CN108595877B - Method for measuring KDP crystal cutting temperature - Google Patents
Method for measuring KDP crystal cutting temperature Download PDFInfo
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Abstract
The invention provides a method for measuring the temperature of a crystal cutting area in a process of carrying out fly-cutting processing on KDP crystals, which comprises the following steps: 1) acquiring parameters of a KDP crystal material; 2) setting cutting speed, cutting depth and feeding amount for simulation software; 3) simulating a KDP crystal cutting process by using finite element simulation software; 4) preparing a color-changing material; 5) coating the color-changing material on a cutter, and carrying out temperature calibration; 6) installing the cutter coated with the color-changing material on a machine tool, setting the same technological parameters as the simulation software, and carrying out crystal cutting; 7) and comparing the color change condition of the color change material with the calibration result to obtain the temperature of the cutting area. The invention combines finite element simulation analysis and a KDP crystal cutting temperature measurement method of the color-changing material, combines the finite element simulation result according to the color-changing condition of the color-changing material on the cutter, can directly obtain the temperature of the front cutter surface of the cutter, and combines simulation to indirectly obtain the temperature distribution in the cutting area.
Description
Technical Field
The invention belongs to the technical field of ultra-precise fly-cutting, and particularly relates to a method for measuring KDP crystal cutting temperature.
Background
The ultra-precision cutting technology is widely applied to high-tech fields such as aerospace, precise instruments, military industry and the like at present due to the characteristics of high processing precision, high production efficiency and good repeatability. In a high-energy solid laser of inertial confinement laser nuclear fusion, a KDP (potassium dihydrogen phosphate) crystal is an irreplaceable material used as a frequency doubling element and photoelectric light opening. Because the KDP crystal has the physical characteristics of softness, brittleness, deliquescence and the like, the KDP crystal is difficult to process in the traditional milling, polishing and other modes, and therefore, the ultra-precise diamond fly-cutting technology suitable for KDP crystal processing is developed.
The ultraprecise diamond fly-cutting machine tool mainly comprises a machine body 1, a stand column 2, a cross beam 3, an air static pressure main shaft 4, a hydraulic guide rail 5, a vacuum chuck 6 and a cutter 7, and is shown in figure 1. The ultra-precise diamond fly-cutting technology can be directly used for the finish machining of KDP crystals, has high precision of the machined surface, and can meet the use requirements of optical elements. Meanwhile, the fly-cutting processing technology is simple to control, has high processing efficiency and is the most effective processing means for KDP crystals. The fly-cutting machining is different from turning machining, a cutter rotates at a high speed along with a large cutter head in the fly-cutting machining, a machined element is slowly fed to realize cutting machining, and the fly-cutting machining is very suitable for machining plane elements.
When the KDP crystal is processed in a fly-cutting mode, the cutting speed can reach more than 10m/s, and when cutting is carried out at a high speed, on one hand, large plastic deformation of crystal materials near a cutting area occurs, on the other hand, severe friction occurs between a cutter and a workpiece, a large amount of heat is generated, the temperature of the materials near the cutting area is increased, and surface defects such as phase change, recrystallization, micro-cracks and the like occur in the cutting area of the KDP crystal.
Because the diamond cutter rotates at a high speed along with the main shaft in the process of carrying out fly-cutting processing on the KDP crystal, the area of a cutting temperature influence area is extremely small, and the position is changed rapidly, the temperature of the cutting area in the process is difficult to accurately measure by using the conventional temperature measuring method.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for measuring the temperature of a crystal cutting area in the process of carrying out fly-cutting processing on KDP crystals.
The technical scheme adopted by the invention for solving the technical problem is as follows: the measuring method of the KDP crystal cutting temperature comprises the following steps:
1) acquiring the density, specific heat capacity, elastic modulus, plasticity parameter and damage parameter of the KDP crystal material;
2) setting cutting speed, cutting depth and feeding amount for simulation software;
3) simulating the KDP crystal cutting process by using finite element simulation software to obtain the temperature distribution of a cutting area and the front cutter face of the cutter;
4) preparing a color-changing material;
5) coating the color-changing material on a cutter, and carrying out temperature calibration to determine the color-changing temperature of the color-changing material;
6) installing a cutter coated with a color-changing material on a machine tool, setting the same process parameters as the simulation software in the step 2), and cutting the crystal;
7) and (3) observing the cutter after cutting, comparing the color change condition of the color change material with the calibration result of the step 5), knowing the temperature of the front cutter surface of the cutter, and obtaining the temperature of the cutting area according to the simulation result of the step 3).
Further, the finite element simulation software can adopt ABAQUS finite element simulation software.
Further, the rake face of the tool refers to a face which directly acts on the KDP crystal layer to be cut and controls chip discharge along the same.
Further, the color-changing material is NiCl 2 ·6H 2 O and Cyclohexanedimethylenetetramine (CH) 2 ) 6 N 4 Preparation of nonreversible double salt NiCl 2 ·2(CH 2 ) 6 N 4 ·10H 2 O。
Further, the temperature calibration is as follows: putting the cutter coated with the color-changing material into an oven, setting the temperature from 50 ℃ to 65 ℃, dividing the temperature interval into three intervals of 50-55 ℃, 55-60 ℃ and 60-65 ℃, observing which interval the color-changing occurs in, then further determining the interval, and calibrating the specific color-changing temperature.
Further, during the actual cutting process, the temperature of the front face of the cutter is increased from 20 ℃ at room temperature to 67 ℃, and the maximum cutting temperature is over 100 ℃.
The invention has the beneficial effects that: the temperature of the front tool face of the tool can be directly obtained by combining finite element simulation analysis and a KDP crystal cutting temperature measurement method of the color-changing material according to the color-changing condition of the color-changing material on the tool and combining a finite element simulation result, and the temperature distribution in a cutting area can be indirectly obtained by combining simulation.
Drawings
Fig. 1 is a schematic view of a KDP cut fly-cutting machine tool configuration;
FIG. 2 is a schematic diagram of a finite element simulation of a KDP cutting process;
fig. 3 is a schematic diagram of the rake face temperature time during KDP cutting.
Detailed Description
Example (b):
the measuring method of the KDP crystal cutting temperature comprises the following steps:
1) obtaining the density rho (kg/m) of KDP crystal material 3 ) Specific heat capacity C (J/kg/° C), elastic modulus e (gpa), and plasticity parameter σ ═ R ∈ n (R strength factor, n hardening index), heat transfer coefficient K and damage parameters are as follows:
| ρ(kg/mm 3 ) | K(W/m/℃) | C(J/kg℃) | ε(MPa) | n | E(GPa) |
| 2350 | 16.1 | 730 | 360 | 0.41 | 46 |
2) setting the cutting speed V to be 10m/s and the cutting depth a for ABAQUS finite element simulation software p 2um and a feed f of 60 um/rad;
3) and simulating the KDP crystal cutting process by using ABAQUS finite element simulation software to obtain the temperature distribution of the cutting area and the cutter front face under the process parameters, wherein the temperature distribution is shown in figure 2. The finite element simulation is to simulate a real physical system by using a mathematical approximation method; the front tool face of the tool is the tool face which directly acts on a crystal layer to be cut and controls chips to be discharged along the front tool face;
4) preparing a color-changing material: with nickel chloride NiCl 2 ·6H 2 O and Cyclohexanedimethylenetetramine (CH) 2 ) 6 N 4 Preparation of nonreciprocal double salt NiCl 2 ·2(CH 2 ) 6 N 4 ·10H 2 O, the color-changing material shows green color at normal temperature and turns yellow at 60 ℃. Mixing the main components according to the atomic weight proportion of the main components in the molecular formula of the color-changing paint, grinding the mixture into fine seams, and slightly adding distilled water to obtain a fresh green paint material;
5) smearing the color-changing material on a cutter, and calibrating the temperature, specifically: placing a cutter coated with a color-changing material into an oven, setting the temperature to be 50-65 ℃, dividing the temperature interval into three large intervals of 50-55 ℃, 55-60 ℃ and 60-65 ℃, observing the interval in which the color-changing occurs, and then further determining the interval in which the color-changing occurs, wherein the color-changing interval is 55-60 ℃, and the color-changing is marked to be obvious at 58 ℃ and is changed from fresh green to yellow;
6) installing the cutter coated with the color-changing material (initially in bright green) on a machine tool, and setting the same process parameters as the simulation software in the step 2): a cutting speed V of 10m/s and a cutting depth a p 2um and the feed amount f is 60um/s, and KDP crystal cutting is carried out;
7) observing the cutter after cutting, comparing the color change condition of the color change material on the cutter with the calibration result of the step 5), so as to know the temperature of the front cutter surface of the cutter, and obtaining the temperature of the cutting area according to the simulation result of the step 3).
The result shows that the color-changing material on the cutter has the color-changing phenomenon, and changes from green to yellow, which indicates that the temperature of the front cutter surface of the cutter reaches above 58 ℃; in the simulation result, the temperature of the front tool face reaches 340K (67 ℃) and exceeds 58 ℃, which shows that the simulation is effective, and in the simulation result, the maximum cutting temperature is 384K (111 ℃), as shown in fig. 2, which shows that the temperature of the front tool face of the tool can be increased to 340K (67 ℃) from room temperature 293K (20 ℃) in the actual cutting process, and the maximum cutting temperature can reach more than 100 ℃, as shown in fig. 3.
Claims (4)
- The method for measuring the cutting temperature of the KDP crystal is characterized by comprising the following steps:1) acquiring the density, specific heat capacity, elastic modulus, plasticity parameter and damage parameter of the KDP crystal material;2) setting cutting speed, cutting depth and feeding amount for simulation software;3) simulating the KDP crystal cutting process by using finite element simulation software to obtain the temperature distribution of a cutting area and the front cutter face of the cutter;4) modulating a color change material, the color change material being NiCl 2 ·6H 2 O and Cyclohexanetetramine (CH) 2 ) 6 N 4 Preparation of nonreciprocal double salt NiCl 2 ·2(CH 2 ) 6 N 4 ·10H 2 O；5) Coating the color-changing material on a cutter, carrying out temperature calibration, and determining the color-changing temperature of the color-changing material, wherein the temperature calibration comprises the following steps: placing the cutter coated with the color-changing material into an oven, setting the temperature to be 50-65 ℃, dividing the temperature interval into three intervals of 50-55 ℃, 55-60 ℃ and 60-65 ℃, observing which interval the color-changing occurs in, then further determining the interval, and calibrating the specific color-changing temperature;6) installing the cutter coated with the color-changing material on a machine tool, setting the same technological parameters as the simulation software in the step 2), and carrying out crystal cutting;7) and (3) observing the cutter after cutting, comparing the color change condition of the color change material with the calibration result of the step 5), knowing the temperature of the front cutter surface of the cutter, and obtaining the temperature of the cutting area according to the simulation result of the step 3).
- 2. The method for measuring the cutting temperature of a KDP crystal of claim 1, wherein the finite element simulation software is ABAQUS finite element simulation software.
- 3. The method for measuring KDP crystal cutting temperature according to claim 1, wherein said tool rake face is the face which acts directly on the KDP crystal layer being cut and controls chip discharge therealong.
- 4. The method for measuring the cutting temperature of KDP crystal according to claim 1, wherein the temperature of the front face of the cutter is increased from room temperature of 20 ℃ to 67 ℃, and the maximum cutting temperature is up to 100 ℃ or higher.
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Inventor after: An Chenhui Inventor after: Feng Ke Inventor after: Xu Qiao Inventor after: Lei Xiangyang Inventor after: Zhang Jianfeng Inventor after: Zhang Shuai Inventor after: Su Wenhu Inventor after: Zhang Liping Inventor after: Wang Wei Inventor before: Feng Ke Inventor before: An Chenhui Inventor before: Xu Qiao Inventor before: Lei Xiangyang Inventor before: Zhang Jianfeng Inventor before: Zhang Shuai Inventor before: Su Wenhu Inventor before: Zhang Liping Inventor before: Wang Wei |
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