CN108535527B - Full PCB installation type closed loop Hall current sensor installation structure - Google Patents
Full PCB installation type closed loop Hall current sensor installation structure Download PDFInfo
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- CN108535527B CN108535527B CN201810568777.6A CN201810568777A CN108535527B CN 108535527 B CN108535527 B CN 108535527B CN 201810568777 A CN201810568777 A CN 201810568777A CN 108535527 B CN108535527 B CN 108535527B
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- 238000009434 installation Methods 0.000 title abstract description 12
- 238000004804 winding Methods 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 9
- 238000004080 punching Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
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- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- General Physics & Mathematics (AREA)
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Abstract
A full PCB installation type closed loop Hall current sensor installation structure relates to the field of Hall current sensor installation structure components. The magnetic core, the framework and the PCB are all arranged on the shell; an air gap is arranged at the tail end accessory of the magnetic core center column; a chip-type packaged Hall element is arranged in the air gap; the framework comprises an inner framework and an outer framework; the Hall element window attached to the PCB is partially inserted into the slot of the inner framework and communicated with the air gap of the magnetic core, and the secondary winding is connected with a circuit on the PCB; the PCB is characterized in that the shell is provided with mounting holes for mounting the inner framework and the outer framework, the shell is provided with pin mounting holes or slots for mounting the primary winding, the shell is provided with slots and fixing pinholes for mounting the fixing magnetic core, and the shell is provided with buckles for mounting the PCB. The invention realizes the purposes of simple structure, convenient installation, higher precision and anti-interference capability and wider application field.
Description
Technical Field
The invention relates to the field of Hall current sensor mounting structure components, in particular to a full PCB mounting type closed-loop Hall current sensor mounting structure.
Background
The current sensor is an electronic component with very wide application, and is widely applied to the automatic control fields of various current converting technologies, alternating current numerical control devices and the like which take current as a control object.
The non-contact measurement and monitoring methods for the current are many, and the hall current sensor is widely applied to form industrialization due to the excellent cost performance; and the full-PCB-mounted closed-loop Hall current sensor is generally used for measuring and monitoring currents below 100A. The Hall current sensor generally has two working modes of open loop and closed loop, the full PCB installation type Hall current sensor of the two modes generally adopts a single air gap and single multilayer punching annular magnetic circuit structure, and the current sensor of the magnetic circuit structure has the following problems:
1. the full PCB mounting type open-loop Hall current sensor has the advantages that the current ampere-turns are small, the primary winding is needed to be wound for a plurality of turns in order to increase the current ampere-turns, namely, a plurality of turns of coils are wound on a single air gap and single multi-layer punching annular magnetic core, and the large-batch winding is time-consuming and labor-consuming due to the small size of the magnetic core; in order to ensure the output amplitude of the sensor, the amplification factor of the circuit is large, and the zero point and the amplitude of the sensor are repeatedly debugged, so that the production efficiency of the open-loop Hall current sensor is too low, and high-efficiency mass production cannot be realized. The magnetic circuit structure of the current sensor determines that the residual magnetism of a magnetic core is too large, so that the measurement accuracy of small current is seriously influenced, the measurement range is 3 times of rated current, the accuracy is preferably 1.5% FS, and the small signal bandwidth can only be 0-50KHZ.
2. In the full-PCB-mounted closed-loop Hall current sensor, the annular magnetic core structure, the primary coil and the secondary coil are respectively wound by using the multi-layer punching sheets to realize batch production, but the leading-out end of the primary coarse coil is not easy to accurately mount and fix, so that the batch production efficiency is affected; the cross section of the multi-layer punching sheet opposite-inserted annular magnetic core is square, and the multi-layer punching sheet opposite-inserted annular magnetic core is provided with a framework, so that the coil has long path, large internal resistance, small linear measurement range of the sensor and poor anti-saturation capability; in order to reduce the internal resistance of the coil, the wire diameter is thickened, the volume and the weight of the sensor are increased, the sensor is not beneficial to miniaturization, more copper materials are consumed, the cost of the sensor is increased, the structure does not fundamentally solve the problem of residual magnetism of a magnetic core, and particularly, a plurality of control systems are provided with a Hall current sensor power supply which is behind the monitored current in time, namely, the monitored current is firstly monitored and then the sensor power supply is added. The problem of remanence of the core is even more pronounced in this case and increases with time, over a measuring range of 2 times the rated current, preferably with a precision of 1.0% fs and a bandwidth of-3 db of 0-100KHZ.
3. Because the primary coil and the secondary coil of the full PCB-mounted closed-loop Hall current sensor are respectively positioned at two sides of the magnetic core, the primary coil and the secondary coil are mounted and fixed on the PCB by pins on the framework after the processing is finished and then are mounted in the shell, the primary coil is wholly sealed by pouring sealant, when the full PCB-mounted closed-loop Hall current sensor works for a long time or at a large current, the heat generated by the coil cannot be discharged, the temperature of the shell of the Hall current sensor is greatly increased, the zero point and the amplitude temperature drift of the Hall current sensor are relatively large, the measuring precision and the environmental resistance of the Hall current sensor are seriously influenced! Also limits the application field and versatility of Hall current sensor-!
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide the full-PCB-mounted closed-loop Hall current sensor mounting structure which is simple in structure, convenient to mount, higher in precision and anti-interference capability and wider in application field.
The invention adopts the following technical scheme:
the full-PCB-mounted closed-loop Hall current sensor mounting structure comprises a shell, a magnetic core, a fixed needle, a framework and a PCB, wherein the magnetic core, the framework and the PCB are all mounted on the shell;
the width of the uppermost central magnetic sheet and the lowest central magnetic sheet of the central column of the magnetic core is smaller than that of the central magnetic sheet of the middle layer, and an air gap is arranged at the tail end accessory of the central column of the magnetic core; a chip-type packaged Hall element is arranged in the air gap; a fixed needle hole is reserved at the center of the opposite insertion part of the magnetic core, and a fixed needle is arranged in the fixed needle hole in a penetrating manner;
the framework comprises an inner framework and an outer framework, a secondary winding is arranged on the inner framework, a primary winding is arranged on the outer framework, the inner framework and the outer framework are in opposite insertion and locking, the inner framework, the outer framework, the primary winding and the secondary winding are positioned on the magnetic core center column, the center parts of the primary winding and the secondary winding are overlapped, and the primary winding is directly exposed in the air;
the magnetic core center column jack for connecting the inner framework is a chamfered magnetic core jack, and the chamfer size of the magnetic core jack corresponds to the angle formed by the upper magnetic sheet and the middle magnetic sheet of the magnetic core center column magnetic sheet; the two end baffles on the inner framework are also provided with chamfers and slots for installing magnetic cores are reserved;
a slot for installing the PCB is formed in a baffle at one end of the inner framework, and the slot is communicated with an air gap on the magnetic core center column; secondary end pin mounting slots are reserved on two sides of the baffle;
an inner framework mounting hole is formed in the outer framework, a chamfer is formed in the inner framework mounting hole, and the chamfer size of the inner framework is matched with that of the baffle plates at the two ends of the inner framework; a convex groove is reserved at the chamfer of the outer framework;
one end of the outer framework is provided with a baffle plate arranged on the shell and a slot for installing the magnetic core; the other end is provided with a buckle which is inversely locked with the inner framework;
after the inner framework and the outer framework are inversely locked, a convex groove is reserved at the chamfer of the outer framework for communicating with the outside air through a secondary winding on the inner framework;
the Hall element window attached to the PCB is partially inserted into the slot of the inner framework and communicated with the air gap of the magnetic core, and the secondary winding is connected with a circuit on the PCB;
the PCB is characterized in that the shell is provided with mounting holes for mounting the inner framework and the outer framework, the shell is provided with pin mounting holes or slots for mounting the primary winding, the shell is provided with slots and fixing pinholes for mounting the fixing magnetic core, and the shell is provided with buckles for mounting the PCB.
Preferably, the magnetic core is formed by oppositely inserting laminated riveting and punching magnetic sheets and is of a central symmetrical magnetic circuit structure.
Preferably, one end of the fixing needle is made into a big head, the size of the big head part of the fixing needle is slightly larger than the size of the magnetic core fixing needle hole on the shell, the fixing needle penetrates through the magnetic core fixing needle hole, and the big head part of the fixing needle is tightly matched with the magnetic core fixing needle hole on the shell.
Preferably, the number of the fixing needles is at least two.
Preferably, the primary winding wound on the outer framework adopts a thick round copper enameled wire for winding or a hollow coil formed by cold punching of a red copper sheet.
Preferably, the number of layers of the magnetic core of the present invention is at least seven.
Preferably, the cover plate is arranged on the shell.
Preferably, the shell of the invention is provided with a slot and a buckle for installing the cover plate.
Preferably, the inner framework, the outer shell and the cover plate are all formed by injection molding of high-temperature resistant plastics.
Compared with the prior art, the invention has the following beneficial effects:
1. the shell is provided with a mounting hole, a primary winding pin mounting hole or slot, a magnetic core mounting and fixing slot and fixing pin hole, a PCB board mounting buckle, and a cover plate mounting slot and buckle when needed, which are corresponding to the inner and outer skeleton sizes; the center of the opposite inserting part of the magnetic core is provided with a fixed needle hole, one end of the fixed needle is made into a big end, the size of the big end part of the fixed needle is slightly larger than that of the magnetic core fixing hole on the shell, the fixed needle penetrates through the magnetic core fixing needle hole, and the big end part of the fixed needle is tightly matched with the magnetic core fixing needle hole on the shell. The whole installation is carried out by taking the shell as the center, welding and screwing are not needed, glue filling is not needed, the installation of the Hall current sensor is completed by using the slot, the buckle and the cooperation of the shell and the components, all the components can be used as standard components or opened or customized and processed in advance, the automatic flow production is realized by using different tools for different components in the assembly of the current sensor, the production efficiency is greatly improved, and the overall dimension and the volume of the current sensor are also greatly reduced!
2. The central symmetry magnetic circuit structure and the single air gap are positioned on the central line of the magnetic core to offset the influence of residual magnetism and electromagnetic interference of the magnetic core, so that the precision and the anti-interference capability of the full PCB-mounted closed-loop current sensor are greatly improved, and the current measurement precision below 100A is within 0.2 percent FS.
3. The magnetic cores which are inserted in a multi-layer way with different punching widths are matched with the chamfered skeletons, so that the coil path is short, the internal resistance is small and the linear measuring range of the sensor is large under the conditions of the same wire diameter and the same number of turns in the secondary winding area; the inner and outer skeletons are respectively wound for times, and the geometric centers of the primary windings are overlapped to form optimal electromagnetic isolation and coupling; the measuring range of the sensor reaches 3 times rated current, the response time is less than 1.0uS, and the bandwidth of-3 db reaches more than 0-100KHZ.
4. The secondary winding on the inner skeleton is communicated with the outside air through a convex groove reserved at the chamfer of the outer skeleton; the primary winding on the outer skeleton is directly exposed in the air, so that the insulation strength is improved, and the insulation voltage reaches more than 5 KV; the temperature rise of the primary winding and the secondary winding generated during working is reduced, the working temperature of the current sensor reaches-40 to 85 ℃, the application field of the full PCB-mounted closed-loop Hall current sensor is expanded!
5. The chip Hall element is installed in the window on the PCB by using the SMD technology, so that the sensitivity center of the Hall element is always positioned on the geometric center position of the air gap of the magnetic core, and the installation consistency is good, thereby ensuring the performance consistency of the sensor.
Drawings
Fig. 1 is a diagram of a central symmetric core field pattern.
Fig. 2 is a diagram of the residual magnetic field profile of a center-symmetrical core.
Fig. 3 is a diagram of a current sensor part of the present invention.
Fig. 4 is a general assembly view of the current sensor product of the present invention.
Detailed Description
The present invention will now be described in detail with reference to the drawings and the specific embodiments thereof, wherein the exemplary embodiments and descriptions of the present invention are provided for illustration of the invention and are not intended to be limiting.
As shown in the figure, the full PCB mounting type closed loop Hall current sensor mounting structure comprises a shell 1, a magnetic core 6, a fixed needle 8, a framework and a PCB 5; the magnetic core 6, the framework and the PCB 5 are all arranged on the shell 1;
the widths of the uppermost central magnetic sheet and the lowermost central magnetic sheet of the central column of the magnetic core 6 are smaller than those of the central magnetic sheet of the middle layer, and an air gap is arranged at the tail end accessory of the central column of the magnetic core 6; a chip-type packaged Hall element is arranged in the air gap; a fixed pinhole is reserved at the center of the opposite inserting part of the magnetic core 6, and a fixed needle 8 is arranged in the fixed pinhole in a penetrating way;
the framework comprises an inner framework 2 and an outer framework 3, a secondary winding is arranged on the inner framework 2, a primary winding 4 is arranged on the outer framework 3, the inner framework 2 and the outer framework 3 are oppositely locked, the inner framework 2, the outer framework 3, the primary winding 4 and the secondary winding are positioned on the magnetic core center post, the center parts of the primary winding 4 and the secondary winding are overlapped, and the primary winding 4 is directly exposed in the air;
the magnetic core center column jack for connecting the inner framework 2 is a chamfered magnetic core jack, and the chamfer size of the magnetic core jack corresponds to the angle formed by the upper magnetic sheet and the middle magnetic sheet of the magnetic core center column magnetic sheet; the two end baffles on the inner framework 2 are also provided with chamfers and slots for installing magnetic cores 6 are reserved;
a slot for installing the PCB 5 is formed in a baffle plate at one end of the inner framework 2, and the slot is communicated with an air gap on the magnetic core center column; secondary end pin mounting slots are reserved on two sides of the baffle;
an inner framework mounting hole is formed in the outer framework 3, a chamfer is formed in the inner framework mounting hole, and the chamfer size of the inner framework mounting hole is matched with that of the baffle plates at the two ends of the inner framework 2; a convex groove is reserved at the chamfer of the outer framework 3;
one end of the outer framework 3 is provided with a baffle plate arranged on the shell 1 and a slot for installing the magnetic core 6; the other end is provided with a buckle which is inversely locked with the inner framework 2;
after the inner framework 2 and the outer framework 3 are inversely locked, a convex groove is reserved at the chamfer of the outer framework 3 through a secondary winding on the inner framework 2 and is communicated with the outside air;
the Hall element window part attached to the PCB 5 is inserted into the slot of the inner framework 2 and communicated with the air gap of the magnetic core 6, and the secondary winding is connected with a circuit on the PCB 5;
the novel PCB is characterized in that the shell 1 is provided with mounting holes for mounting the inner framework 2 and the outer framework 3, the shell 1 is provided with pin mounting holes or slots for mounting the primary winding 4, the shell 1 is provided with slots and fixing pinholes for mounting the fixing magnetic core 6, and the shell 1 is provided with buckles for mounting the PCB 5.
As shown in the figure, the magnetic core 6 of the present invention is formed by oppositely inserting laminated rivet-punched magnetic sheets, and is a central symmetrical magnetic circuit structure.
As shown in the figure, one end of the fixing needle 8 is made into a big head, the size of the big head part of the fixing needle is slightly larger than the size of a magnetic core fixing pinhole on the shell, the fixing needle 8 passes through the magnetic core fixing pinhole, and the big head part of the fixing needle is precisely matched with the magnetic core fixing pinhole on the shell.
As shown, the number of the fixing needles 8 of the present invention is at least two.
As shown in the figure, the primary winding 4 wound on the outer framework 3 adopts a thick round copper enameled wire to wind or adopts a copper sheet to be processed into an air-core coil in a cold punching way.
As shown, the number of layers of the magnetic core 6 of the present invention is at least seven in the singular. The number of layers of the core 6 is 7, 9, 11, etc.
As shown, a cover plate 7 is provided on the housing 1 of the present invention.
As shown, the housing 1 of the present invention is provided with a slot and a buckle for mounting the cover plate 7.
The inner framework 2, the outer framework 3, the shell 1 and the cover plate 7 are all formed by injection molding of high-temperature resistant plastics.
Examples:
the full PCB mounting type closed-loop Hall current sensor mounting structure comprises a shell, a cover plate, a magnetic core, two fixing pins, two frameworks, coil windings and a PCB when needed. The framework, the cover plate, the PCB and the magnetic core are arranged on the shell when needed. The inner skeleton is provided with a secondary winding, the outer skeleton is provided with a primary winding, and the inner skeleton, the outer skeleton and the coil winding are positioned on a magnetic core center column; the magnetic core is formed by oppositely inserting laminated riveting magnetic sheets, the magnetic core is of a central symmetrical magnetic circuit structure, and an air gap is positioned at the tail end close to a central column of the magnetic core; a Hall element is arranged in the air gap, and the Hall element is packaged in a sheet type; the window part of the Hall element attached to the PCB is inserted into the slot of the inner framework and is communicated with the air gap of the magnetic core, and the secondary winding is connected with a circuit on the PCB.
The specific implementation steps are as follows:
1. all parts of the current sensor are processed by a die or in a custom manner;
2. automatically mounting the chip Hall element and other chip electronic components on the PCB jointed board of 5 rows and 5 columns by using an SMD process;
3. processing a secondary winding by an 8-head full-automatic winding machine according to different primary currents and different secondary turns, automatically winding two ends of the secondary winding on pins of an inner framework respectively, soaking tin and planting according to the required pin length;
4. mounting the processed secondary windings and other electronic components with pins on the PCB jointed boards of the soldered chip electronic components one by one, mounting 2-4 PCB jointed boards of 5 rows on an overcurrent frame, automatically soldering by a wave soldering process, and dividing the 5 PCB jointed boards of one row into 5 PCB boards 5;
5. inserting the primary winding 4 into a primary mounting hole on the shell 1, and mounting the primary framework 3 on the shell 1 through the shell 1 and the primary winding 4; inserting a secondary winding on the PCB 5 into the primary framework 3, and pressing the PCB 5 to the bottom by using a tool, so that the PCB 5 is fixed in a buckle on the shell 1;
6. the magnetic core 6 is inserted and installed on the shell 1 through a slot on the shell 1, so that a fixed pinhole on the magnetic core 6 is communicated with a fixed pinhole of the magnetic core of the shell 1, 2 fixed needles 8 are inserted into the fixed pinholes on the shell 1 and the magnetic core 6, and the tool is used for pressing to the bottom;
7. the zero point of the current sensor is well regulated by using laser resistance regulating equipment, after automatic code scanning, testing, recording and judging are qualified by using computer automatic testing equipment, three-proofing paint is painted on a PCB, the PCB is air-dried or dried, a cover plate 7 is inserted into a slot on the shell 1 when necessary, and the cover plate 7 is pressed into a buckle by using a tool;
8. and (5) after the assembled current sensor is laser marked, packaging and warehousing after delivery automatic inspection is qualified.
The foregoing has described in detail the technical solutions provided by the embodiments of the present invention, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present invention, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present invention; meanwhile, as for those skilled in the art, according to the embodiments of the present invention, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present invention.
Claims (7)
1. The full PCB mounting type closed-loop Hall current sensor mounting structure is characterized by comprising a shell (1), a magnetic core (6), a fixing needle (8), a framework and a PCB (5); the magnetic core (6), the framework and the PCB (5) are all arranged on the shell (1);
the widths of the uppermost central magnetic sheet and the lowermost central magnetic sheet of the central column of the magnetic core (6) are smaller than those of the central magnetic sheet of the middle layer, and an air gap is arranged at the tail end accessory of the central column of the magnetic core (6); a chip-type packaged Hall element is arranged in the air gap; a fixed needle hole is reserved at the center of the opposite inserting part of the magnetic core (6), a fixed needle (8) is arranged in the fixed needle hole in a penetrating way, one end of the fixed needle (8) is made into a big head, the size of the big head part of the fixed needle is slightly larger than that of the magnetic core fixed needle hole on the shell, the fixed needle (8) penetrates through the magnetic core fixed needle hole, and the big head part of the fixed needle is tightly matched with the magnetic core fixed needle hole on the shell;
the framework comprises an inner framework (2) and an outer framework (3), a secondary winding is arranged on the inner framework (2), a primary winding (4) is arranged on the outer framework (3), the inner framework (2) and the outer framework (3) are in opposite insertion and locking, the inner framework (2), the outer framework (3), the primary winding (4) and the secondary winding are positioned on the magnetic core center column, the center parts of the primary winding (4) and the secondary winding are overlapped, and the primary winding (4) is directly exposed in the air;
the magnetic core center column jack for connecting the inner framework (2) is a chamfered magnetic core jack, and the chamfer size of the magnetic core jack corresponds to the angle formed by the upper magnetic sheet and the middle magnetic sheet of the magnetic core center column magnetic sheet; the two end baffles on the inner framework (2) are also provided with chamfers and slots for installing magnetic cores (6) are reserved;
a slot for installing the PCB (5) is formed in a baffle at one end of the inner framework (2), and the slot is communicated with an air gap on the magnetic core center column; secondary end pin mounting slots are reserved on two sides of the baffle;
an inner framework mounting hole is formed in the outer framework (3), a chamfer is formed in the inner framework mounting hole, and the chamfer size of the inner framework mounting hole is matched with that of baffle plates at two ends of the inner framework (2); a convex groove is reserved at the chamfer of the outer framework (3);
one end of the outer framework (3) is provided with a baffle plate arranged on the shell (1) and a slot for installing the magnetic core (6); the other end is provided with a buckle which is in opposite locking with the inner framework (2);
after the inner framework (2) and the outer framework (3) are inversely locked, a convex groove is reserved at the chamfer position of the outer framework (3) through a secondary winding on the inner framework (2) and is communicated with the outside air;
the Hall element window part on the PCB (5) is inserted into the slot of the inner framework (2) and is communicated with the air gap of the magnetic core (6), and the secondary winding is connected with a circuit on the PCB (5);
the novel magnetic circuit structure is characterized in that the mounting holes for mounting the inner framework (2) and the outer framework (3) are formed in the outer shell (1), pin mounting holes or slots for mounting the primary winding (4) are formed in the outer shell (1), slots for mounting the fixed magnetic core (6) and fixing pinholes are formed in the outer shell (1), the buckle for mounting the PCB (5) is arranged on the outer shell (1), and the magnetic core (6) is formed by oppositely inserting laminated riveting magnetic sheets into a central symmetry magnetic circuit structure.
2. The full PCB-mounted closed loop type hall current sensor mounting structure according to claim 1, characterized in that the number of the fixing pins (8) is at least two.
3. The mounting structure of the full-PCB-mounted closed-loop hall current sensor according to claim 1, wherein the primary winding (4) wound on the outer skeleton (3) is an air-core coil wound by thick round copper enameled wire or cold-punched by red copper sheet.
4. The full PCB-mounted closed-loop type hall current sensor mounting structure according to claim 1, characterized in that the number of layers of the magnetic core (6) is at least seven layers in a singular number.
5. The full PCB-mounted closed-loop type hall current sensor mounting structure according to claim 1, wherein a cover plate (7) is provided on the housing (1).
6. The mounting structure of the full PCB-mounted closed-loop type hall current sensor according to claim 4, wherein a slot and a buckle for mounting a cover plate (7) are provided on the housing (1).
7. The full-PCB-mounted closed-loop Hall current sensor mounting structure according to claim 1, wherein the inner framework (2), the outer framework (3), the outer shell (1) and the cover plate (7) are all formed by injection molding of high-temperature-resistant plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810568777.6A CN108535527B (en) | 2018-06-05 | 2018-06-05 | Full PCB installation type closed loop Hall current sensor installation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810568777.6A CN108535527B (en) | 2018-06-05 | 2018-06-05 | Full PCB installation type closed loop Hall current sensor installation structure |
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| Publication Number | Publication Date |
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| CN108535527A CN108535527A (en) | 2018-09-14 |
| CN108535527B true CN108535527B (en) | 2023-12-05 |
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| CN109342782B (en) * | 2018-11-27 | 2021-03-16 | 山东航天电子技术研究所 | Hall current sensor framework |
| CN110082581B (en) * | 2019-05-15 | 2021-04-30 | 山东航天电子技术研究所 | Hall current sensor framework |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202256455U (en) * | 2011-10-12 | 2012-05-30 | 长沙南车电气设备有限公司 | Magnetic balanced type Hall current sensor |
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| CN108535527A (en) | 2018-09-14 |
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