CN108629253B - Fingerprint Identification Device - Google Patents

Fingerprint Identification Device Download PDF

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Publication number
CN108629253B
CN108629253B CN201710183302.0A CN201710183302A CN108629253B CN 108629253 B CN108629253 B CN 108629253B CN 201710183302 A CN201710183302 A CN 201710183302A CN 108629253 B CN108629253 B CN 108629253B
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light
image sensing
sensing chip
refraction
identification device
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CN108629253A (en
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王炯翰
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FocalTech Systems Ltd
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FocalTech Systems Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/1341Sensing with light passing through the finger

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

The invention discloses a fingerprint identification device, which comprises a cover plate, an image sensing chip, a light guide part, at least one light emitting part, a collimating part and a light folding part. The image sensing chip is positioned on one side of the cover plate; the light guide piece covers the image sensing chip and comprises a light inlet surface and a light outlet surface, and the light outlet surface is provided with a microstructure; the light emitting element is arranged adjacent to the light incident surface. The collimating component is positioned between the light-emitting surface and the image sensing chip, and the refraction component is positioned between the collimating component and the image sensing chip and comprises a plurality of refraction structures; the outer diameter of the refraction structure is gradually reduced to form sharp angles with the distance from the collimation piece, and the angles of the sharp angles are gradually increased with the distance from the central line of the refraction piece.

Description

指纹辨识装置Fingerprint Identification Device

技术领域technical field

本发明涉及用于阅读或辨识图型的装置,且特别涉及一种指纹辨识装置。The present invention relates to a device for reading or identifying patterns, and more particularly, to a fingerprint identification device.

背景技术Background technique

指纹辨识技术因具有良好的防盗及个人隐私保护功能,被广泛地应用于各种电子器件中,以防止电子器件遭盗用。Fingerprint identification technology is widely used in various electronic devices because of its good anti-theft and personal privacy protection functions to prevent electronic devices from being stolen.

在过去,指纹辨识装置中的影像感测芯片的尺寸主要依据受感测区域的尺寸而定。更具体言之,受感测区域愈小,则影像感测芯片的尺寸也愈小;反之,受感测区域愈大,则影像感测芯片的尺寸也愈大,且影像感测芯片的尺寸会相同于受感测区域的尺寸,藉以提高影像感测芯片的解析能力。然而,大尺寸的影像感测芯片具有高成本及大体积等缺点。In the past, the size of the image sensor chip in the fingerprint recognition device was mainly determined by the size of the sensing area. More specifically, the smaller the sensing area is, the smaller the size of the image sensing chip is; conversely, the larger the sensing area is, the larger the size of the image sensing chip is, and the size of the image sensing chip is also larger. It will be the same as the size of the sensing area, so as to improve the resolution capability of the image sensor chip. However, large-sized image sensor chips have disadvantages such as high cost and large volume.

发明内容SUMMARY OF THE INVENTION

本发明的目的,在于提供一种指纹辨识装置,其可缩减影像感测芯片的尺寸来达到降低成本的效果。The purpose of the present invention is to provide a fingerprint identification device, which can reduce the size of the image sensor chip to reduce the cost.

本发明提供的一种指纹辨识装置,具有一手指感测区域并包含一盖板、一影像感测芯片、一导光件、至少一发光件、一准直件及一折光件。影像感测芯片位于盖板的一侧;导光件罩设影像感测芯片并包含一入光面及一出光面,出光面设置有一微结构;发光件设置邻近于入光面。准直件位于出光面及影像感测芯片之间,折光件位于准直件及影像感测芯片之间并包含多个折光结构;所述折光结构的外径随着远离准直件渐缩形成一尖角,且所述折光结构的尖角的角度随着远离折光件的中心线而逐渐增加。A fingerprint identification device provided by the present invention has a finger sensing area and includes a cover plate, an image sensing chip, a light guide member, at least one light-emitting member, a collimating member and a light-refracting member. The image sensing chip is located on one side of the cover plate; the light guide element covers the image sensing chip and includes a light incident surface and a light emitting surface, the light emitting surface is provided with a microstructure; the light emitting element is arranged adjacent to the light incident surface. The collimating member is located between the light-emitting surface and the image sensing chip, and the refractive member is located between the collimating member and the image sensing chip, and includes a plurality of refractive structures; the outer diameter of the refractive structures is formed by tapering as it moves away from the collimating member. A sharp corner, and the angle of the sharp corner of the refractive structure gradually increases as it moves away from the center line of the refractive element.

在本发明的一实施方式中,影像感测芯片包含多个感测像素,当影像感测芯片于所述的感测像素的光轴构成的横截面上的长度为a,手指感测区域于横截面上的长度为b时,满足下列条件:b≥2a。In one embodiment of the present invention, the image sensing chip includes a plurality of sensing pixels. When the length of the cross section of the image sensing chip formed by the optical axis of the sensing pixels is a, the finger sensing area is at When the length of the cross section is b, the following conditions are met: b ≥ 2a.

在本发明的一实施方式中,所述的感测像素的数量相同于所述折光结构的数量In an embodiment of the present invention, the number of the sensing pixels is the same as the number of the refractive structures

在本发明的一实施方式中,所述的感测像素小于所述折光结构的数量。In an embodiment of the present invention, the number of the sensing pixels is smaller than the number of the refractive structures.

在本发明的一实施方式中,指纹辨识装置更包含多个微透镜,所述的微透镜分别设于所述的感测像素上。In one embodiment of the present invention, the fingerprint identification device further includes a plurality of microlenses, and the microlenses are respectively disposed on the sensing pixels.

在本发明的一实施方式中,准直件包含多个遮光部及多个透光部,所述的遮光部及所述的透光部呈交错排列,且所述的透光部对应于所述的折光结构设置。In an embodiment of the present invention, the collimator includes a plurality of light-shielding parts and a plurality of light-transmitting parts, the light-shielding parts and the light-transmitting parts are arranged in a staggered manner, and the light-transmitting parts correspond to the light-transmitting parts. The refraction structure described above is set.

在本发明的一实施方式中,折光件更包含一基部,所述的折光结构设于基部上,且所述的折光结构的外径随着远离基部渐缩形成尖角。In an embodiment of the present invention, the refractive element further includes a base, the refractive structure is disposed on the base, and the outer diameter of the refractive structure tapers away from the base to form a sharp corner.

在本发明的一实施方式中,折光结构的外表面为一平面或一曲面。In an embodiment of the present invention, the outer surface of the refractive structure is a plane or a curved surface.

在本发明的一实施方式中,指纹辨识装置更包含一光整型件,设于出光面及准直件之间。In an embodiment of the present invention, the fingerprint identification device further includes a light shaping member disposed between the light emitting surface and the collimating member.

在本发明的一实施方式中,指纹辨识装置更包含一第一黏着件及第二黏着件,第一黏着件设于盖板及出光面之间,第二黏着件设于出光面及准直件之间。In one embodiment of the present invention, the fingerprint identification device further includes a first adhesive member and a second adhesive member, the first adhesive member is disposed between the cover plate and the light-emitting surface, and the second adhesive member is disposed on the light-emitting surface and the collimator between pieces.

本发明藉由折光件的折光结构来转折于手指感测区域产生的反射光束的角度,使影像感测芯片的尺寸得以缩减,达到降低成本的效果。In the present invention, the angle of the reflected light beam generated in the finger sensing area is refracted by the refracting structure of the refracting element, so that the size of the image sensing chip can be reduced, and the effect of cost reduction is achieved.

以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

附图说明Description of drawings

图1绘示依照本发明第一实施方式的数字电子器件的俯视图;1 is a top view of a digital electronic device according to a first embodiment of the present invention;

图2绘示依照本发明第一实施方式的指纹辨识装置的剖视图;2 is a cross-sectional view of a fingerprint identification device according to a first embodiment of the present invention;

图3绘示依照本发明第一实施方式的准直件及折光件的剖视图;3 is a cross-sectional view of the collimating member and the refracting member according to the first embodiment of the present invention;

图4绘示依照本发明第二实施方式的指纹辨识装置的剖视图;以及4 is a cross-sectional view of a fingerprint identification device according to a second embodiment of the present invention; and

图5绘示依照本发明第二实施方式的准直件及折光件的剖视图。FIG. 5 is a cross-sectional view of a collimating member and a refracting member according to a second embodiment of the present invention.

附图标记reference number

1 数字电子器件1 Digital Electronics

10 壳体10 Housing

11 屏幕11 screens

12 指纹辨识装置12 Fingerprint identification device

123 手指感测区域123 Finger sensing area

124 基板124 substrates

1240 上表面1240 top surface

126 盖板126 Cover

1260 内表面1260 inner surface

1262 外表面1262 External surface

128 影像感测芯片128 Image Sensor Chip

1280 感测像素1280 sensing pixels

1282 电极1282 Electrodes

130 发光件130 Lights

132 导光件132 Light guide

1320 入光部1320 light entrance

1321 入光面1321 light incident surface

1322 导光部1322 Light guide

1323 出光面1323 light-emitting surface

1324 微结构1324 Microstructure

1326 凹槽1326 Groove

133 容置空间133 accommodating space

134 准直件134 Collimator

1340 遮光部1340 Shading part

1342 透光部1342 Translucent part

136 折光件136 Refractors

1360 基部1360 base

1362 折光结构1362 refractive structure

137 导线137 wires

138 光整型件138 Light Shaping Parts

139 黏着剂139 Adhesives

140 第一黏着件140 first adhesive

142 第二黏着件142 Second adhesive

144 微透镜144 Micro lenses

C 中心线C Centerline

I 光轴I Optical axis

具体实施方式Detailed ways

请参见图1,其绘示依照本发明第一实施方式的数字电子器件的俯视图。数字电子器件1可为一智能型电话、一平板型电脑、个人电脑、个人数字助理、媒体播放器及其它静止及携带型电子器件;数字电子器件1包含一壳体10、一屏幕11及一指纹辨识装置12;屏幕11及指纹辨识装置12分别露出于壳体10外,屏幕11用以显示信息给使用者观看并供使用者以触控的方式操作;指纹辨识装置12用以对使用者的身份执行指纹认证功能,藉以增加数字电子器件1的使用安全性。Please refer to FIG. 1 , which shows a top view of a digital electronic device according to a first embodiment of the present invention. The digital electronic device 1 can be a smart phone, a tablet computer, a personal computer, a personal digital assistant, a media player and other stationary and portable electronic devices; the digital electronic device 1 includes a casing 10, a screen 11 and a The fingerprint identification device 12; the screen 11 and the fingerprint identification device 12 are respectively exposed outside the casing 10. The screen 11 is used to display information for the user to watch and operate by touch; the fingerprint identification device 12 is used to display information to the user. The identity of the device performs fingerprint authentication, thereby increasing the security of the digital electronic device 1 .

请参见图2,其绘示依照本发明第一实施方式的指纹辨识装置的剖视图,其剖视位置为沿图1所示的线段2。指纹辨识装置12具有一手指感测区域123,手指感测区域123的大小可经设定以撷取单手手指的指纹。在图2中,指纹辨识装置12包含一盖板126、一影像感测芯片128、至少一发光件130、一导光件132、一准直件134及一折光件136,其等配合拾取使用者的指纹信息并对指纹信息进行认证。Please refer to FIG. 2 , which is a cross-sectional view of the fingerprint identification device according to the first embodiment of the present invention, the cross-sectional position of which is along the line segment 2 shown in FIG. 1 . The fingerprint recognition device 12 has a finger sensing area 123 , and the size of the finger sensing area 123 can be set to capture the fingerprint of a finger of a single hand. In FIG. 2 , the fingerprint identification device 12 includes a cover plate 126 , an image sensing chip 128 , at least one light-emitting element 130 , a light-guiding element 132 , a collimating element 134 and a light-refracting element 136 , which are used in conjunction with pickup. The fingerprint information of the user is verified and the fingerprint information is authenticated.

盖板126具有一内表面1260及一外表面1262,内表面1260与外表面1262相对,且外表面1262为指纹辨识装置12的触控操作面;换言之,使用者以其手指碰触盖板126的外表面1262,以进行指纹拾取及认证。盖板126可为具有高机械强度及高穿透率的基板(例如:玻璃基板),高机械强度主要用以避免因手指的按压或其它外力冲击而损害到位于盖板126下方的元件,高穿透率则可避免遮蔽来自发光件130的光束。The cover plate 126 has an inner surface 1260 and an outer surface 1262, the inner surface 1260 is opposite to the outer surface 1262, and the outer surface 1262 is the touch operation surface of the fingerprint identification device 12; in other words, the user touches the cover plate 126 with his finger the outer surface 1262 for fingerprint pickup and authentication. The cover plate 126 can be a substrate with high mechanical strength and high transmittance (for example, a glass substrate). The transmittance can avoid blocking the light beam from the light-emitting element 130 .

影像感测芯片128位于盖板126的一侧,适于接收在手指感测区域123被手指反射的光束所产生指纹信息并对指纹信息进行认证。影像感测芯片128可安装在基板124的上表面1240,并通过跨接在影像感测芯片128的电极1282(如图3所示)及上表面1240的导线137而与基板124上的电路布线(图中未示)形成电性连接;指纹信息认证结果可通过形成在基板124上的电路布线传递至屏幕11以进行显示。影像感测芯片128可包含一电荷耦合元件(Charge-Coupled Device;简称CCD)或一互补式金属氧化物半导体(Complementary MetalOxide Semiconductor;简称CMOS)元件。The image sensor chip 128 is located on one side of the cover plate 126 and is adapted to receive fingerprint information generated by the light beam reflected by the finger in the finger sensing area 123 and authenticate the fingerprint information. The image sensor chip 128 can be mounted on the upper surface 1240 of the substrate 124 and is connected to the circuit on the substrate 124 by connecting the electrodes 1282 of the image sensor chip 128 (as shown in FIG. 3 ) and the wires 137 on the upper surface 1240 (not shown in the figure) electrical connection is formed; the authentication result of the fingerprint information can be transmitted to the screen 11 through the circuit wiring formed on the substrate 124 for display. The image sensor chip 128 may include a Charge-Coupled Device (CCD for short) or a Complementary Metal Oxide Semiconductor (CMOS for short) device.

如图1所示,影像感测芯片128可呈矩形,且其上可包含彼此隔开地排成一阵列的多个感测像素1280(如图3所示);其中,感测像素1280适于接收被手指反射的光束并产生指纹信息。As shown in FIG. 1 , the image sensing chip 128 may be rectangular, and may include a plurality of sensing pixels 1280 (as shown in FIG. 3 ) spaced apart and arranged in an array thereon; wherein, the sensing pixels 1280 are suitable for It is used to receive the light beam reflected by the finger and generate fingerprint information.

每个感测像素1280具有一光轴I,所有感测像素1280的光轴I排列在一横截面上(例如沿图1所示的线段2的剖视);当影像感测芯片128在前述横截面上的长度为a,手指感测区域123在前述横截面上的长度为b时,满足下列条件:Each sensing pixel 1280 has an optical axis I, and the optical axes I of all the sensing pixels 1280 are arranged in a cross section (for example, a cross section along the line segment 2 shown in FIG. 1 ); when the image sensor chip 128 is in the aforementioned When the length of the cross section is a, and the length of the finger sensing region 123 on the aforementioned cross section is b, the following conditions are satisfied:

b≥2a。b≥2a.

发光件130设于基板124的上表面1240,并位于影像感测芯片128旁。图2示意性地绘示两个发光件130,且两个发光件130分别配置在影像感测芯片128的左右两侧;在实际实施时,发光件130的数量及其等与影像感测芯片128的相对配置关系并不限于图2所绘示者,且指纹辨识装置1包含多个发光件130,这些发光件130可例如是等角度地设在影像感测芯片128旁。发光件130适于朝导光件132的一入光面1321发出光束。发光件130可例如为发光二极管,并供产生非可见光束(例如红外光束)。The light-emitting element 130 is disposed on the upper surface 1240 of the substrate 124 and beside the image sensor chip 128 . FIG. 2 schematically shows two light-emitting elements 130, and the two light-emitting elements 130 are respectively disposed on the left and right sides of the image sensor chip 128; in actual implementation, the number of light-emitting elements 130 and the number of the light-emitting elements 130 are related to the image sensor chip. The relative disposition relationship of the 128 is not limited to that shown in FIG. 2 , and the fingerprint identification device 1 includes a plurality of light-emitting elements 130 , and the light-emitting elements 130 may be disposed beside the image sensor chip 128 equiangularly, for example. The light emitting element 130 is adapted to emit light beams toward a light incident surface 1321 of the light guide element 132 . The light emitting element 130 can be, for example, a light emitting diode, and is used to generate a non-visible light beam (eg, an infrared light beam).

导光件132可透光,其设于基板124及盖板126之间并罩设影像感测芯片128;导光件132除了可将发光件130产生的光束引导至手指感测区域123之外,还可引导被手指反射的光束(以下称反射光线),使反射光束能通过准直件134及折光件136传递至影像感测芯片128。The light guide 132 can transmit light, is disposed between the substrate 124 and the cover plate 126 and covers the image sensing chip 128 ; the light guide 132 can guide the light beam generated by the light emitting element 130 to the finger sensing area 123 except for , the light beam reflected by the finger (hereinafter referred to as the reflected light beam) can also be guided, so that the reflected light beam can be transmitted to the image sensor chip 128 through the collimating member 134 and the refracting member 136 .

在图2中,导光件132使用高穿透率的材料制作而成,并包含一入光部1320、一导光部1322及多个微结构1324。入光部1320可呈环型,其一端连接于导光部1322,另一端设于基板124的上表面1240。如图2所示,入光部1320的入光面1321可形成有朝向导光部1322的方向凹陷的多个凹槽1326,以供发光件130容设于其中,藉以增加发光件130发出的光束进入入光部1320的机率。凹槽1326的数量相同于发光件130的数量。入光部1320设于基板124上,用以将导光部1322具有一定距离地撑立于基板124上,影像感测芯片128、准直件134及折光件136分别位于基板124、入光部1320及导光部1322配合界定的一容置空间133中。In FIG. 2 , the light guide member 132 is made of a material with high transmittance, and includes a light incident portion 1320 , a light guide portion 1322 and a plurality of microstructures 1324 . The light incident portion 1320 can be in a ring shape, one end of which is connected to the light guide portion 1322 and the other end is disposed on the upper surface 1240 of the substrate 124 . As shown in FIG. 2 , the light incident surface 1321 of the light incident portion 1320 may be formed with a plurality of grooves 1326 recessed toward the direction of the light guide portion 1322 for accommodating the light emitting element 130 therein, thereby increasing the amount of light emitted by the light emitting element 130 . The probability of the light beam entering the light incident part 1320 . The number of the grooves 1326 is the same as the number of the light-emitting elements 130 . The light incident portion 1320 is disposed on the substrate 124 for supporting the light guide portion 1322 on the substrate 124 with a certain distance. The image sensor chip 128 , the collimating member 134 and the refracting member 136 are respectively located on the substrate 124 and the light incident portion. 1320 and the light guide portion 1322 fit into a defined accommodating space 133 .

进一步地,入光部1320的外径随着由基板124往盖板126的方向逐渐缩减,使导光件132的侧剖视大致呈梯型;藉此,可以使让发光件130发出的光束得以传递至手指感测区域123。在本发明中,入光部1320及导光部1322可为一体成型;导光部1322的顶面可通过一第一黏着件140而贴附于盖板126的内表面1260。第一黏着件140呈透明状,且其折射率可例如是相同于盖板126的折射率。Further, the outer diameter of the light incident portion 1320 is gradually reduced in the direction from the base plate 124 to the cover plate 126 , so that the side cross-sectional view of the light guide member 132 is roughly trapezoidal; thereby, the light beam emitted by the light emitting member 130 can be It is transmitted to the finger sensing area 123 . In the present invention, the light incident portion 1320 and the light guide portion 1322 can be integrally formed; the top surface of the light guide portion 1322 can be attached to the inner surface 1260 of the cover plate 126 through a first adhesive member 140 . The first adhesive member 140 is transparent, and its refractive index can be, for example, the same as that of the cover plate 126 .

导光件132更包含一出光面1323,其为导光部1322远离盖板126的表面;在本实施方式中,出光面1323的法线方向平行于入光面1321的法线方向。微结构1324设于出光面1323,且微结构1324与导光部1322可为一体成形。如图2所示,微结构1324可为由出光面1323凹入导光部1322的锯齿状结构;在实际实施时,微结构1324也不排除可以是凸出于出光面1323的锯齿状结构、柱状结构或棱镜结构。The light guide member 132 further includes a light exit surface 1323 , which is the surface of the light guide portion 1322 away from the cover plate 126 ; in this embodiment, the normal direction of the light exit surface 1323 is parallel to the normal direction of the light incident surface 1321 . The microstructure 1324 is disposed on the light exit surface 1323, and the microstructure 1324 and the light guide portion 1322 can be integrally formed. As shown in FIG. 2 , the microstructure 1324 may be a sawtooth structure in which the light exit surface 1323 is recessed into the light guide portion 1322 ; in actual implementation, the microstructure 1324 may also be a sawtooth structure protruding from the light exit surface 1323 , Columnar structure or prismatic structure.

发光件130及导光件132配合产生传递至手指感测区域132的光束;发光件130产生的光束主要经由的入光面1321进入入光部1320,再传递至导光部1322;其中,进入导光部1322的光线传播路径有二:其一直接经导光部1322折射后通过盖板126传递至位于手指感测区域123内的使用者手指,另一则以全内反射的方式于导光部1322内来回传递,直至微结构1324使光束的传播角小于全内反射的临界角,光束才得以通过盖板126传递至位于手指感测区域123内的使用者手指。申言之,微结构1324用以抑制光束以全内反射方式不断在导光部1322中传递。被手指反射的光束(即反射光束)由出光面123出射,并依序通过准直件134及折光件136传递至影像感测芯片128。The light emitting element 130 and the light guide element 132 cooperate to generate a light beam transmitted to the finger sensing area 132; the light beam generated by the light emitting element 130 mainly enters the light incident portion 1320 through the light incident surface 1321, and then is transmitted to the light guide portion 1322; There are two light propagation paths of the light guide portion 1322: one is directly refracted by the light guide portion 1322 and then transmitted to the user's finger located in the finger sensing area 123 through the cover plate 126, and the other is transmitted to the guide portion by total internal reflection. The light portion 1322 is transmitted back and forth until the propagation angle of the light beam is smaller than the critical angle of total internal reflection by the microstructure 1324 , and the light beam can be transmitted to the user's finger located in the finger sensing area 123 through the cover plate 126 . In other words, the microstructure 1324 is used to restrain the light beam from being continuously transmitted in the light guide portion 1322 by total internal reflection. The light beam reflected by the finger (ie, the reflected light beam) is emitted from the light emitting surface 123 and transmitted to the image sensor chip 128 through the collimating member 134 and the refracting member 136 in sequence.

准直件134位于导光件132的出光面1323及影像感测芯片128之间,并可通过一第二黏着件142而贴附于导光件132。手指感测区域123的长度可大致相同于准直件134的长度。准直件134可恰好碰触微结构1324的底端,以避免反射光束在通过导光部1322之后,直接传递至基板124(意即未通过准直件134及折光件136即传递至基板124),造成影像感测芯片128的对比度及影像品质不佳的问题。此外,当第二黏着件142附着于微结构1324时,除了让微结构1324无法抑制光束以全内反射的方式在导光部1322中传递,还可能让部分未经过手指反射的光束向下折射并传递至影像感测芯片128,而让影像感测芯片128产生错误的指纹信息。因此,在组装时,应避免用以将准直件134固定于导光件132上的第二黏着件142附着于微结构1324;在图2中,第二黏着件1324设于入光部1320邻近于出光面1323的位置。第二黏着件142可例如于光固化胶(例如紫外光固化胶)。The collimating member 134 is located between the light-emitting surface 1323 of the light guide member 132 and the image sensing chip 128 , and can be attached to the light guide member 132 through a second adhesive member 142 . The length of the finger sensing region 123 may be approximately the same as the length of the collimator 134 . The collimating member 134 can just touch the bottom end of the microstructure 1324 to prevent the reflected light beam from being directly transmitted to the substrate 124 after passing through the light guide portion 1322 (that is, it is transmitted to the substrate 124 without passing through the collimating member 134 and the refracting member 136 ). ), resulting in problems of poor contrast and image quality of the image sensor chip 128 . In addition, when the second adhesive member 142 is attached to the microstructure 1324, in addition to preventing the microstructure 1324 from inhibiting the light beam from being transmitted in the light guide portion 1322 by total internal reflection, it can also allow part of the light beam that has not been reflected by the finger to be refracted downward. and transmitted to the image sensor chip 128, so that the image sensor chip 128 generates wrong fingerprint information. Therefore, during assembly, the second adhesive member 142 for fixing the collimator 134 on the light guide member 132 should be avoided from being attached to the microstructure 1324; in FIG. A position adjacent to the light-emitting surface 1323 . The second adhesive member 142 can be, for example, a photocurable adhesive (eg, UV curable adhesive).

准直件134用于限制由出光面1323出射的反射光束传输至折光件136的入光面积。请参见图3,准直件134包含多个遮光部1340及多个透光部1342,透光部1342排列在相邻二遮光部1340之间;换言之,遮光部1340及透光部1342呈交错排列。The collimating member 134 is used to limit the reflected light beam emitted from the light exit surface 1323 to transmit to the light incident area of the refracting member 136 . Referring to FIG. 3 , the collimator 134 includes a plurality of light-shielding parts 1340 and a plurality of light-transmitting parts 1342 , and the light-transmitting parts 1342 are arranged between two adjacent light-shielding parts 1340 ; in other words, the light-shielding parts 1340 and the light-transmitting parts 1342 are staggered arrangement.

在反射光束中,以大角度入射者会受到排列在透光部1342两侧的遮光部1340阻挡而无法传递至折光件136,而以小角度入射者可直接通过透光部1342传递至折光件136。在此,定义通过准直件134的光束为准直光束。此外,透光部1342的数量经设计使相同于感测像素1280的数量,意即通过单一透光部1342的准直光束用以供单一感测像素1280产生指纹信息;再者,调整准直件134的长度L及透光部1342的口径ψ,可以调整准直光束传输至折光件136的入光面积。Among the reflected light beams, those incident at a large angle will be blocked by the light shielding portions 1340 arranged on both sides of the light-transmitting portion 1342 and cannot be transmitted to the refractive element 136 , while those incident at a small angle can be directly transmitted to the refractive element through the light-transmitting portion 1342 136. Here, the light beam passing through the collimator 134 is defined as a collimated light beam. In addition, the number of the light-transmitting parts 1342 is designed to be the same as the number of the sensing pixels 1280, that is, the collimated light beam passing through the single light-transmitting part 1342 is used for the single sensing pixel 1280 to generate fingerprint information; furthermore, the collimation is adjusted. The length L of the member 134 and the aperture ψ of the light-transmitting portion 1342 can adjust the light incident area of the collimated beam transmitted to the refracting member 136 .

折光件136设于准直件134及影像感测芯片128之间,并具有一间隔地位于影像感测芯片128上方。折光件136接收准直光束,并用以将通过透光部1342的准直光束会聚于影像感测芯片128的感测像素1280。折光件136的厚度T可为50~200微米。The refracting member 136 is disposed between the collimating member 134 and the image sensing chip 128 , and is located above the image sensing chip 128 with an interval. The refracting member 136 receives the collimated light beam, and is used for condensing the collimated light beam passing through the light-transmitting portion 1342 to the sensing pixels 1280 of the image sensing chip 128 . The thickness T of the refractive element 136 may be 50˜200 μm.

在图3中,折光件136包含一基部1360及多个折光结构1362;基部1360为一透光片,其可通过黏着剂139而贴附于准直件134,并可例如以聚对苯二甲酸乙二酯(polyethyleneterephthalate;简称PET)等高分子材料制作而成。折光结构1362设于基板1360上,且其外径随着远离基部1360而渐缩形成一尖角;折光结构1362可例如由光固化胶制作而成。折光结构1362的外表面为平面。In FIG. 3 , the refractive element 136 includes a base portion 1360 and a plurality of refractive structures 1362 ; the base portion 1360 is a light-transmitting sheet, which can be attached to the collimating member 134 by an adhesive 139 , and can be made of polyethylene terephthalate for example. It is made of polymer materials such as ethylene formate (polyethyleneterephthalate; PET for short). The refractive structure 1362 is disposed on the substrate 1360, and its outer diameter tapers away from the base 1360 to form a sharp corner; the refractive structure 1362 can be made of, for example, a photocurable adhesive. The outer surface of the refractive structure 1362 is flat.

折光结构1362的数量相同于感测像素1280的数量,折光结构136的尖角的角度随着远离折光件136的中心线C而逐渐增加,以让远离折光件136的中心线C的准直光束转折大角度后会聚于相对应的感测像素1280,而靠近折光件136的中心线C的准直光束转折小角度后会聚于相对应的感测像素1280。The number of the refractive structures 1362 is the same as the number of the sensing pixels 1280 , and the angle of the sharp corners of the refractive structures 136 gradually increases with the distance from the center line C of the refractive element 136 , so as to allow the collimated light beams far from the center line C of the refractive element 136 The collimated light beam close to the centerline C of the refractive element 136 converges on the corresponding sensing pixel 1280 after being turned by a large angle and then converges to the corresponding sensing pixel 1280 .

综合前述,在本发明的指纹辨识装置中,发光件130产生的光束由入光面1321进入导光件132并传递至手指感测区123;由使用者手指反射前述光线所产生的反射光束依序通过出光面1323、准直件134及折光件136对焦于影像感测芯片128的感测像素1280。其中,通过本发明通过折光件136上的折光结构1362,可以改变通过准直件134的准直光束入射到感测像素1280的角度,达到缩小影像感测芯片128的长度的效果。To sum up the above, in the fingerprint identification device of the present invention, the light beam generated by the light emitting element 130 enters the light guide element 132 from the light incident surface 1321 and is transmitted to the finger sensing area 123; The light-emitting surface 1323 , the collimating member 134 and the refracting member 136 are sequentially focused on the sensing pixels 1280 of the image sensing chip 128 . Wherein, through the refractive structure 1362 on the refractive element 136 of the present invention, the angle at which the collimated light beam passing through the collimating element 134 is incident on the sensing pixel 1280 can be changed to achieve the effect of reducing the length of the image sensing chip 128 .

请参见图4,其绘示依照本发明第二实施方式的指纹辨识装置的剖视图。图4所绘示的指纹辨识装置12应用于如图1所示的数字电子器件1中,用以对使用者的身份执行指纹认证功能,达到增加数字电子器件1使用安全性的效果。Please refer to FIG. 4 , which is a cross-sectional view of a fingerprint identification device according to a second embodiment of the present invention. The fingerprint identification device 12 shown in FIG. 4 is applied to the digital electronic device 1 shown in FIG. 1 to perform a fingerprint authentication function on the user's identity, thereby increasing the security of the digital electronic device 1 .

指纹辨识装置12设于一基板124的一上表面1240,并用以拾取的指纹信息并对指纹信息进行认证。指纹辨识装置12包含一盖板126、一影像感测芯片128、多个发光件130、一导光件132、一准直件134及一折光件136。The fingerprint identification device 12 is disposed on an upper surface 1240 of a substrate 124 and is used for picking up fingerprint information and authenticating the fingerprint information. The fingerprint identification device 12 includes a cover plate 126 , an image sensor chip 128 , a plurality of light emitting elements 130 , a light guide element 132 , a collimation element 134 and a light refraction element 136 .

盖板126的一外表面1262为指纹辨识装置12的触控操作面;使用者以其手指碰触外表面1262,以进行指纹拾取及认证。An outer surface 1262 of the cover plate 126 is the touch operation surface of the fingerprint identification device 12 ; the user touches the outer surface 1262 with his fingers to perform fingerprint pickup and authentication.

影像感测芯片128位于盖板126的一侧,适于接收于一手指感测区域123内被手指反射的光束(以下称反射光束)以产生指纹信息并进行认证。影像感测芯片128安装在基板124一上表面1240。The image sensor chip 128 is located on one side of the cover plate 126 and is adapted to receive a light beam (hereinafter referred to as a reflected light beam) reflected by a finger in a finger sensing area 123 to generate fingerprint information and perform authentication. The image sensor chip 128 is mounted on an upper surface 1240 of the substrate 124 .

影像感测芯片128呈矩形(如图1所示),且其上可包含彼此隔开地排成一阵列的多个感测像素1280,如图5所示;感测像素1280适于接收被指纹反射的光束并产生指纹信息。每个感测像素1280具有一光轴I,所有感测像素1280的光轴I排列在一横截面上(例如沿图1所示的线段2的剖视);当影像感测芯片128在前述的横截面的长度为a,手指感测区域123在前述的横截面的长度为b时,满足下列条件:The image sensor chip 128 is rectangular (as shown in FIG. 1 ), and can include a plurality of sensing pixels 1280 spaced apart from each other and arranged in an array, as shown in FIG. 5 ; the sensing pixels 1280 are suitable for receiving The fingerprint reflects the light beam and generates the fingerprint information. Each sensing pixel 1280 has an optical axis I, and the optical axes I of all the sensing pixels 1280 are arranged in a cross section (for example, a cross section along the line segment 2 shown in FIG. 1 ); when the image sensor chip 128 is in the aforementioned The length of the cross section is a, and the finger sensing area 123 satisfies the following conditions when the length of the aforementioned cross section is b:

b≥2a。b≥2a.

发光件130设于基板124上,并位于影像感测芯片128旁,其等适于朝向导光件132的一入光面1321发出非可见光束。The light emitting element 130 is disposed on the substrate 124 and located beside the image sensor chip 128 , and is suitable for emitting invisible light beams toward a light incident surface 1321 of the light guide element 132 .

导光件132可透光,其设于基板124及盖板126之间并罩设影像感测芯片128;导光件132包含一入光部1320、一导光部1322及多个微结构1324。入光部1320呈环型,且其外径随着由基板124往盖板126的方向逐渐缩减,用以让发光件130发出的光束得以传递至手指感测区域123。入光部1320的一端连接于导光部1322,另一端设于基板124的上表面1240并包含入光面1321;多个凹槽1326可形成于入光面1321以供发光件130容设于其中,藉以使发光件130产生的光束得以传递至导光部1322。基板124、入光部1320及导光部1322配合界定的一容置空间133以供影像感测芯片128、准直件134及折光件136容设于其中。导光部1322的顶面可通过一第一黏着件140而贴附于盖板126的一内表面1260。The light guide 132 can transmit light, is disposed between the substrate 124 and the cover plate 126 and covers the image sensing chip 128 ; the light guide 132 includes a light incident portion 1320 , a light guide portion 1322 and a plurality of microstructures 1324 . The light incident portion 1320 is in the shape of a ring, and its outer diameter gradually decreases in the direction from the substrate 124 to the cover plate 126 , so that the light beam emitted by the light emitting element 130 can be transmitted to the finger sensing area 123 . One end of the light incident portion 1320 is connected to the light guide portion 1322 , and the other end is disposed on the upper surface 1240 of the substrate 124 and includes a light incident surface 1321 ; a plurality of grooves 1326 can be formed on the light incident surface 1321 for the light emitting element 130 to be accommodated in the light incident surface 1321 . The light beam generated by the light emitting element 130 can be transmitted to the light guide portion 1322 thereby. The substrate 124 , the light incident portion 1320 and the light guide portion 1322 cooperate to define an accommodating space 133 for accommodating the image sensor chip 128 , the collimating member 134 and the refracting member 136 therein. The top surface of the light guide portion 1322 can be attached to an inner surface 1260 of the cover plate 126 through a first adhesive member 140 .

微结构1324形成于出光面1323,并用以抑制由入光部1320传递至导光部1322的光束不断以全内反射的方式于导光部1322内传递;微结构1324可为凹入出光面1323的锯齿状结构。The microstructure 1324 is formed on the light exit surface 1323 and is used to prevent the light beam transmitted from the light incident portion 1320 to the light guide portion 1322 from being continuously transmitted in the light guide portion 1322 by total internal reflection; the microstructure 1324 can be a concave light exit surface 1323 jagged structure.

发光件130及导光件132配合产生传递至手指感测区域132的光束;发光件130产生的光束由入光面1321进入导光部1322,其中进入导光部1322的光线传播路径有二:其一直接经导光部1322折射后通过盖板126传递至使用者的手指,另一则以全内反射的方式于导光部1322内来回传递,直至微结构1324使光束的传播角小于全内反射的临界角,光束才得以通过盖板126传递至使用者的手指。被手指反射的光束(即反射光束)由出光面123出射,并依序通过准直件134及折光件136传递至影像感测芯片128。The light-emitting element 130 and the light-guiding element 132 cooperate to generate a light beam transmitted to the finger sensing area 132; the light beam generated by the light-emitting element 130 enters the light-guiding portion 1322 from the light-incident surface 1321, and there are two propagation paths for the light entering the light-guiding portion 1322: One of them is directly refracted by the light guide portion 1322 and then transmitted to the user's finger through the cover plate 126 , and the other is transmitted back and forth in the light guide portion 1322 by total internal reflection until the microstructure 1324 makes the propagation angle of the light beam less than full. The critical angle of internal reflection allows the light beam to pass through the cover plate 126 to the user's finger. The light beam reflected by the finger (ie, the reflected light beam) is emitted from the light emitting surface 123 and transmitted to the image sensor chip 128 through the collimating member 134 and the refracting member 136 in sequence.

在此要特别说明的是,图5所绘示的微结构1324的角度小于图2所绘示的微结构1324的角度,其可用以使大角度入射的反射光束得以进入准直件134。It should be noted here that the angle of the microstructure 1324 shown in FIG. 5 is smaller than the angle of the microstructure 1324 shown in FIG.

准直件134位于导光件132的出光面1323及影像感测芯片128之间,并可通过一第二黏着件142而贴附于导光件132;其中,第二黏着件142设于准直件134及导光件132的微结构1324之间,第二黏着件142可例如于光固化胶。The collimating member 134 is located between the light-emitting surface 1323 of the light guide member 132 and the image sensing chip 128, and can be attached to the light guide member 132 through a second adhesive member 142; wherein, the second adhesive member 142 is disposed on the collimation member 132. Between the straight member 134 and the microstructure 1324 of the light guide member 132, the second adhesive member 142 may be, for example, a photocurable glue.

准直件134用于限制反射光束传输至折光件136的入光面积,其可包含交错排列的多个遮光部1340及多个透光部1342(如图5所示)。遮光部1340用以防止大角度射入其中的反射光束传递至折光件136,透光部1342则供小角度入射于其中的反射光束通过而传递至折光件136。在此,定义通过准直件134的光束为准直光束。The collimating member 134 is used to limit the incident area of the reflected light beam transmitted to the refracting member 136 , and may include a plurality of light-shielding portions 1340 and a plurality of light-transmitting portions 1342 arranged in a staggered manner (as shown in FIG. 5 ). The light-shielding portion 1340 is used to prevent the reflected light beam incident at a large angle from being transmitted to the refracting member 136 , and the light-transmitting portion 1342 allows the reflected light beam incident therein with a small angle to pass to the refractive member 136 . Here, the light beam passing through the collimator 134 is defined as a collimated light beam.

折光件136位于准直件134及影像感测芯片128之间,并具有一间隔地位于影像感测芯片128上方;折光件136接收准直光束,并会聚准直光束于影像感测芯片128的每一感测像素1280。The refracting member 136 is located between the collimating member 134 and the image sensing chip 128 , and is located above the image sensing chip 128 with an interval; Each sensing pixel 1280.

折光件136包含一基部1360及多个折光结构1362;基部1360为一透光片,其可通过黏着剂139而贴附于准直件134的底部。折光结构1362设于基板1360上,且其外径随着远离基部1360渐缩形成一尖角。在图5中,折光结构1362的外表面为一曲面;其中,曲面设计可进一步地扩大其对准直光束的转折角度。The refracting member 136 includes a base portion 1360 and a plurality of refracting structures 1362 ; the base portion 1360 is a light-transmitting sheet, which can be attached to the bottom of the collimating member 134 through the adhesive 139 . The refractive structure 1362 is disposed on the substrate 1360 , and its outer diameter tapers away from the base 1360 to form a sharp corner. In FIG. 5 , the outer surface of the refractive structure 1362 is a curved surface; wherein, the curved surface design can further expand its turning angle toward the collimated beam.

折光结构1362的数量相同于透光部1342的数量,且折光结构1362对应于透光部1342设置,以接受通过透光部1342的准直光束。折光结构136的尖角的角度随着远离折光件136的中心线C而逐渐增加,以让远离折光件136的中心线C的准直光束转折大角度后会聚于感测像素1280,而靠近折光件136的中心线C的准直光束转折小角度后会聚于感测像素1280,来达到缩小影像感测芯片128的长度的效果。在本实施方式中,感测像素1280的数量小于折光结构1362的数量;换言之,单一个感测像素1280可接受来自多个折光结构1362的光束。举例来说,在图5中,每个感测像素1280可接受来自三个折光结构1362的光束并产生指纹信息以进行认证。The number of the refractive structures 1362 is the same as the number of the transparent portions 1342 , and the refractive structures 1362 are disposed corresponding to the transparent portions 1342 to receive the collimated light beams passing through the transparent portions 1342 . The angle of the sharp corner of the refractive structure 136 gradually increases as it moves away from the center line C of the refractive element 136 , so that the collimated light beam that is far away from the center line C of the refractive element 136 is deflected by a large angle and then converges on the sensing pixel 1280 , and close to the refraction element 136 . The collimated light beam of the center line C of the component 136 is turned by a small angle and then converges on the sensing pixel 1280 , so as to achieve the effect of reducing the length of the image sensing chip 128 . In this embodiment, the number of sensing pixels 1280 is smaller than the number of refractive structures 1362 ; in other words, a single sensing pixel 1280 can receive light beams from multiple refractive structures 1362 . For example, in FIG. 5, each sensing pixel 1280 accepts light beams from three refractive structures 1362 and generates fingerprint information for authentication.

此外,指纹辨识装置12还可以包含一光整型件138及多个微透镜144;光整型件138设于第二黏着件142及准直件134之间,用以将进入准直件134的反射光束进行整型,例如让以大角度进入光整形件138的反射光束以小角度出射至准直件134。微透镜144设于每个感测像素1280上,用以将通过折光件136的光束进一步地聚焦于感测像素1280,以提高感测效果。In addition, the fingerprint identification device 12 may further include a photo-shaping member 138 and a plurality of microlenses 144 ; the photo-shaping member 138 is disposed between the second adhesive member 142 and the collimating member 134 for entering the collimating member 134 For example, the reflected light beam entering the light shaping member 138 at a large angle is shaped to exit the collimating member 134 at a small angle. The microlens 144 is disposed on each sensing pixel 1280 to further focus the light beam passing through the refracting member 136 to the sensing pixel 1280 to improve the sensing effect.

综合前述,在本发明的指纹辨识装置中,发光件130产生的光束由入光面1321进入导光件132并传递至手指感测区123;由使用者手指反射前述光线所产生的反射光束依序通过出光面1323、光整形件138、准直件134及折光件136对焦于影像感测芯片128的感测像素1280。其中,通过本发明的折光件136上的折光结构1362,可以改变通过准直件134的准直光束入射到感测像素1280的角度,藉此可达到缩小影像感测芯片128的长度的效果。To sum up the above, in the fingerprint identification device of the present invention, the light beam generated by the light emitting element 130 enters the light guide element 132 from the light incident surface 1321 and is transmitted to the finger sensing area 123; The light emitting surface 1323 , the light shaping member 138 , the collimating member 134 and the refracting member 136 are sequentially focused on the sensing pixels 1280 of the image sensing chip 128 . The refractive structure 1362 on the refractive element 136 of the present invention can change the angle at which the collimated light beam passing through the collimating element 134 enters the sensing pixel 1280 , thereby reducing the length of the image sensing chip 128 .

当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Of course, the present invention can also have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding Changes and deformations should belong to the protection scope of the appended claims of the present invention.

Claims (9)

1. A fingerprint identification device having a finger sensing area, the fingerprint identification device comprising:
a cover plate;
an image sensing chip located on one side of the cover plate;
a light guide member covering the image sensing chip, the light guide member including a light incident surface and a light emergent surface, the light emergent surface having a microstructure;
at least one light emitting element arranged adjacent to the light incident surface;
a collimating element between the light emergent surface and the image sensing chip; and
a refraction piece arranged between the collimation piece and the image sensing chip and comprising a plurality of refraction structures, wherein the outer diameters of the refraction structures are gradually reduced along the direction far away from the collimation piece and close to the image sensing chip to form a sharp angle, and the angles of the sharp angles of the refraction structures are gradually increased along the direction far away from the central line of the refraction piece;
wherein the image sensing chip and the at least one light-emitting element are mounted on the upper surface of a substrate;
the image sensing chip comprises a plurality of sensing pixels, and when the length of the image sensing chip on a cross section formed by optical axes of the sensing pixels is a, and the length of the finger sensing area on the cross section is b, the following conditions are satisfied:
b≥2a。
2. The apparatus of claim 1, wherein the number of the sensing pixels is the same as the number of the refraction structures.
3. The apparatus of claim 1, wherein the number of the sensing pixels is less than the number of the refraction structures.
4. The apparatus of claim 1, further comprising a plurality of microlenses respectively disposed on the plurality of sensing pixels.
5. The fingerprint identification device according to claim 1 wherein said collimating member comprises a plurality of light-shielding portions and a plurality of light-transmitting portions, said plurality of light-shielding portions and said plurality of light-transmitting portions being staggered, and said plurality of light-transmitting portions being disposed in correspondence to said plurality of light-refracting structures.
6. The apparatus of claim 1, wherein the light-deflecting member further comprises a base portion, the plurality of light-deflecting structures are disposed on the base portion, and an outer diameter of each light-deflecting structure tapers away from the base portion to form the sharp angle.
7. The apparatus of claim 1, wherein the outer surface of the refractive structures is a plane or a curved surface.
8. The fingerprint identification device of claim 1, further comprising a light shaping element disposed between the light exit surface and the collimating element.
9. The apparatus of claim 1, further comprising:
the first adhesion piece is arranged between the cover plate and the light outlet surface; and
the second adhesion piece is arranged between the light-emitting surface and the collimation piece.
CN201710183302.0A 2017-03-24 2017-03-24 Fingerprint Identification Device Expired - Fee Related CN108629253B (en)

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