CN108519162A - A kind of Non-contact Infrared Temperature Measurement system - Google Patents
A kind of Non-contact Infrared Temperature Measurement system Download PDFInfo
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- CN108519162A CN108519162A CN201810384305.5A CN201810384305A CN108519162A CN 108519162 A CN108519162 A CN 108519162A CN 201810384305 A CN201810384305 A CN 201810384305A CN 108519162 A CN108519162 A CN 108519162A
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 15
- 238000012545 processing Methods 0.000 claims abstract description 46
- 238000004088 simulation Methods 0.000 claims abstract description 21
- 238000012360 testing method Methods 0.000 claims abstract description 8
- 102100029368 Cytochrome P450 2C18 Human genes 0.000 claims description 10
- 101000919360 Homo sapiens Cytochrome P450 2C18 Proteins 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000003321 amplification Effects 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
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- 230000000007 visual effect Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
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- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
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- 230000003245 working effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
Abstract
A kind of Non-contact Infrared Temperature Measurement system, including temperature collecting module, Temperature Treatment module and simulation computer；Temperature collecting module acquires testing equipment temperature, output temperature signal, the temperature signal of Temperature Treatment resume module temperature collecting module output, it is converted to specific temperature value, and it is uploaded to simulation computer, the temperature data that simulation computer real-time reception and displays temperature processing module upload, and Acoustic control alarm is set, it alarms the temperature more than threshold value.Temp measuring system of the present invention has ensured that flight control system Hardware-in-loop Simulation Experimentation safely and smoothly carries out.
Description
Technical field
The present invention relates to a kind of Non-contact Infrared Temperature Measurement systems.Flight control system Hardware-in-loop Simulation Experimentation thermometric system
System technical field
Background technology
Thermometric mode can be divided into contact and contactless, and contact temperature-measuring can only measure testee and temperature transducer
Reach the temperature after thermal balance, so the response time is long, and is easily influenced by environment temperature；And infrared measurement of temperature is according to tested
The infrared energy of object determines the temperature of object, is not contacted with testee, has that temperature resolution is high, response speed
Soon, temperature-measuring range is wide, is not limited by the thermometric upper limit, the features such as stability is good, in recent years home automation, automotive electronics,
It is had been more and more widely used in aviation and military affairs.
The size of object infrared energy and the distribution of wavelength and its surface temperature are in close relations.Therefore, by object
The measurement of body itself infra-red radiation, can accurately determine its surface temperature, and infrared measurement of temperature is exactly to utilize this principle measuring temperature
's.Infrared temperature measurement device is made of the part such as optical system, photodetector, signal amplifier and signal processing and output.Optics
System converges the Target Infrared Radiation energy in its visual field, the size of visual field by temperature measurer optical element and its location determination.
Focus infrared energy is on photodetector and is changed into corresponding electric signal.The signal is by amplifier and signal processing electricity
Road, and according in instrument algorithm and backs correction after be changed into the temperature value of measured target.
SMBus agreements are the standard bus protocols between intelligent component, are developed on I2C bus foundations, are
A kind of bus with I2C bus highly compatibles.SMBus bus specifications define SMBus bus signals, electrical code, transmission lattice
Formula, verification mode, bus operation, address such as split at the contents.Constantly improve with specification and update, SMBus agreements are in intelligence
Instrument and industrial measurement and control field have obtained more and more applications.
Cpci bus has high opening, high reliability, hot-swappable property, is suitable for real time system control, real time data
The modularizations such as acquisition, military system and high-reliability, the application field that can be used for a long time.And CPCI is electrically advised based on PCI
The High performance industrial bus of model exploitation, the PCI of operating system, driving and application program and desktop used in cpci bus system
Bus system is compatible with, therefore builds the Measurement ＆control computer of cpci bus platform, meets each performance requirement, and with firmer, more
Reliably, many advantages, such as modularization, easy use, easy care.
Patent of the present invention is applied in flight control system Semi-Physical Simulation Test System.Currently, existing experiment is set
Standby thermometric mainly uses handheld thermometer, handheld thermometer tight by tester's specialized capability, environmental influence
Weight, cannot monitor testing equipment operating status in real time, and temperature measurement accuracy is relatively low.
Invention content
The technology of the present invention solves the problems, such as：A kind of Non-contact Infrared Temperature Measurement is overcome the deficiencies of the prior art and provide
System, experiment device temperature information in acquisition in real time and transmission control system Hardware-in-loop Simulation Experimentation.
Technical solution of the invention is：
A kind of Non-contact Infrared Temperature Measurement system, including temperature collecting module, Temperature Treatment module and simulation computer；
Temperature collecting module acquires testing equipment temperature, output temperature signal, and Temperature Treatment module connects realization based on cpci bus, handles
The temperature signal of temperature collecting module output, is converted to specific temperature value, and be uploaded to simulation computer, and simulation computer is real
When receive and temperature data that displays temperature processing module uploads, and Acoustic control alarm is set, to the temperature progress more than threshold value
Alarm.
The Temperature Treatment module includes data processing module, bus switching module, CPCI interface modules, functional interface mould
Block, bi-directional drive module and difference block；
The triggering command that simulation computer is sent passes to data processing module, data processing mould by bus switching module
After block receives triggering command, generates data acquisition instructions and be sent to bi-directional drive module, bi-directional drive module adopts data
After collection instruction carries out drive amplification, differential signal is converted to by difference block, then export to temperature by functional interface module
The temperature signal of acquisition module, temperature collecting module acquisition is sent into difference block by functional interface module, and difference block will be defeated
The temperature signal entered is sent into bi-directional drive module after being converted to common-mode signal, and the common-mode signal is carried out electricity by bi-directional drive module
Flat turn is supplied to data processing module after changing, data processing module according to corresponding agreement by the signal after carrying out level conversion into
Row processing, handling result matches cpci bus and final output by bus switching module, to realize temperature data acquisition.
Temperature collecting module is realized using infrared temperature collector.
When data processing module carries out data acquisition and processing (DAP) for temperature sensor, using SMBus agreements.
Data processing module is acquired and is handled using SMBus agreements, and steps are as follows：
(4.1) it after data processing module receives triggering command, is first write on the data bus from address to temperature sensor
00H；
(4.2) temperature sensor write order 07H is given on the data bus；
(4.3) temperature sensor write-read order, temperature sensor to start to transmit temperature data on the data bus；
(4.4) data processing module reads temperature data low byte；
(4.5) data processing module reads temperature data high byte；
(4.6) data processing module reads temperature data error message code；
(4.7) temperature data low byte and high byte are spliced, form temperature value and exported.
Compared with the prior art, the invention has the advantages that：
(1) present invention is by building Non-contact Infrared Temperature Measurement system, acquisition in real time and monitoring flight control system half
Matter emulation pilot system is participated in the experiment device temperature, by the way that Acoustic control alarm is arranged, can be alarmed the temperature more than threshold value, side
Just staff searches the equipment specifically to go wrong.Ensured flight control system Hardware-in-loop Simulation Experimentation safely and smoothly into
Row.
(2) due to using digital transducer and corresponding data processing in the present invention, with interfering, small, precision is high
The characteristics of.
Description of the drawings
Fig. 1 is the principle of the present invention block diagram.
Fig. 2 is Temperature Treatment module outline plate frame size figure of the present invention.
Fig. 3 is Temperature Treatment module principle block diagram.
Specific implementation mode
Specific implementation mode is further illustrated the present invention below in conjunction with the accompanying drawings.
As shown in Figure 1 and Figure 2, a kind of Non-contact Infrared Temperature Measurement system proposed by the present invention, including temperature collecting module,
Temperature Treatment module and simulation computer；Temperature collecting module acquires testing equipment temperature, output temperature signal, Temperature Treatment
The temperature signal of resume module temperature collecting module output, is converted to specific temperature value, and be uploaded to simulation computer, emulates
The temperature data that computer real-time reception and displays temperature processing module upload, and Acoustic control alarm is set, to more than threshold value
Temperature is alarmed；
As shown in figure 3, Temperature Treatment module include data processing module (FPGA), bus switching module (9030 bridge piece),
CPCI interface modules (J1), functional interface module (J2), bi-directional drive module and difference block；
The triggering command that simulation computer is sent passes to data processing module, data processing mould by bus switching module
After block receives triggering command, generates data acquisition instructions and be sent to bi-directional drive module, bi-directional drive module adopts data
After collection instruction carries out drive amplification, differential signal is converted to by difference block, then export to temperature by functional interface module
The temperature signal of acquisition module, temperature collecting module acquisition is sent into difference block by functional interface module, and difference block will be defeated
The temperature signal entered is sent into bi-directional drive module after being converted to common-mode signal, and the common-mode signal is carried out electricity by bi-directional drive module
Flat turn is supplied to data processing module after changing, data processing module according to corresponding agreement by the signal after carrying out level conversion into
Row processing, handling result matches cpci bus and final output by bus switching module, to realize temperature data acquisition.
Temperature collecting module is realized using infrared temperature collector in the present invention.Data processing module is directed to temperature sensor
When carrying out data acquisition and processing (DAP), using SMBus agreements, steps are as follows：
(a) it after data processing module receives triggering command, is first write on the data bus from address to temperature sensor
00H；
(b) temperature sensor write order 07H is given on the data bus；
(c) temperature sensor write-read order, temperature sensor to start to transmit temperature data on the data bus；
(d) data processing module reads temperature data low byte；
(e) data processing module reads temperature data high byte；
(f) data processing module reads temperature data error message code；
(g) temperature data low byte and high byte are spliced, form temperature value and exported.
A byte has been sent every time, has been judged as whether other side has response, if there is response just then sends next word
Section；The byte is repeatedly retransmitted if do not replied, until there is response, just then sends next byte, if after repeatedly retransmitting,
Still terminate without response.When receiving data, receiving a byte every time, (step-by-step receives, and it is exactly a word to receive 8 positions
Section), after sending an answer signal to other side, so that it may to continue to next byte.
In embodiment provided by the invention, temperature collecting module is based on Melexis companies MLX90614 series modules, peace
Near testing equipment, testing equipment temperature is acquired.MLX90614 series modules are one group of general infrared measurement of temperature modules.
MLX90614 series modules have been verified and have been linearized before manufacture, have that non-contact, small, precision is high, at low cost etc. excellent
Point.Measured target temperature and environment temperature can be exported by single channel, and have SMBus agreement output interfaces.
Temperature Treatment module, can be according to based on the temperature data acquisition board of the CPCI frameworks based on SMBus agreements
SMBus agreements are connect with MLX90614 series modules, the temperature signal of acquisition in real time and the output for the treatment of temperature acquisition module, conversion
At specific temperature value, and it is uploaded to simulation computer.
Temperature data acquisition board cpci bus Interface design is based on CPCI specifications, using the modular design based on bridge piece
Method：Bridge piece+local function peripheral hardware.Bridge piece special disposal bus interface is translated into the bus timing of PCI complexity relatively easy
Local bus sequential, local function circuit using bridge piece local bus realize SMBus buses be in communication with each other with cpci bus
Purpose.
The effect of simulation computer is real-time reception and the temperature data that displays temperature processing module uploads, and acoustic control is arranged
Alarm can alarm to the temperature more than threshold value.
Simulation computer communicates computing platform using the 9U high-performance high reliabilities based on CPCI/PXI hybrid structures, uses
Real-time emulation system based on Windows+RTX, i.e., the mode of embedded RTX real time operating systems is realized in real time in Windows
Emulation.Operating system is Windows XP, and real time environment selects the RTX real-time extension modules of Ardence companies to realize.
Fig. 2 is patent Temperature Treatment module outline plate frame size figure of the present invention.Build bus interface processing circuit+
The overall architecture of SMBus functional circuits.The research and development of whole system are based on cpci bus, and module PCI Bridge realizes that acquisition calculates
The data interaction of machine and FPGA；FPGA is responsible for the realization of SMBus agreements, the storage of data.The encapsulating structure of CPCI plates is based on IEC
The European board shape that 60297-3, IEC 60297-4 and IEEE 1101.10 are defined.Define 6U sizes (233.35mm*
160mm)。
Simulation computer is the 9U high-performance high reliabilities communication computing platform based on CPCI/PXI hybrid structures, and equipment is abided by
PICMG2.0R3.0 technical specifications are followed, using 19 " European type machine case knot of IEEE 1101.1/10/11 and IEC-60297-1/2 standards
Structure provides the CPCI/PXI systems of 2 groups of autonomous workings to meet high performance application requirement by two pieces of backboards.Collect with height
At, easily extension the features such as.
The content that description in the present invention is not described in detail belongs to the known technology of those skilled in the art.
Claims (5)
1. a kind of Non-contact Infrared Temperature Measurement system, it is characterised in that including temperature collecting module, Temperature Treatment module and imitate
Genuine computer；Temperature collecting module acquires testing equipment temperature, output temperature signal, and Temperature Treatment module is connect based on cpci bus
It realizes, the temperature signal for the treatment of temperature acquisition module output is converted to specific temperature value, and be uploaded to simulation computer, imitates
The temperature data that genuine computer real-time reception and displays temperature processing module upload, and Acoustic control alarm is set, to being more than threshold value
Temperature alarm.
2. a kind of Non-contact Infrared Temperature Measurement system according to claim 1, it is characterised in that：The Temperature Treatment module
Including data processing module, bus switching module, CPCI interface modules, functional interface module, bi-directional drive module and differential mode
Block；
The triggering command that simulation computer is sent passes to data processing module by bus switching module, and data processing module connects
It after receiving triggering command, generates data acquisition instructions and is sent to bi-directional drive module, bi-directional drive module refers to data acquisition
It enables after carrying out drive amplification, differential signal is converted to by difference block, then export to temperature acquisition by functional interface module
The temperature signal of module, temperature collecting module acquisition is sent into difference block by functional interface module, and difference block is by input
Temperature signal is sent into bi-directional drive module after being converted to common-mode signal, and bi-directional drive module turns the common-mode signal into line level
It is supplied to data processing module, data processing module will be at the signal after carrying out level conversion according to corresponding agreement after changing
Reason, handling result matches cpci bus and final output by bus switching module, to realize temperature data acquisition.
3. a kind of Non-contact Infrared Temperature Measurement system according to claim 1, it is characterised in that：Temperature collecting module uses
Infrared temperature collector is realized.
4. a kind of Non-contact Infrared Temperature Measurement system according to claim 2, it is characterised in that：Data processing module is directed to
When temperature sensor carries out data acquisition and processing (DAP), using SMBus agreements.
5. a kind of Non-contact Infrared Temperature Measurement system according to claim 4, it is characterised in that：Data processing module uses
SMBus agreements are acquired and handle, and steps are as follows：
(4.1) it after data processing module receives triggering command, is first write on the data bus from address 00H to temperature sensor；
(4.2) temperature sensor write order 07H is given on the data bus；
(4.3) temperature sensor write-read order, temperature sensor to start to transmit temperature data on the data bus；
(4.4) data processing module reads temperature data low byte；
(4.5) data processing module reads temperature data high byte；
(4.6) data processing module reads temperature data error message code；
(4.7) temperature data low byte and high byte are spliced, form temperature value and exported.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111272295A (en) * | 2020-03-02 | 2020-06-12 | 浙江杭可科技股份有限公司 | Non-contact infrared temperature measurement system and test method based on square battery |
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Application publication date: 20180911 |