CN108512603B - Transmitting end of multi-path coherent optical communication device and multi-path coherent optical communication device - Google Patents
Transmitting end of multi-path coherent optical communication device and multi-path coherent optical communication device Download PDFInfo
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- CN108512603B CN108512603B CN201710107413.3A CN201710107413A CN108512603B CN 108512603 B CN108512603 B CN 108512603B CN 201710107413 A CN201710107413 A CN 201710107413A CN 108512603 B CN108512603 B CN 108512603B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/516—Details of coding or modulation
Abstract
The application provides multichannel coherent light communication device's transmitting terminal and multichannel coherent light communication device, this transmitting terminal includes: the optical digital signal processing device comprises a substrate, a multi-channel optical digital signal processor arranged on the substrate and a multi-channel modulator module arranged on the substrate; the packaging layer is used for packaging the multipath optical digital signal processor and the multipath modulator module on the substrate; the multi-channel modulator module comprises modulators which are correspondingly connected with each channel of the multi-channel optical digital signal processor one by one. In the above technical solution, by using the transmitting end in the multi-path coherent optical communication device as an integral device, compared with a device formed by one transmitting end and one transmitting end adopted in the prior art, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, thereby improving the transmission capability of the single board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
Description
Technical Field
The present application relates to the field of information technology, and in particular, to a transmitting end of a multi-path coherent optical communication device and a multi-path coherent optical communication device.
Background
With the increase of network system traffic, the communication system needs to increase the transmission capacity of the system under the condition of unchanged rack volume, thereby realizing high-density transmission. By reducing the size of the module, the data rate per unit volume can be improved by adopting the light forming modules such as a molded CFP (C form-factor pluggable, 100G-type pluggable), CFP2, CFP4 and the like. For the line side optical module, a module using a coherent technology can support a long transmission distance because a DSP (digital signal processing) algorithm chip is used to compensate dispersion, and a data rate corresponding to the coherent module is generally 100 gbits per second at present.
The existing line side line card can support a plurality of optical modules, and the number of supports is closely related to the module form. With the introduction of CFP modules, a single line card can basically implement data services supporting 4 CFP optical modules and supply power to the CFP optical modules. Most of the existing coherent optical modules adopt a single-path technology, that is, the modules only have one wavelength to modulate coherent signals. The transmitting end of the module is generally composed of these parts: the transmitting end modulator and the radio frequency amplifier are both one. Meanwhile, the processing of the signals of the transmitting terminal and the transmitting terminal is simultaneously realized corresponding to the Odsp chip.
However, in the above scheme, in order to meet the requirement of the future T bit rate of a single line card, a plurality of modules may be placed on a single line card, and if the data rate of each module is 100 gbits, 10 modules can meet the requirement of a single board Tbit. Because each coherent optical module (DCO, Digital coherent optics) needs to use a DSP chip, compared with an incoherent client-side module, the overall power consumption of the module is increased, and thus, when the number of modules is increased, the heat dissipation capability of the board is difficult to meet the demand. Meanwhile, the power consumption cost of the machine room is also an important component of the operation cost of the operator, so that the cost of the operator is further increased. Meanwhile, most of the existing coherent modules adopt a single-channel optical device and an electric device, and the device and the DSP chip are not jointly packaged, so that the small size and low power consumption of multiple channels are difficult to realize.
Disclosure of Invention
The application provides a multichannel coherent light communication device's transmitting terminal and multichannel coherent light communication device, reduces multichannel coherent light communication device's energy consumption, the miniaturized development of multichannel coherent light communication device of being convenient for simultaneously.
In a first aspect, the present application provides a transmitting end of a multi-path coherent optical communication device, the transmitting end comprising: the optical digital signal processing device comprises a substrate, a multi-channel optical digital signal processor arranged on the substrate and a multi-channel modulator module arranged on the substrate; the packaging layer is used for packaging the multipath optical digital signal processor and the multipath modulator module on the substrate; wherein the content of the first and second substances,
the multi-channel modulator module comprises modulators which are correspondingly connected with each channel of the multi-channel optical digital signal processor one by one.
In the above technical solution, by using the transmitting end in the multi-path coherent optical communication device as an integral device, compared with a device formed by one transmitting end and one transmitting end adopted in the prior art, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, thereby improving the transmission capability of the single board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
In a specific embodiment, the optical fiber driver further includes a plurality of rf drivers disposed on the substrate and located between the plurality of optical digital signal processors and the plurality of modulator modules, the plurality of rf drivers include a plurality of rf drivers, the plurality of rf drivers correspond to the plurality of modulators and the plurality of channels of the plurality of optical digital signal processors one to one, and two ends of each rf driver are electrically connected to the corresponding channel of the plurality of optical digital signal processors and the corresponding modulator.
In a specific scheme, the modulators connected with each channel of the multi-channel optical digital signal processor in a one-to-one correspondence mode are arranged in a single row, and the plurality of radio frequency drivers are arranged in a single row. The device is convenient to set, and the space occupied by the transmitting terminal is reduced.
In a specific scheme, the multi-channel radio frequency driver module and the multi-channel modulator module are packaged into a device. The two devices are packaged into one device, so that the connecting line of the transmitting terminal during mounting of the device is reduced, and the space occupied by the transmitting terminal is reduced.
In a specific scheme, the optical amplifier module further comprises a plurality of optical amplifier modules arranged on the substrate, wherein each optical amplifier module comprises optical amplifiers connected with each modulator in a one-to-one correspondence manner.
In a specific scheme, the multichannel optical amplifier module and the multichannel modulator module are packaged into an integral device; and when the multi-channel radio frequency driver module is included, the multi-channel radio frequency driver module, the multi-channel optical amplifier module and the multi-channel modulator module are packaged into an integral device. A plurality of devices are packaged into one device, so that the connecting line of the transmitting terminal during mounting of the device is reduced, and the space occupied by the transmitting terminal is reduced.
In one embodiment, the plurality of optical amplifiers are arranged in a single row. The device is convenient to set, and the space occupied by the transmitting terminal is reduced.
In a specific embodiment, the multiple optical digital signal processors, the multiple modulator modules, and the multiple optical amplifier modules are disposed on the same side of the substrate; and when the multi-channel radio frequency driver module is included, the multi-channel optical digital signal processor, the multi-channel radio frequency driver module, the multi-channel modulator module and the multi-channel optical amplifier module are arranged on the same side of the substrate. The device is convenient to set, and the space occupied by the transmitting terminal is reduced.
In a specific embodiment, the substrate is a silicon substrate or a ceramic substrate. Good support can be provided.
In a second aspect, a multi-path coherent optical communication device is provided, which includes any one of the transmitting terminals described above.
In the above technical solution, by using the transmitting end in the multi-path coherent optical communication device as an integral device, compared with a device formed by one transmitting end and one transmitting end adopted in the prior art, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, thereby improving the transmission capability of the single board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
Drawings
Fig. 1 is a block diagram of a transmitting end of a multi-path coherent optical communication device according to embodiment 1 of the present application;
fig. 2 is a side view of a transmitting end of a multi-path coherent optical communication device provided in embodiment 1 of the present application;
fig. 3 is a block diagram of a transmitting end of a multi-path coherent optical communication device according to embodiment 2 of the present application;
fig. 4 is a side view of a transmitting end of a multi-path coherent optical communication device provided in embodiment 2 of the present application;
fig. 5 is a block diagram of a transmitting end of a multi-path coherent optical communication device according to embodiment 2 of the present application;
fig. 6 is a block diagram of a transmitting end of another multi-path coherent optical communication device provided in embodiment 3 of the present application;
fig. 7 is a block diagram of a transmitting end of a multi-path coherent optical communication device according to embodiment 3 of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
In order to simplify the structure of the multi-path coherent optical communication device, the emission end of the multi-path coherent optical communication device is independently made into a device, and when the device is specifically arranged, the emission end of the multi-path coherent optical communication device comprises a substrate which is used as a bearing part for bearing various electric devices and optical devices of the emission end. In a specific configuration, the substrate may be made of different materials, and specifically, the substrate is a silicon substrate or a ceramic substrate, and both the silicon substrate and the ceramic substrate have good supporting hardness and supporting strength.
In the specific arrangement, different electric devices and optical devices are arranged on the substrate, specifically, the electric devices at least comprise an optical digital processor, and the optical devices at least comprise a modulator module. The optical digital processor is a multi-channel optical digital processor, the corresponding modulator module is a multi-channel modulator module, the multi-channel modulator module includes a plurality of modulators, in a specific embodiment, the modulator may be a Dual-polarization Mach-Zehnder modulator (DP-IQ-MZM), and the modulator may be a silicon photonic or indium phosphide modulator. In specific setting, each modulator is a channel of a multi-channel modulator module, and a plurality of modulators are arranged in a single row and packaged into an integral device.
When the multiple digital signal processors are electrically connected with the multi-channel modulator module, one modulator is correspondingly and electrically connected with one channel in the multiple optical digital signal processors, and when the modulators are specifically connected, each modulator is electrically connected with the channel of the corresponding multiple optical digital signal processor through a cable. When the device is specifically arranged, the multichannel optical digital signal processor and the multichannel modulator module are arranged on the same surface of the substrate, and the multichannel optical digital signal processor and the multichannel modulator module are respectively fixed on the substrate.
In addition, in order to ensure the stability and the safety of the whole transmitting terminal, the transmitting terminal also comprises an encapsulating layer, wherein the encapsulating layer is used for encapsulating the multipath optical digital signal processor and the multipath modulator module on the substrate.
In specific use, the electrical signal respectively corresponds dual-polarization XI (X inphase component of X channel), XQ (X qudarure, X channel quadrature component), YI (Y inphase component of Y channel) and YQ (Y qudarure, X channel quadrature component) signals to the dual-polarization mach-zehnder modulator through Q-DAC (Quatemary-DAC multi-channel digital-to-analog conversion) in the multi-channel optical signal processor, and the electrical signal is modulated onto an optical carrier wave through the photoelectric effect. As can be seen from the above description, in the above embodiments, by using the transmitting end in the multi-path coherent optical communication apparatus as an integral device, compared with a device formed by one transmitting end and one transmitting end in the prior art, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, so as to improve the transmission capability of the board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
To facilitate understanding of the transmitting end provided in the present embodiment, the following detailed description is made in conjunction with specific drawings and embodiments.
Example 1
As shown in fig. 1 and fig. 2, in the present embodiment, for convenience of description, the multi-channel optical digital signal processor employs a four-channel optical digital signal processor 20, and the four-channel optical digital signal processor 20 includes four digital-to-analog converters 21. The corresponding multiplexer module 30 comprises four modulators 31.
In a specific configuration, as shown in fig. 1, the four-channel optical digital signal processor 20 provided in this embodiment is disposed on the substrate 10 by ball bonding, and the four digital-to-analog converters 21 are disposed on the same side of the four-channel optical digital signal processor 20, that is, the four output ports of the four-channel optical digital signal processor 20 are located on the same side of the four-channel optical digital signal processor 20. A multiplexer module 30 consisting of four modulators 31 is disposed on the substrate 10 and on one side of the output port of the four-channel optical digital signal processor 20. When the four-channel optical digital signal processor 20 and the multiplexer module 30 are disposed on the same side of the substrate 10, during specific connection, one digital-to-analog converter 21 of the four-channel optical digital signal processor 20 is electrically connected to one modulator 31 by ball grid array packaging or wire bonding.
As can be seen from the above description, in the above embodiments, by using the transmitting end in the multi-path coherent optical communication apparatus as an integral device, compared with a device formed by one transmitting end and one transmitting end in the prior art, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, so as to improve the transmission capability of the board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
Example 2
As shown in fig. 3 and 4, in the present embodiment, for convenience of description, the multi-channel optical digital signal processor employs a four-channel optical digital signal processor 20, and the four-channel optical digital signal processor 20 includes four digital-to-analog converters 21. The corresponding multiplexer module 30 comprises four modulators 31. In this embodiment, compared with embodiment 1 shown in fig. 1, the transmitting end further includes a multi-channel rf driver module 40 in addition to the structure and arrangement of embodiment 1.
In a specific arrangement, the multiple rf Driver module 40 is disposed on the substrate 10 and located between the four-channel optical digital signal processor 20 and the multiple modulator module 30, and in the specific arrangement, the multiple rf Driver module 40 includes rf drivers 41 (drivers) corresponding to each modulator 31 and multiple channels of the multiple optical digital signal processor one to one, in the specific connection, an input end of each rf Driver 41 is electrically connected to a channel (i.e., one digital-to-analog converter 21) of the multiple optical digital signal processor, and an output end of each rf Driver is electrically connected to one modulator 31, in a specific embodiment, the multiple rf drivers 41 are disposed in a single row arrangement, and the multiple rf drivers 41 are integrally packaged into a device to be used as the multiple rf Driver module 40.
In the embodiment, when the four-channel optical digital signal processor 20 is adopted, the multi-channel rf driver module 40 also includes four rf drivers 41. In the specific arrangement, as shown in fig. 3, the four-channel optical digital signal processor 20, the multi-channel rf driver module 40, and the multi-channel modulator module 30 are disposed on the same side of the substrate 10, and the three components are respectively and fixedly connected to the substrate 10 by ball bonding. The multi-channel rf driver module 40 is disposed between the multi-channel optical digital signal processor and the multi-channel modulator module 30, and an input end of each rf driver 41 is connected to one of the digital-to-analog converters 21 through a cable, and an output end thereof is connected to one of the modulators 31 through a cable.
In specific use, the electrical signal is amplified by Q-DAC (Quatemary-DAC 4 channel digital-to-analog conversion 21) through dual-polarized XI, XQ, YI and XQ signals by four-channel rf drivers 41, the output of each rf driver 41 corresponds to one modulator 31 (dual-polarized mach-zehnder modulator), and the electrical signal is modulated onto an optical carrier wave through the photoelectric effect.
As can be seen from the above description, in this embodiment, the modulator 31, the rf driver 41 and the corresponding optical dsp 20 are respectively packaged to form separate modules, and then jointly packaged to form the transmitting end, specifically, the multiplexer 31 and the multi-channel rf driver module 40 are both packaged in a solder ball array or a grid array, and then jointly packaged with the multi-channel optical signal processor 20, which can greatly reduce the volume of the module itself when obtaining the same bit rate compared with the case where one transmitting end and one transmitting end used in the prior art form one device, thereby improving the transmission capability of the single board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
As a preferred technical solution, as shown in fig. 5, in this embodiment, the multi-channel rf driver module 40 and the multi-channel modulator module 30 may be packaged as an integrated device. In specific setting, the rf driver 41 in the multi-channel rf driver module 40 and the multi-channel modulator module 30 and the corresponding modulator 31 are connected and then packaged as a whole, so that the two modules are packaged into an integral structure. Therefore, the connecting line of the transmitting terminal during the installation of the device is reduced, and the space occupied by the transmitting terminal is reduced.
Example 3
As shown in fig. 6 and 7, in the present embodiment, for convenience of description, the multi-channel optical digital signal processor employs a four-channel optical digital signal processor 20, and the four-channel optical digital signal processor 20 includes four digital-to-analog converters 21. The corresponding multiplexer module 30 comprises four modulators 31. In this embodiment, compared with embodiment 2 shown in fig. 3 and fig. 6, the transmitting end further includes a multi-channel optical amplifier module 50 in addition to the structure and arrangement of embodiment 2. Or a multi-path optical amplifier module 50 is added to the structure of the transmitting end in embodiment 1 as shown in fig. 1.
In a specific arrangement, the multi-channel optical amplifier module 50 includes a plurality of optical amplifiers 51, and in a specific arrangement, the plurality of optical amplifiers 51 are arranged in a single row. And one optical amplifier is connected to one modulator 31 in a one-to-one correspondence, or the multi-path optical amplifier module 50 includes one optical amplifier 51, and the output ends of the plurality of modulators 31 are connected to one optical amplifier 51.
In the embodiment, when the four-channel optical digital signal processor 20 is adopted, the multi-channel optical amplifier module 50 also includes four optical amplifiers 51. When the device is specifically arranged, as shown in fig. 6 and 7, the four-channel optical digital signal processor 20, the multi-channel rf driver module 40, the multi-channel modulator module 30, and the multi-channel optical amplifier module 50 are arranged on the same side of the substrate 10, and the four components are respectively and fixedly connected to the substrate 10 by ball bonding, in addition, the devices in the present application may be arranged in a side-by-side manner as shown in fig. 6, or may be arranged in a stacked manner, and the specific arrangement manner may be arranged according to an actual installation space of the transmitting end. The multi-channel rf driver module 40 is disposed between the multi-channel optical digital signal processor and the multi-channel modulator module 30, and the multi-channel optical amplifier module 50 is disposed at the output end of the multi-channel modulator 31.
In a specific scheme, as shown in fig. 6, when the transmitting end includes a four-channel optical digital signal processor 20, a multi-channel rf driver module 40, a multi-channel modulator module 30, and a multi-channel optical amplifier module 50, the multi-channel rf driver module 40, the multi-channel optical amplifier module 50, and the multi-channel modulator module 30 are packaged into an integrated device. Alternatively, as shown in fig. 7, the multiple optical amplifier module 50 and the multiple modulator module 30 are packaged as an integral device, and the multiple rf driver module 40 is separately configured as a module. When the transmitting end does not comprise a multi-channel radio frequency driver module, the multi-channel optical amplifier module 50 and the multi-channel modulator module 30 are packaged into an integral device. No matter which mode is adopted, the connecting line of the transmitting terminal when the device is installed can be reduced, and meanwhile, the space occupied by the transmitting terminal is reduced.
In particular use, since the actual total insertion loss (equal to the sum of the dc insertion loss and the modulation insertion loss) of the modulator 31 is different, a scene of optical signal amplification may be required. Therefore, the signal amplification is realized by the optical amplifier 51 (simply referred to as optical amplifier), and the optical amplifier 51 may be formed directly on the substrate 10 or may be realized in a module. And when the optical amplifier 51 is specifically adopted, each modulator 31 may be connected with one optical amplifier 51, that is, multiple paths of signals are respectively amplified and then combined, so that sufficient optical power of each path of output optical signal is ensured, or a plurality of modulators 31 may be connected with one optical amplifier 51, that is, a plurality of wavelength signals pass through an optical combiner and then are amplified, so that the number of the optical amplifiers 51 is saved, but four paths of signals cannot be independently output.
As can be seen from the above description, in this embodiment, the modulator 31, the rf driver 41 and the corresponding four-channel optical digital signal processor 20 are respectively packaged to form separate modules, and then jointly packaged to form the transmitting end, that is, the multiplexer 31 and the multi-channel rf driver module 40 are both subjected to solder ball array packaging or grid array packaging, and then jointly packaged with the multi-channel optical signal processor 20, compared with the case where one transmitting end and one transmitting end used in the prior art form one device, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, thereby improving the transmission capability of the single board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
As can be seen from the specific arrangements of the above embodiments 1, 2 and 3, the transmitting terminal provided in the present application performs hybrid packaging on the multipath optical digital processor 20, the modulator 31, the rf driver 41, and the like. Under the condition of processing the same bit rate, the volume of the module can be greatly reduced, so that the transmission capability of the single board is improved; the transmitting end is independently packaged, and compared with a mixed package of transmitting and receiving, the optical crosstalk and the radio frequency crosstalk between the receiving ends are reduced; in addition, the power consumption of the multi-path optical digital processor 20 and the radio frequency driver 41 is high, and the multi-path optical digital processor 20 and the radio frequency driver 41 at the transmitting end adopt a separate packaging scheme in the application, so that the packaging of two high-power-consumption devices is avoided, the excessive high power consumption of the packaging can be avoided, and the heat dissipation and reliability of the packaging are facilitated; in addition, the multi-channel integrated design is adopted, functions such as a clock, a power supply and the like can be repeatedly utilized, and compared with a solution scheme of a plurality of modules, the power consumption can be reduced; in addition, compared with the independent packaging of each device, the combined packaging of a plurality of devices reduces the bandwidth reduction and amplitude attenuation of electric signals caused by a multi-time packaging structure, thereby improving the bandwidth and performance of the system; in addition, because the device packaging and the like account for a large part of the device price, the cost can be shared through a multi-channel packaging structure, so that the cost of each channel of the multi-channel device is far lower than that of a single-channel device, and the overall cost of the optical module can be reduced.
In another aspect, the present application further provides a multi-path coherent optical communication device, which includes the transmitting end described in any one of the above.
In the above technical solution, by using the transmitting end in the multi-path coherent optical communication device as an integral device, compared with a device formed by one transmitting end and one transmitting end adopted in the prior art, the size of the module itself can be greatly reduced under the condition of obtaining the same bit rate, thereby improving the transmission capability of the single board; and the transmitting terminals are separately packaged, so that optical crosstalk and radio frequency crosstalk between the transmitting terminals are reduced compared with a mixed package of transmitting and receiving.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A transmitting end of a multi-path coherent optical communication device, comprising: the optical digital signal processing device comprises a substrate, a multi-channel optical digital signal processor arranged on the substrate and a multi-channel modulator module arranged on the substrate;
the multi-channel radio frequency driver module is arranged on the substrate and positioned between the multi-channel optical digital signal processor and the multi-channel modulator module; the packaging layer is used for packaging the multi-path optical digital signal processor, the multi-path radio frequency driver module and the multi-path modulator module on the substrate; wherein the content of the first and second substances,
the multi-channel modulator module comprises modulators which are correspondingly connected with each channel of the multi-channel optical digital signal processor one by one.
2. The transmitter of claim 1, wherein the multi-channel rf driver module comprises a plurality of rf drivers, the plurality of rf drivers are in one-to-one correspondence with a plurality of modulators and the multi-channel optical dsp, and two ends of each rf driver are electrically connected to the corresponding channel and modulator of the multi-channel optical dsp.
3. The transmitting end of the multi-channel coherent optical communication device according to claim 2, wherein the modulators connected to each channel of the multi-channel optical digital signal processor in a one-to-one correspondence are arranged in a single row, and the plurality of rf drivers are arranged in a single row.
4. The transmit end of the multi-channel coherent optical communication device according to claim 2, wherein the multi-channel rf driver module and the multi-channel modulator module are packaged as an integrated device.
5. The transmitting end of the multi-path coherent optical communication device according to any one of claims 1 to 4, further comprising a multi-path optical amplifier module disposed on the substrate, wherein the multi-path optical amplifier module comprises optical amplifiers connected in a one-to-one correspondence with each modulator.
6. The transmitting end of the multi-path coherent optical communication device according to claim 5, wherein the multi-path optical amplifier module and the multi-path modulator module are packaged as an integrated device; and when the multi-channel radio frequency driver module is included, the multi-channel radio frequency driver module, the multi-channel optical amplifier module and the multi-channel modulator module are packaged into an integral device.
7. The transmitting end of the multi-path coherent optical communication device according to claim 5, wherein the plurality of optical amplifiers are arranged in a single row.
8. The transmitter of claim 5, wherein the multi-channel optical digital signal processor, the multi-channel modulator module and the multi-channel optical amplifier module are disposed on a same side of the substrate; and when the multi-channel radio frequency driver module is included, the multi-channel optical digital signal processor, the multi-channel radio frequency driver module, the multi-channel modulator module and the multi-channel optical amplifier module are arranged on the same side of the substrate.
9. The transmitter of claim 5, wherein the substrate is a silicon substrate or a ceramic substrate.
10. A multi-path coherent optical communication device comprising the transmitting end according to any one of claims 1 to 9.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101634734A (en) * | 2008-07-24 | 2010-01-27 | 索尼株式会社 | Optical device |
| CN103091869A (en) * | 2013-02-05 | 2013-05-08 | 中国科学院半导体研究所 | Integrated coherent-light-communication electro-optical modulator structure |
| CN104870069A (en) * | 2015-01-27 | 2015-08-26 | 索尔思光电（成都）有限公司 | Multi-channel, parallel transmission optical module,and methods for manufacturing and application thereof |
| CN104901745A (en) * | 2014-03-03 | 2015-09-09 | 颖飞公司 | Optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8477056B2 (en) * | 2010-06-01 | 2013-07-02 | Infinera Corporation | Method, system, and apparatus for interpolating an output of an analog-to-digital converter |
-
2017
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101634734A (en) * | 2008-07-24 | 2010-01-27 | 索尼株式会社 | Optical device |
| CN103091869A (en) * | 2013-02-05 | 2013-05-08 | 中国科学院半导体研究所 | Integrated coherent-light-communication electro-optical modulator structure |
| CN104901745A (en) * | 2014-03-03 | 2015-09-09 | 颖飞公司 | Optical module |
| CN104870069A (en) * | 2015-01-27 | 2015-08-26 | 索尔思光电（成都）有限公司 | Multi-channel, parallel transmission optical module,and methods for manufacturing and application thereof |
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