CN108621377A - Injection mold, casting of electronic device and its processing method - Google Patents
Injection mold, casting of electronic device and its processing method Download PDFInfo
- Publication number
- CN108621377A CN108621377A CN201710183988.3A CN201710183988A CN108621377A CN 108621377 A CN108621377 A CN 108621377A CN 201710183988 A CN201710183988 A CN 201710183988A CN 108621377 A CN108621377 A CN 108621377A
- Authority
- CN
- China
- Prior art keywords
- plastics material
- injected plastics
- cavity
- glue
- injection mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
- B29C2045/0044—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks expelling moulding material outside the mould cavity at the weld line location
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
- B29C2045/2671—Resin exit gates or bleeder passages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Abstract
The disclosure is directed to a kind of injection mold, casting of electronic device and its processing method, which includes：Cavity and at least one overflowing well；Multiple glue-feeders and at least one spilling slot are offered on the cavity, the overflowing well is connected to by the spilling slot with the cavity, and each spilling slot is separately positioned between corresponding two adjacent glue-feeders.Pass through the technical solution of the disclosure, before the injected plastics material that can be injected separately into adjacent glue-feeder contacts with each other, make the cold burden of injected plastics material front end pass through to overflow in slot inflow overflowing well, to avoid cold burden the problems such as stomata, sand holes or bonding wire are caused in the junction of two strands of injected plastics materials.
Description
Technical field
This disclosure relates to electronic technology field more particularly to injection mold, casting of electronic device and its processing method.
Background technology
In the related art, by the way that injection molding process to be applied to the manufacturing process to casting of electronic device, Ke Yiti
Rise the manufacture efficiency and machining accuracy to casting of electronic device.In injection molding process, by injection mold into glue
Mouth injection injected plastics material so that after injected plastics material fills the cavity in injection mold, cooling and solidifying obtains corresponding electronic equipment
Shell.
But when each glue-feeder injection injected plastics material, often there is part cold burden in injected plastics material front end, these are cold
Material can not well be combined with the injected plastics material of other meltings so that two strands of injected plastics materials that adjacent glue-feeder is injected separately into are mutual
When contact, cold burden can be focused at the binding site of this two strands of injected plastics materials, lead to casting of electronic device structure after molding
It is bad in the binding force of corresponding position, it is easy to form bonding wire, stomata or sand holes etc., not only causes the structure of casting of electronic device
It is strength reduction, easy to crack, while can also influence its appearance.
Invention content
To overcome the problems in correlation technique, the disclosure provides a kind of injection mold, casting of electronic device and its adds
Work method, to promote the appearance and structural strength of casting of electronic device.
According to the disclosure in a first aspect, propose a kind of injection mold, including：Cavity and at least one overflowing well；
Offer multiple glue-feeders and at least one spilling slot on the cavity, the overflowing well by the spilling slot with
The cavity connection, and each spilling slot is separately positioned between corresponding two adjacent glue-feeders.Injected plastics material front end it is cold
Material before contact by be arranged between corresponding two adjacent glue-feeders overflow slot flow into overflowing well in, avoid product at
After type due to junction cold burden and caused by there are problems that stomata, sand holes and bonding wire.
Optionally, the injected plastics material junction for overflowing slot between corresponding two adjacent glue-feeders.Make opposite
The cold burden of two bursts of injected plastics material front ends of flowing flows out simultaneously, avoid one injected plastics material along overflow slot flow out and another stock also not
Arrive at the spilling slot and caused by injected plastics material waste.
Optionally, the opening area of the corresponding two adjacent glue-feeders of the overflowing well is identical.Ensure each glue-feeder
The identical flow behavior and its Forming Quality that can control injected plastics material in cavity of opening area.
Optionally, the corner of the cavity is equipped with the spilling slot.So that the corresponding cold burden of corner is overflowed, with ensure at
The appearance and structural strength of type product
According to the second aspect of the disclosure, the processing method for proposing a kind of electronic equipment shell, including：
By the glue-feeder on such as above-mentioned injection mold, the injected plastics material of liquid is injected to the cavity of the injection mold
It is interior, until the injected plastics material of each glue-feeder injection is flowed into the presence of at least part in corresponding overflowing well；Ensure phase mutual connection
It touches the injected plastics material combined and does not include cold burden, the product of smooth in appearance can be formed.
By the injected plastics material curing molding in the cavity, to obtain the casting of electronic device.
Optionally, the injected plastics material of liquid is injected in the cavity of the injection mold, including：Using identical speed to phase
Adjacent glue-feeder injects the injected plastics material, so that flow behavior of the injection material in cavity is easier to control, to obtain more
Good Forming Quality.
Optionally, further include：The overflowing well is cut off from the casting of electronic device after molding.
Optionally, the injected plastics material includes：Metal material.
Optionally, the injected plastics material includes：Plastic material.
According to the third aspect of the disclosure, a kind of electronic equipment shell is proposed, the casting of electronic device is by such as above-mentioned
Processing method machine-shaping.
The technical scheme provided by this disclosed embodiment can include the following benefits：
By above-described embodiment it is found that the disclosure for the molding mold cavity of casting of electronic device by opening up spilling slot, and
Overflowing well is connected at slot overflowing, and so that the cold burden of injected plastics material front end is flowed into overflowing well by overflowing slot, is avoided cold burden
Be piled up in the junction between the injected plastics material of adjacent glue-feeder injection, to after preventing casting of electronic device to be molded in the combination
There is the problems such as stomata, sand holes or bonding wire in place.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is a kind of structural schematic diagram of injection mold in the related technology；
Fig. 2 is the structural schematic diagram of electronic equipment center in the related technology；
Fig. 3 is a kind of structural schematic diagram of injection mold of one exemplary embodiment of the disclosure；
Fig. 4 is the structural schematic diagram of a kind of electronic equipment center of one exemplary embodiment of the disclosure；
Fig. 5 is the processing method flow chart of a kind of electronic equipment center of one exemplary embodiment of the disclosure.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
In the following embodiments, by taking the moulding process of electronic equipment center as an example, the technical solution of the disclosure is retouched
It states；Certainly, skilled person would appreciate that：The relevant injection mold of disclosed technique scheme and processing method, together
Sample is suitable for the disclosure such as other shell structures, such as front housing, backboard of electronic equipment and is limited not to this.
Fig. 1 is a kind of structural schematic diagram of injection mold in the related technology.As shown in Figure 1, including in injection mold 10
Cavity 11, and 10 surface of injection mold offers the multiple glue-feeders 111 being connected to cavity 11, by by injected plastics material from into glue
Mouth 111 is injected into cavity 11 so that injected plastics material contact, mixing in cavity 11, and then it is full of cavity 11, thus in cooling
The structure for meeting preset shape, such as electronic equipment center 20 shown in Fig. 2 are obtained after solidification.
In injection moulding process, the front end of the injected plastics material of two bursts of relative flows contacts and ties at first in cavity 11
It closes.Such as when to glue-feeder 111a, 111b, 111c injection injected plastics material, injected plastics material is along the opposite stream in the direction of arrow shown in Fig. 1
It is dynamic, injected plastics material front end may be mingled with remain on cold burden in nozzle and injected plastics material when previous injection molding may be due to
Time into cavity 11 is longer and cools down, and then forms part cold burden in the front end of injected plastics material, and cold burden is in phase mutual connection
Tactile two positions a, b can not well be combined with the injected plastics material of melting, lead to pair of electronic equipment center 20 after molding
It answers position bonding wire 21a, 21b as shown in Figure 2 or stomata, sand holes etc. occur, not only reduces electronic equipment center intensity, also can
Influence its appearance.
Therefore, the disclosure to injection mold 10 by carrying out structure improvement, to solve above-mentioned skill present in the relevant technologies
Art problem.It is described in detail with reference to embodiment.
Fig. 3 is a kind of structural schematic diagram of injection mold of one exemplary embodiment of the disclosure.As shown in figure 3, injection mould
Multiple glue-feeders 111 and at least one spilling slot 112 are offered on the cavity 11 of tool 10, and each spilling slot 112 is respectively set
Between corresponding two adjacent glue-feeders 111, each corresponding position for overflowing slot 112 is equipped with overflowing well 12.
In the present embodiment, by taking two glue-feeders 111a, 111b of arbitrary neighborhood as an example, injected plastics material passes through glue-feeder
After 111a, 111b inject cavity 11, two strands of injected plastics materials of relative flow as shown by arrows are formed, and injected plastics material front end
Cold burden can be flowed by corresponding spilling slot 112a in overflowing well 12a, and the remainder of two strands of injected plastics materials (does not include cold
Material) it contacts with each other and is combined together.Therefore, slot 112 and overflowing well 12 are overflowed by setting, can to avoid cold burden it is adjacent into
The junction accumulation for two strands of injected plastics materials that glue mouth 111 injects, forms the smooth electronic equipment center in surface as shown in Figure 4.Its
In, the number of glue-feeder 111, spilling slot 112 and overflowing well 12 is configured according to specific demand, and the disclosure is not to this
It is limited.
In the present embodiment, software simulation calculating or experimental test can be first passed through in advance, determined through injection mold 10
On glue-feeder 111 inject injected plastics material when, adjacent glue-feeder 111 inject the corresponding junction of two strands of injected plastics materials, to
Slot 112 will be overflowed, overflowing well 12 may be contained within 111 corresponding injected plastics material junction of each glue-feeder.So, for arbitrary two
For a adjacent glue-feeder 111, two strands of injected plastics materials of relative flow almost can reach corresponding junction simultaneously after injection,
And the cold burden of two bursts of injected plastics material front ends is flowed out from the spilling slot 112 of the junction simultaneously, avoid one injected plastics material edge
Overflow the outflow of slot 112 and another stock does not arrive at the spilling slot 112 also, cause first to arrive at junction injected plastics material still need after
It is continuous to inject, until the cold burden of another strand of injected plastics material forms the waste to injected plastics material from the outflow of slot 112 is overflowed.
In the present embodiment, the opening area of the corresponding two adjacent glue-feeder 111a and 111b of overflowing well 12a can phase
Together.The size of glue-feeder 111 can cause shadow to flow behavior of the injected plastics material in cavity 11 during due to injection molding
It rings, and then influences the Forming Quality of injected plastics material, so when ensureing that the opening area of each glue-feeder 111 is identical, for type
In the case that 11 internal diameter of chamber is almost the same, the injected plastics material that the identical glue-feeder 111 of the opening area injects can be made in cavity 11
Interior flowing velocity is consistent, and the spillover position of the corresponding cold burden of control injected plastics material can be convenient for (can be arranged accordingly corresponding
Overflow slot 112 and overflowing well 12 etc.), and the Forming Quality of control electronics center 20 in turn.
Further, since cavity 11 needs the concrete structure according to product to be designed, and in the present embodiment, cavity 11 turns
The flow behavior of injected plastics material is more complicated at angle, is easier to cause if 11 corner of cavity combines if two strands of injected plastics materials
There is the problems such as bonding wire 21, stomata and sand holes in shaped article.Therefore, it is designed in the corner of cavity 11 and overflows slot 112b, made
By the injected plastics material of glue-feeder 111a, glue-feeder 111c injection after arrow shown in Fig. 3 flowing, corresponding cold burden can be from
The spilling slot 112b of corner is spilled over to overflowing well 12b, to ensure the appearance and structural strength of shaped article.
For the above-mentioned injection mold 10 of disclosed technique scheme, the process of corresponding electronic equipment center 20 also phase
It should change.Below by taking the injection mold of embodiment illustrated in fig. 3 10 as an example, to the process of the electronic equipment center 20 into
Row explanation；Wherein, Fig. 5 is a kind of electronic equipment center processing method flow chart of one exemplary embodiment of the disclosure, such as Fig. 5 institutes
Show, this method may comprise steps of：
In step 501, the injected plastics material of liquid is injected in the cavity of injection mold 10, until each glue-feeder injects
Injected plastics material in the presence of at least part flow into corresponding overflowing well.
In the present embodiment, when each glue-feeder 111 inject injected plastics material in the presence of at least part flow into it is corresponding
In overflowing well 12, the cold burden of per share injected plastics material front end is guaranteed to contact each other combination all from the inflow overflowing well 12 of slot 112 is overflowed
Injected plastics material do not include cold burden, the product of smooth in appearance can be formed.
In the present embodiment, the injection rate of injected plastics material can be made identical, makes flowing of the injection material in cavity 11
Characteristic is easier to control, to obtain better Forming Quality.
In step 502, by the injected plastics material curing molding in cavity 11, to obtain electronic equipment center 20.
In the present embodiment, when between the injected plastics material of curing molding in the cold burden in overflowing well 12 and cavity 11 can from
When row is detached from, electronic equipment center 20 can be directly obtained out of cavity 11；Inside cold burden and the cavity 11 in overflowing well 12
Injected plastics material between be connected when, the cold burden in overflowing well 12 can be cut off in step 502, it is after molding to obtain
Electronic equipment center 20.
In the technical solution of the disclosure, the injected plastics material used can be metal material, can also be plastic material, this
It is open to be limited not to this.
Present disclosure also relates to a kind of electronic equipment shell, casting of electronic device is processed by the processing method of such as Fig. 5 embodiments
Molding.The casting of electronic device surface is smooth, no bonding wire 21, stomata and sand holes and not easy to crack.Wherein, casting of electronic device
Can be above-mentioned electronic equipment center 20, or other shell structures such as front housing, backboard of electronic equipment, the disclosure is simultaneously
It is limited not to this.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and includes the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (10)
1. a kind of injection mold, which is characterized in that including：Cavity and at least one overflowing well；
Offer multiple glue-feeders and at least one spilling slot on the cavity, the overflowing well by the spilling slot with it is described
Cavity is connected to, and each spilling slot is separately positioned between corresponding two adjacent glue-feeders.
2. injection mold according to claim 1, which is characterized in that the spilling slot is adjacent into glue positioned at corresponding two
Injected plastics material junction between mouthful.
3. injection mold according to claim 1, which is characterized in that the corresponding two adjacent glue-feeders of the overflowing well
Opening area is identical.
4. injection mold according to claim 1, which is characterized in that the corner of the cavity is equipped with the spilling slot.
5. the processing method of a kind of electronic equipment shell, which is characterized in that including：
By the glue-feeder on injection mold according to any one of claims 1-4, described in the injected plastics material injection by liquid
In the cavity of injection mold, until the injected plastics material of each glue-feeder injection flows into corresponding overflowing well in the presence of at least part
In；
By the injected plastics material curing molding in the cavity, to obtain the casting of electronic device.
6. according to the method described in claim 5, it is characterized in that, the injected plastics material of liquid to be injected to the type of the injection mold
Intracavitary, including：
The injected plastics material is injected to adjacent glue-feeder using identical speed.
7. according to the method described in claim 5, it is characterized in that, further including：
The overflowing well is cut off from the casting of electronic device after molding.
8. according to the method described in claim 5, it is characterized in that, the injected plastics material includes：Metal material or plastic material.
9. a kind of electronic equipment shell, which is characterized in that the casting of electronic device is by as described in any one of claim 5-8
Processing method machine-shaping.
10. casting of electronic device according to claim 9, which is characterized in that the casting of electronic device includes：Electronics is set
Standby center, electronic equipment front housing or electronic equipment backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710183988.3A CN108621377A (en) | 2017-03-24 | 2017-03-24 | Injection mold, casting of electronic device and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710183988.3A CN108621377A (en) | 2017-03-24 | 2017-03-24 | Injection mold, casting of electronic device and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108621377A true CN108621377A (en) | 2018-10-09 |
Family
ID=63707868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710183988.3A Pending CN108621377A (en) | 2017-03-24 | 2017-03-24 | Injection mold, casting of electronic device and its processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108621377A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020140172A1 (en) * | 2018-12-30 | 2020-07-09 | 瑞声精密制造科技(常州)有限公司 | Injection mold having flash well and use method therefor |
| CN112045941A (en) * | 2019-06-06 | 2020-12-08 | 河南裕展精密科技有限公司 | Injection mould |
| CN114012992A (en) * | 2021-11-15 | 2022-02-08 | 广东东亚电器有限公司 | A mould and injection molding machine for assembling product integrated into one piece |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204622460U (en) * | 2014-01-04 | 2015-09-09 | 上海朗亿功能材料有限公司 | A kind of injection mold preparing plastic-metal product |
-
2017
- 2017-03-24 CN CN201710183988.3A patent/CN108621377A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204622460U (en) * | 2014-01-04 | 2015-09-09 | 上海朗亿功能材料有限公司 | A kind of injection mold preparing plastic-metal product |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020140172A1 (en) * | 2018-12-30 | 2020-07-09 | 瑞声精密制造科技(常州)有限公司 | Injection mold having flash well and use method therefor |
| CN112045941A (en) * | 2019-06-06 | 2020-12-08 | 河南裕展精密科技有限公司 | Injection mould |
| CN112045941B (en) * | 2019-06-06 | 2022-06-21 | 河南裕展精密科技有限公司 | Injection mould |
| CN114012992A (en) * | 2021-11-15 | 2022-02-08 | 广东东亚电器有限公司 | A mould and injection molding machine for assembling product integrated into one piece |
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