CN108597865A - Low square resistance metallized film and evaporation process - Google Patents
Low square resistance metallized film and evaporation process Download PDFInfo
- Publication number
- CN108597865A CN108597865A CN201810346865.1A CN201810346865A CN108597865A CN 108597865 A CN108597865 A CN 108597865A CN 201810346865 A CN201810346865 A CN 201810346865A CN 108597865 A CN108597865 A CN 108597865A
- Authority
- CN
- China
- Prior art keywords
- metallized film
- square resistance
- low square
- metal coated
- coated strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011104 metalized film Substances 0.000 title claims abstract description 20
- 238000001704 evaporation Methods 0.000 title claims description 10
- 230000008020 evaporation Effects 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 210000002469 basement membrane Anatomy 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 230000005486 microgravity Effects 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 210000004379 membrane Anatomy 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 206010053615 Thermal burn Diseases 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A kind of low square resistance metallized film of the present invention, including basement membrane (1), it is vaporized on that the metal coated strip (2) of side longitudinal central axis is deposited in basement membrane and blank stays sideband (3), the sheet resistance of the metal coated strip (2) is 0.35~0.85 Ω/.The low square resistance metallized film that the present invention is deposited can use under the extreme environmental conditions such as temperature change dramatically, high temperature, strong vibration and high radiation environment, weightlessness and microgravity, and have very high reliability.
Description
Technical field
The present invention relates to thin film capacitor manufacturing metallized film materials, more particularly to a kind of low square resistance metal
Change film and evaporation process.
Background technology
For thin film capacitor because it is used widely with good resistance to pressure and self-healing property, metallized film is thin-film electro
The important materials of container production manufacture, by high purity metal（Such as AL, ZN）It melts, evaporate under high vacuum state, being deposited to Jie
On matter basement membrane, the film after medium membrane surface forms one layer of very thin coat of metal is exactly metallized film；It metallizes thin
The resistance value of the unit square area of the coat of metal on film is known as sheet resistance（That is square resistance is indicated with Ω/）, metal-plated
The thickness and sheet resistance value of layer are inversely proportional, i.e., sheet resistance is lower, and metal layer thickness is bigger；The sheet resistance of Conventional metallization film is 2~4
Ω/□；Under the conditions of general atmosphere, what such metallized film use was applicable in, but in temperature change dramatically, high temperature, strong vibration
Under the extreme environmental conditions such as high radiation environment, weightlessness and microgravity, then it can not ensure the reliability of the capacitor of its manufacture.
Invention content
The purpose of the present invention is being directed to the deficiencies in the prior art, a kind of low square resistance metallized film and vapor deposition are provided
Technique, can be under the extreme environmental conditions such as temperature change dramatically, high temperature, strong vibration and high radiation environment, weightlessness and microgravity
It uses, and has very high reliability.
Technical solution
To achieve the above object, present invention employs following technical schemes：A kind of side's low square resistance metallized film, including basement membrane,
The metal coated strip and blank for being vaporized on basement membrane vapor deposition side longitudinal central axis stay sideband；The sheet resistance of the metal coated strip is 0.35
~0.85 Ω/, and the sheet resistance of metallized film metal coated strip can only achieve 2~4 Ω/ usually under technical conditions, i.e., it is golden
The thickness of categoryization film metal coating band is 7 times or so of usual technical conditions metal membrane metal coated strip, and metallization is thin
The thickness of film metal coated strip significantly thickens, it is meant that in vacuum evaporation, to precipitate on inherent basement membrane at the same time
More metals, and more precipitated metals also bring more heats to scald organic basement membrane in basement membrane, influence metallized film
Performance.
Further, the coat of metal carrying material is fine aluminium.
Further, a kind of side's low square resistance metallized film includes following evaporation process：
1. the vacuum degree in plated film intracavitary portion is -4 × 10-3mbar；
2. evaporation rate is 2 meter per seconds；
3. the temperature of the main drum of cooling is -25 DEG C.
The beneficial effects of the present invention are
The low square resistance metallized film produced through above-mentioned evaporation process：It can be in temperature change dramatically, high temperature, strong vibration and high spoke
It penetrates under the extreme environmental conditions such as environment, weightlessness and microgravity and uses, and have very high reliability.
Description of the drawings
Fig. 1 is sectional view of the present invention.
In figure, 1 basement membrane, 2 metal coated strips, 3 blank stay sideband.
Specific implementation mode
As shown in Figure 1, a kind of low square resistance metallized film of the present invention, including basement membrane (1), to be vaporized on basement membrane vapor deposition side longitudinal
The metal coated strip (2) and blank of axis stay sideband (3)；The sheet resistance of the metal coated strip (2) be 0.35~0.85 Ω/
, and the sheet resistance of metallized film metal coated strip (2) can only achieve 2~4 Ω/ usually under technical conditions, that is, metallize thin
The thickness of film metal coated strip (2) is 7 times or so of usual technical conditions metal membrane metal coated strip (2), and metallization is thin
The thickness of film metal coated strip (2) significantly thickens, it is meant that in vacuum evaporation, to sink on inherent basement membrane at the same time
Form sediment more metals, and more precipitated metals also bring more heats to scald organic basement membrane (2) in basement membrane (1), influence gold
The performance of categoryization film；
Metal coated strip (2) material is fine aluminium；
A kind of side's low square resistance metallized film includes following evaporation process：
1. the vacuum degree in plated film intracavitary portion is -4 × 10-3mbar；
2. evaporation rate is 2 meter per seconds；
3. the temperature of the main drum of cooling is -25 DEG C.
Claims (3)
1. a kind of low square resistance metallized film, including basement membrane (1), the metal coated strip for being vaporized on basement membrane vapor deposition side longitudinal central axis
(2) and blank stays sideband (3), it is characterised in that the sheet resistance of the metal coated strip (2) is 0.35~0.85 Ω/.
2. a kind of low square resistance metallized film according to claim 1, it is characterised in that metal coated strip (2) material
For fine aluminium.
3. a kind of low square resistance metallized film according to claim 1, it is characterised in that including following evaporation process：
The vacuum degree in A plated film intracavitary portion is -4 × 10-3mbar；
B evaporation rates are 2 meter per seconds；
The temperature that C cools down main drum is -25 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810346865.1A CN108597865A (en) | 2018-04-18 | 2018-04-18 | Low square resistance metallized film and evaporation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810346865.1A CN108597865A (en) | 2018-04-18 | 2018-04-18 | Low square resistance metallized film and evaporation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108597865A true CN108597865A (en) | 2018-09-28 |
Family
ID=63613544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810346865.1A Withdrawn CN108597865A (en) | 2018-04-18 | 2018-04-18 | Low square resistance metallized film and evaporation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108597865A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295581A (en) * | 2007-04-28 | 2008-10-29 | 上海奥移电器有限公司 | All-aluminum thickened thin film for metalized capacitor |
| CN103077821A (en) * | 2013-01-09 | 2013-05-01 | 铜陵市东市电子有限责任公司 | Ultralow-sheet-resistance metal aluminum film |
-
2018
- 2018-04-18 CN CN201810346865.1A patent/CN108597865A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101295581A (en) * | 2007-04-28 | 2008-10-29 | 上海奥移电器有限公司 | All-aluminum thickened thin film for metalized capacitor |
| CN103077821A (en) * | 2013-01-09 | 2013-05-01 | 铜陵市东市电子有限责任公司 | Ultralow-sheet-resistance metal aluminum film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180928 |