CN108624028A - A kind of high heat dissipation handset sheathing material - Google Patents
A kind of high heat dissipation handset sheathing material Download PDFInfo
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- CN108624028A CN108624028A CN201810613023.8A CN201810613023A CN108624028A CN 108624028 A CN108624028 A CN 108624028A CN 201810613023 A CN201810613023 A CN 201810613023A CN 108624028 A CN108624028 A CN 108624028A
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- heat dissipation
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- sheathing material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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Abstract
The invention discloses a kind of high heat dissipation handset sheathing material, raw material includes by weight：32 45 parts of makrolon, 6 13 parts of polylactic acid, 37 parts of polyvinyl chloride, 26 parts of heat filling, 25 parts of calcium sulfate crystal whiskers, 0.5 2 parts of oyster shell whiting, 0.8 1.5 parts of glass fibre, 26 parts of trimethylolpropane tris caprylate.The present invention has excellent heat dissipation performance.
Description
Technical field
The present invention relates to phone housing technical fields, and in particular to a kind of high heat dissipation handset sheathing material.
Background technology
Conventional handset sheathing material mainly has the sheathing material of PC, ABS and PC and the compound three types of ABS.PC
Name makrolon, the performance characteristics of PC materials have：Intensity is high, and tensile strength and flexural strength are higher；High temperature resistant makes for a long time
With being resistant to 130 degree celsius temperature environment；The transparency is good, nontoxic.ABS (propylene fat-butadiene-styrol copolymer) material
Performance characteristics have that intensity is low, and tensile strength and flexural strength are relatively low；Non-refractory, temperature, which is used for a long time, must not be higher than 60
℃；Mobility, coloring and surface spraying and plating performance are preferable.
The heat conductivility of existing handset sheathing material is not high, and when interior of mobile phone temperature is higher, being easy to cause mobile phone makes
With the shortening in service life.
Invention content
Technical problems based on background technology, the present invention propose a kind of high heat dissipation handset sheathing material.The present invention
With excellent heat dissipation performance.
A kind of high heat dissipation handset sheathing material proposed by the present invention, raw material include by weight：Makrolon 32-45
Part, 6-13 parts of polylactic acid, 3-7 parts of polyvinyl chloride, 2-6 parts of heat filling, 2-5 parts of calcium sulfate crystal whiskers, 0.5-2 parts of oyster shell whiting, glass
0.8-1.5 parts of glass fiber, 2-6 parts of trimethylolpropane tris caprylate.
Preferably, the heat filling includes aluminium powder, aluminum nitride powder and diamond.
Preferably, the weight ratio of the aluminium powder, aluminum nitride powder and diamond is 0.7-1：0.2-0.5：1.5-2.5.
Preferably, the diamond is modified diamond, and the preparation method of the modified diamond is：By reduced iron powder with
Bortz powder carries out high-temperature blending processing, obtains graphitise diamond；Thionyl chloride is added into graphitise diamond, heats up,
Solvent is removed after being stirred to react, and the dichloromethane solution of 4- allyloxys -4 '-xenol liquid crystal is added, is removed after reaction molten
Agent, vacuum drying obtain modified diamond.
Preferably, the preparation method of the modified diamond is：At a temperature of 1100-1300 DEG C, by reduced iron powder with
Bortz powder carries out blending processing, obtains graphitise diamond；Thionyl chloride is added into graphitise diamond, is warming up to 80-
95 DEG C, solvent is removed after being stirred to react 6.5-7.5h, the dichloromethane solution of 4- allyloxys -4 '-xenol liquid crystal is added,
Solvent is removed after reaction 11-13h, is dried in vacuo, modified diamond is obtained.
Preferably, the mass ratio of the reduced iron powder and bortz powder is 0.2-0.6：1-1.5.
Preferably, the dichloromethane of the graphitise diamond, thionyl chloride, 4- allyloxys -4 '-xenol liquid crystal
The weight ratio of solution is 1：1-1.4：1.2-1.7.
Preferably, the mass fraction of the dichloromethane solution of the 4- allyloxys -4 '-xenol liquid crystal is 40-
67wt%.
The present invention raw material include：Makrolon, polylactic acid, polyvinyl chloride, heat filling, calcium sulfate crystal whiskers, oyster shell whiting,
Glass fibre, trimethylolpropane tris caprylate；The present invention adds Heat Conduction Material in handset sheathing material, and in preferred embodiment
In, select aluminium powder, aluminum nitride powder and diamond mating reaction as Heat Conduction Material, aluminium powder is metal class filler, and aluminum nitride powder is
Ceramic-like filler, diamond are carbons filler, and three has synergistic effect, has excellent heat-conducting effect；Further preferably side
In case, select diamond for modified diamond, it is in its preparation process, diamond dust is preferred in high temperature with reduced iron powder
Blending processing is carried out at 1100-1300 DEG C, can be looked unfamiliar long graphene nm wall in bortz powder body surface, by itself and 4- allyls
The progress of oxygroup -4 '-xenol liquid crystal is compound, on the basis of covering graphene nano wall, utilizes diamond particle surfaces stone
The high-specific surface area of black alkene nanometer wall construction forms good interface cohesion with 4- allyloxys -4 '-xenol liquid crystal matrix,
High diamond-graphene nm wall/4- allyloxys-the 4 '-xenol liquid crystal composite material of interface bond strength is obtained, by
In diamond and 4- allyloxys -4 '-xenol liquid crystal be lattice structure, with heat transfer based on phonon conduction；Graphene
Heat conduction relies on the temperature vibration of molecule or atom, this vibrations that the molecule of surrounding or atom can be caused to shake thus by heat transfer
Go down；The iron powder contained in graphene nano wall, which is mainly conducted by electronics, carries out heat transfer；Therefore, by diamond-graphite
When alkene nm wall/4- allyloxys -4 '-xenol liquid crystal composite material carries out heat transfer, phonon-Electron-phonon is formd
Heat conduction path, heat conduction efficiency can be improved, and when lattice in diamond or 4- allyloxys -4 '-xenol liquid crystal
When vibration, the atom in graphene can be made to deviate equilbrium position, cause the change of potential energy, the electronics in iron powder is by lattice displacement
The effect of produced additional potential field, this effect can effectively enhance conduction of heat, significantly improve the heat dissipation performance of the present invention.
Specific implementation mode
In the following, technical scheme of the present invention is described in detail by specific embodiment.
Embodiment 1
A kind of high heat dissipation handset sheathing material, raw material include by weight：32 parts of makrolon, gathers at 13 parts of polylactic acid
3 parts of vinyl chloride, 6 parts of heat filling, 2 parts of calcium sulfate crystal whiskers, 2 parts of oyster shell whiting, 0.8 part of glass fibre, trimethylolpropane tris are pungent
6 parts of acid esters.
Embodiment 2
A kind of high heat dissipation handset sheathing material, raw material include by weight：45 parts of makrolon, 6 parts of polylactic acid, polychlorostyrene
7 parts of ethylene, 2 parts of heat filling, 5 parts of calcium sulfate crystal whiskers, 0.5 part of oyster shell whiting, 1.5 parts of glass fibre, trimethylolpropane tris are pungent
2 parts of acid esters；
Wherein, the heat filling includes aluminium powder, aluminum nitride powder and diamond；
The weight ratio of the aluminium powder, aluminum nitride powder and diamond is 0.9：0.4：1.8；
The diamond is modified diamond, and the preparation method of the modified diamond is：By reduced iron powder and diamond
Powder carries out high-temperature blending processing, obtains graphitise diamond；Thionyl chloride is added into graphitise diamond, heats up, stirring is anti-
Should after remove solvent, the dichloromethane solution of 4- allyloxys -4 '-xenol liquid crystal is added, solvent, vacuum are removed after reaction
It is dry, obtain modified diamond.
Embodiment 3
A kind of high heat dissipation handset sheathing material, raw material include by weight：38 parts of makrolon, 9 parts of polylactic acid, polychlorostyrene
5 parts of ethylene, 4 parts of heat filling, 3.5 parts of calcium sulfate crystal whiskers, 1.3 parts of oyster shell whiting, 1 part of glass fibre, trimethylolpropane tris are pungent
4 parts of acid esters；
Wherein, the heat filling includes aluminium powder, aluminum nitride powder and diamond；
The weight ratio of the aluminium powder, aluminum nitride powder and diamond is 0.8：0.3：2；
The diamond is modified diamond, and the preparation method of the modified diamond is：It, will at a temperature of 1200 DEG C
Reduced iron powder carries out that processing is blended with bortz powder, obtains graphitise diamond；Thionyl chloride is added into graphitise diamond,
90 DEG C are warming up to, solvent is removed after being stirred to react 7h, the dichloromethane solution of 4- allyloxys -4 '-xenol liquid crystal is added,
Solvent is removed after reaction 12h, is dried in vacuo, modified diamond is obtained；
The mass ratio of the reduced iron powder and bortz powder is 0.4：1.3；
The dichloromethane solution of the graphitise diamond, thionyl chloride, 4- allyloxys -4 '-xenol liquid crystal
Weight ratio is 1：1.2：1.5；
The mass fraction of the dichloromethane solution of the 4- allyloxys -4 '-xenol liquid crystal is 55wt%.
Embodiment 4
A kind of high heat dissipation handset sheathing material, raw material include by weight：35 parts of makrolon, 7 parts of polylactic acid, polychlorostyrene
4 parts of ethylene, 3 parts of heat filling, 3 parts of calcium sulfate crystal whiskers, 1 part of oyster shell whiting, 0.9 part of glass fibre, trimethylolpropane tris octanoic acid
3 parts of ester；
Wherein, the heat filling includes aluminium powder, aluminum nitride powder and diamond；
The weight ratio of the aluminium powder, aluminum nitride powder and diamond is 0.7：0.5：1.5；
The diamond is modified diamond, and the preparation method of the modified diamond is：It, will at a temperature of 1300 DEG C
Reduced iron powder carries out that processing is blended with bortz powder, obtains graphitise diamond；Thionyl chloride is added into graphitise diamond,
80 DEG C are warming up to, removes solvent after being stirred to react 7.5h, the dichloromethane that 4- allyloxys -4 '-xenol liquid crystal is added is molten
Liquid removes solvent after reacting 11h, is dried in vacuo, and obtains modified diamond；
The mass ratio of the reduced iron powder and bortz powder is 0.6：1；
The dichloromethane solution of the graphitise diamond, thionyl chloride, 4- allyloxys -4 '-xenol liquid crystal
Weight ratio is 1：1.4：1.2；
The mass fraction of the dichloromethane solution of the 4- allyloxys -4 '-xenol liquid crystal is 67wt%.
Embodiment 5
A kind of high heat dissipation handset sheathing material, raw material include by weight：42 parts of makrolon, gathers at 11 parts of polylactic acid
6 parts of vinyl chloride, 5 parts of heat filling, 4.5 parts of calcium sulfate crystal whiskers, 1.7 parts of oyster shell whiting, 1.3 parts of glass fibre, trimethylolpropane
Three 5 parts of caprylates；
Wherein, the heat filling includes aluminium powder, aluminum nitride powder and diamond；
The weight ratio of the aluminium powder, aluminum nitride powder and diamond is 1：0.2：2.5；
The diamond is modified diamond, and the preparation method of the modified diamond is：It, will at a temperature of 1100 DEG C
Reduced iron powder carries out that processing is blended with bortz powder, obtains graphitise diamond；Thionyl chloride is added into graphitise diamond,
95 DEG C are warming up to, removes solvent after being stirred to react 6.5h, the dichloromethane that 4- allyloxys -4 '-xenol liquid crystal is added is molten
Liquid removes solvent after reacting 13h, is dried in vacuo, and obtains modified diamond；
The mass ratio of the reduced iron powder and bortz powder is 0.2：1.5；
The dichloromethane solution of the graphitise diamond, thionyl chloride, 4- allyloxys -4 '-xenol liquid crystal
Weight ratio is 1：1：1.7；
The mass fraction of the dichloromethane solution of the 4- allyloxys -4 '-xenol liquid crystal is 40wt%.
Comparative example 1
A kind of handset sheathing material, raw material include by weight：42 parts of makrolon, 11 parts of polylactic acid, polyvinyl chloride 6
Part, 5 parts of heat filling, 4.5 parts of calcium sulfate crystal whiskers, 1.7 parts of oyster shell whiting, 1.3 parts of glass fibre, trimethylolpropane tris caprylate
5 parts；
Wherein, the heat filling includes aluminium powder, aluminum nitride powder and diamond；
The weight ratio of the aluminium powder, aluminum nitride powder and diamond is 1：0.2：2.5.
Comparative example 2
A kind of handset sheathing material, raw material include by weight：42 parts of makrolon, 11 parts of polylactic acid, polyvinyl chloride 6
Part, 4.5 parts of calcium sulfate crystal whiskers, 1.7 parts of oyster shell whiting, 1.3 parts of glass fibre, 5 parts of trimethylolpropane tris caprylate.
Test example 1
Phone housing and city made of the handset sheathing material obtained respectively to embodiment 5, comparative example 1 and comparative example 2
Phone housing on face carries out heat conductivility test, is denoted as test group and control group 1-3 successively；Test result is as follows table：
| Project | Thermal conductivity (Wm-1·K-1) |
| Test group | 460 |
| Control group 1 | 405 |
| Control group 2 | 380 |
| Control group 3 | 370 |
As can be seen from the above table, when diamond is modified diamond, the heat dissipation performance of obtained phone housing is not better than
The phone housing of modified diamond is much better than regular handset shell on the market；In addition, by diamond and aluminium powder and aluminium nitride
Powder carries out mating reaction, and heat dissipation performance is better than being not added with outside the phone housing and regular handset on the market of heat filling
Shell.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of high heat dissipation handset sheathing material, which is characterized in that its raw material includes by weight：32-45 parts of makrolon gathers
6-13 parts of lactic acid, 3-7 parts of polyvinyl chloride, 2-6 parts of heat filling, 2-5 parts of calcium sulfate crystal whiskers, 0.5-2 parts of oyster shell whiting, glass fibre
0.8-1.5 parts, 2-6 parts of trimethylolpropane tris caprylate.
2. high heat dissipation handset sheathing material according to claim 1, which is characterized in that the heat filling includes aluminium powder, nitrogen
Change aluminium powder and diamond.
3. high heat dissipation handset sheathing material according to claim 2, which is characterized in that the aluminium powder, aluminum nitride powder and Buddha's warrior attendant
The weight ratio of stone is 0.7-1：0.2-0.5：1.5-2.5.
4. according to high heat dissipation handset sheathing material described in Claims 2 or 3, which is characterized in that the diamond is modified Buddha's warrior attendant
The preparation method of stone, the modified diamond is：Reduced iron powder and bortz powder are subjected to high-temperature blending processing, are graphitized
Diamond；Thionyl chloride is added into graphitise diamond, heats up, solvent is removed after being stirred to react, 4- allyloxys-are added
The dichloromethane solution of 4 '-xenol liquid crystal removes solvent after reaction, vacuum drying, obtains modified diamond.
5. high heat dissipation handset sheathing material according to claim 4, which is characterized in that the preparation method of the modified diamond
For：At a temperature of 1100-1300 DEG C, reduced iron powder is carried out with bortz powder processing is blended, obtain graphitise diamond；To
Thionyl chloride is added in graphitise diamond, is warming up to 80-95 DEG C, removes solvent after being stirred to react 6.5-7.5h, 4- alkene is added
The dichloromethane solution of propoxyl group -4 '-xenol liquid crystal removes solvent after reacting 11-13h, is dried in vacuo, and obtains modified gold
Hard rock.
6. high heat dissipation handset sheathing material according to claim 4, which is characterized in that the reduced iron powder and bortz powder
Mass ratio is 0.2-0.6：1-1.5.
7. high heat dissipation handset sheathing material according to claim 4, which is characterized in that the graphitise diamond, dichloro are sub-
The weight ratio of the dichloromethane solution of sulfone, 4- allyloxys -4 '-xenol liquid crystal is 1：1-1.4：1.2-1.7.
8. high heat dissipation handset sheathing material according to claim 4, which is characterized in that the 4- allyloxys -4 '-hydroxyl connection
The mass fraction of the dichloromethane solution of benzene liquid crystal is 40-67wt%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810613023.8A CN108624028A (en) | 2018-06-14 | 2018-06-14 | A kind of high heat dissipation handset sheathing material |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810613023.8A CN108624028A (en) | 2018-06-14 | 2018-06-14 | A kind of high heat dissipation handset sheathing material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109627714A (en) * | 2018-11-12 | 2019-04-16 | 包惠芳 | A kind of PLA composite material and preparation method |
| CN113121972A (en) * | 2019-12-30 | 2021-07-16 | 江苏派锐电子有限公司 | Novel easy-heat-dissipation anti-aging electronic component plastic shell material |
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| CN105273372A (en) * | 2015-11-18 | 2016-01-27 | 东莞市万江明冠实业有限公司 | Macromolecule heat conduction and dissipation blended composite material and automatic preparation method |
| CN105694439A (en) * | 2016-04-13 | 2016-06-22 | 苏州锦腾电子科技有限公司 | Thermoconductive and electroconductive plastic and preparation method thereof |
| CN107189272A (en) * | 2017-07-04 | 2017-09-22 | 合肥市大卓电力有限责任公司 | A kind of power electric meter sheathing material and preparation method thereof |
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2018
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Patent Citations (3)
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| CN105273372A (en) * | 2015-11-18 | 2016-01-27 | 东莞市万江明冠实业有限公司 | Macromolecule heat conduction and dissipation blended composite material and automatic preparation method |
| CN105694439A (en) * | 2016-04-13 | 2016-06-22 | 苏州锦腾电子科技有限公司 | Thermoconductive and electroconductive plastic and preparation method thereof |
| CN107189272A (en) * | 2017-07-04 | 2017-09-22 | 合肥市大卓电力有限责任公司 | A kind of power electric meter sheathing material and preparation method thereof |
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| 温变英: "《高分子材料加工》", 30 June 2016, 中国轻工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109627714A (en) * | 2018-11-12 | 2019-04-16 | 包惠芳 | A kind of PLA composite material and preparation method |
| CN113121972A (en) * | 2019-12-30 | 2021-07-16 | 江苏派锐电子有限公司 | Novel easy-heat-dissipation anti-aging electronic component plastic shell material |
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Application publication date: 20181009 |