CN108598286A - a kind of OLED display panel and packaging method - Google Patents
a kind of OLED display panel and packaging method Download PDFInfo
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- CN108598286A CN108598286A CN201810717111.2A CN201810717111A CN108598286A CN 108598286 A CN108598286 A CN 108598286A CN 201810717111 A CN201810717111 A CN 201810717111A CN 108598286 A CN108598286 A CN 108598286A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000012044 organic layer Substances 0.000 claims abstract description 86
- 239000010410 layer Substances 0.000 claims abstract description 51
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 47
- 239000001301 oxygen Substances 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000011358 absorbing material Substances 0.000 claims abstract description 21
- 229920006280 packaging film Polymers 0.000 claims abstract description 14
- 239000012785 packaging film Substances 0.000 claims abstract description 14
- 230000000903 blocking effect Effects 0.000 claims description 25
- 238000005538 encapsulation Methods 0.000 claims description 17
- 230000004888 barrier function Effects 0.000 claims description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 6
- 239000002121 nanofiber Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 28
- 239000000463 material Substances 0.000 description 6
- 238000007641 inkjet printing Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011368 organic material Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000000017 hydrogel Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Oled panel provided by the invention and packaging method, including：Light-emitting substrate, and at least one set of packaging film is set on the light-emitting substrate；Packaging film described in every group includes the first inorganic layer being arranged on the light-emitting substrate, it is provided with organic layer on first inorganic layer, the fringe region of the organic layer is provided with organic barricade, and the organic layer is blocked in organic barricade, and the second inorganic layer for covering first inorganic layer, organic layer and organic barricade is provided on the organic layer；Wherein, water-absorbing material is filled in organic barricade, to improve the water oxygen obstructing capacity of oled panel.Organic barricade is set by the fringe region in organic layer, and water-absorbing material is filled in organic barricade, to achieve the purpose that improve to steam and oxygen obstruction ability, to extend the service life of oled panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to an OLED panel and an encapsulation method.
Background
As a current type Light Emitting device, an OLED (Organic Light Emitting Diode) has attracted attention because of its advantages of self-luminescence, rich colors, fast response speed, wide viewing angle, Light weight, capability of being made into a flexible display screen, and the like.
However, OLED devices are very sensitive to moisture and oxygen, and therefore, encapsulation of the OLED devices is often required. The existing packaging method still enables the edge of the OLED device to be easily invaded by water vapor and oxygen, and further causes phenomena such as electrode oxidation, poor chemical reaction of organic materials or black spots, and the like, thereby reducing the service life of the OLED device.
Therefore, it is desirable to provide an OLED panel and an encapsulation method to solve the problems of the prior art.
Disclosure of Invention
The embodiment of the invention provides an OLED panel, which can improve the blocking capability of the OLED panel on water vapor and oxygen, so that the service life of the OLED panel is prolonged.
The present invention provides an OLED panel, comprising:
the packaging structure comprises a light-emitting substrate and at least one group of packaging films arranged on the light-emitting substrate;
each group of packaging films comprises a first inorganic layer arranged on the light-emitting substrate, an organic layer is arranged on the first inorganic layer, an organic retaining wall is arranged in the edge area of the organic layer, the organic layer is blocked in the organic retaining wall, and a second inorganic layer covering the first inorganic layer, the organic layer and the organic retaining wall is arranged on the organic layer; wherein,
the organic retaining wall is filled with water-absorbing materials so as to improve the water-oxygen blocking capability of the OLED panel.
According to a preferred embodiment of the present invention, the organic retaining wall is a ring structure, and the organic retaining wall at least surrounds the organic layer.
According to a preferred embodiment of the present invention, the organic retaining wall includes an organic sub-retaining wall, and a plurality of water-oxygen blocking blocks disposed in the organic sub-retaining wall.
According to a preferred embodiment of the present invention, the water-oxygen barrier block is made of electrospun acetate nanofibers or polyacrylic resin.
According to a preferred embodiment of the present invention, the organic retaining wall and the organic layer are made of acrylic or epoxy.
Correspondingly, the invention also provides an encapsulation method of the OLED panel, which comprises the following steps: providing a light-emitting substrate;
forming at least one group of packaging films on the light-emitting substrate; wherein,
each group of packaging films comprises a first inorganic layer, an organic layer and a second inorganic layer which are stacked on the light-emitting substrate; wherein an organic retaining wall is formed at an edge region of the organic layer.
According to a preferred embodiment of the present invention, the step of forming at least one group of encapsulation films on the light-emitting substrate includes:
forming a first inorganic layer on the light emitting substrate;
forming an organic layer on the first inorganic layer;
forming an organic retaining wall on an edge region of the organic layer; wherein the organic layer is blocked within the organic barrier wall;
and forming a second inorganic layer on the first inorganic layer, the organic layer and the organic barrier wall.
According to a preferred embodiment of the present invention, the organic retaining wall is a ring structure, and the organic retaining wall at least surrounds the organic layer.
According to a preferred embodiment of the present invention, the organic retaining wall includes an organic sub-retaining wall, and a plurality of water-oxygen blocking blocks disposed in the organic sub-retaining wall.
According to a preferred embodiment of the present invention, the water-oxygen barrier block is made of electrospun acetate nanofibers or polyacrylic resin.
The OLED panel and the packaging method provided by the invention comprise the following steps: the packaging structure comprises a light-emitting substrate and at least one group of packaging films arranged on the light-emitting substrate; each group of packaging films comprises a first inorganic layer arranged on the light-emitting substrate, an organic layer is arranged on the first inorganic layer, an organic retaining wall is arranged in the edge area of the organic layer, the organic layer is blocked in the organic retaining wall, and a second inorganic layer covering the first inorganic layer, the organic layer and the organic retaining wall is arranged on the organic layer; and the organic retaining wall is filled with a water-absorbing material so as to improve the water and oxygen blocking capacity of the OLED panel. The organic retaining wall is arranged in the edge area of the organic layer, and the organic retaining wall is filled with the water-absorbing material, so that the purpose of improving the water vapor and oxygen blocking capacity is achieved, and the service life of the OLED panel is prolonged.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic flow chart of an encapsulation method of an OLED device according to an embodiment of the present invention;
FIG. 2 is a schematic plan view of an OLED panel provided in an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of an organic retaining wall according to an embodiment of the present invention;
fig. 4 is a schematic flowchart of an encapsulation method of an OLED panel according to an embodiment of the present invention;
fig. 5 is a schematic flowchart of step S102 according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an OLED panel according to an embodiment of the invention.
An embodiment of the present invention provides an OLED panel, including:
a light emitting substrate 10, and at least one set of encapsulation films 20 disposed on the light emitting substrate;
each group of the encapsulation films 20 includes a first inorganic layer 201 disposed on the light emitting substrate, an organic layer 202 disposed on the first inorganic layer, an organic retaining wall 206 disposed on an edge region of the organic layer 202, and the organic layer 202 is retained in the organic retaining wall 206, and a second inorganic layer 203 disposed on the organic layer 202 and covering the first inorganic layer 201, the organic layer 202, and the organic retaining wall 206; wherein,
the organic retaining wall 206 is filled with a water-absorbing material to improve the water oxygen blocking capability of the OLED panel.
Specifically, the light emitting substrate 10 may be a light emitting substrate formed with an OLED device, and the light emitting substrate 10 may include various circuit structures and/or substrate structures according to actual needs. At least one set of encapsulation films 20 is disposed on the light emitting substrate 10, and optionally, one set of encapsulation films 20 may be disposed, or multiple sets of encapsulation films 20 may be stacked on the light emitting substrate 10. For example, the first inorganic layer 201 may be prepared on the light emitting substrate 10 by a chemical vapor deposition process, and the material of the first inorganic layer 201 may be silicon nitride, silicon oxynitride, or silicon oxide. The organic layer 202 is disposed on the first inorganic layer 201, the organic retaining wall 206 is disposed on the edge region of the organic layer 202, and the organic layer 202 is retained in the organic retaining wall 206, the organic layer 202 and the organic retaining wall 206 may be formed by an inkjet printing process, and the material of the organic layer 102 may be acrylic, epoxy or silicone resin for buffering stress and foreign matter coating of the device during bending and folding. It should be noted that the organic retaining wall 206 is filled with a water-absorbing material, and if the organic retaining wall 206 and the organic layer 202 are fabricated together, the water-absorbing material of the organic retaining wall 206 will affect the light-emitting effect of the OLED panel, so the process of forming the organic layer 202 and the process of forming the organic retaining wall 206 are two processes, and cannot be fabricated together. The organic layer 202 is provided with a second inorganic layer 203 covering the first inorganic layer 201, the organic layer 202 and the organic retaining wall 206, the second inorganic layer 203 can also be manufactured by a chemical vapor deposition process, and the material of the second inorganic layer 203 can be silicon nitride or silicon oxynitride.
Further, please refer to fig. 1 and fig. 2 in combination, fig. 2 is a schematic plan view of an OLED panel according to an embodiment of the present invention.
Preferably, the organic retaining wall 206 is a ring structure, and the organic retaining wall 206 at least surrounds the organic layer 202. For example, the ring-shaped organic retaining wall 206 is disposed to surround the organic layer 202, and the interior of the organic retaining wall 206 is filled with a water-absorbing material, so that not only can the path of water and oxygen from the side to the organic layer 202 be increased, and the probability of water and oxygen from the organic layer 202 be reduced, but also, because the water-absorbing material is disposed inside the organic retaining wall 206, when water and oxygen from the side to the organic layer 202, the water-absorbing material in the organic retaining wall 206 will react with water and oxygen to form a water and oxygen barrier like hydrogel, and the water and oxygen barrier can further block water and oxygen from the organic layer 202, thereby preventing water and oxygen from invading the organic layer 202 and causing the OLED panel to fail, and therefore, the ring-shaped organic retaining wall 206 is disposed to achieve the purpose of blocking water and oxygen from invading the organic layer 202, thereby improving the water and oxygen blocking capability of the OLED panel, and prolonging the.
Of course, the structure of the organic retaining wall 206 is not limited to this, and may be in other special shapes, and this embodiment only describes that the organic retaining wall 206 is in a ring structure.
Preferably, the organic retaining wall 206 includes an organic sub-retaining wall 301, and a plurality of water-oxygen blocking blocks 302 disposed inside the organic sub-retaining wall.
Specifically, referring to fig. 3, fig. 3 is an enlarged schematic view of an organic retaining wall according to an embodiment of the present invention. In specific implementation, a mixture of an organic material and a water-absorbing material is printed on the edge region of the organic layer 202 by an inkjet printing process to form the organic retaining wall 206 on the edge region of the organic layer 202, the organic retaining wall 206 includes an organic sub-retaining wall 301 and a plurality of water-oxygen blocking blocks 302, the water-oxygen blocking blocks 302 are disposed in the organic sub-retaining wall 301, wherein the water-oxygen blocking blocks 302 are made of the water-absorbing material. It should be noted that, in this embodiment, the shape and size of the water and oxygen blocking block 302 are not limited thereto, and fig. 3 is only a schematic illustration and is not a limitation to the present invention.
Preferably, the material of the water and oxygen blocking block 302 is electrospun acetate nanofiber or polyacrylic resin.
Preferably, the material of the organic retaining wall 302 and the organic layer 202 is acrylic or epoxy.
Accordingly, an embodiment of the present invention provides a method for encapsulating an OLED panel, and referring to fig. 4, the method for encapsulating an OLED panel includes:
s101, providing a light emitting substrate.
In step S101, a light emitting substrate is provided, which may be a light emitting substrate formed with an OLED device, and the light emitting substrate may include various circuit structures and/or substrate structures according to actual needs.
And S102, forming at least one group of packaging films on the light-emitting substrate.
In step S102, at least one group of encapsulation films, optionally one group of encapsulation films, or multiple groups of encapsulation films, are formed on the light-emitting substrate. Each group of packaging films comprises a first inorganic layer, an organic layer and a second inorganic layer which are stacked on the light-emitting substrate; wherein an organic retaining wall is formed at an edge region of the organic layer.
Optionally, step S102 may specifically include:
s201, forming a first inorganic layer on the light-emitting substrate.
And S202, forming an organic layer on the first inorganic layer.
And S203, forming an organic retaining wall on the edge area of the organic layer.
And S204, forming a second inorganic layer on the first inorganic layer, the organic layer and the organic barrier.
In step S201, the light-emitting substrate 10 is transferred into a reaction chamber, and a silicon nitride or silicon oxynitride film is deposited on the light-emitting substrate 10 by PECVD (Plasma Enhanced Chemical Vapor Deposition) to form a first inorganic layer 201 on the light-emitting substrate 10, in conjunction with fig. 1, fig. 2, fig. 3 and fig. 5. Next, in step S202, after the first inorganic layer 201 is cooled, the organic layer 202 is formed on the first inorganic layer 201 through an inkjet printing process, and the material of the organic layer 202 may be acryl or epoxy. Then, in step S203, a mixture of an organic material and a water absorbing material is printed on the edge region of the organic layer 202 by an inkjet printing process to form an organic retaining wall 206 on the edge region of the organic layer 202. In step S204, the light-emitting substrate 10 on which the first inorganic layer 201, the organic layer 202 and the organic retaining wall 206 have been formed is transferred into a reaction chamber, and the second inorganic layer 203 is formed on the first inorganic layer 201, the organic layer 202 and the organic retaining wall 206 by PECVD.
Preferably, the organic retaining wall is an annular structure, and the organic retaining wall at least surrounds the organic layer.
Referring to fig. 1 and fig. 2, preferably, the organic retaining wall 206 is a ring structure, and the organic retaining wall 206 at least surrounds the organic layer 202. For example, the annular organic retaining wall 206 is disposed to surround the organic layer 202, and the interior of the organic retaining wall 206 is filled with water-absorbing material, so that not only the path of water and oxygen from the side to the organic layer 202 is increased, and the probability of water and oxygen from the organic layer 202 is reduced, but also, because the water-absorbing material is disposed inside the organic retaining wall 206, when water and oxygen from the side to the organic layer 202, the water-absorbing material in the organic retaining wall 206 will react with water and oxygen to form a substance like hydrogel, so that the purpose of blocking water and oxygen from entering the organic layer 202 is achieved by disposing the annular organic retaining wall 206, thereby improving the water and oxygen blocking capability of the OLED panel and prolonging the service life of the OLED panel.
The organic retaining wall comprises an organic sub-retaining wall and a plurality of water oxygen blocking blocks arranged in the organic sub-retaining wall.
Specifically, referring to fig. 3, in an implementation, a mixture of an organic material and a water-absorbing material is printed on an edge region of the organic layer 202 by an inkjet printing process to form an organic retaining wall 206 on the edge region of the organic layer 202, the organic retaining wall 206 includes an organic sub-retaining wall 301 and a plurality of water-oxygen blocking blocks 302, the water-oxygen blocking blocks 302 are disposed in the organic sub-retaining wall 301, wherein the water-oxygen blocking blocks 302 are made of the water-absorbing material. It should be noted that, in this embodiment, the shape and size of the water and oxygen blocking block 302 are not limited thereto, and fig. 3 is only a schematic illustration and is not a limitation to the present invention.
The water-oxygen barrier block is made of electrospun acetate nanofiber or polyacrylic resin.
In this embodiment, the organic retaining wall 206 is formed at the edge region of the organic layer 202, wherein the organic retaining wall 206 is filled with a water-absorbing material to achieve the purpose of improving the water vapor and oxygen blocking capability, thereby prolonging the service life of the OLED panel.
The OLED panel and the packaging method provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein using specific examples, which are merely used to help understanding the present invention. Meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. An OLED panel, comprising:
the packaging structure comprises a light-emitting substrate and at least one group of packaging films arranged on the light-emitting substrate;
each group of packaging films comprises a first inorganic layer arranged on the light-emitting substrate, an organic layer is arranged on the first inorganic layer, an organic retaining wall is arranged in the edge area of the organic layer, the organic layer is blocked in the organic retaining wall, and a second inorganic layer covering the first inorganic layer, the organic layer and the organic retaining wall is arranged on the organic layer; wherein,
the organic retaining wall is filled with water-absorbing materials so as to improve the water-oxygen blocking capability of the OLED panel.
2. The OLED panel of claim 1, wherein the organic retaining wall is a ring structure and at least surrounds the organic layer.
3. The OLED panel of claim 2, wherein the organic retaining wall comprises an organic sub-retaining wall and a plurality of water-oxygen blocking blocks disposed within the organic sub-retaining wall.
4. The OLED panel of claim 3, wherein the water-oxygen barrier block is made of electrospun acetate nanofibers or polyacrylic resins.
5. The OLED panel according to any one of claims 2 to 4, wherein the organic retaining wall and the organic layer are made of acrylic or epoxy.
6. An encapsulation method of an OLED panel is characterized by comprising the following steps:
providing a light-emitting substrate;
forming at least one group of packaging films on the light-emitting substrate; wherein,
each group of packaging films comprises a first inorganic layer, an organic layer and a second inorganic layer which are stacked on the light-emitting substrate; wherein an organic retaining wall is formed at an edge region of the organic layer.
7. The method of claim 6, wherein the step of forming at least one set of encapsulation films on the light-emitting substrate comprises:
forming a first inorganic layer on the light emitting substrate;
forming an organic layer on the first inorganic layer;
forming an organic retaining wall on an edge region of the organic layer; wherein the organic layer is blocked within the organic barrier wall;
and forming a second inorganic layer on the first inorganic layer, the organic layer and the organic barrier wall.
8. The method according to claim 7, wherein the organic dam is a ring structure, and the organic dam at least surrounds the organic layer.
9. The method of claim 8, wherein the organic dam comprises an organic sub-dam and a plurality of water-oxygen barrier blocks disposed inside the organic sub-dam.
10. The method of claim 9, wherein the water-oxygen barrier block is made of electrospun acetate nanofibers or polyacrylic resin.
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| CN201810717111.2A CN108598286B (en) | 2018-07-03 | 2018-07-03 | OLED display panel and packaging method |
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| CN201810717111.2A CN108598286B (en) | 2018-07-03 | 2018-07-03 | OLED display panel and packaging method |
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Cited By (7)
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| CN109411630A (en) * | 2018-12-11 | 2019-03-01 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN109546006A (en) * | 2018-12-17 | 2019-03-29 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED display panel and preparation method thereof |
| CN109616583A (en) * | 2018-12-12 | 2019-04-12 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN109671861A (en) * | 2018-12-13 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN111180604A (en) * | 2019-03-14 | 2020-05-19 | 广东聚华印刷显示技术有限公司 | Packaging structure, preparation method thereof and display panel |
| CN111900262A (en) * | 2020-07-31 | 2020-11-06 | 合肥维信诺科技有限公司 | Display panel and preparation method thereof |
| CN112768615A (en) * | 2020-12-30 | 2021-05-07 | 厦门天马微电子有限公司 | Thin film packaging structure, manufacturing method thereof and display device |
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