CN108587461A - A kind of electronic protection agent and preparation method thereof - Google Patents
A kind of electronic protection agent and preparation method thereof Download PDFInfo
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- CN108587461A CN108587461A CN201810215662.9A CN201810215662A CN108587461A CN 108587461 A CN108587461 A CN 108587461A CN 201810215662 A CN201810215662 A CN 201810215662A CN 108587461 A CN108587461 A CN 108587461A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D193/00—Coating compositions based on natural resins; Coating compositions based on derivatives thereof
- C09D193/04—Rosin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D157/00—Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D157/02—Copolymers of mineral oil hydrocarbons
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/329—Phosphorus containing acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of electronic protection agent and preparation method thereof, this kind of electronic protection agent includes the raw material of following parts by weight：20 25 parts of acrylic resin, 15 25 parts of epoxy resin, 20 30 parts of curing agent, 10 15 parts of emulsifier, 20 25 parts of thermoplastic styrene butadiene rubber, 30 40 parts of tackifying resin, 50 60 parts of organic solvent, 30 40 parts of phosphoric acid, 20 30 parts of potassium bromide, 10 20 parts of ammonium hydroxide, 15 25 parts of corrosion inhibiter, 10 15 parts of weak base, 50 60 parts of water.The present invention is used as the raw material of electronic protection agent by mixing various kinds of resin with curing agent, so that the salt spray resistance of electronic protection agent is improved 30 50% using the special chain structure of resin；It can reinforce the degree of adhesion of electronic protection agent and electronic component by adding tackifying resin, prevent it from causing the electronic protection agent to fall off because electronic component works long hours fever, the service life of electronic component is made to improve 23 times；The electronic protection agent process velocity is fast, and producing efficiency is high, of low cost, while having high salt spray resistance and corrosion resistance.
Description
Technical field
The present invention relates to electronic component protection technology fields more particularly to a kind of electronic protection agent and preparation method thereof.
Background technology
The metal used in electronic component is manufactured there is thermodynamic instability factor, these factors cause device generally to be deposited
Short life, high failure rate, not salt spray resistance, damp and hot, mould and the industrial atmosphere the problems such as, to influence the stabilization of electronic product
Property and service life lead to existing electronic component there is service lifes short, stability and poor reliability.Moreover,
The conventional methods such as existing plating cannot be satisfied increasing quality requirement.
Through retrieval, Chinese patent Authorization Notice No. is that CN106433465A discloses a kind of electronic protection agent and its preparation side
Method includes that the phosphoric acid of five parts of equivalent is mixed to get five parts of mixtures with the potassium bromide of five parts of equivalent respectively, heats respectively；It will add
Thermogenetic gas is passed through in the octadecyl alcolol of melting successively, obtains mixing liquid；Hexamethylenetetramine is added in mixing liquid；
Ammonium hydroxide is heated, the gas of generation is passed through in mixing liquid；Mixing liquid is poured into distilled water, is heated to boiling,
10-20 minutes postcoolings of boiling are kept, dark yellow solid substance is obtained；It is molten by being heated in dark yellow solid substance addition distilled water
Change until boiling, 10-20 minutes postcoolings of holding, obtain dark yellow color substance, the pH of water of repetition step until cooling
Value is 6.8-7.2, obtains dark yellow solid；Dark yellow solid is heated to all dissolving with beeswax, it is cold after stirring 5-10 minutes
But, the electronic protection agent is obtained.
Existing electronic protection agent and preparation method thereof has the following disadvantages：The preparation method complex steps, processing
Process temperature is excessively high, increases processing cost, and electronic protection agent salt spray resistance obtained is low so that and electronic component is unstable,
Service life is short.
Invention content
The purpose of the present invention is to provide a kind of electronic protection agent and preparation method thereof, it is fast to have a process velocity, makes effect
Rate is high, of low cost, has the advantages that high salt spray resistance and corrosion resistance, solves that production method is cumbersome, and high processing costs are obtained
Electronic protection agent salt spray resistance it is low so that electronic component is unstable, the short problem of service life.
A kind of electronic protection agent according to the ... of the embodiment of the present invention, this kind of electronic protection agent include the raw material of following parts by weight：
20-25 parts of acrylic resin, 15-25 parts of epoxy resin, 20-30 parts of curing agent, 10-15 parts of emulsifier, thermoplastic styrene butadiene rubber
20-25 parts, 30-40 parts of tackifying resin, 50-60 parts of organic solvent, 30-40 parts of phosphoric acid, 20-30 parts of potassium bromide, ammonium hydroxide 10-20
Part, 15-25 parts of corrosion inhibiter, 10-15 parts of weak base, 50-60 parts of water.
On the basis of said program, this kind of electronic protection agent further includes the raw material of following parts by weight：Calcium mahogany sulfonate 10-15
Part.
On the basis of said program, the curing agent includes the raw material of following parts by weight：10-15 parts of phenol, 4- chlorobenzene sulphurs
20-30 parts sour, 15-25 parts of 4- hydroxyl benzene sulfonyl chlorides, 20-30 parts of 4- bromo-benzene sulfonic acids, 10-20 parts of p-hydroxybenzenyl sulfonate, benzoquinones 25-
30 parts.
On the basis of said program, the tackifying resin is rosin polyol ester, Petropols, hydrogenated petroleum resin, phenol
One or more mixtures in urea formaldehyde.
On the basis of said program, the organic solvent is ethyl acetate, Ethyl formate, dimethyl carbonate, butyl acetate
In one or more mixtures.
On the basis of said program, the corrosion inhibiter is organic inhibitor.
On the basis of said program, the organic inhibitor be sulfamic acid, sodium benzoate, one kind in triethanolamine or
Several mixtures.
On the basis of said program, the weak base is one or both of sodium bicarbonate, calcium bicarbonate mixture.
On the basis of said program, the emulsifier includes the raw material of following parts by weight：5-15 parts of fatty acid mono glycidol,
10-20 parts of soybean lecithin, 15-25 parts of lauric monoglyceride, 20-25 parts of methyl glycol fatty acid ester.
A kind of preparation method of electronic protection agent, is as follows：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：By the acrylic resin of above-mentioned parts by weight, epoxy resin, curing agent, emulsifier, thermoplasticity butylbenzene rubber
Glue is added in the water of constant weight number, and 20-50min is stirred at 30-60 DEG C, and solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in
30-40min is stirred at 20-50 DEG C and obtains mixed liquor, then takes the ammonium hydroxide of above-mentioned parts by weight to be heated to 40-50 DEG C of generation ammonia logical
Enter into mixed liquor, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 20-30min, are added after its is uniform
Tackifying resin, organic solvent and corrosion inhibiter are obtained by the blender uniform stirring 30-50min that rotating speed is 300-500r/min
Uniform sizing material；
(5) it adjusts：It is 7.2-7.8 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
The present invention has an advantageous effect in that compared with prior art：It is used as electricity by mixing various kinds of resin with curing agent
The raw material of sub- protective agent makes the salt spray resistance of electronic protection agent improve 30-50% using the special chain structure of resin, increases
The application scenario of electronic component is added；It can reinforce electronic protection agent and the bonding of electronic component by adding tackifying resin
Degree prevents it from causing the electronic protection agent to fall off because electronic component works long hours fever, makes the use of electronic component
Service life improves 2-3 times；Weak base, which is added, can slowly adjust the acid-base value of solution, avoid using highly basic that pH value was changed
Soon, it being difficult to control, wastes raw material, and weak base is cheap, processing cost reduces 10-20%, meanwhile, add in process
Work temperature is not high, reduces the requirement to heating equipment so that processing cost further decreases, can by adding corrosion inhibiter
Further strengthen the corrosion resistance of the electronic protection agent so that the corrosion resistance of electronic component improves 20-30%, addition emulsification
Agent can remove impurity in solution；Therefore, process velocity of the present invention is fast, and producing efficiency is high, of low cost, while having high salt tolerant
Mist and corrosion resistance.
Specific implementation mode
For that can further appreciate that feature, technological means and the concrete function reached of the present invention, below with specific implementation
Mode is described in further detail the present invention.
Embodiment 1
A kind of electronic protection agent is present embodiments provided, this kind of electronic protection agent includes the raw material of following parts by weight：Propylene
20 parts of acid resin, 15 parts of epoxy resin, 20 parts of curing agent, 10 parts of emulsifier, 20 parts of thermoplastic styrene butadiene rubber, tackifying resin 30
Part, 50 parts of organic solvent, 30 parts of phosphoric acid, 20 parts of potassium bromide, 10 parts of ammonium hydroxide, 15 parts of corrosion inhibiter, 10 parts of weak base, 50 parts of water, oil
10 parts of sulfoacid calcium.
Wherein, curing agent includes the raw material of following parts by weight：10 parts of phenol, 20 parts of 4- chlorobenzenesulfonic acids, 4- hydroxyl benzene sulfonyls
15 parts of chlorine, 20 parts of 4- bromo-benzene sulfonic acids, 10 parts of p-hydroxybenzenyl sulfonate, 25 parts of benzoquinones, tackifying resin are rosin polyol ester, oil tree
Fat, the mixture of hydrogenated petroleum resin, mixing ratio 2:1:1, organic solvent is ethyl acetate, dimethyl carbonate, mixing
Object, mixing ratio 1:2, corrosion inhibiter is organic inhibitor, organic inhibitor be sulfamic acid, sodium benzoate, triethanolamine it is mixed
Close object, mixing ratio 2:1:3, weak base is sodium bicarbonate, and emulsifier includes the raw material of following parts by weight：Fatty acid mono glycidol
5 parts, 10 parts of soybean lecithin, 15 parts of lauric monoglyceride, 20 parts of methyl glycol fatty acid ester.
A kind of preparation method of electronic protection agent, is as follows：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：By the acrylic resin of above-mentioned parts by weight, epoxy resin, curing agent, emulsifier, thermoplasticity butylbenzene rubber
Glue is added in the water of constant weight number, and 20min is stirred at 30 DEG C, and solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in
30min is stirred at 20 DEG C and obtains mixed liquor, is then taken the ammonium hydroxide of above-mentioned parts by weight to be heated to 40 DEG C of generation ammonias and is passed through to mixing
In liquid, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 20min, is added and increases after its is uniform
Viscosity resin, organic solvent and corrosion inhibiter obtain uniform sizing material by the blender uniform stirring 30min that rotating speed is 300r/min；
(5) it adjusts：It is 7.2 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
Embodiment 2
A kind of electronic protection agent is present embodiments provided, this kind of electronic protection agent includes the raw material of following parts by weight：Propylene
25 parts of acid resin, 25 parts of epoxy resin, 30 parts of curing agent, 15 parts of emulsifier, 25 parts of thermoplastic styrene butadiene rubber, tackifying resin 40
Part, 60 parts of organic solvent, 0 part of phosphatase 24,30 parts of potassium bromide, 20 parts of ammonium hydroxide, 25 parts of corrosion inhibiter, 15 parts of weak base, 60 parts of water, oil
15 parts of sulfoacid calcium.
Wherein, curing agent includes the raw material of following parts by weight：15 parts of phenol, 30 parts of 4- chlorobenzenesulfonic acids, 4- hydroxyl benzene sulfonyls
25 parts of chlorine, 30 parts of 4- bromo-benzene sulfonic acids, 20 parts of p-hydroxybenzenyl sulfonate, 30 parts of benzoquinones, tackifying resin are hydrogenated petroleum resin, You Jirong
Agent is the mixture of ethyl acetate, Ethyl formate, dimethyl carbonate, mixing ratio 2:1:2, corrosion inhibiter is organic inhibitor,
Organic inhibitor is the mixture of sulfamic acid, sodium benzoate, mixing ratio 2:1, weak base is calcium bicarbonate, and emulsifier includes
The raw material of following parts by weight：15 parts of fatty acid mono glycidol, 20 parts of soybean lecithin, 25 parts of lauric monoglyceride, propylene glycol fat
25 parts of fat acid esters.
A kind of preparation method of electronic protection agent, is as follows：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：By the acrylic resin of above-mentioned parts by weight, epoxy resin, curing agent, emulsifier, thermoplasticity butylbenzene rubber
Glue is added in the water of constant weight number, and 50min is stirred at 60 DEG C, and solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in
40min is stirred at 50 DEG C and obtains mixed liquor, is then taken the ammonium hydroxide of above-mentioned parts by weight to be heated to 50 DEG C of generation ammonias and is passed through to mixing
In liquid, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 30min, is added and increases after its is uniform
Viscosity resin, organic solvent and corrosion inhibiter obtain uniform sizing material by the blender uniform stirring 50min that rotating speed is 500r/min；
(5) it adjusts：It is 7.8 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
Embodiment 3
A kind of electronic protection agent is present embodiments provided, this kind of electronic protection agent includes the raw material of following parts by weight：Propylene
22 parts of acid resin, 20 parts of epoxy resin, 25 parts of curing agent, 12 parts of emulsifier, 22 parts of thermoplastic styrene butadiene rubber, tackifying resin 35
Part, 55 parts of organic solvent, 35 parts of phosphoric acid, 25 parts of potassium bromide, 15 parts of ammonium hydroxide, 20 parts of corrosion inhibiter, 12 parts of weak base, 55 parts of water, oil
12 parts of sulfoacid calcium.
Wherein, curing agent includes the raw material of following parts by weight：12 parts of phenol, 25 parts of 4- chlorobenzenesulfonic acids, 4- hydroxyl benzene sulfonyls
20 parts of chlorine, 25 parts of 4- bromo-benzene sulfonic acids, 15 parts of p-hydroxybenzenyl sulfonate, 27 parts of benzoquinones, tackifying resin are rosin polyol ester, oil tree
Fat, hydrogenated petroleum resin, phenolic resin mixture, mixing ratio 1:2:3:4, organic solvent is ethyl acetate, formic acid second
The mixture of ester, dimethyl carbonate, butyl acetate, mixing ratio 3:1:2:2, corrosion inhibiter is organic inhibitor, organic inhibition
Agent is sulfamic acid, and weak base is the mixture of sodium bicarbonate, calcium bicarbonate, mixing ratio 2:1, emulsifier includes following weight
The raw material of part：7 parts of fatty acid mono glycidol, 12 parts of soybean lecithin, 17 parts of lauric monoglyceride, methyl glycol fatty acid ester 21
Part.
A kind of preparation method of electronic protection agent, is as follows：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：By the acrylic resin of above-mentioned parts by weight, epoxy resin, curing agent, emulsifier, thermoplasticity butylbenzene rubber
Glue is added in the water of constant weight number, and 35min is stirred at 45 DEG C, and solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in
35min is stirred at 35 DEG C and obtains mixed liquor, is then taken the ammonium hydroxide of above-mentioned parts by weight to be heated to 45 DEG C of generation ammonias and is passed through to mixing
In liquid, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 25min, is added and increases after its is uniform
Viscosity resin, organic solvent and corrosion inhibiter obtain uniform sizing material by the blender uniform stirring 40min that rotating speed is 400r/min；
(5) it adjusts：It is 7.5 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
Embodiment 4
A kind of electronic protection agent is present embodiments provided, this kind of electronic protection agent includes the raw material of following parts by weight：Propylene
21 parts of acid resin, 17 parts of epoxy resin, 22 parts of curing agent, 11 parts of emulsifier, 21 parts of thermoplastic styrene butadiene rubber, tackifying resin 32
Part, 52 parts of organic solvent, 32 parts of phosphoric acid, 22 parts of potassium bromide, 12 parts of ammonium hydroxide, 17 parts of corrosion inhibiter, 11 parts of weak base, 52 parts of water, oil
11 parts of sulfoacid calcium.
Wherein, curing agent includes the raw material of following parts by weight：11 parts of phenol, 22 parts of 4- chlorobenzenesulfonic acids, 4- hydroxyl benzene sulfonyls
17 parts of chlorine, 22 parts of 4- bromo-benzene sulfonic acids, 12 parts of p-hydroxybenzenyl sulfonate, 26 parts of benzoquinones, tackifying resin are loose hydrogenated petroleum resin, phenolic aldehyde
The mixture of resin, mixing ratio 3:1, organic solvent is the mixture of ethyl acetate, dimethyl carbonate, butyl acetate,
Mixing ratio is 1:2:3, corrosion inhibiter is organic inhibitor, and organic inhibitor is the mixture of sulfamic acid, sodium benzoate, mixing
Than being 2:1, weak base is sodium bicarbonate, and emulsifier includes the raw material of following parts by weight：7 parts of fatty acid mono glycidol, soybean lecithin
12 parts, 17 parts of lauric monoglyceride, 21 parts of methyl glycol fatty acid ester.
A kind of preparation method of electronic protection agent, is as follows：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：By the acrylic resin of above-mentioned parts by weight, epoxy resin, curing agent, emulsifier, thermoplasticity butylbenzene rubber
Glue is added in the water of constant weight number, and 27min is stirred at 37 DEG C, and solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in
32min is stirred at 27 DEG C and obtains mixed liquor, is then taken the ammonium hydroxide of above-mentioned parts by weight to be heated to 42 DEG C of generation ammonias and is passed through to mixing
In liquid, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 22min, is added and increases after its is uniform
Viscosity resin, organic solvent and corrosion inhibiter obtain uniform sizing material by the blender uniform stirring 35min that rotating speed is 350r/min；
(5) it adjusts：It is 7.3 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
Embodiment 5
A kind of electronic protection agent is present embodiments provided, this kind of electronic protection agent includes the raw material of following parts by weight：Propylene
23 parts of acid resin, 22 parts of epoxy resin, 27 parts of curing agent, 13 parts of emulsifier, 23 parts of thermoplastic styrene butadiene rubber, tackifying resin 37
Part, 57 parts of organic solvent, 37 parts of phosphoric acid, 27 parts of potassium bromide, 17 parts of ammonium hydroxide, 22 parts of corrosion inhibiter, 13 parts of weak base, 57 parts of water, oil
13 parts of sulfoacid calcium.
Wherein, curing agent includes the raw material of following parts by weight：13 parts of phenol, 27 parts of 4- chlorobenzenesulfonic acids, 4- hydroxyl benzene sulfonyls
22 parts of chlorine, 27 parts of 4- bromo-benzene sulfonic acids, 17 parts of p-hydroxybenzenyl sulfonate, 28 parts of benzoquinones, tackifying resin are rosin polyol ester, You Jirong
Agent is the mixture of ethyl acetate, Ethyl formate, mixing ratio 2:3, corrosion inhibiter is organic inhibitor, and organic inhibitor is benzene
The mixture of sodium formate, triethanolamine, mixing ratio 2:1, weak base is the mixture of sodium bicarbonate, calcium bicarbonate, mixing
Than being 3:1, emulsifier includes the raw material of following parts by weight：12 parts of fatty acid mono glycidol, 17 parts of soybean lecithin, lauric acid list are sweet
22 parts of grease, 23 parts of methyl glycol fatty acid ester.
A kind of preparation method of electronic protection agent, is as follows：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：By the acrylic resin of above-mentioned parts by weight, epoxy resin, curing agent, emulsifier, thermoplasticity butylbenzene rubber
Glue is added in the water of constant weight number, and 42min is stirred at 52 DEG C, and solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in
37min is stirred at 42 DEG C and obtains mixed liquor, is then taken the ammonium hydroxide of above-mentioned parts by weight to be heated to 47 DEG C of generation ammonias and is passed through to mixing
In liquid, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 27min, is added and increases after its is uniform
Viscosity resin, organic solvent and corrosion inhibiter obtain uniform sizing material by the blender uniform stirring 45min that rotating speed is 450r/min；
(5) it adjusts：It is 7.6 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
Reference examples
Experimental example will be used as by electronic protection agent made from above-mentioned five experimental examples in the present invention, with existing in the market
Electronic protection agent as a control group, is tested process time respectively, then applies the electronic protection agent of experimental group and control group respectively
In on six copper coins, carries out salt spray test and evaluate salt spray resistance grade and corrosion-resistant grade according to GB/T6461-2002 (grade is commented
Grade is higher, and test block performance is better), test result is as follows shown in table：
| Index | Process time (min) | Corrosion-resistant grade | Salt spray resistance grade |
| Experimental group 1 | 120 | 8 | 8 |
| Experimental group 2 | 190 | 8 | 8 |
| Experimental group 3 | 155 | 8 | 9 |
| Experimental group 4 | 136 | 7 | 7 |
| Experimental group 5 | 171 | 7 | 8 |
| Control group | 240 | 3 | 5 |
In conclusion the preparation method process time of the present invention shortens 0.8-1 times, salt spray resistance grade significantly improves 2-
4 grades, corrosion-resistant grade improves 4-5 grades, and therefore, the present invention is high in machining efficiency, and processing cost is low, smears electricity produced by the present invention
The electronic component salt spray resistance of sub- protective agent, corrosion resistance significantly improve, and have dissemination.
Place is not described in detail by the present invention, is the known technology of those skilled in the art.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of electronic protection agent, it is characterised in that：This kind of electronic protection agent includes the raw material of following parts by weight：Acrylic resin
20-25 parts, 15-25 parts of epoxy resin, 20-30 parts of curing agent, 10-15 parts of emulsifier, 20-25 parts of thermoplastic styrene butadiene rubber, increase
30-40 parts of viscosity resin, 50-60 parts of organic solvent, 30-40 parts of phosphoric acid, 20-30 parts of potassium bromide, 10-20 parts of ammonium hydroxide, corrosion inhibiter 15-
25 parts, 10-15 parts of weak base, 50-60 parts of water.
2. a kind of electronic protection agent according to claim 1, it is characterised in that：This kind of electronic protection agent further includes following heavy
Measure the raw material of part：10-15 parts of calcium mahogany sulfonate.
3. a kind of electronic protection agent according to claim 1, it is characterised in that：The curing agent includes following parts by weight
Raw material：It is 10-15 parts of phenol, 20-30 parts of 4- chlorobenzenesulfonic acids, 15-25 parts of 4- hydroxyl benzene sulfonyl chlorides, 20-30 parts of 4- bromo-benzene sulfonic acids, right
10-20 parts of hydroxy benzene sulfonic acid, 25-30 parts of benzoquinones.
4. a kind of electronic protection agent according to claim 1, it is characterised in that：The tackifying resin is rosin polyalcohol
Ester, Petropols, one or more mixtures in hydrogenated petroleum resin, phenolic resin.
5. a kind of electronic protection agent according to claim 1, it is characterised in that：The organic solvent is ethyl acetate, first
One or more mixtures in acetoacetic ester, dimethyl carbonate, butyl acetate.
6. a kind of electronic protection agent according to claim 1, it is characterised in that：The corrosion inhibiter is organic inhibitor.
7. a kind of electronic protection agent according to claim 6, it is characterised in that：The organic inhibitor be sulfamic acid,
One or more of sodium benzoate, triethanolamine mixture.
8. a kind of electronic protection agent according to claim 1, it is characterised in that：The weak base is sodium bicarbonate, bicarbonate
One or both of calcium mixture.
9. a kind of electronic protection agent according to claim 1, it is characterised in that：The emulsifier includes following parts by weight
Raw material：5-15 parts of fatty acid mono glycidol, 10-20 parts of soybean lecithin, 15-25 parts of lauric monoglyceride, propylene glycol fatty acid
20-25 parts of ester.
10. according to a kind of preparation method of electronic protection agent according to any one of claims 1 to 9, include the following steps：
(1) it stocks up：Raw material for standby is taken by above-mentioned parts by weight；
(2) A liquid processed：The acrylic resin of above-mentioned parts by weight, epoxy resin, emulsifier, curing agent, thermoplastic styrene butadiene rubber are added
In the water for entering constant weight number, 20-50min is stirred at 30-60 DEG C, solution A is made；
(3) B liquid processed：The phosphoric acid of above-mentioned parts by weight, potassium bromide, calcium mahogany sulfonate are added in the water of certain part by weight, in 20-50
At DEG C stir 30-40min obtain mixed liquor, then take the ammonium hydroxide of above-mentioned parts by weight be heated to 40-50 DEG C generate ammonia be passed through to
In mixed liquor, B solution is made；
(4) it mixes：A obtained in step (2), (3), B solution are mixed into 20-30min, thickening is added after its is uniform
Resin, organic solvent and corrosion inhibiter are obtained uniform by the blender uniform stirring 30-50min that rotating speed is 300-500r/min
Slurry；
(5) it adjusts：It is 7.2-7.8 to add weak base into slurry and adjust pH value, obtains electronic protection agent.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113982356A (en) * | 2021-11-01 | 2022-01-28 | 峻江建设有限公司 | Acid rain corrosion resistant iron tower structural member |
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| CN105073883A (en) * | 2013-03-28 | 2015-11-18 | 三菱化学株式会社 | Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and method for manufacturing layered semiconductor device |
| CN106433465A (en) * | 2016-09-13 | 2017-02-22 | 张滨 | Electronic protection agent and preparation method thereof |
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| CN101602879A (en) * | 2009-06-26 | 2009-12-16 | 湖北正兴高分子科技有限公司 | A kind of rust-proof sealing material and preparation method thereof |
| CN105073883A (en) * | 2013-03-28 | 2015-11-18 | 三菱化学株式会社 | Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and method for manufacturing layered semiconductor device |
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Application publication date: 20180928 |