CN108541138B - Processing technology for electronic component - Google Patents
Processing technology for electronic component Download PDFInfo
- Publication number
- CN108541138B CN108541138B CN201810272677.9A CN201810272677A CN108541138B CN 108541138 B CN108541138 B CN 108541138B CN 201810272677 A CN201810272677 A CN 201810272677A CN 108541138 B CN108541138 B CN 108541138B
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- China
- Prior art keywords
- transfer
- plate
- wiring board
- fixedly connected
- collecting mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims abstract description 15
- 238000005516 engineering process Methods 0.000 title claims abstract description 13
- 238000012546 transfer Methods 0.000 claims abstract description 74
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 239000002699 waste material Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The present invention relates to electronic component manufacture fields, and in particular to for the processing technology of electronic component, includes the following steps: step 1: preparing a kind of electronic component processing unit (plant)；Step 2: collecting mechanism forward direction drives cutter unit mobile to plate direction is transferred during running；Step 3: wiring board, which is moved to, to be transferred on plate, drives cutter unit to far from the movement of transfer plate direction during collecting mechanism reverse direction operation；Step 4: collecting mechanism drives cutter unit to cut to cutter unit in the moving process of plate direction is transferred to wiring board, and the wiring board after cutting is fallen on conveyer belt；Step 5: collecting mechanism is collected wiring board during inverted running again, and during collecting mechanism positive operation again, remaining waste material is collected after cutting to first piece of wiring board.When using the technical program, wiring board can neatly be cut in the case where conveyer belt does not stop and wiring board and waste material are separated automatically.
Description
Technical field
The present invention relates to electronic component manufacture fields, and in particular to the processing technology for electronic component.
Background technique
Chip components and parts are essential accessory in modern electronic equipment, all electronic equipments, either big machinery
Or PC, communication base station or mobile phone, household electrical appliance or electronic toy can use chip components and parts.
General first procedure of the production of chip components and parts is exactly that chip components and parts raw material are cut into institute according to demand
Then the size needed carries out the subsequent handlings such as drilling or silk-screen.Traditional technology needs when being cut to chip components and parts
It manually holds chip components and parts to be cut, and needs manually to take away the chip components and parts and waste material of well cutting after cutting, this
Sample has certain risk to worker, and the hand that worker is made it possible in reclaiming process is cut, and cutting efficiency also compared with
It is low.It is in the prior art usually that chip components and parts are placed on running transmission to guarantee safety operation and improve efficiency
Carry out automatic cutting is taken, not only ensure that safety in this way, but also improve cutting efficiency.But chip components and parts are transmitting
During carry out that cutting has the following deficiencies: 1, cutting may cause chip components and parts and cut in the case where conveyer belt does not stop
Mouth is irregular, burr phenomena occurs；2, chip components and parts and waste material after cutting can not be automatically separated, and subsequent sub-material is increased
Workload, influence the manufacturing procedure of chip components and parts.
Summary of the invention
The purpose of the present invention is to provide one kind neatly to cut chip components and parts in the case where conveyer belt does not stop
The technique cut and chip components and parts and waste material are separated automatically.
In order to achieve the above objectives, technical solution of the present invention provides the processing technology for being used for electronic component, including walks as follows
It is rapid:
Step 1: preparing a kind of electronic component processing unit (plant), including conveyer belt, transfer plate, collecting mechanism and transfer cutting machine
Structure, the transfer cutting mechanism includes transfer unit and cutter unit；
Step 2: successively placing chip components and parts on a moving belt, collecting mechanism forward direction drives cutting during running
Unit is mobile to plate direction is transferred, and transfer unit is mobile to cutter unit direction；
Step 3: chip components and parts, which are moved to, to be transferred on plate, drives cutter unit during collecting mechanism reverse direction operation
To far from the movement of plate direction is transferred, transfer unit is to far from the movement of cutter unit direction；
Step 4: transfer unit contacts during moving to separate cutter unit direction with chip components and parts, in the machine of collection
Transfer unit drives chip components and parts mobile to cutter unit direction to structure during positive operation again, is collected simultaneously mechanism band
Dynamic cutter unit cuts chip components and parts to cutter unit in the moving process of plate direction is transferred, the chip member device after cutting
Part is fallen on conveyer belt；
Step 5: collecting mechanism is collected chip components and parts during inverted running again, at this time transfer unit with
Second piece of chip components and parts contact；During collecting mechanism positive operation again, second piece of chip components and parts pushes the
Remaining waste material, which is moved in collecting mechanism, after one piece of chip components and parts cutting is collected.
Having the technical effect that for this programme is cooperated by transferring plate and conveyer belt, can turn the chip components and parts on conveyer belt
It moves to and transfers on plate, then cooperate with collecting mechanism and transfer unit, chip components and parts are transferred at cutter unit position, it is real
Now to the neat cutting of chip components and parts, and conveyer belt is in operating status at this time；Chip components and parts after cutting are fallen to
On conveyer belt, the scrap that cutting generates can be shaken off, then fall in collecting mechanism and be collected from conveyer belt；Next
When chip components and parts are cut, the waste material left after the cutting of previous chip components and parts is pushed into conveyer belt automatically
On, then under collecting mechanism cooperation, automatically give waste material to collecting mechanism, automatic point for realizing chip components and parts and waste material
From.
Further, it is uniformly arranged on conveyer belt described in step 1 fluted.Having the technical effect that for this programme ensures piece
Formula component can be sent to from conveyer belt to be transferred on plate, and tilting a period of time on transferring plate, is moved to piece to transfer unit
At formula component, chip components and parts is avoided to topple over too early and push down transfer plate by transfer unit.
Further, collecting mechanism described in step 1 includes push plate.Having the technical effect that for this programme ensures collecting mechanism
It is more stable in mobile process.
Further, transfer unit described in step 1 includes transfer hook, and the free end of the transfer hook is equipped with graphite linings.
This programme has the technical effect that the frictional force for reducing transfer hook free end and chip components and parts lower surface, avoids transfer hook and piece
Push chip components and parts mobile when formula component following table face contact.
Further, transfer plate described in step 1 includes level board and hang plate, and the level board two sides are equipped with baffle.
This programme has the technical effect that baffle can be oriented to chip components and parts, it is ensured that chip components and parts are smoothly transferred to cutting
Immediately below unit.
Detailed description of the invention
Fig. 1 is the schematic diagram before present invention cutting；
Schematic diagram when Fig. 2 is present invention cutting；
Fig. 3 is Fig. 1 right view；
Fig. 4 is the top view for transferring plate；
Fig. 5 is the schematic diagram that rectangular knife enters cutting mouth.
Specific embodiment
Below by the further details of explanation of specific embodiment:
Appended drawing reference in Figure of description includes: conveyer belt 1, level board 2, hang plate 3, groove 4, cutting mouth 5, baffle
6, slideway 7, through slot 8, round roller 9, push plate 10, push rod 11, No.1 spring 12, No.1 collection frame 13, No. two collection frames 14, gear
15, rack gear 16, connecting rod 17, rectangular knife 18, transfer block 19, transfer hook 20, No. two springs 21, bracing wire 22, chip components and parts 23.
For the processing technology of electronic component, specifically comprise the following steps:
Step 1: preparing a kind of electronic component processing unit (plant) as shown in Figure 1, 2, including conveyer belt 1, transfer plate, collection machine
Structure and transfer cutting mechanism.It transfers plate and is fixed on the rack and transfers plate and be located at 1 top of conveyer belt, transferring plate includes level
Plate 2 and hang plate 3, hang plate 3 is obliquely installed and 3 lower end of hang plate is contacted with conveyer belt 1.Conveyer belt 1 is for transmitting chip member
Device 23, and several grooves 4 (Fig. 1,2 in only depict one) is uniformly provided on conveyer belt 1.It is horizontal as shown in Fig. 1,2,4
Cutting mouth 5 is provided on plate 2,2 upper surface of level board is fixed with baffle 6, and 2 lower surface of level board is provided with slideway 7, in addition level board 2
With the through slot 8 being connected to is provided on hang plate 3.
Collecting mechanism is located at 1 right end of conveyer belt, as shown in figure 3, collecting mechanism include servo motor, round roller 9, push plate 10,
Push rod 11, No.1 spring 12, No.1 collection frame 13 and No. two collection frames 14.Servo motor is fixed on the rack, and 9 bias of round roller is set
It is placed on servo motor output shaft.Push rod 11 is slideably positioned in rack, and 11 left end of push rod is fixedly connected with push plate 10, push plate 10
Left side contacted with the roll surface of round roller 9；11 right end of push rod is fixedly connected with No.1 collection frame 13, wherein No.1 collection frame 13 again with
No. two collection frames 14 are fixedly connected.No.1 spring 12 is sheathed on push rod 11, and 12 left end of No.1 spring is fixedly connected with push plate 10,
12 right end of No.1 spring is fixedly connected with rack.
Transfer cutting mechanism includes transfer unit and cutter unit, as shown in Figure 1, 2, 3, cutter unit include gear 15,
Rack gear 16, connecting rod 17 and rectangular knife 18.Gear 15 is fixedly and coaxially connected on servo motor output shaft, the sliding setting of rack gear 16
In in rack, rack gear 16 is engaged with gear 15.As shown in figure 3, connecting rod 17 is L-shaped, on 17 left end of connecting rod and rack gear 16
End is fixedly connected, and 17 right end of connecting rod is fixedly connected with rectangular knife 18, and rectangular knife 18 is located at right above cutting mouth 5.
As shown in Figure 1, 2, transfer unit includes transfer block 19, transfer 20, No. two springs 21 of hook and bracing wire 22.Transfer block 19
It is slideably positioned in slideway 7, transfer hook 20 is fixedly connected with transfer block 19 and transfers hook 20 and is slideably positioned in through slot 8, transfers
Hook 20 can pull to the right chip components and parts 23 after contacting with chip components and parts 23, wherein the end A of transfer hook 20 is fixed with graphite linings.
No. two 21 left ends of spring are fixedly connected with transfer block 19, and No. two 21 right ends of spring are fixedly connected with level board 2.22 upper end of bracing wire with
Transfer block 19 is fixedly connected, and 22 lower end of bracing wire is fixedly connected after passing through the through-hole on level board 2 with 16 lower end of rack gear.
Step 2: when being cut to chip components and parts 23, successively chip components and parts 23 being placed on conveyer belt 1, together
Shi Qidong servo motor, as shown in figure 3, servo motor drives the eccentric rotary clockwise of round roller 9, so that push rod 11 be pushed to slide to the right
It is dynamic, and then No.1 collection frame 13 and No. two collection frames 14 is pushed to move right, No.1 spring 12 is in compressive state at this time；Servo
Motor drives band moving gear 15 while 9 eccentric rotary clockwise of round roller to rotate clockwise, thus moved downward with carry-over bar 16,
And then rectangular knife 18 is driven to move downwardly in cutting mouth 5, bracing wire at this time 22 pulls transfer block 19 to move right, No. two springs 21
In compressive state, as shown in Figure 5；
Step 3: during rectangular knife 18 enters in cutting mouth 5, the chip components and parts 23 on conveyer belt 1 are gradually from biography
Band 1 is sent to be moved on hang plate 3, servo motor rotates counterclockwise at this time, and band moving gear 15 rotates counterclockwise, thus with carry-over bar
16 move upwards, and then rectangular knife 18 is driven to move up, and No. two springs 21 extend at this time, and transfer block 19 is moved to the left；
Step 4: as shown in Figure 1, chip components and parts 23 are from 3 updip of hang plate during transferring block 19 and being moved to the left
Down on level board 2, after transfer hook 20 and 23 following table face contact of chip components and parts, continue to the left under the action of No. two spring 21
It is mobile, it is produced relative sliding with chip components and parts 23, it is final as shown in Figure 1；Then servo motor rotates forward again, such as Fig. 3
Shown, band moving gear 15 rotates clockwise, to move downward with carry-over bar 16, and then rectangular knife 18 is driven to move down；Tooth
During item 16 moves down, as shown in Fig. 2, bracing wire 22 pulls transfer block 19 to move right, to pass through transfer 20 band of hook
Component 23 moving vane type moves right, when chip components and parts 23 are moved at cutting mouth 5, rectangular knife 18 and chip components and parts 23
Contact, during servo motor continues to rotate, rectangular knife 18, which moves down, cuts chip components and parts 23, after cutting
Chip components and parts 23 fallen on conveyer belt 1 from cutting mouth 5；
Step 5: servo motor is rotated counterclockwise again to as shown in figure 3, the chip components and parts 23 on conveyer belt 1 just fall
It drops down onto and is collected in No. two collection frames 14；Transfer block 19 and transfer hook 20 are also moved to position as shown in Figure 1, in servo motor
During another is rotated clockwise, transfer block 19 is driven to move right next piece of chip components and parts 23 by bracing wire 22, this
When No.1 collection frame 13 move right；When next block piece formula component 23 is moved to position as shown in Figure 2, No.1 collection frame 13
It is placed exactly in 1 lower right of conveyer belt, after next piece of chip components and parts 23 are contacted with first piece of chip components and parts 23, pushes first piece
Remaining waste material, which moves right and falls into No.1 collection frame 13, after chip components and parts 23 are cut is collected.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Without departing from the inventive concept of the premise, several modifications and improvements can also be made, these also should be considered as guarantor of the invention
Range is protected, these all will not influence the effect and patent practicability that the present invention is implemented.The present invention omits the technology of description, shape
Shape, construction portion are well-known technique.
Claims (5)
1. being used for the processing technology of electronic component, which comprises the steps of:
Step 1: preparing a kind of electronic component processing unit (plant), including rack, conveyer belt, transfer plate, collecting mechanism and transfer cutting
Mechanism；The transfer plate, which is fixed on the rack and transfers plate, to be located above conveyer belt, the transfers plate include level board with
Hang plate, the hang plate are contacted with conveyer belt；The level board is equipped with cutting mouth, and the lower surface of level board is equipped with and slides
Road；The level board is equipped with the through slot being connected to hang plate；
The collecting mechanism is located at the right end of conveyer belt, including servo motor, round roller, push plate, push rod, No.1 spring, No.1 receipts
Collect frame and No. two collection frames；The servo motor is fixed on the rack, and the round roller eccentric setting is on servo motor output shaft；
The push rod is slideably positioned in rack, and push rod left end is fixedly connected with push plate, and the left side of push plate is contacted with the roll surface of round roller,
Push rod right end is fixedly connected with No.1 collection frame, and wherein No.1 collection frame is fixedly connected with No. two collection frames；The No.1 spring
It is sheathed on push rod and No.1 spring left end is fixedly connected with push plate, No.1 spring right end is fixedly connected with rack；
The transfer cutting mechanism includes transfer unit and cutter unit, the cutter unit include gear, rack gear, connecting rod and
Rectangular knife；The gear is fixedly and coaxially connected on servo motor output shaft, and the rack gear is slideably positioned in rack, and rack gear
Conjunction is gnawed with gear；Described connecting rod one end is fixedly connected with rack gear one end, and the connecting rod other end is fixedly connected with rectangular knife, described
Rectangular knife is located at right above cutting mouth；
The transfer unit includes transfer block, transfer hook, No. two springs and bracing wire；The transfer block is slideably positioned in slideway,
The transfer hook is fixedly connected with transfer block and transfers hook and is slideably positioned in through slot, and transfer hook can be to the right after contacting with wiring board
Pull wiring board；No. two spring one ends are fixedly connected with transfer block, and No. two spring free ends are fixedly connected with level board；Institute
It states bracing wire upper end to be fixedly connected with transfer block, bracing wire lower end passes through level board and is fixedly connected with the rack gear other end；
Step 2: successively by wiring board place on a moving belt, collecting mechanism forward direction run during drive cutter unit to turn
Send plate direction mobile, transfer unit is mobile to cutter unit direction；
Step 3: wiring board, which is moved to, to be transferred on plate, and cutter unit is driven to turn during collecting mechanism reverse direction operation to separate
Send plate direction mobile, transfer unit is to far from the movement of cutter unit direction；
Step 4: transfer unit to far from cutter unit direction it is mobile during contact with wiring board, collecting mechanism again just
Drive wiring board mobile to cutter unit direction to transfer unit during operation, be collected simultaneously mechanism drive cutter unit to
It transfers cutter unit in the moving process of plate direction to cut wiring board, the wiring board after cutting is fallen on conveyer belt；
Step 5: collecting mechanism is collected wiring board during inverted running again, at this time transfer unit and second piece of line
The contact of road plate；During collecting mechanism positive operation again, after second piece of wiring board pushes first piece of wiring board cutting
Remaining waste material, which is moved in collecting mechanism, to be collected.
2. the processing technology according to claim 1 for electronic component, it is characterised in that: conveyer belt described in step 1
On be uniformly arranged it is fluted.
3. the processing technology according to claim 2 for electronic component, it is characterised in that: collect machine described in step 1
Structure includes push plate.
4. the processing technology according to claim 3 for electronic component, it is characterised in that: sheet described in step 1
Member includes transfer hook, and the free end of the transfer hook is equipped with graphite linings.
5. the processing technology according to claim 4 for electronic component, it is characterised in that: transfer plate described in step 1
Including level board and hang plate, the level board two sides are equipped with baffle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810272677.9A CN108541138B (en) | 2018-03-29 | 2018-03-29 | Processing technology for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810272677.9A CN108541138B (en) | 2018-03-29 | 2018-03-29 | Processing technology for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108541138A CN108541138A (en) | 2018-09-14 |
| CN108541138B true CN108541138B (en) | 2019-07-09 |
Family
ID=63482010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810272677.9A Expired - Fee Related CN108541138B (en) | 2018-03-29 | 2018-03-29 | Processing technology for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108541138B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822537A (en) * | 2012-10-29 | 2015-08-05 | 埃萨纳斯特里有限公司 | Apparatus and method for weeding multilayer sheet comprising support liner and at least one adhesive film coupled with liner |
| CN106535479A (en) * | 2016-11-11 | 2017-03-22 | 深圳市得鑫自动化设备有限公司 | Automatic assembly line for sheet punching |
| CN206640879U (en) * | 2017-04-21 | 2017-11-14 | 苏州市度边电子科技有限公司 | A kind of laminating apparatus for stainless steel stiffening plate |
| CN107801311A (en) * | 2017-11-29 | 2018-03-13 | 四川珩必鑫电子科技有限公司 | A kind of wiring board cutter device |
| CN207150963U (en) * | 2017-09-12 | 2018-03-27 | 铜陵华科电子材料有限公司 | Substrate guillotine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101863139B1 (en) * | 2017-10-23 | 2018-05-31 | (주)임펙 엔터프라이즈 | Substrate cutting apparatus of which scrap collector is installed under unloading area |
-
2018
- 2018-03-29 CN CN201810272677.9A patent/CN108541138B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822537A (en) * | 2012-10-29 | 2015-08-05 | 埃萨纳斯特里有限公司 | Apparatus and method for weeding multilayer sheet comprising support liner and at least one adhesive film coupled with liner |
| CN106535479A (en) * | 2016-11-11 | 2017-03-22 | 深圳市得鑫自动化设备有限公司 | Automatic assembly line for sheet punching |
| CN206640879U (en) * | 2017-04-21 | 2017-11-14 | 苏州市度边电子科技有限公司 | A kind of laminating apparatus for stainless steel stiffening plate |
| CN207150963U (en) * | 2017-09-12 | 2018-03-27 | 铜陵华科电子材料有限公司 | Substrate guillotine |
| CN107801311A (en) * | 2017-11-29 | 2018-03-13 | 四川珩必鑫电子科技有限公司 | A kind of wiring board cutter device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108541138A (en) | 2018-09-14 |
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Effective date of registration: 20200730 Address after: 253000 No.152, Wandong village, Zhaohu Town, Decheng District, Dezhou City, Shandong Province Patentee after: Hou Guangchao Address before: 401220 Chongqing Changshou District, Taoyuan, 2 West Road 51, 1-1 Patentee before: CHONGQING TUDOU E-COMMERCE Co.,Ltd. |
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Address after: 241000 12 huolonggang industrial concentration zone, South District, high tech Development Zone, Wuhu City, Anhui Province Patentee after: Hou Guangchao Address before: 253000 No.152, Wandong village, Zhaohu Town, Decheng District, Dezhou City, Shandong Province Patentee before: Hou Guangchao |
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Effective date of registration: 20201210 Address after: 223600 north side of Taoyuan road and east side of Ruisheng Avenue, Shuyang County Development Zone, Suqian City, Jiangsu Province Patentee after: Jiangsu lekun Electronic Technology Co.,Ltd. Address before: 241000 12 huolonggang industrial concentration zone, South District, high tech Development Zone, Wuhu City, Anhui Province Patentee before: Hou Guangchao |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190709 |
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| CF01 | Termination of patent right due to non-payment of annual fee |