, pallet 71 has transported drying module 8 with belt 4
Lower section, gear 78 motor one drive under rotate, gear 78 rotation band carry-over bar 77 rise, rack gear 77, which moves up, to be made to place
Plate 79 moves up, and placement plate 79 drives diode to move up, and simultaneous retractable cylinder 2 81 moves down, telescopic cylinder 3 86
Work, semi-circular tube 84 encases the lead of diode, and magnetic patch facilitates the closure of semi-circular tube 84, fan cup 82 driven by the motor into
Row rotation, while heating coil 85 works, and quickly dries up to diode lead, improves the glue solidification speed of diode lead
Degree.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (6)
1. a kind of diode lead sizer, including fixed frame (1), feed opening (2), glue tank module (3), belt (4) and
Belt pulley (5), it is characterised in that: further include gluing head module (6), pallet module (7) and drying module (8), the glue
Tank module (3) is fixedly mounted on fixed frame (1)；The feed opening (2) is located at the top of glue tank module (3), glue case
Module (3) is for containing glue；The belt pulley (5) is mounted on motor shaft；The belt (4) is located at glue tank module
(3) lower section, belt (4) cover on belt pulley (5)；The gluing head module (6) is mounted on the lower section of glue case (32), on
Rubber head module (6) is for gluing diode lead；The pallet module (7) is located at the lower section of glue tank module (3),
Pallet module (7) is mounted on belt (4)；The drying module (8) is mounted on the lower surface of glue tank module (3), drying
Module (8) is located at the right side of gluing head module (6)；
The gluing head module (6) includes upper sebific duct (61), hemispherical Shell (62), shaft (63), micromotor (64), circular cone plate
(65) and rubber membrane, the upper sebific duct (61) are mounted on the lower section of glue tank module (3), upper sebific duct (61) and glue case (32)
It communicates；The micromotor (64) is mounted on the lower end of sebific duct (61)；The shaft (63) is mounted on micromotor
(64) on motor shaft；The hemispherical Shell (62) is mounted on shaft (63), and the bottom of hemispherical Shell (62) offers circular hole one,
Hemispherical Shell (62) is swung with shaft (63)；The circular cone plate (65) is mounted on the lower section of hemispherical Shell (62), circular cone plate (65)
Centre offer through-hole；The rubber membrane is connected on hemispherical Shell (62) and upper sebific duct (61), and rubber membrane is used for gluing
Pipe (61) lower end is sealed.
2. a kind of diode lead sizer according to claim 1, it is characterised in that: the glue tank module
It (3) include water tank (31), glue case (32) and heater strip, the water tank (31) is mounted on fixed frame (1)；The heating
Silk is located in the inner wall of water tank (31)；The glue case (32) is located at the inside of water tank (31).
3. a kind of diode lead sizer according to claim 1, it is characterised in that: the hemispherical Shell (62) is also
Plectane (67), rope (68), ball (69) and electromagnetism locking bearing (70) are installed, the plectane (67) is located at hemispherical Shell
(62) in circular hole one, plectane (67) is movably arranged on hemispherical Shell (62) by rotation axis one；Rope (68) installation
On plectane (67)；The ball (69) is mounted on rope (68)；The electromagnetism locking bearing (70) is mounted on rotation
On axis one, electromagnetism locking bearing (70) is used for locking rotation axis one.
4. a kind of diode lead sizer according to claim 1, it is characterised in that: the pallet module (7)
It is described including pallet (71), vibration motor (72), vibration spring (73), fixed plate (74), brushing board (75) and plugging block (76)
Fixed plate (74) be mounted on belt (4)；The vibration spring (73) is fixedly mounted on fixed plate (74)；The support
Disk (71) is mounted on the other end of vibration spring (73), opens up inside pallet (71) fluted；Vibration motor (72) peace
Mounted in the lower section of pallet (71)；The brushing board (75) is located in the internal groove of pallet (71), and brushing board (75) passes through spiral shell
Spin axis is mounted on pallet (71)；The plugging block (76) is located in pallet (71) groove, offers among plugging block (76)
Wire lead slot.
5. a kind of diode lead sizer according to claim 4, it is characterised in that: in the pallet (71) also
Fluted one and groove two are opened up, rack gear (77), gear (78), motor one and placement plate (79) are installed on pallet (71)；Institute
Rack gear (77) are installed in the groove one stated；It is equipped in the groove two gear (78), gear (78) and rack gear (77) are nibbled
It closes；The gear axis connection of the motor one and gear (78)；The placement plate (79) is fixedly connected with rack gear (77).
6. a kind of diode lead sizer according to claim 1, it is characterised in that: the drying module (8)
Including telescopic cylinder two (81), fan cup (82), rotation axis (83), semi-circular tube (84), heating coil (85), magnetic patch, telescopic cylinder
Three (86) and strut (87), the telescopic cylinder two (81) are mounted on the lower section of glue tank module (3)；The rotation axis
(83) it is mounted on the inside of telescopic cylinder two (81), rotation axis (83) is driven by motor；The fan cup (82) passes through cross bar
It is mounted on rotation axis (83)；The semi-circular tube (84) is hinged on the front end of telescopic cylinder two (81)；The heating coil
(85) it is located at the inner wall of semi-circular tube (84)；The magnetic patch is mounted on the front end of semi-circular tube (84)；The telescopic cylinder three
(86) it is mounted on telescopic cylinder two (81) outer wall；Described strut (87) one end connects telescopic cylinder three (86), strut (87)
The other end be connected on semi-circular tube (84).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810491045.1A CN108636719B (en) | 2018-05-21 | 2018-05-21 | A kind of diode lead sizer |
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| CN201810491045.1A CN108636719B (en) | 2018-05-21 | 2018-05-21 | A kind of diode lead sizer |
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| CN108636719A CN108636719A (en) | 2018-10-12 |
| CN108636719B true CN108636719B (en) | 2019-08-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5567238A (en) * | 1994-12-06 | 1996-10-22 | Coating Machinery Systems, Inc. | Oscillating bed seed coating machine for particulate material |
| CN103931005A (en) * | 2011-09-14 | 2014-07-16 | 玛太克司马特股份有限公司 | Led manufacturing method, led manufacturing device, and led |
| CN206215444U (en) * | 2016-11-03 | 2017-06-06 | 天津市景元机电有限公司 | A kind of Mobile telephone shell spray equipment |
| CN206286147U (en) * | 2016-12-15 | 2017-06-30 | 陈新友 | A kind of local hot melt powder coating equipment |
| CN206401360U (en) * | 2017-02-07 | 2017-08-11 | 东莞市易光电子有限公司 | One kind drying glue dispensing and packaging device |
| CN107297303A (en) * | 2017-07-30 | 2017-10-27 | 合肥杰代机电科技有限公司 | A kind of diode gluing machine for being capable of proper alignment diode |
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Effective date of registration: 20190724 Address after: 223400 North of Yanhuang Avenue, West District of Lianshui Economic Development Zone, Huaian City, Jiangsu Province Applicant after: Lianshui core Ocean Electronic Technology Co., Ltd. Address before: 518031 Room 2102, Metropolitan Xuan, Shenzhen Futian District, Shenzhen City, Guangdong Province, Shenzhen Goodwalk Electronics Co., Ltd. Applicant before: Tang Meixia |
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