CN108493266A - A kind of silk-screen printing technique of solar silicon wafers - Google Patents
A kind of silk-screen printing technique of solar silicon wafers Download PDFInfo
- Publication number
- CN108493266A CN108493266A CN201810272160.XA CN201810272160A CN108493266A CN 108493266 A CN108493266 A CN 108493266A CN 201810272160 A CN201810272160 A CN 201810272160A CN 108493266 A CN108493266 A CN 108493266A
- Authority
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- China
- Prior art keywords
- silicon wafers
- solar silicon
- silk
- solar
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 49
- 235000012431 wafers Nutrition 0.000 title claims abstract description 46
- 238000007650 screen-printing Methods 0.000 title claims abstract description 26
- 238000007639 printing Methods 0.000 claims abstract description 32
- 238000007790 scraping Methods 0.000 claims abstract description 15
- 238000007711 solidification Methods 0.000 claims abstract description 9
- 230000008023 solidification Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000007599 discharging Methods 0.000 claims abstract description 3
- 239000000976 ink Substances 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- -1 alcohol ester Chemical class 0.000 claims description 5
- 125000004806 1-methylethylene group Chemical class [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229920004933 Terylene® Polymers 0.000 claims description 3
- 238000003848 UV Light-Curing Methods 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- JPSIUEJLDNCSHS-UHFFFAOYSA-N propane;prop-2-enoic acid Chemical compound CCC.OC(=O)C=C JPSIUEJLDNCSHS-UHFFFAOYSA-N 0.000 claims description 3
- LJRSZGKUUZPHEB-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxypropoxy)propoxy]propyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COC(C)COC(=O)C=C LJRSZGKUUZPHEB-UHFFFAOYSA-N 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000009776 industrial production Methods 0.000 abstract description 2
- 238000004804 winding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 206010054949 Metaplasia Diseases 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0081—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/17—Dry transfer
- B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
- B44C1/1729—Hot stamping techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Sustainable Energy (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Sustainable Development (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Methods (AREA)
- Screen Printers (AREA)
Abstract
The invention discloses a kind of silk-screen printing techniques of solar silicon wafers, which is characterized in that includes the following steps：Step 1: getting out printing material, the material and mesh number of silk screen are then chosen；Step 2: the print speed printing speed of setting screen process press, discharges solar silicon wafers by discharging unit；Step 3: solar silicon wafers are sent into screen process press, start ink-scraping device and carry out wiping, printing one layer in solar power silicon on piece can thermoprint UV cured printing ink；Step 4: solidification is dried in the ink of the solar silicon wafers to printing；Step 5: the solar power silicon on piece in hot stamping equipment by thermoprint paper tinsel film thermoprint after being dried through step 4；Step 6: neat winding.The present invention is by the setting to parameters in screen printing process, the solar silicon wafers appearance looks elegant printed, and exquisiteness is refined, simple for process, convenient operation and control, stable quality, and production efficiency is high, can large-scale industrial production.
Description
Technical field
The invention belongs to solar silicon wafers printing technologies, and in particular, to a kind of silk-screen printing of solar silicon wafers
Technique.
Background technology
It is well known that at present in the case where fossil fuel is reduced increasingly, solar energy has become the weight that the mankind use the energy
Component part is wanted, and is constantly developed.The utilization of solar energy has photothermal conversion and opto-electronic conversion two ways, solar power generation
It is a kind of emerging regenerative resource.
With the continuous development of solar battery technology, the solar cell based on photovoltaic effect has fine answer
Use foreground.Important procedure of the silk-screen printing as production solar cell, printing quality directly affect each of solar silicon wafers
Item performance.Screen printing technique is widely applied in many industries, is especially obtained in recent ten years in photovoltaic industry
Good development.Screen printing technique is mainly used in the manufacture of photovoltaic cell in photovoltaic industry, photovoltaic cell be
Semiconductor silicon on piece forms PN junction, and the two-face printing grid line with the mode of silk-screen printing in semi-conductor silicon chip does electricity to collect electric current
Pole.
With the development of photovoltaic industry, the requirement to the silk-screen printing quality of solar silicon wafers is higher and higher.
Invention content
The purpose of the present invention is to provide a kind of silk-screen printing techniques of solar silicon wafers, by technique in silk-screen printing
The setting of parameter, by the way of wire mark+hot stamping, so as to get solar silicon wafers appearance looks elegant, exquisiteness is refined, technique letter
Single, convenient operation and control, stable quality, production efficiency is high, can large-scale industrial production.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of silk-screen printing technique of solar silicon wafers, which is characterized in that include the following steps：
Step 1: getting out printing material, the material and mesh number of silk screen are then chosen；
Step 2: the print speed printing speed of setting screen process press, print speed printing speed are less than or equal to 10000 impressions/h, pass through blowing
Unit discharges solar silicon wafers；
Step 3: solar silicon wafers are sent into screen process press, the gap of solar silicon wafers and halftone is set as 2mm-
Sdueegee is installed in ink-scraping device by 4mm, is started ink-scraping device and is carried out wiping, and printing one layer in solar power silicon on piece can scald
Print UV cured printing inks；
Step 4: the drying equipment running parameter of screen process press is adjusted, the ink to the solar silicon wafers printed
Solidification is dried；
Step 5: the running parameter of hot stamping equipment is set, by thermoprint paper tinsel film thermoprint through step 4 in hot stamping equipment
Solar power silicon on piece after drying；
Step 6: will through step 5, treated that printed matter is neatly wound, printing process terminates.
It is 200-350 mesh that terylene silk net, meshcount are selected in the step 1.
UV cured printing inks used in the step 3 are by urethane acrylate, epoxy acrylate, two contractings 3 the third two
Alcohol diacrylate, three acrylic acid propane front three alcohol esters, polymerization [2- hydroxy-2-methyls -1- [4- (1- methyl ethylenes) benzene
Base] acetone], dimethyl silicone polymer, Siloxane-Oxyalkylene Copolymers and polyethylene wax composition.
In the step 4 surface be printed on can thermoprint UV cured printing inks solar silicon wafers by UV Light Curing Units carry out
Cure drying, uses wavelength that preliminarily dried, initial drying time 0.3- is dried for 250-300 nanometers of ultraviolet light
0.5s continues to be cured with 350-400 nanometers of ultraviolet light, hardening time 0.4s-0.6s.
Foil stamping process uses platen hot stamping technique, pressure of hot stamping 15-30kg/cm in the step 52, thermoprint temperature
Degree is 95 DEG C -105 DEG C, and the thermoprint time is 0.4s-0.7s.
Ink-scraping device used in the step 3, including support device and the linkage that is installed in support device；
The support device includes support baseboard and is perpendicularly fixed at the first side plate, second side plate on support baseboard surface,
The apparent surface of first side plate and the second side plate is vertically and fixedly provided with positioning shaft, and the surface of the positioning shaft is provided with bar shaped
Groove, the strip groove are parallel to the setting of support baseboard length direction, spring are equipped on the positioning shaft；Described first
The surface of side plate is provided with the first circular through hole, and the surface of second side plate is provided with the second circular through hole；
The linkage includes threaded rod, cylinder unit and sdueegee, and the threaded rod is installed on the table of the first side plate
Face, the cylinder unit include position-arresting disk and the cylinder for being fixed on limit panel surface, and the cylinder, which runs through, is installed on the second side plate
Surface, the cylinder and the second circular through hole it is concentric activity coordinate；All side external surfaces of the cylinder are fixed with square body,
The lower surface of the square body is fixed with starting stave, and the starting stave is fixed with the second riser by connecting transverse slat, described
Connection transverse slat is perpendicularly fixed at the apparent surface of starting stave and the second riser, the opposite table of the starting stave and the second riser
Face is provided with third circular through hole, and the hole wall of the third circular through hole is fixed with raised line；The surface of the connection transverse slat is equipped with
Sdueegee.
Further, one end of the threaded rod is fixed with installation axle, and the installation axle coordinates with the first circular through hole, institute
It states installation axle and runs through the surface for being fixed on the first side plate by bearing.
Further, the cylindrical sleeve is set on threaded rod, and the side inner surface of cylinder is provided with the spiral shell with shaft
Groove.
Further, third circular through hole coordinates with the concentric activity of positioning shaft, the item of raised line and positioning axle surface
Connected in star coordinates；One end of spring connects with the second side plate, and the other end of spring connects with starting stave.
Further, the lower surface of the connection transverse slat is provided with mounting groove, and the sdueegee is secured by bolts in installation
In slot.
Beneficial effects of the present invention：
The present invention by the way of wire mark+hot stamping, to tiny lines, on the spot, raised effect reproduction it is good；It is scalding
India and China save plate-making cost；The present invention deforms solar silicon wafers tensionless winkler foundation and damages without indentation convex process；The present invention couple
Solar silicon wafers screen printing ink carry out secondary drying, make silk-screen printing technique more rationally it is perfect, so as to get solar silicon wafers
Appearance looks elegant, exquisiteness is refined, simple for process, convenient operation and control, stable quality, and production efficiency is high, can large-scale industry metaplasia
Production.
Description of the drawings
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is the structural schematic diagram of ink-scraping device of the present invention；
Fig. 2 is the partial structural diagram of ink-scraping device of the present invention；
Fig. 3 is the structural schematic diagram of linkage in Fig. 1；
Fig. 4 is the structural schematic diagram of cylinder unit in Fig. 3；
Fig. 5 is the structural schematic diagram of ink-scraping device of the present invention.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
It is only a part of the embodiment of the present invention to apply example, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
All other embodiment that logical technical staff is obtained without creative efforts belongs to what the present invention protected
Range.
A kind of silk-screen printing technique of solar silicon wafers, includes the following steps：
Step 1: getting out printing material, the material and mesh number of silk screen are then chosen；
It is 200-350 mesh to select terylene silk net, meshcount；
Step 2: the print speed printing speed of setting screen process press, discharges solar silicon wafers by discharging unit；
The print speed printing speed of screen process press is less than or equal to 10000 impressions/h.
Step 3: the working condition of setting screen process press, by wire mark unit one layer of printable fabric surface printing can
Thermoprint UV cured printing inks；
Detailed process is：The gap of solar silicon wafers and halftone is 2mm-4mm first, and sdueegee is secondly installed to wiping
In device, moved left and right in solar power silicon on piece printing UV cured printing ink by sdueegee in ink-scraping device；
UV cured printing inks used by urethane acrylate, epoxy acrylate, tri (propylene glycol) diacrylate,
Three acrylic acid propane front three alcohol esters, polymerization [2- hydroxy-2-methyls -1- [4- (1- methyl ethylenes) phenyl] acetone], poly- diformazan
Radical siloxane, Siloxane-Oxyalkylene Copolymers and polyethylene wax composition；
Step 4: the drying equipment running parameter of screen process press is adjusted, the ink to the solar silicon wafers printed
Solidification is dried；
Surface be printed on can the solar silicon wafers of thermoprint UV cured printing inks carry out solidification drying by UV Light Curing Units, use
Wavelength is that preliminarily dried is dried in 250-300 nanometers of ultraviolet light, and initial drying time 0.3-0.5s continues to use 350-
400 nanometers of ultraviolet light solidification, hardening time 0.4s-0.6s；
The UV cured printing inks that solar silicon wafers surface is printed on are cured again by preliminarily dried, are ensureing ink property
On the basis of, ink is not easily to fall off, and solidification effect is good；
Step 5: the running parameter of hot stamping equipment is set, by thermoprint paper tinsel film thermoprint through step 4 in hot stamping equipment
Solar power silicon on piece after drying；
Foil stamping process uses platen hot stamping technique, pressure of hot stamping 15-30kg/cm2, blocking point be 95 DEG C-
105 DEG C, the thermoprint time is 0.4s-0.7s；
Step 6: will through step 5, treated that printed matter is neatly wound, printing process terminates.
Ink-scraping device in the step 3, in conjunction with shown in Fig. 1 to Fig. 5, including support device 1 is filled with support is installed on
Set the linkage 2 on 1；
Support device 1 includes support baseboard 11 and the first side plate 12, the second side that are perpendicularly fixed at 11 surface of support baseboard
The length direction that plate 13, the first side plate 12 and the second side plate 13 are parallel to support baseboard 11 is oppositely arranged, the first side plate 12 and
The apparent surface of two side plates 13 is fixed with positioning shaft 14, and positioning shaft 14 is parallel to the length direction setting of support baseboard 11,
The surface of positioning shaft 14 is provided with strip groove 1401, and strip groove 1401 is parallel to the setting of 11 length direction of support baseboard, fixed
Spring 15 is installed on the shaft 14 of position；The surface of first side plate 12 is provided with the first circular through hole 1201, the surface of the second side plate 13
It is provided with the second circular through hole 1301, the center of circle of the first circular through hole 1201 and the second circular through hole 1301 is in sustained height；
Linkage 2 includes threaded rod 21, cylinder unit 22 and sdueegee 23, and threaded rod 21 is installed on the first side plate 12
The one end on surface, threaded rod 21 is fixed with installation axle 2101, and installation axle 2101 and the first circular through hole 1201 coordinate, installation axle
2101 run through the surface for being fixed on the first side plate 12 by bearing, and installation axle 2101 is connected with motor, motor driven threaded rod 21
Rotation；Cylinder unit 22 includes position-arresting disk 2201 and the cylinder 2202 for being fixed on 2201 surface of position-arresting disk, and cylinder 2202 is through peace
Surface loaded on the second side plate 13, cylinder 2202 and the 1301 concentric activity of the second circular through hole coordinate, and cylinder 2202 can be in water
Square to moving back and forth；Cylinder 2202 is sheathed on threaded rod 21, and the side inner surface of cylinder 2202 is provided with matches with threaded rod 21
The thread groove of conjunction；All side external surfaces of cylinder 2202 are fixed with direction body 2203, and the lower surface of square body 2203 is fixed with first
Riser 2204, starting stave 2204 are fixed with the second riser 2206 by connecting transverse slat 2205, and starting stave 2204 and second is perpendicular
Plate 2206 is oppositely arranged, and connection transverse slat 2205 is perpendicularly fixed at the apparent surface of starting stave 2204 and the second riser 2206, the
The apparent surface of one riser 2204 and the second riser 2206 is provided with third circular through hole 2207, the hole of third circular through hole 2207
Wall is fixed with raised line 2208, and third circular through hole 2207 coordinates with the 14 concentric activity of positioning shaft, raised line 2208 and locating shaft
The strip groove 1401 on 14 surface of bar coordinates, and one end of spring 15 connects with the second side plate 13, the other end of spring 15 and first
Riser 2204 connects；The surface of connection transverse slat 2205 is equipped with sdueegee 23, and the lower surface of connection transverse slat 2205 is provided with mounting groove
2209, sdueegee 23 is secured by bolts in mounting groove 2209；
The working theory and processing of the ink-scraping device：Solar silicon wafers are placed on support baseboard 11, sdueegee 23
Underface starts motor, and motor driven threaded rod 21 rotates, and threaded rod 21 is sheathed in cylinder 2202 and the week of cylinder 2202
Side inner surface is provided with the thread groove coordinated with threaded rod 21, and cylinder 2202 can be rotated with threaded rod 21, in raised line 2208 and positioning
Under the cooperation position-limiting action of the strip groove on 14 surface of shaft, cylinder 2202 transforms the rotation into as straight line fortune in the horizontal direction
It is dynamic, and then the movement of sdueegee 23 is driven, when being moved to the edge of solar silicon wafers, motor is closed, in the bullet of spring 15
Under force effect, sdueegee 23 back moves, and so completes a cycle of wiping, the initiation culture of motor can be arranged, and realizes
Wiping of the ink-scraping device to solar silicon wafers；The ink-scraping device is simple in structure, easily operated, passes through motor driving, threaded rod
The elastic force effect of transmission, the position-limiting action of raised line highlighted towards housing and spring, realizes the wiping of sdueegee, wiping uniform in effect；Meanwhile
Sdueegee is directly bolted, and is convenient for changing sdueegee；
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to preferably explain the present invention
Principle and practical application, to enable skilled artisan to be best understood by and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (10)
1. a kind of silk-screen printing technique of solar silicon wafers, which is characterized in that include the following steps：
Step 1: getting out printing material, the material and mesh number of silk screen are then chosen；
Step 2: the print speed printing speed of setting screen process press, print speed printing speed are less than or equal to 10000 impressions/h, pass through discharging unit
Discharge solar silicon wafers；
Step 3: solar silicon wafers are sent into screen process press, the gap of solar silicon wafers and halftone is set as 2mm-4mm, it will
Sdueegee is installed in ink-scraping device, is started ink-scraping device and is carried out wiping, solar power silicon on piece print one layer can thermoprint UV it is solid
Carburetion ink；
Step 4: adjusting the drying equipment running parameter of screen process press, the ink of the solar silicon wafers printed is carried out
Dry solidification；
Step 5: setting the running parameter of hot stamping equipment, thermoprint paper tinsel film thermoprint is dried through step 4 in hot stamping equipment
Solar power silicon on piece afterwards；
Step 6: will through step 5, treated that printed matter is neatly wound, printing process terminates.
2. a kind of silk-screen printing technique of solar silicon wafers according to claim 1, which is characterized in that in the step 1
It is 200-350 mesh to select terylene silk net, meshcount.
3. a kind of silk-screen printing technique of solar silicon wafers according to claim 1, which is characterized in that in the step 3
UV cured printing inks used are by urethane acrylate, epoxy acrylate, tri (propylene glycol) diacrylate, three acrylic acid
Propane front three alcohol ester, polymerization [2- hydroxy-2-methyls -1- [4- (1- methyl ethylenes) phenyl] acetone], dimethyl silicone polymer,
Siloxane-Oxyalkylene Copolymers and polyethylene wax composition.
4. a kind of silk-screen printing technique of solar silicon wafers according to claim 1, which is characterized in that in the step 4
Surface be printed on can the solar silicon wafers of thermoprint UV cured printing inks carry out solidification drying by UV Light Curing Units, use wavelength for
Preliminarily dried is dried in 250-300 nanometers of ultraviolet light, and initial drying time 0.3-0.5s continues to use 350-400 nanometers
Ultraviolet light solidification, hardening time 0.4s-0.6s.
5. a kind of silk-screen printing technique of solar silicon wafers according to claim 1, which is characterized in that in the step 5
Foil stamping process uses platen hot stamping technique, pressure of hot stamping 15-30kg/cm2, blocking point is 95 DEG C -105 DEG C, thermoprint
Time is 0.4s-0.7s.
6. a kind of silk-screen printing technique of solar silicon wafers according to claim 1, which is characterized in that in the step 3
Ink-scraping device used, including support device (1) and the linkage (2) that is installed in support device (1)；
The support device (1) includes support baseboard (11) and the first side plate for being perpendicularly fixed at support baseboard (11) surface
(12), the apparent surface of the second side plate (13), first side plate (12) and the second side plate (13) is vertically and fixedly provided with positioning shaft
(14), the surface of the positioning shaft (14) is provided with strip groove (1401), and the strip groove (1401) is parallel to support bottom
Plate (11) length direction is arranged, and spring (15) is equipped on the positioning shaft (14)；It opens on the surface of first side plate (12)
There are the first circular through hole (1201), the surface of second side plate (13) to be provided with the second circular through hole (1301)；
The linkage (2) includes threaded rod (21), cylinder unit (22) and sdueegee (23), threaded rod (21) installation
Surface in the first side plate (12), the cylinder unit (22) include position-arresting disk (2201) and are fixed on position-arresting disk (2201) surface
Cylinder (2202), the cylinder (2202), which is run through, is installed on the surfaces of the second side plate (13), the cylinder (2202) and second
The concentric activity cooperation of circular through hole (1301)；All side external surfaces of the cylinder (2202) are fixed with square body (2203), institute
The lower surface for stating square body (2203) is fixed with starting stave (2204), and the starting stave (2204) is by connecting transverse slat
(2205) it is fixed with the second riser (2206), the connection transverse slat (2205) is perpendicularly fixed at starting stave (2204) and second and erects
It is logical that the apparent surface of the apparent surface of plate (2206), the starting stave (2204) and the second riser (2206) is provided with third circle
The hole wall in hole (2207), the third circular through hole (2207) is fixed with raised line (2208)；The table of the connection transverse slat (2205)
Face is equipped with sdueegee (23).
7. a kind of silk-screen printing technique of solar silicon wafers according to claim 6, which is characterized in that the threaded rod
(21) one end is fixed with installation axle (2101), and the installation axle (2101) coordinates with the first circular through hole (1201), the peace
Dress axis (2101) runs through the surface for being fixed on the first side plate (12) by bearing.
8. a kind of silk-screen printing technique of solar silicon wafers according to claim 6, which is characterized in that the cylinder
(2202) it is sheathed on threaded rod (21), the side inner surface of cylinder (2202) is provided with the thread groove with threaded rod (21) cooperation.
9. a kind of silk-screen printing technique of solar silicon wafers according to claim 6, which is characterized in that third circular through hole
(2207) coordinate with the concentric activity of positioning shaft (14), the strip groove of raised line (2208) and positioning shaft (14) surface
(1401) coordinate；One end of spring (15) connects with the second side plate (13), the other end and the starting stave (2204) of spring (15)
Connect.
10. a kind of silk-screen printing technique of solar silicon wafers according to claim 6, which is characterized in that the connection is horizontal
The lower surface of plate (2205) is provided with mounting groove (2209), and the sdueegee (23) is secured by bolts in mounting groove (2209).
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| CN201810272160.XA CN108493266B (en) | 2018-03-29 | 2018-03-29 | Screen printing process for solar silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810272160.XA CN108493266B (en) | 2018-03-29 | 2018-03-29 | Screen printing process for solar silicon wafer |
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| CN108493266B CN108493266B (en) | 2020-11-10 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201186521Y (en) * | 2008-04-15 | 2009-01-28 | 潘日从 | Ink scraping apparatus |
| CN104804527A (en) * | 2015-04-25 | 2015-07-29 | 汕头东风印刷股份有限公司 | Ultraviolet curing ink and preparation method thereof |
| WO2017026766A1 (en) * | 2015-08-07 | 2017-02-16 | 성균관대학교산학협력단 | Perovskite having improved moisture stability and photostability, and solar cell using same |
| CN107020223A (en) * | 2017-06-09 | 2017-08-08 | 长兴宏盛电子有限公司 | A kind of glue spreading apparatus for electronic component |
| CN107458104A (en) * | 2017-08-31 | 2017-12-12 | 东莞市源铁印刷机械有限公司 | A kind of silk-screen printing technique |
| JP2018034446A (en) * | 2016-08-31 | 2018-03-08 | 株式会社トッパンＴｄｋレーベル | Screen printing apparatus and printing method |
-
2018
- 2018-03-29 CN CN201810272160.XA patent/CN108493266B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201186521Y (en) * | 2008-04-15 | 2009-01-28 | 潘日从 | Ink scraping apparatus |
| CN104804527A (en) * | 2015-04-25 | 2015-07-29 | 汕头东风印刷股份有限公司 | Ultraviolet curing ink and preparation method thereof |
| WO2017026766A1 (en) * | 2015-08-07 | 2017-02-16 | 성균관대학교산학협력단 | Perovskite having improved moisture stability and photostability, and solar cell using same |
| JP2018034446A (en) * | 2016-08-31 | 2018-03-08 | 株式会社トッパンＴｄｋレーベル | Screen printing apparatus and printing method |
| CN107020223A (en) * | 2017-06-09 | 2017-08-08 | 长兴宏盛电子有限公司 | A kind of glue spreading apparatus for electronic component |
| CN107458104A (en) * | 2017-08-31 | 2017-12-12 | 东莞市源铁印刷机械有限公司 | A kind of silk-screen printing technique |
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|---|---|
| CN108493266B (en) | 2020-11-10 |
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Effective date of registration: 20230323 Address after: No.58 Huixian Middle Road, Jintan District, Changzhou City, Jiangsu Province 213200 Patentee after: CHANGZHOU SANYO PRECISION PLATE MAKING Co.,Ltd. Address before: 232000 workshop No. 5, Ancheng Economic Development Zone, tianjia'an District, Huainan City, Anhui Province (standardized workshop) Patentee before: ANHUI SANDIAN PHOTOVOLTAIC TECHNOLOGY Co.,Ltd. |
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Address after: No. 58 Huixian Middle Road, Jintan District, Changzhou City, Jiangsu Province, 213000 Patentee after: Changzhou Sanyo Precision Plate Making Co.,Ltd. Country or region after: China Address before: No.58 Huixian Middle Road, Jintan District, Changzhou City, Jiangsu Province 213200 Patentee before: CHANGZHOU SANYO PRECISION PLATE MAKING Co.,Ltd. Country or region before: China |