CN108630643A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN108630643A CN108630643A CN201810585669.XA CN201810585669A CN108630643A CN 108630643 A CN108630643 A CN 108630643A CN 201810585669 A CN201810585669 A CN 201810585669A CN 108630643 A CN108630643 A CN 108630643A
- Authority
- CN
- China
- Prior art keywords
- radiator
- container
- water inlet
- inlet pipe
- outlet pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 230000004308 accommodation Effects 0.000 claims abstract description 18
- 238000005192 partition Methods 0.000 claims abstract description 16
- 239000011148 porous material Substances 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 210000002435 tendon Anatomy 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 239000007788 liquid Substances 0.000 abstract description 14
- 239000002826 coolant Substances 0.000 abstract description 13
- 239000012141 concentrate Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 4
- 235000010210 aluminium Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiator for transistor radiating, the radiator includes：Container, including mutual corresponding antetheca and rear wall, and the roof and bottom wall of the connection antetheca and rear wall, it is formed with partition board in the container, the container is divided into the first receiving space with the first opening and the second accommodation space with the second opening by the partition board, and the partition board offers the port for being connected to the first receiving space and the second accommodation space；Water inlet pipe is connected with the first receiving space；Outlet pipe is connected with second accommodation space；And it is installed on the container and closes off 2 pieces of floors of first opening and the second opening.Shunting will not be formed after coolant liquid flows into radiator, all coolant liquids are all to concentrate to flow through first receiving space and the second accommodation space and carry out flowing heat dissipation, and flow is big, and heat dissipation effect is excellent so that transistor can be radiated to the greatest extent.
Description
Technical field
The invention belongs to heat spreader structures design fields, more particularly, to a kind of radiator for transistor radiating.
Background technology
In motor inverter, to insulated gate bipolar transistor（IGBT）The high power radiation of this Primary Component is must
Indispensable, often influence the working efficiency of entire motor inverter.It is understood that will be to insulated gate bipolar crystal
Pipe（IGBT）It carries out concentrating heat dissipation being very difficult, conventionally, as centralized integration will be needed in motor inverter
Insulated gate bipolar transistor（IGBT）It concentrates design design difficulty in structure larger with radiator, is accounted for simultaneously
The problem of volume and heat radiation function of radiator, heat spreader structures are relatively fixed and degree of freedom is relatively low, and in radiator
The runner design of coolant liquid and connection also contribute to whether radiator can be insulated gate bipolar transistor（IGBT）It provides excellent
Radiating condition.
Invention content
In order to solve the above-mentioned technical problem, the present invention proposes a kind of radiator for transistor radiating, the heat dissipation
Device includes：
Container, including mutual corresponding antetheca and rear wall, and connect the roof and bottom wall of the antetheca and rear wall, the appearance
It sets and is formed with partition board in box, the container is divided into first receiving space with the first opening and with the by the partition board
Second accommodation spaces of two openings, and the partition board offers the logical of the connection first receiving space and the second accommodation space
Mouthful；
Water inlet pipe is connected with the first receiving space；
Outlet pipe is connected with second accommodation space；And
It is installed on the container and closes off 2 pieces of floors of first opening and the second opening.
As a further improvement on the present invention, the water inlet pipe and outlet pipe are all connected to lean on the bottom wall of the container
Nearby one end of wall, and the port is arranged far from the water inlet pipe and outlet pipe.
As a further improvement on the present invention, the floor protruded out towards the direction for being assembled to the container be formed with it is several
Thermal column, after 2 pieces of floors close off first opening and the second opening, the thermal column is held in described respectively
On partition board.
As a further improvement on the present invention, the roof of the container and bottom wall protrude out shape into the container respectively
The matched tendons of thermal column described in Cheng Youyu.
As a further improvement on the present invention, the radiator includes fixing piece, the fixing piece include with container it
Between the fixing end that is bolted to connection and the outer surface that the floor exposes outward is fixed in transistor pressing
Press-side.
As a further improvement on the present invention, the radiator further includes that part is attached at the outer of floor exposure outward
The potsherd on surface, the radiator include fixing piece, and the fixing piece includes being bolted to connection between container
Fixing end and press-side on the potsherd is fixed in transistor pressing.
As a further improvement on the present invention, which is characterized in that the radiator further includes being attached at 2 pieces of ribs respectively
2 temperature sensors on plate, 2 temperature sensors are arranged respectively close to the water inlet pipe and outlet pipe.
It is special the invention also provides a kind of combined structure of heat radiator, including at least two any radiator as above
Sign is that the combined structure of heat radiator includes connecting platform, and the connecting platform includes corresponding with the radiator quantity
Connection group, each connection group includes being opened on the connecting platform for the water inlet pipe and outlet pipe phase with radiator
2 intercommunicating pores of connection connect by connecting pipeline the water outlet so that between adjacent radiator between the adjacent connection group
It is interconnected between pipe and water inlet pipe.
As a further improvement on the present invention, one end connected between the water inlet pipe and outlet pipe and the intercommunicating pore point
It does not enclose equipped at least one sealing ring.
As a further improvement on the present invention, it is bolted to connection between the radiator and the connecting platform.
Beneficial effects of the present invention：It, will not shape after coolant liquid flows into radiator in technical solution proposed by the present invention
At shunting, all coolant liquids are all to concentrate to flow through first receiving space and the second accommodation space and carry out flowing heat dissipation, flow
Greatly, heat dissipation effect is excellent so that and transistor can be radiated to the greatest extent, while heat dissipation device combination proposed by the present invention,
Quantity and the arrangement to adjust radiator can be adapted to according to the motor inverter of different model, degree of freedom is high, operation
Simply, highly practical.
Description of the drawings
Fig. 1 is an angled arrangement schematic diagram of radiator in one embodiment of the invention；
Fig. 2 is another angled arrangement schematic diagram of radiator in one embodiment of the invention
Fig. 3 is the overall structure diagram of radiator in one embodiment of the invention；
Fig. 4 is the structure sectional view of heat dissipation device combination in one embodiment of the invention.
Specific implementation mode
In order to make those skilled in the art more fully understand the technical solution in the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
The every other embodiment that technical staff is obtained without making creative work, should all belong to protection of the present invention
Range.
In addition, the label repeated or mark may be used in various embodiments.These are repeated only for simple clear
The ground narration present invention, not representing has any relevance between the different embodiments or structure discussed.
It should be noted that in embodiments of the present invention, the antetheca, rear wall, roof, bottom wall etc. are just for the sake of convenient
Illustrate, for explaining the correspondence of antetheca and rear wall, the correspondence of roof and bottom wall, and is not specific to any position and closes
System.
Join shown in Fig. 1 and Fig. 2, the present invention proposes one kind and radiates for transistor 500, especially in motor inverter
Insulated gate bipolar transistor 500（IGBT）The radiator 10 of heat dissipation, the radiator 10 include container 100, specifically,
Container 100 includes mutual corresponding antetheca 110 and rear wall 120, and 130 He of roof of connection antetheca 110 and rear wall 120
Bottom wall 140, in the present embodiment, antetheca 110, rear wall 120, roof 130 and bottom wall 140 surround connection, meanwhile, container 100
Aluminium can be used, concretely ALSI12 (Fe) carries out die casting, or is forged using 6063 aluminiums.
Further, partition board 150 is formed in container 100, container 100 is divided by partition board 150 to be opened with first
Mouthfuls 161 first receiving space 160 and the second accommodation space 170 with the second opening 171, while also being opened up on partition board 150
There is the port 151 of connection first receiving space 160 and the second accommodation space 170.
Radiator 10 further includes having the water inlet pipe 300 being connected with first receiving space 160 and the second accommodation space 170
The outlet pipe 400 being connected, and be installed on container 100 and close off 2 pieces of the first opening 161 and second opening 171
Floor 200.
After 2 pieces of floors 200 are installed on container 100, coolant liquid can flow into first receiving space 160 by water inlet pipe 300,
The second accommodation space 170 is diverted by port 151 again, is finally discharged from outlet pipe 400, it should be noted that due to this reality
Applying water inlet pipe 300 and outlet pipe 400 in example structurally and functionally while having the effect of Inlet and outlet water, in the present embodiment only
Its title is limited in order to facilitate description, in other embodiments of the present invention, also can adjust water inlet pipe 300 according to actual demand
With the functional descriptions of outlet pipe 400.
Particularly, the water inlet pipe 300 in the present embodiment and outlet pipe 400 are all connected to lean on the bottom wall 140 of container 100
Nearby one end of wall 110, and port 151 is arranged far from water inlet pipe 300 and outlet pipe 400, also port 151 is set to
Close to one end of rear wall 120 on partition board 150, so that coolant liquid has most in first receiving space 160 and the second accommodation space 170
Big stream away from, improve the radiating efficiency of radiator 10, meanwhile, shorten the entire length of radiator 10, so reduce with
The overall volume of the mating structural member of radiator 10.
Meanwhile floor 200 protrudes out towards the direction for being assembled to container 100 and is formed with several thermal columns 210, in the present embodiment
In, thermal column 210 and floor 200 are integrally formed design, when 2 pieces of floors 200 are respectively fitted to container 100 and closing first
After opening 161 and the second opening 171, thermal column 210 is held in respectively on partition board 150, also, the floor 200 in the present embodiment
Using aluminium 6063,1060,1070, friction sole can be used in the assembly of forged manufacture, while floor 200 and container 100
The modes such as welding, laser welding, electron beam welding, while also to ensure the requirement for needing to meet air-tightness after welding, so that
Coolant liquid in first receiving space 160 and the second accommodation space 170 is in closed state, and coolant liquid is avoided to leak and cause
Accident.
Meanwhile several tendons are provided with towards protruding out in container 100 respectively on the roof 130 and bottom wall 140 of container 100
180, to coordinate thermal column 210 to increase the contact area between coolant liquid and floor 200 and the inside of container 100, to increase
Strong heat dissipation performance.
Further, in conjunction with shown in Fig. 3, radiator 10 proposed by the invention is mainly used for being directed to insulated gate bipolar
Transistor npn npn 500（IGBT）Heat dissipation, radiator 10 further includes the fixing piece 600 for being useful for fixed transistor 500, fixing piece
600 include the fixing end 610 being bolted to connection between container 100 and the press-side 620 for fixed chip,
In the present embodiment, fixing piece 600 is set as elastic steel sheet；Meanwhile radiator 10 further includes that part is attached at floor 200 outward
Potsherd 700 on exposed outer surface, after fixing piece 600 is fixed on container 100, by press-side 620 by transistor
500 pressings are fixed on potsherd 700, greatly promote the heat dissipation performance of transistor 500, also, in order to ensure transistor 500
High-voltage isulation is further coated with thermal plastic insulation between transistor 500 and potsherd 700.
Radiator 10 in the present invention further includes having the temperature sensor 800 being attached at respectively on 2 pieces of floors 200, and 2
Temperature sensor 800 is arranged respectively close to water inlet pipe 300 and outlet pipe 400, to monitor water inlet pipe 300, outlet pipe 400 in real time
And the temperature of transistor 500, further improve the stability and reliability of system.
Join shown in Fig. 4, includes that at least two is as described above the invention also provides a kind of composite structure of radiator
Radiator 10, meanwhile, combined structure of heat radiator further includes having connecting platform 20, and connecting platform 20 includes and 10 quantity of radiator
Corresponding connection group 21, and each connection group 21 includes to be opened on connecting platform 20 for the water inlet with radiator 10
2 intercommunicating pores 22 that pipe 300 is connected to outlet pipe 400 are connected so that adjacent by connecting pipeline 23 between adjacent connection group 21
Radiator 10 between outlet pipe 400 and water inlet pipe 300 between be interconnected.
Meanwhile the one end connected between water inlet pipe 300 and outlet pipe 400 and intercommunicating pore 22 is enclosed respectively equipped at least one close
Seal further avoids coolant liquid and leaks.
Specifically, 10 composite structure of radiator in the present embodiment is by radiator 10a, radiator 10b and radiator 10c groups
At, 3 groups of connection groups 21 and 2 connecting pipelines 23 are provided on connecting platform 20, it is logical between radiator 10 and connecting platform 20
Bolt is crossed to be fixedly connected, meanwhile, connecting platform 20 is additionally provided with the water inlet manifold being connected with the water inlet pipe 300a of radiator 10a
Road 25 and the outfall sewer road 26 being connected to the outlet pipe 400c of radiator 10c.
The workflow of heat dissipation device combination in the present embodiment is：After 3 radiators are each attached on connecting platform 20,
Coolant liquid is flowed into from water inlet manifold road 25, from water inlet pipe 300a followed by radiator 10a, radiator 10b and radiator 10c,
First receiving space 160 and the second accommodation space 170 between adjacent heat radiation device is set to form series via, then through outlet pipe 400c
Outfall sewer road 26 is flowed into, thus to stationary arrangement in the transistor 500 on radiator 10a, radiator 10b and radiator 10c
It radiates.
In technical solution proposed by the present invention, coolant liquid will not form shunting, all coolings after flowing into radiator 10
Liquid is all to concentrate on carrying out flowing heat dissipation in the runner that one is serially connected, and flow is big, and heat dissipation effect is excellent so that transistor
500 can be radiated to the greatest extent, while heat dissipation device combination proposed by the present invention, can be inverse according to the motor of different model
Become device and be adapted to quantity and arrangement to adjust radiator 10, degree of freedom is high, easy to operate, highly practical.
It should be appreciated that although this specification is described according to embodiment, not each embodiment only includes one only
Vertical technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should be by specification
As a whole, the technical solutions in the various embodiments may also be suitably combined, formed it will be appreciated by those skilled in the art that
Other embodiment.
The series of detailed descriptions listed above is illustrated only for possible embodiments of the invention,
Not to limit the scope of the invention, it is all without departing from equivalent embodiment made by technical spirit of the present invention or change should all
It is included within protection scope of the present invention.
Claims (10)
1. a kind of radiator for transistor radiating, which is characterized in that the radiator includes：
Container, including mutual corresponding antetheca and rear wall, and connect the roof and bottom wall of the antetheca and rear wall, the appearance
It sets and is formed with partition board in box, the container is divided into first receiving space with the first opening and with the by the partition board
Second accommodation spaces of two openings, and the partition board offers the logical of the connection first receiving space and the second accommodation space
Mouthful；
Water inlet pipe is connected with the first receiving space；
Outlet pipe is connected with second accommodation space；And
It is installed on the container and closes off 2 pieces of floors of first opening and the second opening.
2. radiator according to claim 1, which is characterized in that the water inlet pipe and outlet pipe are all connected to described house
Close to one end of antetheca on the bottom wall of box, and the port is arranged far from the water inlet pipe and outlet pipe.
3. radiator according to claim 1, which is characterized in that the floor is convex towards the direction for being assembled to the container
It stretches and is formed with several thermal columns, after 2 pieces of floors close off first opening and the second opening, the thermal column point
It is not held on the partition board.
4. radiator according to claim 3, which is characterized in that the roof and bottom wall of the container are respectively to the appearance
It sets to protrude out in box and be formed with and the matched tendons of the thermal column.
5. radiator according to claim 1, which is characterized in that the radiator includes fixing piece, the fixing piece packet
It includes the fixing end being bolted to connection between container and to be fixed on the floor sudden and violent outward by transistor pressing
The press-side of the outer surface of dew.
6. radiator according to claim 1, which is characterized in that the radiator further includes that part is attached at the floor
The potsherd of exposed outer surface outward, the radiator includes fixing piece, and the fixing piece includes passing through between container
The fixing end and the press-side on the potsherd is fixed in transistor pressing that bolt is fixedly connected.
7. radiator according to claim 1, which is characterized in that the radiator further includes being attached at respectively described in 2 pieces
2 temperature sensors on floor, 2 temperature sensors are arranged respectively close to the water inlet pipe and outlet pipe.
8. a kind of combined structure of heat radiator, including at least two such as claim 1 to 7 it is any as described in radiator, feature exists
In the combined structure of heat radiator includes connecting platform, and the connecting platform includes company corresponding with the radiator quantity
Logical group, each connection group include being opened on the connecting platform for being connected with the water inlet pipe of radiator and outlet pipe
2 intercommunicating pores, connected by connecting pipeline between the adjacent connection group so that outlet pipe between adjacent radiator and
It is interconnected between water inlet pipe.
9. combined structure of heat radiator according to claim 8, which is characterized in that the water inlet pipe and outlet pipe and the company
It is enclosed respectively equipped at least one sealing ring the one end connected between through-hole.
10. combined structure of heat radiator according to claim 8, which is characterized in that the radiator and the connecting platform
Between be bolted to connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810585669.XA CN108630643A (en) | 2018-06-08 | 2018-06-08 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810585669.XA CN108630643A (en) | 2018-06-08 | 2018-06-08 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108630643A true CN108630643A (en) | 2018-10-09 |
Family
ID=63691449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810585669.XA Pending CN108630643A (en) | 2018-06-08 | 2018-06-08 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108630643A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111386009A (en) * | 2018-12-26 | 2020-07-07 | 丰田自动车株式会社 | Electrical device |
| CN113728537A (en) * | 2019-04-25 | 2021-11-30 | 美国轮轴制造公司 | Electric drive module |
| DE102022101510A1 (en) | 2022-01-24 | 2023-07-27 | Semikron Elektronik Gmbh & Co. Kg | power converter arrangement |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2800489Y (en) * | 2005-05-13 | 2006-07-26 | 李达标 | Device for clinging to transistor on radiating fin |
| CN101764110A (en) * | 2009-12-29 | 2010-06-30 | 中国科学院电工研究所 | Radiator of IGBT (Insulated Gate Bipolar Translator) module for electric vehicle or hybrid electric vehicle |
| CN101932219A (en) * | 2009-06-26 | 2010-12-29 | 赫克斯科技股份有限公司 | Water-cooling device and manufacturing method thereof |
| CN202423258U (en) * | 2011-12-29 | 2012-09-05 | 嘉兴市欧迅电器有限公司 | Silicon-controlled radiator |
| KR101282780B1 (en) * | 2012-01-05 | 2013-07-05 | 국방과학연구소 | The cooling equipment for separated multi-phase inverter |
| CN105489574A (en) * | 2016-01-18 | 2016-04-13 | 池州容尔电气科技有限责任公司 | Water-cooled heat radiator of power semiconductor device |
| CN106783766A (en) * | 2017-03-02 | 2017-05-31 | 中国第汽车股份有限公司 | A kind of IGBT power modules of high integration |
| KR20180028109A (en) * | 2016-09-08 | 2018-03-16 | 주식회사 이지트로닉스 | cooling module for Insulated Gate Bipolar Transistors |
| CN207367958U (en) * | 2017-09-28 | 2018-05-15 | 罗立军 | Radiator and the fixing structure of radiator based on transistor |
| CN208753304U (en) * | 2018-06-08 | 2019-04-16 | 苏州加拉泰克动力有限公司 | Radiator and combined structure of heat radiator including it |
-
2018
- 2018-06-08 CN CN201810585669.XA patent/CN108630643A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2800489Y (en) * | 2005-05-13 | 2006-07-26 | 李达标 | Device for clinging to transistor on radiating fin |
| CN101932219A (en) * | 2009-06-26 | 2010-12-29 | 赫克斯科技股份有限公司 | Water-cooling device and manufacturing method thereof |
| CN101764110A (en) * | 2009-12-29 | 2010-06-30 | 中国科学院电工研究所 | Radiator of IGBT (Insulated Gate Bipolar Translator) module for electric vehicle or hybrid electric vehicle |
| CN202423258U (en) * | 2011-12-29 | 2012-09-05 | 嘉兴市欧迅电器有限公司 | Silicon-controlled radiator |
| KR101282780B1 (en) * | 2012-01-05 | 2013-07-05 | 국방과학연구소 | The cooling equipment for separated multi-phase inverter |
| CN105489574A (en) * | 2016-01-18 | 2016-04-13 | 池州容尔电气科技有限责任公司 | Water-cooled heat radiator of power semiconductor device |
| KR20180028109A (en) * | 2016-09-08 | 2018-03-16 | 주식회사 이지트로닉스 | cooling module for Insulated Gate Bipolar Transistors |
| CN106783766A (en) * | 2017-03-02 | 2017-05-31 | 中国第汽车股份有限公司 | A kind of IGBT power modules of high integration |
| CN207367958U (en) * | 2017-09-28 | 2018-05-15 | 罗立军 | Radiator and the fixing structure of radiator based on transistor |
| CN208753304U (en) * | 2018-06-08 | 2019-04-16 | 苏州加拉泰克动力有限公司 | Radiator and combined structure of heat radiator including it |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111386009A (en) * | 2018-12-26 | 2020-07-07 | 丰田自动车株式会社 | Electrical device |
| CN111386009B (en) * | 2018-12-26 | 2022-02-18 | 丰田自动车株式会社 | Electrical device |
| CN113728537A (en) * | 2019-04-25 | 2021-11-30 | 美国轮轴制造公司 | Electric drive module |
| CN113728537B (en) * | 2019-04-25 | 2024-04-12 | 美国轮轴制造公司 | Electric drive module |
| DE102022101510A1 (en) | 2022-01-24 | 2023-07-27 | Semikron Elektronik Gmbh & Co. Kg | power converter arrangement |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211223 Address after: 215312 No. 288, Shipai Rui'an Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou jiaxinchuang Microelectronics Co.,Ltd. Address before: 215000 No. 9, Shek Yang Road, hi tech Zone, Suzhou, Jiangsu Applicant before: SUZHOU GALA TECH POWER Co.,Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181009 |