CN108572702A - 一种计算机主机机箱 - Google Patents
一种计算机主机机箱 Download PDFInfo
- Publication number
- CN108572702A CN108572702A CN201710140588.4A CN201710140588A CN108572702A CN 108572702 A CN108572702 A CN 108572702A CN 201710140588 A CN201710140588 A CN 201710140588A CN 108572702 A CN108572702 A CN 108572702A
- Authority
- CN
- China
- Prior art keywords
- babinet
- support combinations
- heat dissipation
- combinations frame
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000008439 repair process Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710140588.4A CN108572702A (zh) | 2017-03-10 | 2017-03-10 | 一种计算机主机机箱 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710140588.4A CN108572702A (zh) | 2017-03-10 | 2017-03-10 | 一种计算机主机机箱 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108572702A true CN108572702A (zh) | 2018-09-25 |
Family
ID=63577115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710140588.4A Pending CN108572702A (zh) | 2017-03-10 | 2017-03-10 | 一种计算机主机机箱 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108572702A (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3759475A (en) * | 1972-03-29 | 1973-09-18 | Sperry Rand Corp | Rack mounted electronic module support mechanism |
CN2800353Y (zh) * | 2005-06-03 | 2006-07-26 | 鸿富锦精密工业(深圳)有限公司 | 计算机机箱固定座 |
CN101593006A (zh) * | 2008-05-29 | 2009-12-02 | 安方高科信息安全技术(北京)有限公司 | 计算机主机机箱 |
CN201976387U (zh) * | 2011-03-29 | 2011-09-14 | 东莞天意电子有限公司 | 一种方便维护的机柜嵌套结构 |
CN103079386A (zh) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | 一种机架式通信设备的散热结构 |
CN207133721U (zh) * | 2017-08-04 | 2018-03-23 | 齐文军 | 一种便于拆卸安装的计算机主机箱 |
-
2017
- 2017-03-10 CN CN201710140588.4A patent/CN108572702A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3759475A (en) * | 1972-03-29 | 1973-09-18 | Sperry Rand Corp | Rack mounted electronic module support mechanism |
CN2800353Y (zh) * | 2005-06-03 | 2006-07-26 | 鸿富锦精密工业(深圳)有限公司 | 计算机机箱固定座 |
CN101593006A (zh) * | 2008-05-29 | 2009-12-02 | 安方高科信息安全技术(北京)有限公司 | 计算机主机机箱 |
CN201976387U (zh) * | 2011-03-29 | 2011-09-14 | 东莞天意电子有限公司 | 一种方便维护的机柜嵌套结构 |
CN103079386A (zh) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | 一种机架式通信设备的散热结构 |
CN207133721U (zh) * | 2017-08-04 | 2018-03-23 | 齐文军 | 一种便于拆卸安装的计算机主机箱 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
DD01 | Delivery of document by public notice |
Addressee: Lin Dayong Document name: Notification of Passing Preliminary Examination of the Application for Invention |
|
DD01 | Delivery of document by public notice | ||
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
DD01 | Delivery of document by public notice |
Addressee: Lin Dayong Document name: Notification of Publication and of Entering the Substantive Examination Stage of the Application for Invention |
|
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Wang Dean Document name: Notice of first office action |
|
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Lin Dayong Document name: Deemed notice of withdrawal |
|
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180925 |