CN108629249A - Fingerprint imaging module and electronic equipment - Google Patents
Fingerprint imaging module and electronic equipment Download PDFInfo
- Publication number
- CN108629249A CN108629249A CN201710182126.9A CN201710182126A CN108629249A CN 108629249 A CN108629249 A CN 108629249A CN 201710182126 A CN201710182126 A CN 201710182126A CN 108629249 A CN108629249 A CN 108629249A
- Authority
- CN
- China
- Prior art keywords
- imaging module
- layer
- fingerprint imaging
- touch control
- touch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
Abstract
A kind of fingerprint imaging module and electronic equipment, the fingerprint imaging module include：Light source, for generating incident light；Sensing face, the incident light reflect to form the reflected light for carrying finger print information in the sensing face；Imaging sensor is converted to electric signal to obtain fingerprint image for acquiring the reflected light, and by the optical signal of the reflected light；Touch control layer is touched for constituting capacitance structure with sensing between described image sensor and the sensing face, and when sensing touch, control described image sensor obtains fingerprint image.Technical solution of the present invention can effectively improve the success rate of finger detection, be conducive to the raising for triggering success rate.
Description
Technical field
The present invention relates to fingerprint imaging field, more particularly to a kind of fingerprint imaging module and electronic equipment.
Background technology
Fingerprint identification technology collects the fingerprint image of human body by fingerprint imaging sensor, then with fingerprint recognition system
In have fingerprint imaging information be compared, to realize identification.Due to the use of convenience and somatic fingerprint it is unique
Property, fingerprint identification technology have been widely used in every field, such as：The field of safety check such as public security bureau, customs, the gate inhibition system of building
System and the consumer product areas such as PC and mobile phone etc..
Imaging mode used by fingerprint identification technology has the multiple technologies such as optical profile type, condenser type, ultrasonic type.Wherein one
Kind is that the fingerprint image of human body is acquired by optical imagery module.Optical fingerprint imaging modules include mainly：Cover sheet, light
It learns sensor, integrated chip (IC), flexible PCB (FPC) and electronic device (including light source led) on flexible PCB, lead
The critical pieces such as tabula rasa, upper protection shell and lower protection shell.Wherein optical sensor is to utilize amorphous silicon film transistor
(a-Si TFT), low-temperature polysilicon film transistor (LTPS TFT) or oxide semiconductor thin-film transistor (OS TFT) etc. half
Semiconductor process technology, makes on the glass substrate；Later encapsulation is realized by processes such as cutting, dispensing, bondings.
Currently, application of the fingerprint imaging sensor in mobile terminal device is unlocked using fingerprint.But due to
The limited battery capacity of mobile terminal extends stand-by time, therefore power management to reduce the energy consumption of fingerprint imaging sensor
Always mobile terminal develops a critically important part.
Touch function is integrated in fingerprint imaging module, is existing to judge whether the fingerprint imaging module is touched
There is a kind of effective voltage management method in technology.Finger detection is realized on fingerprint imaging module, when not detecting finger,
The fingerprint imaging module is set to enter suspend mode, to reduce power consumption；When detecting finger, the fingerprint imaging mould is waken up
Group makes it be in working condition from dormant state conversion, obtains fingerprint image.
But the fingerprint imaging module for being integrated with touch function in the prior art there is a problem of trigger success rate it is unstable.
Invention content
Problems solved by the invention is to provide a kind of fingerprint imaging module and electronic equipment, to improve the fingerprint imaging mould
The triggering success rate of group.
To solve the above problems, the present invention provides a kind of fingerprint imaging module, including：
Light source, for generating incident light；Sensing face, the incident light reflect to form in the sensing face and carry finger
The reflected light of line information；Imaging sensor is converted to telecommunications for acquiring the reflected light, and by the optical signal of the reflected light
Number to obtain fingerprint image；Touch control layer, between described image sensor and the sensing face, for constitute capacitance structure with
Sensing touches, and when sensing touch, control described image sensor obtains fingerprint image.
Optionally, the material of the touch control layer includes metal or transparent oxide conductor.
Optionally, described image sensor includes：Device layer, have in the device layer sensor devices and for realizing
The interconnection line of connection, the device layer towards the surface of the sensing face be the first face；The touch control layer is to first face
Distance is greater than or equal to 20 μm.
Optionally, described image sensor further includes：Cover the encapsulated layer in the first face of the device layer；The touch control layer position
Between the encapsulated layer and the sensing face, the thickness of the encapsulated layer is less than or equal to 20 μm.
Optionally, the fingerprint imaging module further includes：Adhesive layer covers the encapsulated layer；The touch control layer passes through institute
It states adhesive layer and fits in described image sensor surface.
Optionally, the material of the adhesive layer and the encapsulated layer material identical.
Optionally, the thickness of the adhesive layer is less than or equal to 20 μm.
Optionally, the fingerprint imaging module further includes：Upper cover plate is located in described image sensor；The sensing face
It is the upper cover plate backwards to the surface of described image sensor；The touch control layer is located at the upper cover plate and described image sensor
Between.
Optionally, the material of the upper cover plate is glass.
Optionally, the touch control layer includes one or more touch-control items, and the touch-control item is in the flat of the parallel sensing face
It is in square-wave-shaped or latticed setting in face.
Optionally, the area of the touch control layer is greater than or equal to 4mm2。
Optionally, the touch control layer includes multiple feelings blocks, and the multiple feelings block is on the surface of the parallel sensing face
Inside it is arranged in array.
Correspondingly, the present invention also provides a kind of electronic equipment, including：The fingerprint imaging module of the present invention.
Compared with prior art, technical scheme of the present invention has the following advantages：
The touch control layer is touched between described image sensor and the sensing face with sensing；Due to the touch-control
Layer is between described image sensor and the sensing face, with the setting touch circuit around the optics area array sensor
Technical solution is compared, and in fingerprint sensing, the overlapping area between the touch control layer and finger is larger；Between touch control layer and finger
The increase of overlapping area can effectively improve the success rate of finger detection, be conducive to the raising for triggering success rate.
In alternative of the present invention, described image sensor includes the internal device layer with sensor devices and interconnection line,
The distance between the touch control layer and the first face of the device layer are greater than or equal to 20 μm.By the touch control layer and the device layer
The distance between first face is set greater than or is equal to 20 μm, can effectively increase touch control layer and the sensor devices and described
The distance between interconnection line effectively reduces the parasitism electricity between the touch control layer and the sensor devices and the interconnection line
Hold, advantageously reduces interference of the touch control layer to electric signal produced by described image sensor, advantageously reduce described image
The noise of sensor is conducive to the acquisition of high quality fingerprint image.
In alternative of the present invention, the fingerprint imaging module further includes：Positioned at the upper cover plate of described image sensor, institute
Touch control layer is stated between the upper cover plate and described image sensor.The touch control layer is set to the upper cover plate towards institute
The side of imaging sensor is stated, the upper cover plate can play the role of the isolation touch control layer and external environment, can reduce
The probability that the touch control layer is contacted reduces the appearance for accidentally touching phenomenon to be conducive to improve.
Description of the drawings
Fig. 1 is a kind of cross-sectional view of fingerprint imaging module；
Fig. 2 is the cross-sectional view of fingerprint imaging module first embodiment of the present invention；
Fig. 3 is the overlooking structure diagram along the directions A in the embodiment of fingerprint imaging module shown in Fig. 2；
Fig. 4 is the overlooking structure diagram of fingerprint imaging module second embodiment of the present invention；
Fig. 5 is the overlooking structure diagram of fingerprint imaging module 3rd embodiment of the present invention；
Fig. 6 is the overlooking structure diagram of fingerprint imaging module fourth embodiment of the present invention；
Fig. 7 is the overlooking structure diagram of the 5th embodiment of fingerprint imaging module of the present invention.
Specific implementation mode
By background technology it is found that the fingerprint imaging module with touch function has triggering success rate shakiness in the prior art
Fixed problem.
With reference to figure 1, a kind of cross-sectional view of fingerprint imaging module is shown.
As shown in Figure 1, the fingerprint imaging module is super-thin optical fingerprint imaging modules.The fingerprint imaging module
Be by photoelectricity transformation principle realize fingerprint imaging, including：Light source 11, the optics area array sensor on the light source 11
12, the protective layer 13 on the optics area array sensor 12.
When acquiring fingerprint, finger 10 presses on protective layer 13；The incident light that light source 11 generates is in finger 10 and protection
Reflection and transmission occur for the contact interface of layer 13；It is formed by reflected light and penetrates protective layer 13, be projected to optics area array sensor
On 12；Optics area array sensor 12 acquires the reflected light, and carries out opto-electronic conversion and signal processing, realizes adopting for fingerprint image
Collection.The encapsulation of the optics area array sensor 12 mainly use after dicing by photoelectric sensor small pieces by sealing material with it is upper
Lid carries out fitting and realizes encapsulation.
In order to realize touch function on the fingerprint imaging module, it is arranged around the optics area array sensor 12 and touches
Touch circuit 14.Since touch-control circuit 14 is set to around the optics area array sensor 12, thus the touch-control circuit 14 with
The overlapping area of finger is effective, affects the detection to finger 10, to the problem for causing triggering success rate unstable.
Especially when the area of the fingerprint imaging module is larger, such as 2 refer to, 4 refer to or large-sized fingerprint such as the full palm
In imaging modules, the fingerprint imaging module is triggered by the touch-control circuit 14 being set to around the optics area array sensor 12
The success rate for obtaining fingerprint image is just lower.
To solve the technical problem, the present invention provides a kind of fingerprint imaging module, and the fingerprint imaging module is in image
Sticking touch control layer realizes that touch-control is conducive to cost control so as to effectively reduce technology difficulty on sensor.
To make the above purposes, features and advantages of the invention more obvious and understandable, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
With reference to figure 2, the cross-sectional view of fingerprint imaging module first embodiment of the present invention is shown.
The fingerprint imaging module includes：
Light source 110, for generating incident light 111；Sensing face 120, the incident light 111 is in the formation of the sensing face 120
Carry the reflected light 121 of finger print information；Imaging sensor 130, for acquiring the reflected light 121, and by the reflected light
121 optical signal is converted to electric signal to obtain fingerprint image；Touch control layer 140 is located at described image sensor 130 and the sense
It between survey face 120, is touched for constituting capacitance structure with sensing, when sensing touch, control described image sensor 130 obtains
Obtain fingerprint image.
The touch control layer 140 is touched between described image sensor 130 and the sensing face 120 with sensing；Due to
The touch control layer 140 is between described image sensor 130 and the sensing face 120, and in the optics area array sensor
The technical solution of surrounding setting touch circuit is compared, in fingerprint sensing, the overlapping area between the touch control layer 140 and finger
It is larger；The increase of overlapping area between touch control layer 140 and finger can effectively improve the success rate of finger detection, be conducive to
Trigger the raising of success rate.
In the present embodiment, the light source 110 be area source, including light emitting diode (not shown) and be located at the hair
The light guide plate (not shown) of optical diode side.The light emitting diode is used to form initial light；The light emitting diode
Generated initial light is projected into the light guide plate, and the incident light of light distribution evenly is reflected to form through the light guide plate
111.It sets the light source 110 to the way of area source, can effectively improve the uniformity of the incident light 111, it can
The incident angle for effectively reducing incident light 111 is conducive to the quality for improving obtained fingerprint image.
In other embodiments of the invention, the light source may be the light source of the other forms such as linear light source or point light source.Example
Such as, the light source can be single light emitting diode.
Incident light 111 caused by the light source 110 can be visible light, or black light.Specifically, described
Incident light 111 can be black light, purple light, blue light, green light, sodium yellow, red light, near infrared light or white light etc.
Color.
The sensing face 120 is for receiving touch.As shown in Fig. 2, when carrying out fingerprint sensing, the incident light 111 is thrown
It is incident upon on the thoughts and feelings face 120, reflection or refraction occurs on the thoughts and feelings face 120, finger print information is carried to be formed
Reflected light 121.
Specifically, in the present embodiment, the fingerprint imaging module further includes the upper cover plate 121 to shield, the sense
Survey face 120 is the upper cover plate 121 backwards to the surface of the light source 110.Specifically, the material of the upper cover plate 121 can be
Glass.
Described image sensor 130 is converted for acquiring the reflected light 121, and by the optical signal of the reflected light 121
For electric signal, to obtain the fingerprint image.
In the present embodiment, the fingerprint imaging module is ultrathin fingerprint imaging module, and described image sensor 130 is located at
Between the sensing face 120 and the light source 110；It is projected to after the transmission described image sensor 130 of the incident light 111 described
In sensing face 120.
Described image sensor 130 includes device layer 131, has sensor devices and connection institute in the device layer 131
State the interconnection line of sensor devices.When the reflected light 121 is projected to the device layer 131, is acquired and turned by the sensor devices
It is changed to electric signal, to obtain fingerprint image；The interconnection line for realizing between sensor devices and the sensor devices with
Electrical connection between external circuit.Specifically, the sensor devices can be light sensitive diode；The interconnection line can be conductor
Material is formed by metal interconnection structure.
The device layer 131 towards the surface of the sensing face 120 be the first face.In the present embodiment, described image sensing
Device 130 further includes the encapsulated layer 132 for covering 131 first face of device layer.The encapsulated layer 132 covers the device layer 131,
To realize being isolated for the sensor devices and the interconnection line and external environment, to improve the stabilization of imaging sensor 130
Property.So the material of the encapsulated layer 132 can be capacitative materials, such as UV glue, transparent silica gel, capacitive character optical cement
Materials such as (Optically Clear Adhesive, OCA).
It should be noted that the thickness of the encapsulated layer 132 should not it is too big also should not be too small.The thickness of the encapsulated layer 132
If degree is too small, it is unfavorable for realizing being isolated for the device layer 131 and external environment, is unfavorable for described image sensor 130
Stability improve；If the thickness of the encapsulated layer 132 is too big, it be easy to cause waste of material, increases asking for technology difficulty
Topic.Specifically, the thickness of the encapsulated layer 132 is less than or equal to 20 μm.
The touch control layer 140 is touched for a pole plate as capacitance structure to sense, when sensing touch,
It controls described image sensor 130 and obtains fingerprint image.
Specifically, the material of the touch control layer 140 includes metal or transparent oxide conductor.So working as the sensing face
When not having finger on 120, the touch control layer 140 is in suspended state, and capacitance structure is constituted between the touch control layer 140 and ground terminal,
Capacitance structure has certain capacitance between the touch control layer 140 and ground terminal.
When finger 100 is pressed into the sensing face 120, human body is conductor, potentially acts as the pole plate of capacitance structure, because
, due to the addition of human body, the capacitance structure between the touch control layer 140 and ground terminal becomes between the touch control layer 140 and human body for this
Capacitance structure is connected between capacitance structure and human body and ground terminal, so capacitance structure between the touch control layer 140 and ground terminal
Capacitance with there is no finger 100 when changed, so passing through capacitance between the touch control layer 140 and ground terminal
Variation, whether have finger, that is to say, that the setting of the touch control layer 140 can be realized if can sense in the sensing face 120
The sensing of touch.
And since the touch control layer 140 is between imaging sensor 130 and the sensing face 120, as shown in Fig. 2,
The finger 100 is located immediately at the top in the thoughts and feelings face 140, so with the skill in described image sensor surrounding touch circuit
Art scheme is compared, and overlapping area is larger between the finger 100 and the touch control layer 140, distance is closer, human body and the touch-control
Capacitance is larger between layer 140, therefore the shadow of the addition of human body capacitance structure capacitance between the touch control layer 140 and ground terminal
Sound is larger, therefore can effectively improve the success rate of finger detection, is conducive to improve triggering success rate.
It should be noted that in the present embodiment, the fingerprint imaging module further includes being located in described image sensor 130
Upper cover plate 121, the sensing face 120 be the upper cover plate 121 backwards to described image sensor 130 surface；So described
Touch control layer 140 is also located between the upper cover plate 121 and described image sensor 130.When carrying out touch-sensing, the upper cover plate
121 realize electric isolution between the touch control layer 140 and finger 100 as electrolyte, to constitute capacitance structure.
The touch control layer 140 is not easy to the distance between 130 device layer of described image sensor, 131 first face should not be too
It is small.It is described to touch if the touch control layer 140 is too small to the distance between 130 device layer of described image sensor, 131 first face
It is too small to control the distance between layer 140 and the device layer 131, due to the touch control layer 140, sensor devices and described mutual
Line is conductive material, so may have one between the touch control layer 140 and the sensor devices and the interconnection line
Fixed parasitic capacitance, distance is too small between the touch control layer 140 and the sensor devices and the interconnection line, can cause parasitic electricity
Hold it is excessive, to influence the conduction of the formation and the interconnection line of the sensor devices electric signal to the electric signal, be easy
Cause noise excessive, the fingerprint image for being unfavorable for high quality obtains.Specifically, in the present embodiment, in the present embodiment, the touch-control
The distance in layer 140 to first face is greater than or equal to 20 μm.
It should be noted that the touch control layer 140 between 130 device layer of described image sensor, 131 first face away from
It should not be too big from also.If the touch control layer 140 arrives the distance between 130 device layer of described image sensor, 131 first face too
Greatly, then the distance between the touch control layer 140 and the device layer 131 are excessive, be easy to cause waste of material, also institute easy to increase
The volume for stating fingerprint imaging module is unfavorable for the raising of the ultrathin and integrated level of the fingerprint imaging module.So this implementation
Example, the distance between described touch control layer 140 to 130 device layer of described image sensor, 131 first face are less than or equal to 100 μm.
In the present embodiment, the fingerprint imaging module further includes adhesive layer 141, is located on the encapsulated layer 132；It is described to touch
Control layer 140 fits in 132 surface of the encapsulated layer by the adhesive layer 141.
The adhesive layer 141 is for realizing the connection between the touch control layer 140 and described image sensor 130.Due to
The adhesive layer 141 needs to transmit the incident light 111 and the reflected light 121, so the material of the adhesive layer 141 and institute
132 material identical of encapsulated layer is stated, to reduce the influence to the incident light 111 and the reflected light 121.Specifically, described viscous
The material for closing layer 141 can be capacitative materials, such as UV glue, transparent silica gel, capacitive character optical cement (Optically Clear
Adhesive, OCA) etc. materials.
The thickness of the adhesive layer 141 should not it is too big also should not be too small.If the thickness of the adhesive layer 141 is too small,
It is too small to be likely to result in distance between the touch control layer 140 and the device layer 131, the touch control layer 140 and the photoreceptor
Parasitic capacitance is excessive between part and interconnection line, influences the signal-to-noise ratio of described image sensor；The thickness of the adhesive layer 141 is such as
Fruit is too big, then be easy to cause waste of material, increases the problem of technology difficulty.Specifically, in the present embodiment, the adhesive layer 141
Thickness be less than or equal to 20 μm.
The adhesive layer 141 covers 132 surface of the encapsulated layer, and the touch control layer 140 is located at the encapsulated layer 132 and institute
Between stating sensing face 120,132 surface of the encapsulated layer is fitted in.So the touch control layer 140 and the device layer 131 first
The distance between face is the sum of thickness and 141 thickness of the adhesive layer of the encapsulated layer 132.So the encapsulated layer 132
The thickness of thickness and the adhesive layer 141 cooperates, and distance between the touch control layer 140 and the device layer 131 is made to reach
In zone of reasonableness, to reach taking into account for module integrated level and signal-to-noise ratio, the performance of the fingerprint imaging module is improved.
And realize that is connected between the touch control layer 140 and described image sensor 130 does by the adhesive layer 141
Method can directly fit the touch control layer 140 on the basis of existing imaging sensor 130, be formed to advantageously reduce
The technology difficulty of the touch control layer 140 is conducive to control process costs.
With reference to figure 3, the overlooking structure diagram along the directions A in the embodiment of fingerprint imaging module shown in Fig. 2 is shown.
As shown in figure 3, the touch control layer 140 includes one or more touch-control items, the touch-control item is in the parallel sensing
It is arranged in square waveform in the plane in face 120.Set the touch-control item to the way of square-wave-shaped, it can be by sensing the touch-control
At different location between ground terminal capacitance variation sequencing, realize the sensing to finger movement, be conducive to extend institute
The function of stating fingerprint imaging module is conducive to the manipulation experience for improving electronic equipment.
Projected area should not be too small in the sensing face 120 for the touch control layer 140.The touch control layer 140 is in the sense
If projected area is too small on survey face 120, the area being overlapped between touch control layer and finger can be influenced, finger spy may be influenced
The success rate of survey is unfavorable for triggering the raising of success rate.Specifically, in the present embodiment, the touch control layer 140 is in the sensing face
Projected area is greater than or equal to 4mm on 1202。
It should be noted that in other embodiments of the invention, the touch control layer projects in the sensing face can also be with
The sensing face overlaps.
With reference to figure 4, the overlooking structure diagram of fingerprint imaging module second embodiment of the present invention is shown.Fig. 4 is Fig. 3 institutes
Corresponding overlooking structure diagram.
240 touch-control item of the touch control layer can also be in latticed setting in the plane of the parallel sensing face 220.Due to
Gap is all had between square-wave-shaped and the touch-control item of latticed setting, set the touch-control item to square-wave-shaped or latticed is done
Method, additionally it is possible to so that the incident light and the reflected light is transmitted the touch control layer 240 from the gap between the touch-control item, to
Influence of the touch control layer 240 to the incident light and the reflected light can be effectively reduced, is conducive to ensureing to be referred to
Under the premise of print image quality, realizes and improve triggering success rate, improve touch experience.
The latticed touch control layer 240 can be there are many constituted mode.As shown in figure 4, in the present embodiment, the touch-control
Multiple touch-control items in layer 240 are located at same layer, and are connected with each other between the multiple touch-control item, latticed to constitute.
With reference to figure 5, the overlooking structure diagram of fingerprint imaging module 3rd embodiment of the present invention is shown.Fig. 5 is Fig. 3 institutes
Corresponding overlooking structure diagram.
In the present embodiment, projection of the touch control layer 241 in the sensing face 220 is also latticed.But this implementation
Example with previous embodiment the difference is that, in the present embodiment, the touch-control item includes the first touch-control 241a and positioned at described
The second touch-control 241b between first touch-control 241a and the sensing face 220.The first touch-control 241a extending directions
Perpendicular to the extending direction of the second touch-control 241b, to constitute latticed touch control layer 241.
In addition, the touch control layer can also be the grid of other forms, as shown in fig. 6, showing fingerprint imaging of the present invention
The overlooking structure diagram of module fourth embodiment.Fig. 6 is the overlooking structure diagram corresponding to Fig. 3.
The present embodiment and previous embodiment something in common, details are not described herein by the present invention.
The present embodiment and previous embodiment the difference is that, in the present embodiment, in the touch control layer 242, the first touch-control
The length and width of 242a and the second touch-control 242b are bigger, linear, that is to say, that the first touch-control article 242a and described
Two touch-control 242b are conductor wire, for example, the first touch-control 242a and the second touch-control 242b can be nano silver
Metal wire.
And in the present embodiment, the first touch-control 242a is with the second touch-control 242b respectively in the parallel sense
Network is constituted in the plane in survey face 220.
With reference to figure 7, the overlooking structure diagram of the 5th embodiment of fingerprint imaging module of the present invention is shown.Fig. 7 is Fig. 3 institutes
Corresponding overlooking structure diagram.
The present embodiment and previous embodiment something in common, the present invention repeat no more again.The present embodiment and previous embodiment
The difference is that the touch control layer 340 includes multiple feelings blocks, the multiple feelings block is in the parallel sensing face 220
It is arranged in array in surface.
The way of the touch control layer 340 is made up of the feelings block of array arrangement, can effectively improve the touch control layer
340 with the overlapping area of finger, be conducive to the raising of finger detection success rate, be conducive to obtain higher triggering success rate.
It should be noted that in the present embodiment, the touch control layer 340 can be detected by self-capacitance or mutual capacitance detects
Mode realize the sensing to touch.In other embodiments of the invention, such as in embodiment illustrated in fig. 5, the touch control layer can be with
It is detected by mutual capacitance and realizes finger detection.
Correspondingly, the present invention also provides a kind of electronic equipment, including：Fingerprint imaging module of the present invention.
The fingerprint imaging module is for acquiring fingerprint image.The fingerprint imaging module is fingerprint imaging mould of the present invention
Group, specific technical solution refer to the specific embodiment of aforementioned fingerprint imaging modules, and details are not described herein by the present invention.The electronics is set
For according to the obtained fingerprint image of fingerprint imaging module, fingerprint recognition is carried out.
When finger is pressed into the sensing face, finger forms electricity with the touch control layer below described image sensor
Hold structure, by the variation of capacitance between the touch control layer and ground terminal, the fingerprint imaging module can detect finger
In the presence of generating incident light to control the light source, and control described image sensor and acquire optical signal to obtain fingerprint image.
The touch control layer is between described image sensor and the sensing face, so the faying surface between the touch control layer and finger
Product is larger；The increase of overlapping area between touch control layer and finger can effectively improve the success rate of finger detection, be conducive to touch
Send out the raising of success rate.
Specifically, the electronic equipment is mobile phone or tablet computer.The setting of the touch control layer can effectively reduce institute
The energy consumption for stating electronic equipment is conducive to extend the stand-by time of the electronic equipment.
To sum up, the touch control layer is touched between described image sensor and the sensing face with sensing；Due to described
Touch control layer is between described image sensor and the sensing face, with the setting touch electricity around the optics area array sensor
The technical solution on road is compared, and in fingerprint sensing, the overlapping area between the touch control layer and finger is larger；Touch control layer and finger
Between overlapping area increase, can effectively improve finger detection success rate, be conducive to trigger success rate raising.And
And in alternative of the present invention, described image sensor includes the internal device layer with sensor devices and interconnection line, described to touch
It controls the distance between layer and the first face of the device layer and is greater than or equal to 20 μm.By the touch control layer and the first face of the device layer
The distance between be set greater than or be equal to 20 μm, can effectively increase touch control layer and the sensor devices and the interconnection line
The distance between, effectively reduce the parasitic capacitance between the touch control layer and the sensor devices and the interconnection line, favorably
In reducing interference of the touch control layer to electric signal produced by described image sensor, described image sensor is advantageously reduced
Noise is conducive to the acquisition of high quality fingerprint image.In addition, in alternative of the present invention, the fingerprint imaging module further includes：
Positioned at the upper cover plate of described image sensor, the touch control layer is between the upper cover plate and described image sensor.By institute
It states touch control layer and is set to side of the upper cover plate towards described image sensor, it is described tactile that the upper cover plate can play isolation
The effect for controlling layer and external environment, can reduce the probability that the touch control layer is contacted, accidentally tactile existing to be conducive to improve reduction
The appearance of elephant.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (13)
1. a kind of fingerprint imaging module, which is characterized in that including：
Light source, for generating incident light；
Sensing face, the incident light reflect to form the reflected light for carrying finger print information in the sensing face；
Imaging sensor is converted to electric signal to be referred to for acquiring the reflected light, and by the optical signal of the reflected light
Print image；
Touch control layer is touched with sensing for constituting capacitance structure, is being felt between described image sensor and the sensing face
When measuring touch, control described image sensor obtains fingerprint image.
2. fingerprint imaging module as described in claim 1, which is characterized in that the material of the touch control layer includes metal or transparent
Oxide conductor.
3. fingerprint imaging module as described in claim 1, which is characterized in that described image sensor includes：
Device layer, has sensor devices and the interconnection line for realizing connection in the device layer, and the device layer is towards institute
The surface for stating sensing face is the first face；
The distance in the touch control layer to first face is greater than or equal to 20 μm.
4. fingerprint imaging module as claimed in claim 3, which is characterized in that described image sensor further includes：Described in covering
The encapsulated layer in the first face of device layer；
For the touch control layer between the encapsulated layer and the sensing face, the thickness of the encapsulated layer is less than or equal to 20 μm.
5. fingerprint imaging module as claimed in claim 4, which is characterized in that the fingerprint imaging module further includes：Adhesive layer,
Cover the encapsulated layer；
The touch control layer fits in the encapsulation layer surface by the adhesive layer.
6. fingerprint imaging module as claimed in claim 5, which is characterized in that the material of the adhesive layer and the encapsulated layer material
Expect identical.
7. fingerprint imaging module as claimed in claim 5, which is characterized in that the thickness of the adhesive layer is less than or equal to 20 μ
m。
8. fingerprint imaging module as described in claim 1, which is characterized in that the fingerprint imaging module further includes：Upper cover plate,
In described image sensor；
The sensing face is the upper cover plate backwards to the surface of described image sensor；
The touch control layer is between the upper cover plate and described image sensor.
9. fingerprint imaging module as claimed in claim 8, which is characterized in that the material of the upper cover plate is glass.
10. fingerprint imaging module as described in claim 1, which is characterized in that the touch control layer includes one or more touch-controls
Item, the touch-control item are in square-wave-shaped or latticed setting in the plane of the parallel sensing face.
11. fingerprint imaging module as described in claim 1, which is characterized in that the area of the touch control layer is greater than or equal to
4mm2。
12. fingerprint imaging module as described in claim 1, which is characterized in that the touch control layer includes multiple feelings blocks, described
Multiple feelings blocks are arranged in array in the surface of the parallel sensing face.
13. a kind of electronic equipment, which is characterized in that including：Such as claim 1 to claim 12 any one claim institute
The fingerprint imaging module stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710182126.9A CN108629249A (en) | 2017-03-24 | 2017-03-24 | Fingerprint imaging module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710182126.9A CN108629249A (en) | 2017-03-24 | 2017-03-24 | Fingerprint imaging module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108629249A true CN108629249A (en) | 2018-10-09 |
Family
ID=63707553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710182126.9A Pending CN108629249A (en) | 2017-03-24 | 2017-03-24 | Fingerprint imaging module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108629249A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111126305A (en) * | 2019-03-25 | 2020-05-08 | 神盾股份有限公司 | Fingerprint sensing device |
| CN113030621A (en) * | 2021-03-18 | 2021-06-25 | 江阴邦融微电子有限公司 | Fingerprint sensor testing device with anti-interference function and testing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120035964A (en) * | 2010-10-07 | 2012-04-17 | (주)아이리스아이디 | An apparatus for collecting biometrics and a method thereof |
| CN105117086A (en) * | 2015-09-11 | 2015-12-02 | 小米科技有限责任公司 | Fingerprint recognition system, fingerprint recognition realizing method and device and electronic equipment |
| CN105183221A (en) * | 2015-08-27 | 2015-12-23 | 上海箩箕技术有限公司 | Touch awakening fingerprint imaging module group and touch awakening apparatus thereof |
| CN105809137A (en) * | 2016-03-14 | 2016-07-27 | 广东欧珀移动通信有限公司 | Fingerprint identification device and mobile terminal |
| CN106066767A (en) * | 2016-05-27 | 2016-11-02 | 广东欧珀移动通信有限公司 | A kind of unlocking method and mobile terminal |
| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN106354351A (en) * | 2016-08-30 | 2017-01-25 | 京东方科技集团股份有限公司 | Touch substrate, manufacturing method, display device, fingerprint identification device and method |
-
2017
- 2017-03-24 CN CN201710182126.9A patent/CN108629249A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120035964A (en) * | 2010-10-07 | 2012-04-17 | (주)아이리스아이디 | An apparatus for collecting biometrics and a method thereof |
| CN105183221A (en) * | 2015-08-27 | 2015-12-23 | 上海箩箕技术有限公司 | Touch awakening fingerprint imaging module group and touch awakening apparatus thereof |
| CN105117086A (en) * | 2015-09-11 | 2015-12-02 | 小米科技有限责任公司 | Fingerprint recognition system, fingerprint recognition realizing method and device and electronic equipment |
| CN105809137A (en) * | 2016-03-14 | 2016-07-27 | 广东欧珀移动通信有限公司 | Fingerprint identification device and mobile terminal |
| CN106066767A (en) * | 2016-05-27 | 2016-11-02 | 广东欧珀移动通信有限公司 | A kind of unlocking method and mobile terminal |
| CN106354351A (en) * | 2016-08-30 | 2017-01-25 | 京东方科技集团股份有限公司 | Touch substrate, manufacturing method, display device, fingerprint identification device and method |
| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111126305A (en) * | 2019-03-25 | 2020-05-08 | 神盾股份有限公司 | Fingerprint sensing device |
| CN113030621A (en) * | 2021-03-18 | 2021-06-25 | 江阴邦融微电子有限公司 | Fingerprint sensor testing device with anti-interference function and testing method |
| CN113030621B (en) * | 2021-03-18 | 2023-10-31 | 江阴邦融微电子有限公司 | Fingerprint sensor testing device with anti-interference function and testing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106354351B (en) | Touch base plate and production method, display device, fingerprint identification device and method | |
| US10698529B2 (en) | Integrating capacitive sensing with an optical sensor | |
| US10042467B2 (en) | Integrated capacitive fingerprint sensor | |
| TWI569187B (en) | Touch sensing device, touch fingerprint image collector and touch electronic device | |
| CN105867696B (en) | Touch display panel, flexible display panel and display device | |
| US10025411B2 (en) | Touch screen and pressure touch detection method thereof | |
| KR102592857B1 (en) | Display panel and display device having the same | |
| US9787934B2 (en) | Wireless devices with touch sensors and solar cells | |
| KR20160056759A (en) | Flexible display apparatus able to image scan and driving method thereof | |
| WO2019024538A1 (en) | Fingerprint identification structure and manufacturing method therefor | |
| TW201543373A (en) | Biometric sensor for touch-enabled device | |
| KR20180136172A (en) | Optical Image Sensor and Display Device having the Same | |
| CN108664854A (en) | Fingerprint imaging module and electronic equipment | |
| US20170177107A1 (en) | Infrared Touch Screen, Touch Detection Method and Display Apparatus | |
| CN106155393B (en) | Identification device | |
| TWI654916B (en) | Portable electronic device | |
| US9201530B2 (en) | Touch panel having conductive particle layer | |
| CN106845322B (en) | Fingerprint imaging sensor and fingerprint imaging module that touch was awaken up | |
| JP2021531048A (en) | Array substrate, its manufacturing method, and display device | |
| CN108629249A (en) | Fingerprint imaging module and electronic equipment | |
| CN106384101B (en) | Touch method, touch panel and touching device | |
| CN110050280A (en) | Display device and its operating method | |
| TWM593585U (en) | Fingerprint recognition touch panel capable of improving sensitivity | |
| US20160026304A1 (en) | Hand-Held Electronic Device and Touch-Sensing Cover Thereof | |
| KR101191145B1 (en) | Touch film for capacitive type touchscreen, touchscreen comprising and mobile device comprising the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181009 |
|
| WD01 | Invention patent application deemed withdrawn after publication |