CN108471683A - A kind of cover board and preparation method thereof, electronic equipment - Google Patents
A kind of cover board and preparation method thereof, electronic equipment Download PDFInfo
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- CN108471683A CN108471683A CN201810214033.4A CN201810214033A CN108471683A CN 108471683 A CN108471683 A CN 108471683A CN 201810214033 A CN201810214033 A CN 201810214033A CN 108471683 A CN108471683 A CN 108471683A
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- layer
- cover board
- yellow light
- photoresist
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
- B44C5/0446—Ornamental plaques, e.g. decorative panels, decorative veneers bearing graphical information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
Abstract
This application discloses a kind of cover board and preparation method thereof, electronic equipment, which includes the substrate being stacked, yellow light texture layer, color film layer；Wherein, yellow light texture layer is one layer of photoresist layer with texture formed using yellow light technique.By the above-mentioned means, the application can reduce production process, unnecessary tools are saved, and then reduces production cost, improve production efficiency, while the yield of product can also be improved.
Description
Technical field
This application involves technical field of electronic equipment, more particularly to a kind of cover board and preparation method thereof, electronic equipment.
Background technology
With the development of the electronic equipments such as mobile phone, tablet computer, intelligent wearable device, people do not require nothing more than electronic equipment tool
There is good performance, higher requirement more is proposed to the appearance of electronic equipment, sense of touch.By taking the cover board of electronic equipment as an example, from
Plastic cover plate, metal cover board develop to glass cover-plate, none does not allow for the impression of user.
Currently, more electronic equipments in order to improve sense organ, need that texture is added in cover board, but in existing technology
Technique is cumbersome, expensive.
Invention content
In order to solve the above technical problems, the technical solution that the application uses is：A kind of cover board is provided, which includes
The substrate that is stacked, yellow light texture layer, color film layer；Wherein, yellow light texture layer is one layer of tool formed using yellow light technique
Textured photoresist layer.
In order to solve the above technical problems, another technical solution that the application uses is：A kind of making side of cover board is provided
The production method of method, the cover board includes：One substrate is provided；Yellow light texture layer is formed on substrate；Wherein, yellow light texture layer is one
The photoresist layer with texture that layer is formed using yellow light technique；Color film layer is formed on yellow light texture layer.
In order to solve the above technical problems, another technical solution that the application uses is：A kind of electronic equipment, the electricity are provided
Sub- equipment includes cover board, which includes the substrate being stacked, yellow light texture layer, color film layer；Wherein, yellow light texture layer is
One layer of photoresist layer with texture formed using yellow light technique；Or the cover board is made of production method below：It provides
One substrate；Yellow light texture layer is formed on substrate；Wherein, yellow light texture layer is one layer has texture using what yellow light technique was formed
Photoresist layer；Color film layer is formed on yellow light texture layer.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is the structural schematic diagram of existing glass cover-plate；
Fig. 2 is the structural schematic diagram of one embodiment of cover board provided by the present application；
Fig. 3 is the flow diagram of one embodiment of production method of cover board provided by the present application；
Fig. 4 be cover board provided by the present application one embodiment of production method in do not receive 32 flow diagram；
Fig. 5 is the structural schematic diagram of another embodiment of cover board provided by the present application；
Fig. 6 is the flow diagram of another embodiment of production method of cover board provided by the present application；
Fig. 7 be cover board provided by the present application another embodiment of production method in plated film film layer first structure schematic diagram；
Fig. 8 be cover board provided by the present application another embodiment of production method in plated film film layer the second structural schematic diagram；
Fig. 9 is the positive structure schematic of one embodiment of electronic equipment provided by the present application；
Figure 10 is the structure schematic diagram of one embodiment of electronic equipment provided by the present application.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing
Sequence.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It further includes the steps that optionally not listing or unit to be, or further includes optionally for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
It should be understood that with the development of the electronic equipments such as mobile phone, tablet computer, intelligent wearable device, people not only want
It asks electronic equipment with good performance, higher requirement more is proposed to the appearance of electronic equipment, sense of touch.With electronic equipment
For cover board, glass cover-plate is developed to from plastic cover plate, metal cover board, none does not allow for the impression of user.It is especially existing
Glass cover-plate experienced due to good sense of touch and appearance, increasingly obtain liking for people, but how in glass cover-plate
Upper making texture, becomes urgent problem to be solved.
Wherein, the cover board in the following examples can be screen protection cover board, battery protective cover, camera protection cover, refer to
Line module protection cap etc., the application is not restricted.
As shown in Figure 1, Fig. 1 is the structural schematic diagram of existing glass cover-plate.Include mainly layer in existing glass cover-plate
Glass 11, OCA glue (Optically Clear Adhesive) 12, PET (polyethylene terephthalate) film of folded setting
13, texture layer 14, plated film film layer 15 and ink layer 16.Wherein, the method that texture layer 14 mainly uses UV transfers using PET films
It is formed.The technique is first printed on UV glue on mold with texture, then the glue with texture graphics on grinding tool
It is transferred on PET films, finally PET films is cut on required adhered shape to glass cover-plate again.This method exist with
Lower Railway Project point：
1, it is related to the making of mold, product development cycle is long；
2, complex process, yield are low, of high cost；
3, PET films, mold consumptive material are expensive.
Referring to Fig.2, Fig. 2 is the structural schematic diagram of one embodiment of cover board provided by the present application, which includes being stacked
Substrate 21, yellow light texture layer 22, color film layer 23.
Wherein, which is one layer of photoresist layer with texture formed using yellow light technique, optionally,
The photoresist is generally photosensitive resin.
The technical sophistication of photoresist, kind are more.According to its chemical reaction mechanism and development principle, negative photoresist and just can be divided
Property two class of glue.Form insoluble material after illumination is negative photoresist；Conversely, being insoluble to certain solvents, become after illumination
What it is at soluble substance is positive photoresist.Photoresist making coatings can be etched into required electricity in silicon chip surface using this performance
Road figure.Chemical constitution based on photosensitive resin, photoresist can be divided into three types.
Photo-polymerization type.Using vinyl monomer, free radical is generated under light action, it is poly- that free radical further causes monomer
It closes, ultimately produces polymer, have the characteristics that form erect image.
Photolysis type.Using the material containing nitrine quinones, after illumination, it may occur that photolysis reactions, by oil
Dissolubility becomes water-soluble, and positive photoresist can be made.
Photo-crosslinking type.Light-sensitive material is used as using polyvinyl alcohol laurate etc., it is double in molecule under the action of light
Key is opened, and makes to crosslink between chain and chain, forms a kind of insoluble reticular structure, and plays the role of against corrosion, this is
A kind of typical negative photoresist.Product K PR (polyvinyl cinnamate) glue of Kodak belongs to such.
Optionally, in one embodiment, the viscosity of the photosensitive resin used is 0.5-100cps.
Optionally, in one embodiment, the thickness of yellow light texture layer is 0.5-100 μm.
In the following, the manufacture craft of the cover board in above-described embodiment is introduced by an embodiment, it is refering to Fig. 3, Fig. 3
The flow diagram of one embodiment of production method of cover board provided by the present application, this method include：
Step 31：One substrate is provided.
Wherein, which is generally transparent glass substrate.
It should be understood that the purposes of the cover board in embodiment provided by the present application is various, and by taking mobile phone as an example, Ke Yishi
Screen protection cover board, battery protective cover, camera protection cover, fingerprint module protection cap.Therefore, under normal circumstances, screen is protected
Protecting cover plate, camera protection cover, fingerprint module protection cap etc. are required at least partly transparent glass cover-plate, it is of course also possible to
Using transparent plastic cover plate.
In addition, in other embodiments, it can be that itself is certain using having that can also use colored substrate, colored substrate
The substrate that the material of color makes can also be that a layer pigment, such as colored paint are coated on transparent substrate, colored substrate with it is follow-up
The color film layer of formation cooperatively forms the cover board color of needs.
Optionally, since cover board can be plane, curved surface or other anisotropic glass cover-plates, so the substrate used is also answered
This is the matched shaped substrates of cover board pattern with needs.For example, mobile phone mostly uses greatly Curved screen now, then screen protection
Cover board needs the curved surface for having certain；In another example camera protection cover used by rear camera is generally then flat glass
Cover board.
Step 32：Yellow light texture layer is formed on substrate.
Wherein, yellow light texture layer is one layer of photoresist layer with texture formed using yellow light technique.
Optionally, as shown in figure 4, in a specific embodiment, step 32 specifically includes：
Step 321：Photoresist is formed on substrate.
Optionally, which is generally photosensitive resin, forms the method for photoresist generally by the way of coating, including
But it is not limited to spraying, blade coating, spin coating.By taking spraying as an example, spraying is by spray gun or dish-style atomizer, by means of pressure or centrifugation
Power is dispersed into uniform and fine droplet, is applied over the coating process on coated article surface.Aerial spraying can be divided into, sprayed without air
It applies, the mode of electrostatic spraying and the various derivations of above-mentioned basic spray form, such as big flow low-pressure atomizing spraying, thermal jet
It applies, spraying, multigroup spraying etc. automatically.
In addition, before step 321, substrate can generally be cleaned, photoetching is completed and then carry out in base-plate cleaning
Existing cleaning may be used in the cleaning of the coating process of glue, substrate, and which is not described herein again.
Step 322：In the environment of 80-150 DEG C, baking 2-10min is carried out to photoresist.
It should be understood that in this step, the temperature of baking is relatively low, the time of baking is relatively short, therefore, step
322 baking can also be called it is soft roasting, to carry out primary solidification to the photoresist of formation.
Step 323：Photoresist is exposed using ultraviolet light.
Wherein, exposing the texture of use can determine according to actual demand.In one embodiment, which is rule
The a plurality of waveform texture of arrangement.
Specifically, the texture of needs can be inputted exposure machine to expose with electronic drawings and archives, so there is no need to molds
Design and fabrication, can quick Fabrication sample, the development cycle of product is greatly reduced.
Wherein, ultraviolet light UV can specifically be divided into three wave bands, including UVA, UVB and UVC, the wavelength longest of wherein UVA,
Generally 320-420nm, in the present embodiment, using the ultraviolet light of UVA wave bands, intensity 50-2000MJ/cm2。
Step 324：Developed to photoresist using developer solution.
Developer solution is usually the solution chemically reacted with photoresist, be may be used according to the cost of photoresist different
Developer solution.By taking the photosensitive resin in above-described embodiment as an example, generally developed to it as developer solution using alkaline solution.
Optionally, in one embodiment, the pH value of developer solution is 8-14, and development temperature is 20-40 DEG C, and developing time is
10-300sec。
Specifically, on the one hand, can control the temperature of developer solution at 20-40 DEG C, alternatively, it is also possible at 20-40 DEG C
Temperature environment in, carry out development operation.
Step 325：In the environment of 150-300 DEG C, baking 10-120min is carried out to photoresist.
It should be understood that this step is relative to step 322, the temperature of baking is relatively high, and the time of baking is relatively long,
Therefore, the baking of step 322 can also be called hard baking, further be cured with the photoresist to formation.
Step 33：Color film layer is formed on yellow light texture layer.
Wherein, which is specially that cover board provides required color, which matches with texture, can bring very
Good visual perception.In the following embodiments, it will the part is described in detail.
The case where being different from the prior art, cover board provided in this embodiment include the substrate being stacked, yellow light texture layer,
Color film layer；Wherein, yellow light texture layer is one layer of photoresist layer with texture formed using yellow light technique.Specifically,
In manufacture craft can specifically include：One substrate is provided；Yellow light texture layer is formed on substrate；It is formed on yellow light texture layer
Color film layer.Using aforesaid way, texture is made with yellow light technique, good visual effect is brought to cover board, on the one hand
Existing film, mold etc. are not used, reduces production cost, and another convenience eliminates the techniques such as transfer, cutting, fitting, subtracts
Process is lacked, has improved production efficiency, while having reduced process to improve the yield of product.
It is the structural schematic diagram of another embodiment of cover board provided by the present application refering to Fig. 5, Fig. 5, which includes that stacking is set
Substrate 51, yellow light texture layer 52, plated film film layer 53 and the ink layer 54 set.
Wherein, the substrate 51 and yellow light texture layer 22 in above-described embodiment substrate and yellow light texture layer it is similar, here
It repeats no more.
Wherein, in an optional embodiment, plated film film layer 53 includes at least one layer of metal or metal oxide.These gold
Belong to or metal oxide is usually used what the mode of plated film was formed.
In the following, the manufacture craft of the cover board in above-described embodiment is introduced by an embodiment, it is refering to Fig. 6, Fig. 6
The flow diagram of another embodiment of production method of cover board provided by the present application, this method include：
Step 61：One substrate is provided.
Wherein, which is generally transparent glass substrate.
It should be understood that the purposes of the cover board in embodiment provided by the present application is various, and by taking mobile phone as an example, Ke Yishi
Screen protection cover board, battery protective cover, camera protection cover, fingerprint module protection cap.Therefore, under normal circumstances, screen is protected
Protecting cover plate, camera protection cover, fingerprint module protection cap etc. are required at least partly transparent glass cover-plate, it is of course also possible to
Using transparent plastic cover plate.
In addition, in other embodiments, it can be that itself is certain using having that can also use colored substrate, colored substrate
The substrate that the material of color makes can also be that a layer pigment, such as colored paint are coated on transparent substrate, colored substrate with it is follow-up
The color film layer of formation cooperatively forms the cover board color of needs.
Optionally, since cover board can be plane, curved surface or other anisotropic glass cover-plates, so the substrate used is also answered
This is the matched shaped substrates of cover board pattern with needs.For example, mobile phone mostly uses greatly Curved screen now, then screen protection
Cover board needs the curved surface for having certain；In another example camera protection cover used by rear camera is generally then flat glass
Cover board.
Step 62：Yellow light texture layer is formed on substrate.
Wherein, yellow light texture layer is one layer of photoresist layer with texture formed using yellow light technique.
Wherein, step 62 can specifically include：Photoresist is formed on substrate；Soft baking is carried out to photoresist；Using purple
Outer light is exposed photoresist；Developed to photoresist using developer solution；Photoresist is toasted firmly.
Optionally, which is generally photosensitive resin, forms the method for photoresist generally by the way of coating, including
But it is not limited to spraying, blade coating, spin coating.By taking spraying as an example, spraying is by spray gun or dish-style atomizer, by means of pressure or centrifugation
Power is dispersed into uniform and fine droplet, is applied over the coating process on coated article surface.Aerial spraying can be divided into, sprayed without air
It applies, the mode of electrostatic spraying and the various derivations of above-mentioned basic spray form, such as big flow low-pressure atomizing spraying, thermal jet
It applies, spraying, multigroup spraying etc. automatically.
Wherein, in soft baking, in the environment of 80-150 DEG C, baking 2-10min is carried out to photoresist.
Wherein, exposing the texture of use can determine according to actual demand.In one embodiment, which is rule
The a plurality of waveform texture of arrangement.
Specifically, the texture of needs can be inputted exposure machine to expose with electronic drawings and archives, so there is no need to molds
Design and fabrication, can quick Fabrication sample, the development cycle of product is greatly reduced.
Wherein, ultraviolet light UV can specifically be divided into three wave bands, including UVA, UVB and UVC, the wavelength longest of wherein UVA,
Generally 320-420nm, in the present embodiment, using the ultraviolet light of UVA wave bands, intensity 50-2000MJ/cm2。
Wherein, when being developed, the developer solution of use is usually the solution chemically reacted with photoresist, according to light
Different developer solutions may be used in the cost of photoresist.By taking the photosensitive resin in above-described embodiment as an example, alkaline solution is generally used
Develop to it as developer solution.
Optionally, in one embodiment, the pH value of developer solution is 8-14, and development temperature is 20-40 DEG C, and developing time is
10-300sec。
Specifically, on the one hand, can control the temperature of developer solution at 20-40 DEG C, alternatively, it is also possible at 20-40 DEG C
Temperature environment in, carry out development operation.
Wherein, in hard baking, in the environment of 150-300 DEG C, baking 10-120min is carried out to photoresist.
Step 63：Plated film film layer is formed on yellow light texture layer using coating process.
Wherein, which can specifically include physical vapour deposition (PVD) (PVD) technology and chemical vapor deposition (CVD) two
Major class can be specifically vacuum vapor plating, sputter coating, vacuum ion membrane plating, plating etc..
The structure of several plated film film layers is set forth below.
The first, in conjunction with shown in Fig. 5 and Fig. 7, plated film film layer 53 may include the first titanyl compound layer being stacked
531, the oxide skin(coating) 532 of silicon, the second titanyl compound layer 533.Specifically, titanyl compound therein can be three oxidations two
Titanium (Ti2O3) or titanium pentoxide (Ti3O5), the oxide of silicon can be silica (SiO2), so, the knot of plated film film layer 53
Structure can be specifically Ti2O3/Ti3O5+SiO2+Ti2O3/Ti3O5。
Second, in conjunction with shown in Fig. 5 and Fig. 8, plated film film layer 53 may include the indium being stacked oxide skin(coating) 534,
First titanyl compound layer 531, the oxide skin(coating) 532 of silicon, the second titanyl compound layer 533.Specifically, the oxidation of indium therein
Nitride layer can be indium sesquioxide (In2O3), titanyl compound can be titanium sesquioxide (Ti2O3) or titanium pentoxide
(Ti3O5), the oxide of silicon can be silica (SiO2), so, the structure of plated film film layer 53 can be specifically In2O3+
Ti2O3/Ti3O5+SiO2+Ti2O3/Ti3O5。
The third (not shown), plated film film layer may include that indium sesquioxide and silica stack to be formed, wherein can be with
There are multilayer indium sesquioxide and multi-layer silica dioxide to be alternately stacked, such as：In2O3+SiO2+In2O3。
It should be understood that in the above-described embodiment, the thickness of film layer and the number of plies of film stack can be according to practical need
The color asked determines, generally 1-5 layer.
In addition, in order to increase the hardness of plated film film layer, one layer of cured film can also be added in plated film film layer 53, for example, can
To plate one layer of alundum (Al2O3) (Al again2O3)。
Optionally, the thickness of plated film film layer therein is generally 0-10 μm.
Step 64：Ink layer is formed in plated film film layer using silk screen printing process.
The material of ink layer is generally high molecular polymer, and ink layer generally uses semi permeability ink layer.Its role is to
The color needed is formed with plated film film layer matched combined.
Optionally, the thickness of ink layer therein is generally 0-100 μm.
On the cover board, ink layer can weaken the bad order after plated film film layer is formed for above-mentioned ink layer setting, such as
Grain, dirt pits；Simple plated film film layer realizes color effects, and color variation range is big, and each batch products color change is big, signed-off sample
Relatively difficult, plated film color has certain limitation, by the combination of ink layer and plated film film layer, can reduce the aberration of cover board, make
Color keep consistency.
Wherein, the mode that silk-screen may be used in ink layer is formed, according to corresponding harmonious colours color oil, oil is added in color oil
In black main body, and stir 3-5min so that color oil is uniformly distributed, and web plate is arranged in plated film film layer, ink is applied to net
It is printed on plate, the cover board after printing is then subjected to baking-curing.Optionally, when being toasted to cover board, temperature 80
DEG C, baking time is 2 hours.
It is different from the prior art, the texture layer that the yellow light technique in this implementation is formed brings good vision to cover board
On the one hand effect does not use existing film, mold etc., reduces production cost, another convenience eliminates transfer, cutting, patch
The techniques such as conjunction, reduce process, improve production efficiency, while reducing process to improve the yield of product.In addition, plated film film
Layer uses the structure of multiple layer metal or metal oxide, can bring better glare effect, improve the visual effect of cover board.
It is the positive structure schematic of one embodiment of electronic equipment provided by the present application, Figure 10 refering to Fig. 9 and Figure 10, Fig. 9
It is the structure schematic diagram of one embodiment of electronic equipment provided by the present application.
Wherein, which includes front shroud 91 and back shroud 92.
Optionally, a center (not indicating), i.e. front shroud 91 are additionally provided between front shroud 91 and back shroud 92 therein
It is set to the one side of center, back shroud 92 is set to the another side of center.
It should be understood that front shroud 91 is mainly used for being attached on display screen, display screen is played a certain protective role,
It is then used to house other function elements such as mainboard, battery between back shroud 92 and center.
Optionally, as shown in Figure 10, multiple void regions are additionally provided on back shroud 92, wherein for be arranged camera,
Flash lamp, fingerprint module etc..Wherein, which further includes camera protection cover 93 and fingerprint module protection cap 94, is somebody's turn to do
Camera protection cover 93 is covered in camera module, which is covered on fingerprint module, wherein camera shooting
Head protection lid 93 and fingerprint module protection cap 94 are connect with back shroud 92 above-mentioned, specifically can be by the modes such as bonding, being clamped
It is fixed.
Wherein, any in above-mentioned front shroud 91, back shroud 92, camera protection cover 93 and fingerprint module protection cap 94
A kind of cover board that may be used in the above embodiments, or cover board is made using above-mentioned manufacture craft.
Particularly, front shroud 91 therein, camera protection cover 93 are generally transparent or semitransparent cover board, back shroud
92, fingerprint module protection cap 94 can be coloured cover board.
It should be understood that the cover board made of the above embodiments is especially used in in the electronic device in mobile phone,
The aesthetics for improving mobile phone additionally improves the production efficiency of mobile phone, reduces cost.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field includes similarly in the scope of patent protection of the application.
Claims (18)
1. a kind of cover board, which is characterized in that the cover board includes the substrate being stacked, yellow light texture layer, color film layer；
Wherein, the yellow light texture layer is one layer of photoresist layer with texture formed using yellow light technique.
2. cover board according to claim 1, which is characterized in that
The photoresist is photosensitive resin, and the viscosity of the photosensitive resin is 0.5-100cps.
3. cover board according to claim 1 or 2, which is characterized in that
The thickness of the yellow light texture layer is 0.5-100 μm.
4. cover board according to claim 1, which is characterized in that
The color film layer includes the plated film film layer being stacked and ink layer, wherein the plated film film layer is close to the yellow light
Texture layer, the plated film film layer and the ink layer combine the color to form the cover board.
5. cover board according to claim 4, which is characterized in that
The plated film film layer includes at least one layer of metal or metal oxide.
6. cover board according to claim 4, which is characterized in that
The plated film film layer includes the first titanyl compound layer being stacked, the oxide skin(coating) of silicon, the second titanyl compound layer.
7. cover board according to claim 4, which is characterized in that
The plated film film layer includes the oxide skin(coating) for the indium being stacked, the first titanyl compound layer, the oxide skin(coating) of silicon, second
Titanyl compound layer.
8. the cover board described according to claim 6 or 7, which is characterized in that
The titanyl compound is titanium sesquioxide or titanium pentoxide, and the oxide of the silicon is silica.
9. the cover board described according to claim 6 or 7, which is characterized in that
Further include one layer of alundum (Al2O3) on the second titanyl compound layer.
10. cover board according to claim 4, which is characterized in that
The thickness of the plated film film layer is 0-10 μm, and the thickness of the ink layer is 0-100 μm.
11. cover board according to claim 1, which is characterized in that
The substrate is glass substrate.
12. a kind of production method of cover board, which is characterized in that including：
One substrate is provided；
Yellow light texture layer is formed on the substrate；Wherein, the yellow light texture layer is one layer of tool formed using yellow light technique
Textured photoresist layer；
Color film layer is formed on the yellow light texture layer.
13. the production method of cover board according to claim 12, which is characterized in that
Described the step of forming yellow light texture layer on the substrate, including：
Photoresist is formed on the substrate；
The photoresist is exposed using ultraviolet light；
Developed to the photoresist using developer solution.
14. the production method of cover board according to claim 13, which is characterized in that
Before described the step of being exposed to the photoresist using ultraviolet light, further include：
In the environment of 80-150 DEG C, baking 2-10min is carried out to the photoresist；
After described the step of being developed to the photoresist using developer solution, further include：
In the environment of 150-300 DEG C, baking 10-120min is carried out to the photoresist.
15. the production method of cover board according to claim 13, which is characterized in that
The wavelength of the ultraviolet light is 320-420nm, and the intensity of the ultraviolet light is 50-2000MJ/cm2。
16. the production method of cover board according to claim 13, which is characterized in that
The pH value of the developer solution is 8-14, and development temperature is 20-40 DEG C, developing time 10-300sec.
17. the production method of cover board according to claim 12, which is characterized in that
It is described on the yellow light texture layer formed color film layer the step of, including：
Plated film film layer is formed on the yellow light texture layer using coating process；
Ink layer is formed in the plated film film layer using silk screen printing process.
18. a kind of electronic equipment, which is characterized in that the electronic equipment includes such as claim 1-11 any one of them lids
Plate or the electronic equipment include the cover board made such as claim 12-17 any one of them production methods.
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| CN112346297A (en) * | 2019-08-06 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic equipment 3D rear cover, manufacturing method of electronic equipment 3D rear cover and electronic equipment |
| CN113840493A (en) * | 2021-09-30 | 2021-12-24 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and electronic equipment |
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|---|---|
| CN108471683B (en) | 2021-04-27 |
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