CN108549782B - Gold bump process and circuit design method - Google Patents
Gold bump process and circuit design method Download PDFInfo
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- CN108549782B CN108549782B CN201810383000.2A CN201810383000A CN108549782B CN 108549782 B CN108549782 B CN 108549782B CN 201810383000 A CN201810383000 A CN 201810383000A CN 108549782 B CN108549782 B CN 108549782B
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- 239000010931 gold Substances 0.000 title claims abstract description 133
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 133
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 131
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000013461 design Methods 0.000 title claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 238000003780 insertion Methods 0.000 claims description 11
- 230000037431 insertion Effects 0.000 claims description 11
- 238000002513 implantation Methods 0.000 claims description 8
- 238000005457 optimization Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 5
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 4
- 238000004088 simulation Methods 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000011548 physical evaluation Methods 0.000 claims description 2
- 150000002343 gold Chemical class 0.000 claims 2
- 230000032683 aging Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000006978 adaptation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
Abstract
A gold bump technology and circuit design method comprises separating the replaced circuit, and connecting the gold bump with the display screen, or the keyboard, or the battery, and the display screen in the structure matched with the circuit; or a circuit and battery, and a keyboard; and the mutual potential and the gold bumps are connected to realize data exchange. The gold bump technology forms unequal thickness below 20nm between the fit structures, or forms contact positions and limit positions which are mutually contained in different forms to realize the fastening in the mutual internal structures. The contact position and the limit position which are mutually contained relate to a circuit and a display screen; or a circuit and keyboard structure; or a heat sink layer, a shield layer, and a non-wiring region between the circuit and the battery. The gold bumps comprise non-conductive bumps, so that EMI is optimized; and realizing the performance index of EMC. In the embodiment, the structure of the circuit board 6 surface is preferable, and the structure of the circuit which is accommodated and matched by combining the guide rail and the guide groove is pulled and separated, and the structure which is matched by the electro-permanent magnet pair is interlocked.
Description
Technical Field
The invention relates to a gold bump process and a circuit design method. With different side structures and local spaces above and below, different directions will be passed: the non-continuous gold bumps and the gold bumps in the wedge-in direction or the gold bumps in different forms and the gold bumps in the wedge-in direction form mutually-contained contact positions and limiting positions, and the fastening in the mutual internal structure is realized through the gradual change of the mutually-contained contact positions, the limiting position distances and the gold bump dimension specifications.
Background
Gold bump technology is commonly used on flip chips of flexible substrates (as well as ceramic substrates, PCBs, etc.), and is widely used for preparing surface contacts for electronic devices, such as contacts for liquid crystal displays, contacts in semiconductor devices. The coplanarity is usually adopted, so that the uniformity of the bump morphology and the uniformity of the electrical contact performance are improved, and the adverse effect of surface roughness on the subsequent flip-chip bonding of the semiconductor chip is avoided, and the reliability of the semiconductor device is influenced.
However, in practice, there is no technology for realizing the fastening in the mutual internal structure from the gradual change of the distance and the size specification of the mutual structure of the gold bumps in the gold bump technology, especially based on the discontinuous gold bump technology.
Disclosure of Invention
A gold bump technology and circuit design method comprises separating the replaced circuit, and connecting the gold bump with the display screen, or the keyboard, or the battery, and the display screen in the structure matched with the circuit; or a circuit and battery, and a keyboard; the electric potential and the ground wire are connected through gold bumps, so that data exchange is realized; the gold bump technology forms different thicknesses below 20nm among the fit structures, and the thicknesses are different in directions: the discontinuous gold bumps 1 and the gold bumps 2 in the wedge-in direction or the gold bumps in different forms and the gold bumps in the wedge-in direction form mutually-contained contact positions 3 and limiting positions 4, and the fastening in the mutual internal structure is realized through the gradual change of the mutually-contained contact positions, the limiting position distances and the dimension specifications.
The design method of gold bump technology and circuit comprises separating the replaced circuit, and in the structure matched with the circuit, the circuit and display screen, or the circuit and keyboard structure, or the circuit and battery, and the display screen; or a circuit and battery, and a keyboard; the electric potential and the ground wire are connected through gold bumps, so that data exchange is realized;
in the fit structure, a guide rail or a guide groove is used for adapting the circuit to the display screen or the circuit to the keyboard structure or the circuit to the battery and the display screen; or the circuit, the battery and the keyboard are integrated into a product for use, the guide rail or the guide groove is in an integrated structure, and a separated and replaced propelling cavity for circuit implantation is formed through the display screen and the battery or the keyboard and the battery, so that a first structure is formed for fastening;
and has the following characteristics that the directions are different: the contact position 3 and the limit position 4 which are mutually contained are formed between the discontinuous gold convex points 1 and the gold convex points 2 in the direction of insertion or between the gold convex points in different forms and the gold convex points in the direction of insertion, and the gradual change of the contact position, the limit position distance and the dimension specification which are mutually contained is realized: a second of the internal structures is secured to each other.
A design method of gold bump technology and circuit comprises a battery and a display screen, or a battery and a keyboard; the guide rail or the guide groove is arranged in the matched structure, and forms a propelling cavity implanted by the separated and replaced circuit through the display screen and the battery or the keyboard and the battery, so as to form a first structural fastening;
there are by different directions: the contact position 3 and the limit position 4 which are mutually contained are formed between the discontinuous gold convex points 1 and the gold convex points 2 in the direction of insertion or between the gold convex points in different forms and the gold convex points in the direction of insertion, and the gradual change of the contact position, the limit position distance and the dimension specification which are mutually contained is realized: a second pass of fastening in the mutual internal structure;
the separated and replaced circuit is interlocked with the battery and the display screen or the separated and replaced circuit is interlocked with the battery and the electric permanent magnet of the keyboard at one side of the implantation port.
Providing a local space in respect of using different side structures and up and down will pass different directions: the non-continuous gold bumps and the gold bumps in the wedge-in direction or the gold bumps in different forms and the gold bumps in the wedge-in direction form mutually-contained contact positions and limiting positions, and the fastening in the mutual internal structure is realized through the gradual change of the mutually-contained contact positions, the limiting position distances and the gold bump dimension specifications. Facilitating implementation of modular hardware techniques. Thereby reducing the use cost in terms of maintenance.
Drawings
FIG. 1 is a schematic illustration of gold bump connections for different mating directions of a circuit board;
fig. 2 is a view of the tail of the pusher lumen interlocked with the electro-permanent magnet for an implanted discrete replacement circuit.
Detailed Description
A gold bump technology and circuit design method comprises separating the replaced circuit, and connecting the gold bump with the display screen, or the keyboard, or the battery, and the display screen in the structure matched with the circuit; or a circuit and battery, and a keyboard; the electric potential and the ground wire are connected through gold bumps, so that data exchange is realized; the gold bump technology forms different thicknesses below 20nm among the fit structures, and the thicknesses are different in directions: the discontinuous gold bumps 1 and the gold bumps 2 in the wedge-in direction or the gold bumps in different forms and the gold bumps in the wedge-in direction form mutually-contained contact positions 3 and limiting positions 4, and the fastening in the mutual internal structure is realized through the gradual change of the mutually-contained contact positions, the limiting position distances and the dimension specifications.
This is accomplished by different directions: the fastening design method in the mutual internal structure is realized through gradual change of the contact position, the limiting position distance and the dimension specification of the mutual insertion, and the fastening design method is suitable for cameras, GPS modules, external lenses, miniature external projectors and loudspeaker peripheral products.
Examples: the circuit board is of a six-sided structure generally, but the layout optimization of wiring and chips is considered in the existing process only through a PCB level mode, so that the design of a separate replacement circuit is omitted, and meanwhile, the different side structures and the upper and lower partial spaces in the six-sided structure are utilized, and the three-dimensional structure is realized in different directions: the non-continuous gold bumps and the gold bumps in the wedge-in direction or the gold bumps in different forms and the gold bumps in the wedge-in direction form mutually-contained contact positions and limiting positions, and the fastening in the mutual internal structure is realized through the gradual change of the mutually-contained contact positions, the limiting position distances and the gold bump dimension specifications. Referring to fig. 1, a schematic illustration of gold bump connection modes in different fitting directions is provided for positive and negative sides of a circuit board, and discontinuous gold bumps thereof can reduce fitting intervals in the fitting direction, so that the gold bumps of the circuit board adapt to the size specification at mutually-contained contact positions until the gold bumps of the circuit board are pushed by limiting separation replacement circuits in limiting positions through different shapes;
consider that: optimizing the EMI; the performance index of EMC, the heat dissipation layer, the shielding layer and the non-wiring area between the PCBs, the adaptation between the heat dissipation layer and the shielding layer and the gold bumps, and the gold bumps under the EMI numerical optimization are realized, and the non-conductive bumps are included.
The design method of gold bump technology and circuit comprises separating the replaced circuit, and in the structure matched with the circuit, the circuit and display screen, or the circuit and keyboard structure, or the circuit and battery, and the display screen; or a circuit and battery, and a keyboard; the electric potential and the ground wire are connected through gold bumps, so that data exchange is realized;
in the fit structure, a guide rail or a guide groove is used for adapting the circuit to the display screen or the circuit to the keyboard structure or the circuit to the battery and the display screen; or the circuit, the battery and the keyboard are integrated into a product for use, the guide rail or the guide groove is in an integrated structure, and a separated and replaced propelling cavity for circuit implantation is formed through the display screen and the battery or the keyboard and the battery, so that a first structure is formed for fastening;
and has the following characteristics that the directions are different: the contact position 3 and the limit position 4 which are mutually contained are formed between the discontinuous gold convex points 1 and the gold convex points 2 in the direction of insertion or between the gold convex points in different forms and the gold convex points in the direction of insertion, and the gradual change of the contact position, the limit position distance and the dimension specification which are mutually contained is realized: a second of the internal structures is secured to each other.
Examples: the contact position and the limit position which are mutually contained relate to a circuit and a display screen; or a circuit and keyboard structure; or the gold bump of the structure position between the circuit and the battery is accommodated in the contact position and the limit position. The potential and data connection of the I/O interface are realized. Considering the use frequency of the use period, the gold bump technology forms unequal thickness below 20nm among the fit structures, the abrasion is separated from a circuit with the use design of more than 5000-10000 times, and the display screen is damaged and updated, and the material characteristics of the existing gold bumps cannot completely realize the use frequency of the similar use period. The guide rail or the guide groove is arranged in the matched structure, a separate and replaceable circuit implanted propulsion cavity is formed by the display screen and the battery or the keyboard and the battery, and the first structure is formed for fastening, so that the practical verification proves that the guide rail or the guide groove has good use frequency for 30000 times at maximum. Therefore, the double fastening is adopted, and the practical significance of the technology is achieved.
In the embodiment, the upper and lower cylindrical gold bumps are matched with ground wires and potentials, and the limit of the non-conductive cylindrical gold bumps limiting the push-in position is also realized, or a box body structure is formed by a battery and a display screen at the right and left sides of the circuit board and the matched position thereof, a guide rail is arranged, or a guide groove is contacted with the position through a convex-concave structure, and the cylindrical gold bumps are matched with the ground wires and potentials and the limit position of a circuit at one side of the contacted position;
or the upper and lower circuit boards and the battery and display screen at the matching position thereof form a box body structure through a guide rail or a guide groove, the guide rail or the guide groove limits the separated and replaced circuit contact position through a convex-concave structure, and a cylindrical gold bump is arranged at one side of the contact position for matching the ground wire and the potential, and the cylindrical gold bump limits the circuit; forming an exchange of data.
A design method of gold bump technology and circuit comprises a battery and a display screen, or a battery and a keyboard; the guide rail or the guide groove is arranged in the matched structure, and forms a propelling cavity implanted by the separated and replaced circuit through the display screen and the battery or the keyboard and the battery, so as to form a first structural fastening;
there are by different directions: the contact position 3 and the limit position 4 which are mutually contained are formed between the discontinuous gold convex points 1 and the gold convex points 2 in the direction of insertion or between the gold convex points in different forms and the gold convex points in the direction of insertion, and the gradual change of the contact position, the limit position distance and the dimension specification which are mutually contained is realized: a second pass of fastening in the mutual internal structure;
the circuit and the battery and the display screen which are separated and replaced or the circuit and the battery and the keyboard which are separated and replaced are combined into a part of the integral matching direction of the product, and the battery and the display screen which are combined with the circuit which are separated and replaced are arranged at one side of the implantation opening, or the circuit which is separated and replaced is mutually interlocked with an electro-permanent magnet which is arranged between the battery and the keyboard.
In the embodiment, the structure of the circuit board 6 is preferable, the structure of the circuit board 6 is combined with the guide rail and the guide groove structure to enable the circuit to be accommodated in the matched structure to be pulled and separated, the box body structure is formed by the battery and the display screen matched with the left side and the right side of the separated and replaced circuit board structure, the guide rail or the guide groove is arranged, the box body structure is formed by the battery and the display screen implanted in the circuit board, and the structure matched with the battery and the display screen mutually is interlocked at one side of the implantation port by the battery and the display screen matched with the circuit board or the structure matched with the battery and the electric permanent magnet pair mutually of the keyboard.
Referring to fig. 2, similar technical means can be also referred to as follows:
the left side and the right side of the separated and replaced circuit board structure are combined with the battery and the display screen to form a box body structure, a guide rail or a guide groove is arranged, the battery and the display screen are implanted into the circuit board to form the box body structure, and the electric permanent magnets of the battery and the display screen at the combining position of the circuit board and the circuit board are interlocked at one side of the implantation port;
the upper and lower surfaces of the separated and replaced circuit board structure and the battery and the display screen at the matched position form a box body structure, a guide rail is arranged, or the guide rail limits the pushing amount through a convex-concave structure, and the circuit board is interlocked with the electric permanent magnet between the battery and the display screen at the matched position at one side of the implantation port;
the upper and lower cylindrical gold bumps are matched with ground wires and potentials, and limit positions of the permanent magnets are limited by interlocking;
the left and right cylindrical gold bumps are matched with ground wires and potentials, and limit positions of the permanent magnets are limited by interlocking;
the upper and lower columnar gold bumps are used for matching ground wires and potentials, and the non-conductive columnar gold bumps with limiting positions are limited;
the left and right columnar gold bumps are used for matching ground wires and potentials and limiting non-conductive columnar gold bumps at limiting positions;
and the non-conductive bumps are included in the non-wiring areas of the shielding layer, the heat dissipation layer and the substrate by referring to the optimization of the EMI, the adaptation between the non-conductive bumps and the gold bumps under the optimization of the EMI value.
The gold bump technology and the design method of the circuit are characterized by comprising non-conductive bumps, a heat dissipation layer, a shielding layer and a non-wiring area between PCBs, and optimizing the adaptation of EMI between the non-conductive bumps; and realizing the performance index of EMC.
The structure which is matched by the guide rail or the guide groove in the gold bump technology and the design method of the circuit is characterized in that the structure which is matched by the guide rail or the guide groove, a heat dissipation layer, a shielding layer and a non-wiring area between the PCB and the circuit which is separated and replaced optimize the matching of the EMI; the performance index of EMC is realized, the non-conductive material is preferably used as a guide rail or guide groove adapting structure, such as plastic, and the use efficiency of drawing and separating is more than 5000-10000 times.
The electro-permanent magnet 5 is characterized in that the separated and replaced circuit is matched with a battery and a display screen of a structure, or the separated and replaced circuit, the battery and a keyboard are mutually arranged, and the electro-permanent magnet 5 is technically characterized in that the closing force of the electro-permanent magnet is 30-50 kg.
The gold bump is characterized in that the gold bump is a contact position 3 non-conductive bump, and then the limit position 4 gold bump is integrated with a battery and a display screen in a separated and replaced circuit or a battery and a keyboard in a separated and replaced circuit, and the battery and the display screen or the battery and the keyboard limit position 4 gold bump are connected with a gold bump in a matching direction of the separated and replaced circuit to realize mutual potential and ground wire connection, so that data exchange is realized.
A gold bump process and a design method of a circuit are provided, wherein: the design steps are as follows:
s1, selecting a device, simulating the device through wiring layout and an EMI circuit, generating simulation before a digital circuit, and selecting according to a fitting mechanism at a fitting relation position: contact, limit, guide or guide rail positions;
s2, selecting a battery, a circuit and a display screen in EMC design values according to the signal interference source of the EMI; or part of the battery, the circuit and the keyboard structure is integrated with the battery and the display screen through the integral design of the non-wiring area, the heat dissipation area and the shielding area of the circuit; or a gold bump process that the battery and the keyboard form a fastening structure and a push-pull separation structure that the guide rail or the guide groove is matched with;
s3, through layout confirmation, designing simulation pairs of a battery, a circuit and a display screen; or part of the battery, the circuit and the keyboard structure is integrated with the battery and the display screen through the integral design of the non-wiring area, the heat dissipation area and the shielding area of the circuit; or the battery and the keyboard form a gold bump technology of a fastening structure, and the corresponding materials of the guide rail or the guide groove are matched, and through further optimization of the non-conductive material, the flow sheet is produced;
s4, carrying out subsequent physical evaluation on a device structure produced by a flow sheet, conforming to EMI optimization, forming technical standards under the specification of EMC design values, and further carrying out reliability: the anti-aging, structural vibration, structural impact, anti-fatigue, waterproof and heat dissipation performance are optimized, and the interlocking of the permanent magnets is selected for the fastening performance, so that the technical performance is realized.
Claims (10)
1. A gold bump process and a circuit design method sequentially comprise the following design steps:
s1, selecting a device, wherein the device is simulated by a wiring layout and an EMI circuit, and before simulation generation of a digital circuit, the device is selected according to a fit structure: a contact bit, a limit bit;
s2, selecting a part of a battery and a circuit and a display screen structure, a part of a battery and a circuit and a keyboard structure, a part of a battery and a circuit, a part of a circuit or a part of a circuit and a display screen structure in EMC design values according to a signal interference source of the EMI, so that the whole design of a non-wiring area, a heat dissipation area and a shielding area of the circuit and the battery and the display screen, or a process fastening structure of a gold salient point is formed with the battery and the keyboard;
s3, through layout confirmation, the parts of the battery and the circuit and the display screen, the parts of the battery and the circuit and the keyboard structure, the parts of the battery and the circuit, or the parts of the circuit and the display screen structure are designed, the non-wiring area, the heat dissipation area and the shielding area of the circuit are integrally designed with the battery and the display screen or the battery and the keyboard to form a fastening structure of a gold bump process, and the production of the current sheet is carried out after the further optimization of the non-conductive material;
s4, performing physical evaluation on a device structure produced by the circuit flow sheet, conforming to EMI optimization, forming technical standards under the specification of EMC design values, and further optimizing the ageing resistance, structural vibration, structural impact resistance, fatigue resistance, waterproofness and heat dissipation of the circuit to realize technical design performance.
2. The method of designing a circuit according to claim 1, wherein the circuit includes a discontinuous gold bump (1) and a gold bump (2) in a wedge-in direction, and a circuit for separating and replacing the gold bump;
in the structure matched with the separated and replaced circuit, the circuit is connected with the display screen, or the circuit is connected with the keyboard, or the circuit is connected with the battery and the display screen, or the circuit is connected with the battery and the keyboard through gold bumps, so that data exchange is realized; the gold bump technology forms different thicknesses below 20nm among the fitting structures, and forms mutually-contained contact positions (3) and limiting positions (4) between discontinuous gold bumps (1) and gold bumps (2) in the fitting direction or between gold bumps in different forms and gold bumps in the fitting direction in different directions, so that fastening in the mutually-internal structures is realized through the mutually-contained contact positions, the limiting position distance and the gradual change of the dimension specification.
3. The design method according to claim 1, wherein the gold bump process circuit is characterized by comprising discontinuous gold bumps (1) and gold bumps (2) in the direction of insertion, and separated replacement circuits;
in the structure matched with the separated and replaced circuit, the circuit is connected with the display screen, or the circuit is connected with the keyboard, or the circuit is connected with the battery and the display screen, or the circuit is connected with the battery and the keyboard through gold bumps, so that data exchange is realized;
in the fit structure, a structure of adapting a guide rail or a guide groove is used for integrating a circuit with a display screen, a circuit with a keyboard, a circuit with a battery and a display screen, or a circuit with a battery and a keyboard into a product, and the guide rail or the guide groove is in the fit structure and is fastened with a first structure formed by the display screen with the battery, the keyboard with the battery and a propulsion cavity implanted by the separated and replaced circuit;
in different directions, the contact position (3) and the limiting position (4) which are mutually contained are formed between the discontinuous gold convex points (1) and the gold convex points (2) in the contracting direction or between the gold convex points in different forms and the gold convex points in the contracting direction, and the second fastening in the mutual internal structure is realized through the gradual change of the contact position, the limiting position distance and the dimension specification which are mutually contained.
4. The design method according to claim 1, wherein the gold bump process circuit is characterized by comprising discontinuous gold bumps (1) and gold bumps (2) in the direction of insertion, and separated replacement circuits;
the battery and the display screen, or the battery and the keyboard are mutually fastened by adopting the fit of convex-concave structural surfaces, and in the local propelling direction formed by the fit fastening of the convex-concave structural surfaces, a structure matched by a guide rail or a guide groove is adopted, a separated and replaced circuit is integrated with the battery and the display screen, or the separated and replaced circuit is integrated with the battery and the keyboard into a product, and the guide rail or the guide groove is in the fit structure, and forms a first structure fastening with a propelling cavity implanted by the separated and replaced circuit through the display screen and the battery, or the keyboard and the battery;
in different directions, forming mutually-contained contact positions (3) and limiting positions (4) between the discontinuous gold convex points (1) and the gold convex points (2) in the wedge-in direction or between the gold convex points in different forms and the gold convex points in the wedge-in direction, and realizing second fastening in the mutual internal structure through the gradual change of the mutually-contained contact positions, the limiting position distances and the dimensional specifications;
and an electro-permanent magnet (5) is arranged between the separated and replaced circuit and the battery or the display screen or between the separated and replaced circuit and the battery and the keyboard to interlock the battery or the display screen with the matched structure at one side of the implantation port.
5. The design method according to any one of claims 2 to 4, comprising non-conductive bumps, wherein the non-conductive bumps are optimally adapted to EMI between a heat dissipation layer, a shielding layer and a non-wiring region between the PCB and the non-conductive bumps, so as to achieve performance indexes of EMC.
6. The design method according to any one of claims 3 to 4, characterized by comprising a structure adapted by a guide rail or a guide groove, wherein the structure adapted by the guide rail or the guide groove is optimally adapted to EMI between a heat dissipation layer, a shielding layer, a non-wiring area and a separated and replaced circuit between PCBs, so as to realize performance indexes of the EMC, and a non-conductive material is used as the structure adapted by the guide rail or the guide groove, and the number of times of pulling and separating the structure adapted by the guide rail or the guide groove is more than 5000 to 10000 times.
7. The design method according to claim 4, wherein the separated and replaced circuit is provided with an electro-permanent magnet between the battery and the display screen, or between the separated and replaced circuit and the battery and the keyboard, and is technically characterized in that the closing force of the electro-permanent magnet is 30-50 kg.
8. The design method according to claim 5, wherein the gold bumps are non-conductive bumps of the contact sites (3), the separated and replaced circuit is integrated with the battery and the display screen or the separated and replaced circuit is integrated with the battery and the keyboard through the gold bumps of the limiting sites (4), and the gold bumps of the limiting sites (4) realize mutual potential and ground connection to realize data exchange.
9. The design method according to claim 2, which is applicable to cameras, GPS modules, external lenses, miniature external projectors, and speaker peripheral products.
10. The design method according to claim 1, wherein the designed gold bump process circuit is characterized by comprising a circuit with separation and replacement, wherein in a structure matched with the circuit with separation and replacement, mutually-contained contact positions (3) and limit positions (4) are formed between discontinuous gold bumps (1) and gold bumps (2) in the fitting direction or between gold bumps in different forms and gold bumps in the fitting direction in different directions by utilizing different side structures and partial spaces on the upper and lower surfaces in six-surface structures of the separation and replacement circuit, and fastening in the mutually-internal structure is realized by the mutual-contained contact positions, limit position distances and gradual change of gold bump dimension specifications.
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| CN201810383000.2A CN108549782B (en) | 2018-04-26 | 2018-04-26 | Gold bump process and circuit design method |
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| CN201810383000.2A CN108549782B (en) | 2018-04-26 | 2018-04-26 | Gold bump process and circuit design method |
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| CN1886034A (en) * | 2005-06-24 | 2006-12-27 | 三星电机株式会社 | Printed circuit board using convex point and manufacturing method thereof |
| CN201898161U (en) * | 2010-09-02 | 2011-07-13 | 张静 | Battery mounting box |
| CN202013614U (en) * | 2011-03-25 | 2011-10-19 | 公信电子股份有限公司 | Improvement of POS terminal and expansion module connecting structure |
| CN203553454U (en) * | 2013-10-24 | 2014-04-16 | 东莞市奕联实业有限公司 | An anti-EMI electric connector and a shielding housing thereof |
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