CN108586701A - A kind of binder of hot melt adhesive film and preparation method thereof and its FFC wire rods application - Google Patents
A kind of binder of hot melt adhesive film and preparation method thereof and its FFC wire rods application Download PDFInfo
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- CN108586701A CN108586701A CN201810195027.9A CN201810195027A CN108586701A CN 108586701 A CN108586701 A CN 108586701A CN 201810195027 A CN201810195027 A CN 201810195027A CN 108586701 A CN108586701 A CN 108586701A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
- C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of binder of hot melt adhesive film and preparation method thereof and its in the application of FFC wire rods, the binder presses mass fraction, including:19%~21% saturated polyester resin A, 10%~19% saturated polyester resin B, 6%~9% saturated polyester resin C, 38% 43% fire retardant, 5%~7% hexamethylene diisocyanate curing agent A, 1%~3% 2,4 methyl diphenylene diisocyanate curing agent B, 1%~3% isophorone diisocyanate curing agent C and the filler of surplus;The binder is prepared by three easy steps and for the hot melt adhesive film of FFC wire rods, the hot melt adhesive film is from top to bottom followed successively by 19~50 μm of PET hot melt adhesive film layer, 1~3 μm of pre- dope layer and 20~50 μm of high-fire resistance adhesive layer;The hot melt adhesive film of the present invention has excellent high-temp resisting high-humidity resisting stability and thermal shock stability.
Description
Technical field
The present invention relates to adhesive techniques fields more particularly to a kind of binder of hot melt adhesive film and preparation method thereof and its
In the application of FFC wire rods.
Background technology
Due to environmental protection and energy-efficient requirement, automotive light weight technology has become the trend of world car development, in automobile wire rod
Aspect, FFC wire rods, which substitute traditional wire rod, can effectively reduce the weight of vehicle.In addition, the application of FFC wire rods can also reduce
Material cost realizes the requirement of auto parts and components multifunctional signal transmission.Meanwhile the connection of FFC wire rods is simple, and it is quick detachable, it replaces
Cost is also greatly lowered.But the FFC wire rods of automobile have the requirement in terms of weatherability more tight relative to common FFC wire rods
Lattice.
Invention content
It is an object of the invention to propose a kind of binder of hot melt adhesive film, the polyester resin of superelevation Melt Viscosity is used
It is collocated with each other as main material, and using 3 kinds of different types of curing agent, makes the hot melt adhesive film of the present invention that there is high resistance to height
The high wet stability of temperature and thermal shock stability;
It is an object of the invention to propose a kind of hot melt adhesive film prepared using above-mentioned binder, coordinate PET hot melt adhesive films
Layer, pre- dope layer prepare the hot melt adhesive film for FFC wire rods, and the melten gel film properties of FFC wire rods are stablized;
It is an object of the invention to propose that a kind of preparation method of above-mentioned binder, this method are simple, quick.
For this purpose, the present invention uses following technical scheme:
A kind of binder of hot melt adhesive film, by mass fraction, including:19%~21% saturated polyester resin A, 10%~
19% saturated polyester resin B, the fire retardant of 6%~9% saturated polyester resin C, 38%-43%, 5%~7% solidification
Agent A, 1%~3% curing agent B, 1%~3% curing agent C and the filler of surplus;
The glass transition temperature of the saturated polyester resin A is 5~15 DEG C;The glass transition temperature of saturated polyester resin B is 50
~80 DEG C;The glass transition temperature of saturated polyester resin C is 0~20 DEG C;The curing agent A is hexamethylene diisocyanate;Institute
It is 2,4- methyl diphenylene diisocyanates to state curing agent B;The curing agent C is isophorone diisocyanate.
It illustrates further, the Melt Viscosity of the saturated polyester resin A is 250000mPa.s or more, and the saturation is poly-
The Melt Viscosity of ester resin B is 60000~80000mPa.s, the Melt Viscosity of the saturated polyester resin C is 40000~
60000mPa.s。
It illustrates further, the softening point temperature of the saturated polyester resin A is 140~170 DEG C;The saturated polyester tree
The softening point temperature of fat B is 120~150 DEG C;The softening point temperature of the saturated polyester resin C is 90~120 DEG C.
It illustrates further, the curing agent A is single aggressiveness of hexamethylene diisocyanate, hexa-methylene diisocyanate
One or more cooperations of the dimer of ester, the polymer of hexamethylene diisocyanate.
It illustrates further, the curing agent B is single aggressiveness, 2, the 4- diphenyl of 2,4- methyl diphenylene diisocyanates
The dimer of methane diisocyanate or 2, one or more cooperations of the polymer of 4- methyl diphenylene diisocyanates.
It illustrates further, the curing agent C is single aggressiveness, the isophorone diisocyanate of isophorone diisocyanate
One or more cooperations of the dimer of ester or the polymer of isophorone diisocyanate.
It illustrates further, the fire retardant is arbitrary bromide fire retardant, phosphorus flame retardant, nitrogenated flame retardant, metallic hydrogen
The mixing of one or more of oxygen compound based flame retardant, metal oxide fire retardant and metal boride fire retardant.
Illustrate further, the filler be arbitrary hydrophobicity gas silicon, semi-hydrophobic gas silicon, hydrophily gas silicon, titanium dioxide,
One or more combinations in talcum powder, carbon black, styrene and rubber.
It illustrates further, the binder is used for the hot melt adhesive film of FFC wire rods, includes successively from superficial layer to bottom:
PET hot melt adhesive film layer, pre- dope layer and high-fire resistance adhesive layer;The high-fire resistance adhesive layer is cured by the binder
It forms;The thickness of the PET hot melt adhesive film layer is 19~50 μm;The thickness of the pre- dope layer is 1~3 μm;The height is heat-resisting
Property adhesive layer thickness be 20~50 μm.
It illustrates further, a kind of preparation method of the binder of hot melt adhesive film includes the following steps:
Step 1:
a:Butanone solvent and toluene solvant are made into mixed solvent;
b:Saturated polyester resin A, saturated polyester resin B and saturated polyester resin C have been dissolved by the mixed solvent
Entirely;
c:Fire retardant and filler are added to the saturated polyester resin A dissolved, saturated polyester resin B and saturation is poly-
In ester resin C, component A is obtained;
d:The component A is tentatively uniformly dispersed;
e:Ground component A twice using grinder or more, until the fineness of component A is at 10 μm or less;
Step 2:
a:Curing agent A, curing agent B and curing agent C are weighed respectively successively, are then injected into container;
b:Butanone solvent is added in a reservoir, and curing agent A, curing agent B and curing agent C are uniformly mixed, obtains B groups
Point;
Step 3:
In the state that the component A is placed in dispersion, the B component is added in the component A in 30 minutes, and point
It dissipates 20~30 minutes;
The step 1 and the step 2 are in no particular order.
Beneficial effects of the present invention:
The polyester resin of superelevation Melt Viscosity is used as material, then utilizes 3 kinds of different types of curing agent mutual
Collocation makes the hot melt adhesive film of the present invention have excellent heat resistance, high-temp resisting high-humidity resisting stability, thermal shock stability, toughness.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of hot melt adhesive film for FFC wire rods of the present invention.
Wherein:
PET hot melt adhesive film layer 1, pre- dope layer 2, high-fire resistance adhesive layer 3.
Specific implementation mode
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
A kind of binder of hot melt adhesive film, by mass fraction, including:19%~21% saturated polyester resin A, 10%~
19% saturated polyester resin B, the fire retardant of 6%~9% saturated polyester resin C, 38%-43%, 5%~7% solidification
Agent A, 1%~3% curing agent B, 1%~3% curing agent C and the filler of surplus;
The glass transition temperature of the saturated polyester resin A is 5~15 DEG C;The glass transition temperature of saturated polyester resin B is 50
~80 DEG C;The glass transition temperature of saturated polyester resin C is 0~20 DEG C;The curing agent A is hexamethylene diisocyanate;Institute
It is 2,4- methyl diphenylene diisocyanates to state curing agent B;The curing agent C is isophorone diisocyanate.
It illustrates further, if the adhesive force that the saturated polyester A crosses binder under at most room temperature is not high;If described
The additive amount of saturated polyester B can excessively influence the heat resistance of binder, the room temperature if the saturated polyester B additive amounts are excessively few
Under binder adhesive force it is not high;The saturated polyester C is softer, and the saturated polyester C additions can improve viscous on a small quantity
The adhesive force under the room temperature of agent is tied, the heat resistance of the excessive then binder of additive amount of the saturated polyester C declines.
Different types of curing agent makes binder form the soft reticular structure being combined firmly, can improve the heat-resisting of binder
Property, and can ensure the flexibility of binder, makes the existing high-fire resistance of FFC wire rods made, and can guarantee excellent resistance to
Tortuous performance.
It illustrates further, the Melt Viscosity of the saturated polyester resin A is 250000mPa.s or more, and the saturation is poly-
The Melt Viscosity of ester resin B is 60000~80000mPa.s, the Melt Viscosity of the saturated polyester resin C is 40000~
60000mPa.s。
It illustrates further, the softening point temperature of the saturated polyester resin A is 140~170 DEG C;The saturated polyester tree
The softening point temperature of fat B is 120~150 DEG C;The softening point temperature of the saturated polyester resin C is 90~120 DEG C.
It illustrates further, the curing agent A is single aggressiveness of hexamethylene diisocyanate, hexa-methylene diisocyanate
The dimer of ester, the polymer of hexamethylene diisocyanate.
It illustrates further, the curing agent B is single aggressiveness, 2, the 4- diphenyl of 2,4- methyl diphenylene diisocyanates
The dimer of methane diisocyanate or 2, the polymer of 4- methyl diphenylene diisocyanates.
It illustrates further, the curing agent C is single aggressiveness, the isophorone diisocyanate of isophorone diisocyanate
The dimer of ester or the polymer of isophorone diisocyanate.
It illustrates further, the fire retardant is arbitrary bromide fire retardant, phosphorus flame retardant, nitrogenated flame retardant, metallic hydrogen
The mixing of one or more of oxygen compound based flame retardant, metal oxide fire retardant and metal boride fire retardant.
It illustrates further, the bromide fire retardant such as polybrominated diphenyl ethers class, tribromo-benzene phenols, bromophthalic acid acid anhydride
Class, brominated bisphenol-A class, bromo alcohols, bromo high polymer and other bromide fire retardants, such as pentabromotoluene, hexabromocyclododecane, ten
Bromine diphenylethane and dibromo phenyl glycidol ether ethyl brominated flame-retardant monomer etc..
Illustrate further, the phosphorus flame retardant can be Phos based flame retardant or organic phosphates fire retardant, wherein
Inorganic phosphorus type flame retardant can be red phosphorus or ammonium polyphosphate;Organic phosphates fire retardant can be phosphate ester class or phosphorus heterocycle chemical combination
Object, phosphoric acid ester as that can be that triphenyl phosphate, phosphoric acid ethylbenzene phenylester, two base ester of phosphoric acid tert-butyl benzene, four aryl are sub-
Aryl biphosphonate, resorcin phosphate and tetraphenyl bisphenol A- bisphosphates etc.;Phosphorous heterocylic compound can be monocycle phosphorus
Heterocyclic compound, phosphorus spiro-compound and cage modle phosphorus compound.
It illustrates further, the nitrogenated flame retardant can be the derivative, double of melamine, cyanuric acid, melamine
Cyanamide, urea and its derivative, derivative such as Melamine Polyphosphate, melamine phosphate, the trimerization of melamine
Cyanamide cyanurate.
It illustrates further, the metal oxyhydroxide based flame retardant can be aluminium hydroxide or magnesium hydroxide etc..
It illustrates further, the metal oxide can be antimony oxide, antimony oxide, iron oxide, tin oxide.
It illustrates further, the metal boride fire retardant can be the borates such as zinc borate, barium borate.
Illustrate further, the filler be arbitrary hydrophobicity gas silicon, semi-hydrophobic gas silicon, hydrophily gas silicon, titanium dioxide,
One or more combinations in talcum powder, carbon black, styrene and rubber.
It illustrates further, the binder is used for the hot melt adhesive film of FFC wire rods, as shown in Figure 1, from superficial layer to bottom
Include successively:PET hot melt adhesive film layer 1, pre- dope layer 2 and high-fire resistance adhesive layer 3;The high-fire resistance adhesive layer 3 by
The binder cures;The thickness of the PET hot melt adhesive film layer 1 is 19~50 μm;The thickness of the pre- dope layer 2 is 1
~3 μm;The thickness of the high-fire resistance adhesive layer 3 is 20~50 μm.
It illustrates further, a kind of preparation method of the binder of hot melt adhesive film includes the following steps:
Step 1:
a:Butanone solvent and toluene solvant are made into mixed solvent;
b:Saturated polyester resin A, saturated polyester resin B and saturated polyester resin C have been dissolved by the mixed solvent
Entirely;
c:Fire retardant and filler are added to the saturated polyester resin A dissolved, saturated polyester resin B and saturation is poly-
In ester resin C, component A is obtained;
d:The component A is tentatively uniformly dispersed;
e:Ground component A twice using grinder or more, until the fineness of component A is at 10 μm or less;
Step 2:
a:Curing agent A, curing agent B and curing agent C are weighed respectively successively, are then injected into container;
b:Butanone solvent is added in a reservoir, and curing agent A, curing agent B and curing agent C are uniformly mixed, obtains B groups
Point;
Step 3:
In the state that the component A is placed in dispersion, the B component is added in the component A in 30 minutes, and point
It dissipates 20~30 minutes.
The step 1 and the step 2 are in no particular order.
It illustrates further, the d methods in the step 1, which have used, to be tentatively uniformly dispersed, its purpose is that by the component A
It is uniformly mixed, raw material is made to dissolve as far as possible, the preprocessing process in the component A is added for the B component of the step 3,
Can make the curing agent of the step 3 more have an opportunity with the saturated polyester resin A of component A, the saturated polyester resin B and
The saturated polyester resin C haptoreactions.
Embodiment A:
The proportioning of 1 embodiment A1~A6 of table
A kind of preparation method of the binder of hot melt adhesive film, according to the following steps:
Step 1:
a:Butanone solvent and toluene solvant are made into mixed solvent;
b:Saturated polyester resin A, saturated polyester resin B and saturated polyester resin C is molten by table 1 by the mixed solvent
Solution is complete;
c:By fire retardant and filler be added to by table 1 the saturated polyester resin A dissolved, saturated polyester resin B and
In saturated polyester resin C, component A is obtained;
d:The component A is tentatively uniformly dispersed;
e:Ground component A twice using grinder or more, until the fineness of component A is at 10 μm or less;
Step 2:
a:Curing agent A, curing agent B and curing agent C are weighed by table 1 respectively successively, are then injected into container;
b:Butanone solvent is added in a reservoir, and curing agent A, curing agent B and curing agent C are uniformly mixed, obtains B groups
Point;
Step 3:
In the state that the component A is placed in dispersion, the B component is added in the component A in 30 minutes, and point
It dissipates 20~30 minutes.
The step 1 and the step 2 are in no particular order.
Embodiment B:
The proportioning of 2 embodiment B1~B6 of table
A kind of preparation method of the binder of hot melt adhesive film, according to the following steps:
Step 1:
a:Butanone solvent and toluene solvant are made into mixed solvent;
b:Saturated polyester resin A, saturated polyester resin B and saturated polyester resin C is molten by table 2 by the mixed solvent
Solution is complete;
c:By fire retardant and filler be added to by table 2 the saturated polyester resin A dissolved, saturated polyester resin B and
In saturated polyester resin C, component A is obtained;
d:The component A is tentatively uniformly dispersed;
e:Ground component A twice using grinder or more, until the fineness of component A is at 10 μm or less;
Step 2:
a:Curing agent A, curing agent B and curing agent C are weighed by table 2 respectively successively, are then injected into container;
b:Butanone solvent is added in a reservoir, and curing agent A, curing agent B and curing agent C are uniformly mixed, obtains B groups
Point;
Step 3:
In the state that the component A is placed in dispersion, the B component is added in the component A in 30 minutes, and point
It dissipates 20~30 minutes.
Such as the experiment of following (1)~(9) of embodiment B progress in embodiment A in table 1 and table 2 is tested for the property, is drawn
Go out the table 3 of embodiment A and the table 4 of embodiment B:
(1) appearance
It estimates after the high-fire resistance adhesive layer is coated on the PET hot melt adhesive films layer surface, obtains a kind of use
There are bubble-free, pin hole or particle etc. to influence showing for appearance in the face of the hot melt adhesive film of FFC wire rods, high-fire resistance adhesive layer
It is qualification as the phenomenon that, no influence appearance.
(2) back of the body is viscous
With the PET hot melt adhesive film layer is coated on the smooth non-corona for being fitted in PET of PET hot melt adhesive film levels
On face, the specification of model is 50mmX200mm, and the counterweight of smooth placement 5kg, puts in 50 DEG C of baking oven on this model
The peeling force of test sample plate after setting 48 hours, the peeling rate 50mm/min of puller system, peel value are less than 0.2N/5cm, as close
Lattice.
(3) conductor is glued
The anaerobic copper conductor of 0.035mm thickness X 0.3mm width is pressed under 160~190 DEG C of temperature condition;Use pulling force
The FFC wire rods that a kind of hot melt adhesive film for FFC wire rods of the velocity test present invention of machine setting 300mm/min is fabricated to,
The adhesive force of the window's position single conductor, it is qualification that standard, which is more than 20g/0.3mm,.
(4) heat resistance
The FFC wire rods, are put into 150 by the FFC wire rods being fabricated to a kind of hot melt adhesive film for FFC wire rods of the present invention
3000 hours in DEG C oven, then takes out in the FFC wire tests its 1 minute and under conditions of voltage is AC500V, observation should
Whether becoming attached to for FFC wire rods destroys;Then by the FFC wire tests 1 minute in water and under conditions of voltage is AC500V,
Observe whether becoming attached to for the FFC wire rods destroys;It is qualification without destroying.
(5) high-temp resisting high-humidity resisting
The FFC wire rods, are put into perseverance by the FFC wire rods being fabricated to a kind of hot melt adhesive film for FFC wire rods of the present invention
In temperature very wet tank, test condition is set as (85 DEG C, 85%RH, 1000 hours), then takes out the FFC wire tests its 1 minute
Under conditions of interior and voltage is AC500V, observe whether becoming attached to for the FFC wire rods destroys;Then by the FFC wire tests 1 minute
Inside in water and voltage be AC500V under conditions of, observe whether becoming attached to for the FFC wire rods destroys;It is qualification without destroying.
(6) thermal shock
The FFC wire rods being fabricated to a kind of hot melt adhesive film for FFC wire rods of the present invention, are put into the FFC wire rods cold
In thermal shock test case, test condition is set as (- 40 DEG C of+150 DEG C of X0.5 hours X0.5 hours) * 1000 cycles, is then taken
Go out in the FFC wire tests its 1 minute and under conditions of voltage is AC500V, observes whether becoming attached to for the FFC wire rods destroys;So
In water and under conditions of voltage is AC500V, whether becoming attached to for the FFC wire rods will be observed in the FFC wire tests 1 minute afterwards
It destroys;It is qualification without destroying.
(7) bent rich test
The FFC wire rods being fabricated to a kind of hot melt adhesive film for FFC wire rods of the present invention, the FFC wire rods two
End is clipped on bent rich tester, and the rich tester of song moves back and forth 7,000,000 times, then take out in the FFC wire tests its 1 minute and
Under conditions of voltage is AC500V, observe whether becoming attached to for the FFC wire rods destroys;Then by the FFC wire tests 1 minute
In water and voltage be AC500V under conditions of, observe whether becoming attached to for the FFC wire rods destroys;It is qualification without destroying.
(8) excessive glue is tested
The FFC wire rods that a kind of hot melt adhesive film for FFC wire rods is fabricated to and take connector temperature be 85
It is placed 96 hours in DEG C baking oven, then takes out the FFC wire rods and pull up connector, the FFC wire rods are watched under Quadratic Finite Element machine
Whether the high-fire resistance adhesive layer deforms;It is qualification without destroying.
The test performance of 3 embodiment A1~A6 of table
By table 3 it is found that in A1~A6:
Respectively comparative example A1, A2, A3 and A4 it is found that with saturated polyester A content increase, embodiment A1, A2 and
The adhesive force of A3 is gradually increased, and there are maximum values in embodiment A3;And the content in the presence of saturated polyester A is when continuing growing,
The adhesive force of embodiment A4 is reduced to minimum instead, is 18g/0.3mm, is underproof product.
Comparative example A1, A5, A6 are it is found that the content with saturated polyester B increases respectively, and the reduction of saturated polyester C,
It is unqualified that embodiment A5 and A6 has significant difference, embodiment A5 and A6 in the performance ratio embodiment A1 of high-temp resisting high-humidity resisting.
Conclusion:
1, under certain concentration gradient, the adhesive force of sample can be improved by improving the content of the saturated polyester A in the design,
But as the content of saturated polyester A increases, the adhesive force of sample reaches maximum value;Continue growing the content of saturated polyester A instead
The adhesive force of sample can be lowered;So saturated polyester A mass fractions should be controlled 19%~21%.
2, the saturated polyester C of the saturated polyester B of too high amount and low content excessively can influence the high temperature and humidity resistance of sample,
Therefore the content of saturated polyester B should be controlled 10%~19%, and saturated polyester C should be controlled 6%~9%.
The test performance of 4 embodiment B1~B6 of table
Comparative example B1, B2, B3 and B6:
Curing agent A in B1:Curing agent B:Curing agent C=2.5:1:1;
Curing agent A in B2:Curing agent B:Curing agent C=4:1:1;
Curing agent A in B3:Curing agent B:Curing agent C=7:1:1;
Curing agent A in B6:Curing agent B:Curing agent C=16:1:1;
By data comparison it is found that the content with curing agent A increases, the heat resistance and Nai Gao of embodiment B1, B2, B3
It is qualification that the performance of warm high humidity, which is all graded all, and the heat resistance of embodiment B4 and the performance of high-temp resisting high-humidity resisting are all rated and do not conform to
Lattice.
Comparative example B1~B6, it is known that, curing agent A is in 5%~7% range in content, and corresponding curing agent B and
Curing agent C controls are in 1%~2%, in the binder building-up process for hot melt adhesive film that the design can be made, solidification path
Degree is suitable, and it is appropriate to be crosslinked between the strand of the binder for hot melt adhesive film, therefore has toughness, in the rich test of song
In, embodiment B1~B3 is qualification;Instead because not between curing agent A, curing agent B and curing agent C in embodiment B4~B6
Relationship there is no limit good, and ratio is excessively close or difference is too big, therefore affects the crosslinking situation of binder, under toughness
Drop.
Conclusion:
The content of curing agent A cannot be excessive, otherwise can influence the heat resistance of binder and the performance of high-temp resisting high-humidity resisting.
Curing agent A is controlled in content in 5%~7% range, curing agent B and curing agent C controls in 1%~2%, this
The binder of design can reach best cross-linking effect, there is preferable toughness.
Embodiment C:
The method for preparing binder of the prior art is by the saturated polyester 1 of 15%-20%, 20%-25% saturated polyesters 2
It is uniformly mixed with solvent dissolving, 40% fire retardant and surplus filler organic solvent;It is eventually adding 10% curing agent and disperses, make
It is standby go out embodiment C1.
Embodiment A1 and above-described embodiment C1 are subjected to above-mentioned 9 performance comparisons, table 5 is made.
5 embodiment A1 of table and embodiment C1 performance comparison tables
It can be seen that although the embodiment C1 of the prior art is qualified mark in terms of performance is appearance, carries on the back viscous, adhesive force
It is accurate;And standard is all not achieved in high-temp resisting high-humidity resisting, thermal shock, bent rich test and snap connector test performance, it is unqualified;
Reason is that curing agent causes the curing degree of material incomplete without paying attention to the proportioning between curing agent in the prior art;Gu
Agent is likely to occur excessively or reactivity is excessively active, causes crosslink density excessive, keeps the reticular structure in material excessive, be in
Reveal hard and crisp situation;And curing agent is very few or selects the too low curing agent of reactivity, then can cause material occur it is soft and
Weak situation;And C can be obtained through this embodiment, the A1 in the design, using saturated polyester A, saturated polyester B as main tree
Fat, and carry out corresponding performance using saturated polyester C and fill a vacancy;The proportioning of rational allocation curing agent is curing agent A:Curing agent B:Gu
Agent C=5:2:2, the ratio of different curing agent has utilization to avoid hardener dose excessive or very few situation at successively decreasing.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and it cannot be construed to limiting the scope of the invention in any way.Based on the explanation herein, the technology of this field
Personnel would not require any inventive effort the other specific implementation modes that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of binder of hot melt adhesive film, which is characterized in that mass fraction is pressed, including:19%~21% saturated polyester tree
Fat A, 10%~19% saturated polyester resin B, the fire retardant of 6%~9% saturated polyester resin C, 38%-43%, 5%~
7% curing agent A, 1%~3% curing agent B, 1%~3% curing agent C and the filler of surplus;
The glass transition temperature of the saturated polyester resin A is 5~15 DEG C;The glass transition temperature of saturated polyester resin B is 50~80
℃;The glass transition temperature of saturated polyester resin C is 0~20 DEG C;The curing agent A is hexamethylene diisocyanate;It is described solid
Agent B is 2,4- methyl diphenylene diisocyanates;The curing agent C is isophorone diisocyanate.
2. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the saturated polyester resin A's
Melt Viscosity is 250000mPa.s or more, and the Melt Viscosity of the saturated polyester resin B is 60000~80000mPa.s, described
The Melt Viscosity of saturated polyester resin C is 40000~60000mPa.s.
3. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the saturated polyester resin A's
Softening point temperature is 140~170 DEG C;The softening point temperature of the saturated polyester resin B is 120~150 DEG C;The saturated polyester
The softening point temperature of resin C is 90~120 DEG C.
4. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the curing agent A is six methylenes
The polymer of single aggressiveness of group diisocyanate, the dimer of hexamethylene diisocyanate, hexamethylene diisocyanate
One or more cooperations.
5. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the curing agent B is 2,4- bis-
Single aggressiveness of methylenebis phenyl isocyanate, the dimer or 2 of 2,4- methyl diphenylene diisocyanates, 4- diphenyl methanes two
One or more cooperations of the polymer of isocyanates.
6. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the curing agent C is different Fo Er
The polymer of single aggressiveness of ketone diisocyanate, the dimer of isophorone diisocyanate or isophorone diisocyanate
One or more cooperations.
7. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the fire retardant is arbitrary bromine system
Fire retardant, phosphorus flame retardant, nitrogenated flame retardant, metal oxyhydroxide based flame retardant, metal oxide fire retardant and metal boron
The mixing of one or more of compound fire retardant.
8. a kind of binder of hot melt adhesive film according to claim 1, which is characterized in that the filler is arbitrary hydrophobicity
It is one or more in gas silicon, semi-hydrophobic gas silicon, hydrophily gas silicon, titanium dioxide, talcum powder, carbon black, styrene and rubber
Combination.
9. being used for the hot melt adhesive film of FFC wire rods using the binder described in arbitrary claim 1~8 any one, feature exists
In including successively from superficial layer to bottom:PET hot melt adhesive film layer, pre- dope layer and high-fire resistance adhesive layer;The height is heat-resisting
Property adhesive layer is cured by the binder;The thickness of the PET hot melt adhesive film layer is 19~50 μm;The pre- dope layer
Thickness be 1~3 μm;The thickness of the high-fire resistance adhesive layer is 20~50 μm.
10. a kind of preparation method of the binder of hot melt adhesive film as described in claim 1~8 any one, which is characterized in that
Include the following steps:
Step 1:
a:Butanone solvent and toluene solvant are made into mixed solvent;
b:Saturated polyester resin A, saturated polyester resin B and saturated polyester resin C are dissolved completely by the mixed solvent;
c:Fire retardant and filler are added to the saturated polyester resin A, saturated polyester resin B and saturated polyester tree dissolved
In fat C, component A is obtained;
d:The component A is tentatively uniformly dispersed;
e:Ground component A twice using grinder or more, until the fineness of component A is at 10 μm or less;
Step 2:
a:Curing agent A, curing agent B and curing agent C are weighed respectively successively, are then injected into container;
b:Butanone solvent is added in a reservoir, and curing agent A, curing agent B and curing agent C are uniformly mixed, obtains B component;
Step 3:
In the state that the component A is placed in dispersion, the B component is added in the component A in 30 minutes, and disperse 20
~30 minutes;
The step 1 and the step 2 are in no particular order.
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Cited By (4)
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CN110452653A (en) * | 2019-07-29 | 2019-11-15 | 广东莱尔新材料科技股份有限公司 | A kind of weather-proof hot melt adhesive of high viscous force and preparation method thereof and hot melt adhesive film |
CN110564350A (en) * | 2019-09-27 | 2019-12-13 | 广东莱尔新材料科技股份有限公司 | binder for reinforcing plate and reinforcing plate thereof |
CN110713813A (en) * | 2019-10-10 | 2020-01-21 | 广东莱尔新材料科技股份有限公司 | Preparation method of micro-foaming adhesive and micro-foaming hot melt adhesive film for FFC (Flexible Flat Cable) |
CN114412328A (en) * | 2022-01-21 | 2022-04-29 | 广州市盛艺门业有限公司 | Composite solid wood door |
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EP2328034A1 (en) * | 2003-12-10 | 2011-06-01 | Sanyo Chemical Industries, Ltd. | Composite resin particles |
CN104178044A (en) * | 2014-07-28 | 2014-12-03 | 苏州赛伍应用技术有限公司 | Insulating adhesive film for laminated bus bar and laminated bus bar |
CN107586518A (en) * | 2017-10-13 | 2018-01-16 | 苏州赛伍应用技术股份有限公司 | A kind of photovoltaic module busbar insulating tape, busbar and photovoltaic module comprising the insulating tape |
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EP2328034A1 (en) * | 2003-12-10 | 2011-06-01 | Sanyo Chemical Industries, Ltd. | Composite resin particles |
CN104178044A (en) * | 2014-07-28 | 2014-12-03 | 苏州赛伍应用技术有限公司 | Insulating adhesive film for laminated bus bar and laminated bus bar |
CN107586518A (en) * | 2017-10-13 | 2018-01-16 | 苏州赛伍应用技术股份有限公司 | A kind of photovoltaic module busbar insulating tape, busbar and photovoltaic module comprising the insulating tape |
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CN110452653A (en) * | 2019-07-29 | 2019-11-15 | 广东莱尔新材料科技股份有限公司 | A kind of weather-proof hot melt adhesive of high viscous force and preparation method thereof and hot melt adhesive film |
CN110564350A (en) * | 2019-09-27 | 2019-12-13 | 广东莱尔新材料科技股份有限公司 | binder for reinforcing plate and reinforcing plate thereof |
CN110713813A (en) * | 2019-10-10 | 2020-01-21 | 广东莱尔新材料科技股份有限公司 | Preparation method of micro-foaming adhesive and micro-foaming hot melt adhesive film for FFC (Flexible Flat Cable) |
CN114412328A (en) * | 2022-01-21 | 2022-04-29 | 广州市盛艺门业有限公司 | Composite solid wood door |
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