CN108551721A - Flexible circuit board and its bending-type electronics module of application - Google Patents
Flexible circuit board and its bending-type electronics module of application Download PDFInfo
- Publication number
- CN108551721A CN108551721A CN201810637282.4A CN201810637282A CN108551721A CN 108551721 A CN108551721 A CN 108551721A CN 201810637282 A CN201810637282 A CN 201810637282A CN 108551721 A CN108551721 A CN 108551721A
- Authority
- CN
- China
- Prior art keywords
- region
- bending
- circuit board
- length
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Abstract
System of the present invention discloses the bending-type electronics module of a kind of flexible circuit board and its application, wherein region is sticked together comprising a conduction in flexible circuit board system, one bending region and a circuit layout region, wherein region and bending region intersection are sticked together in conduction, the wide cut in bending region is at least 0.5 that conduction sticks together the wide cut in region, and the invention discloses flexible circuit board can pass through conductive layer to be attached to the bending-type substrate with flexure plane, therefore the wide cut design of Length discrepancy is damaged caused by bending, stress is accumulated in order to reduce flexible circuit board, by the wide cut for reducing bending region, to avoid conductive layer is damaged and flexible circuit board is caused to be detached with flexure plane.
Description
Technical field
System of the present invention discloses the electronics module of a kind of circuit board and its application, in particular to a kind of flexible circuit board
And its bending-type electronics module of application.
Background technology
Electronic product is linked by circuit board and electrical property of substrate with up to the driving of product, and with portable electric product
Development, the rigid circuit board of flexible circuit board (FPC) substitution tradition, flexible circuit board is in addition to volume is light and short, ductility
The characteristic of good and high Distribution density also 3D wirings and can limit according to space and make the change of shape, and therefore, flexible circuit is in electricity
Benefit with height in son encapsulation.
Other than light and short, sci-tech product more starts with demand toward curved surface application, seems that touch-control product does not limit to
In flat-panel screens, according to the design of ergonomics, the appearances of many touch-control products is both facing to Flow of surfaces, appearance in order to balance
Consider with function, the substrate with flexure plane is with the substrate instead of past plane formula, and flexible circuit board is attached to bending
Stability on face becomes inevitable demand already.Even so, this technology be still under flexure plane degree of sticking together difference with it is flexible
Property circuit board is easily destroyed the limitation on gluing surface after bending, and can not obtain satisfactory production yield, more often leads
Cause electronic product that the problem of open circuit occurs.
In view of the above problem, the invention discloses a kind of flexible circuit board and its bending-type electronics module of application, with
It efficiently solves and how flexible circuit board steadily to be sticked together to the problem on the flexure plane of bending-type substrate.
Invention content
The main purpose of the present invention is in that provide the bending-type electronics module of a kind of flexible circuit board and its application,
System sticks together on the bending-type substrate with flexure plane, by the area for reducing bending region, to avoid conductive layer is damaged
Flexible circuit board is caused to be detached with flexure plane.
Another object of the present invention is in that provide the bending-type electronics module of a kind of flexible circuit board and its application,
The region of electrically sticking together of middle flexible circuit board is respectively provided with the first length and the second length with adjacent bending region, wherein the
One length is cemented, and the second length is then bent, when the ratio of the length of the second length/first is more than 0.5, conductive layer
It can be destroyed when bending region and bending, and when the ratio of the length of the second length/first is less than 0.5, conduction can be reduced
Layer damages caused by when bending region and bending, and when the ratio of the length of the second length/first is less than 0.33, conductive layer about still has
50% probability can be damaged, and when the ratio of the length of the second length/first is less than 0.25, then can almost avoid conduction completely
Layer is damaged when bending region and being bent, and whole flexible circuit board will not also be shelled from the curved substrate for taking face
From.
Another object of the present invention is in that provide the bending-type electronics module of a kind of flexible circuit board and its application, position
The first length that region is sticked together in conduction is substantially parallel with bending second length in region.
Another object of the present invention is in that provide the bending-type electronics module of a kind of flexible circuit board and its application,
In when conduction stick together in region have when sticking together side of multiple Length discrepancies, with the first length sticks together side system be wherein most
Close to the side person in bending region.
Another object of the present invention is in that provide the bending-type electronics module of a kind of flexible circuit board and its application,
Middle conduction series of strata can be anisotropic conductive adhesive paste so that flexible circuit board to be attached on the flexure plane of bending-type substrate.
It can in the flexible circuit board of the present invention and its bending-type electronics module of application for the purpose for reaching above-mentioned
Formula circuit board system's electrical communication is scratched on the flexure plane of bending-type substrate, and include a conduction stick together region, a bending region and
One circuit layout region, conduction stick together region and are attached to the flexure plane of substrate by conductive layer and stick together side at least one,
There is the first length, bending region to extend from conduction and stick together region for it, and bending region is not attached to base with circuit layout region
The flexure plane of plate, in bending region and the conductive intersection for sticking together region, bending region has one side of the second length, circuit cloth
Office region then extends from bending region and an at least electronic component is arranged；The ratio b/B systems of wherein the second length and the first length
It is less than 0.33, best ratio b/B systems less than 0.5, preferable ratio b/B systems and is less than 0.25.
Due to by conduction stick together region with bend region intersection bending region narrow, or by conduction stick together region and
The conduction of bending region intersection sticks together region and broadens so that be attached to flexure plane sticks together side at least more than not sticking together side
2 times, when flexible circuit board after being attached to bending-type substrate when being bent, sticking together region due to conduction at most only has 1/2
Part directly influenced by cumulative stress when bending, known flexible circuit board is then entirely to stick together side all bending
During, it is stressed the influence of accumulation completely, is compared with known techniques, the flexible circuit board in the present invention and its application
Bending-type electronics module in, flexible circuit board sticks together region by broken by the area for reducing bending region, to avoid conduction
Badly flexible circuit board is caused to be detached with bending-type substrate.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of flexible circuit board of the present invention.
Fig. 2A is a kind of decomposition texture schematic diagram of the bending-type electronics module of the present invention when being not yet bent.
Fig. 2 B are a kind of decomposition texture schematic diagram of bending-type electronics module of the present invention upon bending.
Fig. 2 C are a kind of structural schematic diagram of bending-type electronics module of the present invention.
Reference numeral：
1 flexible circuit board, 2 bending-type substrate
3 bending-type electronics module, 11 conduction sticks together region
111, which stick together side 13, bends region
131 side, 15 circuit layout region
151 electronic component C flexure planes
AD conductive layers the first length of B
The second length of b
Specific implementation mode
The technological means and its construction that the present invention uses, hereby drawing, it is special with regard to the preferred embodiments of the invention elaborate
Sign is as follows with function, understands completely in order to sharp.
Shown in Fig. 1, Fig. 2A, Fig. 2 B and Fig. 2 C, wherein Fig. 1 is a kind of flexible circuit board of the present invention
Structural schematic diagram, Fig. 2A and Fig. 2 B systems be respectively the invention discloses a kind of flexible circuit board be bent forward and backward decomposition knot
Structure schematic diagram, Fig. 2 C are then for a kind of structural schematic diagram of bending-type electronics module of the present invention.The bending-type electronics of the present invention
Module 3 includes flexible circuit board 1, bending-type substrate 2 and adhesion layer AD, wherein 1 system of flexible circuit board includes one conductive glutinous
It region 11, one and bends region 13 and a circuit layout region 15, wherein conduction is sticked together region 11 and is attached to by conductive layer AD
On the flexure plane C of bending-type substrate 2, then self-conductive is sticked together region 11 and is extended in bending region 13, and bending region 13 is to be attached to
On flexure plane C, but 11 intersection of region is sticked together with conduction in bending region 13, the one side 131 in bending region 13 has the second length
Degree b, the conductive side 111 of sticking together for sticking together region 11 then have the first length B, and above-mentioned side 131 and stick together 111 essence of side
Upper is parallel to each other, and it is that electronic component 151 can be arranged to extend from the circuit layout region 15 for bending region 13.In this reality
It applies in aspect, conduction sticks together region 11 and bending region 13, circuit layout region 15 illustrate by taking rectangle as an example, certainly, conductive
Different designs can be had individually according to different demands by sticking together region 11 and bending region 13, circuit layout region 15, be illustrated
For, conduction sticks together region 11, bending region 13, circuit layout region 15 can be square, diamond shape, ellipse, circle or appoints
Meaning shape.
Since flexible circuit board 1 follows in bending process the equation of second moment of area：
Wherein, b is the thickness that the second length b, h is conductive layer AD.
It follows that under the conditions of identical stick together, such as：Identical conductive layer AD thickness (h is fixed value), second
Length b can be directly proportional to I, therefore, when flexible circuit board 1 is in bending, can be shown from the experiment of Von Mise ' s stress,
The ratio b/B of second length b and the first length B are necessarily less than 0.5, otherwise will be when flexible circuit board 1 is bent, and causing can
It scratches formula circuit board 1 to remove from the flexure plane C of bending-type substrate 2 completely, preferable aspect is then the second length b and the first length
The ratio b/B of B is necessarily less than 0.33, but under this ratio, the flexible circuit board 1 for still about having 50% can be from bending
It is removed on the flexure plane C of formula substrate 2, the ratio b/B of the second best length b and the first length B is then less than 0.25 herein one
Flexible circuit board 1 under Proportionality design is bent anyway, will not all be removed from the flexure plane C of bending-type substrate 2.And
Flexible circuit board 1 in bending-type electronics module 3 can be that be from the principal element of the flexure plane C strippings of bending-type substrate 2,
Conductive layer AD is most vulnerable to stress when flexible circuit board 1 is bent, in the conductive layer AD bodies close to bending region 13
The influence of accumulation, and being damaged can then lead to flexible circuit board 1 when conductive layer AD loses adhesion in response to force effect
The situation removed from bending-type substrate 2.
In process conditions (seeming the processing procedures such as pressing, heating, curing), material condition (conditions such as viscosity, surface tension) control
In the state of being made preferably, or changing using when adhesive tape type conductive layer, the phenomenon that colloid overflow of conductive layer, is not serious, thus
Conduction can be sticked together and almost coat conductive colloid in region, therefore under such aspect, conduction sticks together the glutinous of region
It side and bends the aspect when being substantially total in region, in addition, since conductive layer is in coating, pressing, heating, curing etc.
When fabrication steps, it will usually be sticked together in conduction and retain one piece of overflow area between region and bending region, pressed in order to provide part
Under the action of power, temperature, conductive layer is because occurring overflow after stress, heated or surface tension change, stickiness changes, therefore by surrounding
Region gives, but during overflow, because it is difficult to which the degree and state for controlling overflow may result in and stick together side system reality
Quality is adjacent with the bending side in region, and is not necessarily fully connected.
In addition, when irregular or side with multiple and different length is presented in the shape that conduction sticks together region, in the present invention
The side system of sticking together with the first length disclosed is defined as closest to bending region and the conductive side for sticking together region intersection
Person；And the conductive layer is then anisotropic conductive adhesive paste；Bending-type substrate with flexure plane includes then printed circuit board, glass
Substrate, flexible circuit board, metal foil substrate knead dough plate.
From the above it is found that the invention discloses a kind of flexible circuit board and its application bending-type electronics module,
Middle flexible circuit board system electrical communication includes that a conduction sticks together region, a bent area on the flexure plane of bending-type substrate
Domain and a circuit layout region, wherein stick together region close to conduction and bend the intersection in region, conduction, which sticks together region, to be had
First length B, bending region have the second length b, according to the display of Von Mise ' s stress, when the second length b and first is grown
When spending the ratio b/B of B less than 0.25, the colloid of the angle no matter bent, conductive layer nearly all will not be by any damage, therefore
Flexible circuit board and the adhesion of bending-type substrate quite it is strong, for the structural strength and stabilization of Integral bending musical form electronics module
Degree, there is quite positive benefit.
Claims (19)
1. a kind of flexible circuit board is to be electrically connected on a flexure plane of a substrate, which is characterized in that the bendable electricity
Road plate system includes：
One conduction sticks together region, and the flexure plane is attached to by a conductive layer, which sticks together region and stick together side at least one
Side has one first length；
One bending region, extends from the conduction and sticks together region, which is not attached to the flexure plane, and glutinous with the conduction
Region intersection, which has one side, has one second length；And
One circuit layout region extends from the bending region, and an at least electronic component is arranged；
Wherein, the ratio b/B systems of second length and first length are less than 0.5.
2. flexible circuit board as described in claim 1, the wherein conduction stick together region this stick together side to be parallel to this curved
The side in folding area domain.
3. flexible circuit board as described in claim 1, the wherein conduction stick together region this stick together side and the bent area
The side in domain is adjacent.
4. flexible circuit board as described in claim 1, the wherein conduction stick together region this stick together side and the bent area
This of domain is while for altogether.
5. flexible circuit board as described in claim 1, the wherein conduction stick together region those stick together side Length discrepancy, have
Have first length this stick together side system be wherein closest to the side person in the bending region.
6. flexible circuit board as described in claim 1, wherein the preferred proportion b/B systems of second length and first length
Less than 0.33.
7. flexible circuit board as described in claim 1, wherein the optimal proportion b/B systems of second length and first length
Less than 0.25.
8. flexible circuit board as described in claim 1, the wherein conductive layer are anisotropic conductive adhesive paste.
9. flexible circuit board as described in claim 1, wherein the substrate system are bending or flexible, and the substrate system is
Printed circuit board, glass substrate, flexible circuit board, metal foil substrate or panel.
10. a kind of bending-type electronics module, which is characterized in that it is to include：
One bending-type substrate is with a flexure plane；
One conductive layer is to be set to the flexure plane；And
One flexible circuit board is to be connect with the bending-type electrical property of substrate by the conductive layer, flexible circuit board system packet
Contain：
One conduction sticks together region, and by the conductive layer to be attached to the flexure plane, which sticks together region and sticked together at least one
Side has one first length；
One bending region, extends from the conduction and sticks together region, which is not attached to the flexure plane, and glutinous with the conduction
Region intersection, which has one side, has one second length；And
One circuit layout region extends from the bending region, and an at least electronic component is arranged；
Wherein, the ratio b/B systems of second length and first length are less than 0.5.
11. bending-type electronics module as claimed in claim 10, wherein the bending-type substrate system are flexible or with fixed curvature.
12. bending-type electronics module as claimed in claim 10, wherein the substrate system be printed circuit board, glass substrate, soft
Property circuit board, metal foil substrate or panel.
13. bending-type electronics module as claimed in claim 10, the wherein conduction stick together region this stick together side and be parallel to
The side in the bending region.
14. bending-type electronics module as claimed in claim 10, the wherein conduction stick together this of region, to stick together side curved with this
The side in folding area domain is adjacent.
15. bending-type electronics module as claimed in claim 10, the wherein conduction stick together this of region, to stick together side curved with this
This of folding area domain is while for altogether.
16. bending-type electronics module as claimed in claim 10, the wherein conduction stick together region those stick together side etc.
Long, this with first length sticks together side system for wherein closest to the side person in the bending region.
17. bending-type electronics module as claimed in claim 10, the wherein preferred proportion of second length and first length
B/B systems are less than 0.33.
18. bending-type electronics module as claimed in claim 10, the wherein optimal proportion of second length and first length
B/B systems are less than 0.25.
19. bending-type electronics module as claimed in claim 10, the wherein conductive layer are anisotropic conductive adhesive paste.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810637282.4A CN108551721A (en) | 2018-06-20 | 2018-06-20 | Flexible circuit board and its bending-type electronics module of application |
| TW107122409A TW202002739A (en) | 2018-06-20 | 2018-06-28 | Flexible printed circuit and its related curved electrical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810637282.4A CN108551721A (en) | 2018-06-20 | 2018-06-20 | Flexible circuit board and its bending-type electronics module of application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108551721A true CN108551721A (en) | 2018-09-18 |
Family
ID=63493837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810637282.4A Pending CN108551721A (en) | 2018-06-20 | 2018-06-20 | Flexible circuit board and its bending-type electronics module of application |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108551721A (en) |
| TW (1) | TW202002739A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788712A (en) * | 2019-01-14 | 2019-05-21 | 常州常发制冷科技有限公司 | Side divergence type liquid cooling plate and its processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101581995A (en) * | 2008-05-16 | 2009-11-18 | 苹果公司 | Flex circuit with single sided routing and double sided attach |
| CN202018547U (en) * | 2011-04-15 | 2011-10-26 | Tcl显示科技（惠州）有限公司 | Main flexible printed circuit for liquid crystal display module |
| CN103582296A (en) * | 2012-08-10 | 2014-02-12 | 乐金显示有限公司 | Flexible printed circuit film and display device using the same |
| CN205912333U (en) * | 2016-08-28 | 2017-01-25 | 江西合力泰科技有限公司 | Bent FPC of proof warp |
| CN206042528U (en) * | 2016-09-22 | 2017-03-22 | Tcl显示科技（惠州）有限公司 | Flexible circuit board and display device |
-
2018
- 2018-06-20 CN CN201810637282.4A patent/CN108551721A/en active Pending
- 2018-06-28 TW TW107122409A patent/TW202002739A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101581995A (en) * | 2008-05-16 | 2009-11-18 | 苹果公司 | Flex circuit with single sided routing and double sided attach |
| CN202018547U (en) * | 2011-04-15 | 2011-10-26 | Tcl显示科技（惠州）有限公司 | Main flexible printed circuit for liquid crystal display module |
| CN103582296A (en) * | 2012-08-10 | 2014-02-12 | 乐金显示有限公司 | Flexible printed circuit film and display device using the same |
| CN205912333U (en) * | 2016-08-28 | 2017-01-25 | 江西合力泰科技有限公司 | Bent FPC of proof warp |
| CN206042528U (en) * | 2016-09-22 | 2017-03-22 | Tcl显示科技（惠州）有限公司 | Flexible circuit board and display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109788712A (en) * | 2019-01-14 | 2019-05-21 | 常州常发制冷科技有限公司 | Side divergence type liquid cooling plate and its processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202002739A (en) | 2020-01-01 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180918 |