CN108465952A - A kind of laser cutting head - Google Patents
A kind of laser cutting head Download PDFInfo
- Publication number
- CN108465952A CN108465952A CN201810537507.9A CN201810537507A CN108465952A CN 108465952 A CN108465952 A CN 108465952A CN 201810537507 A CN201810537507 A CN 201810537507A CN 108465952 A CN108465952 A CN 108465952A
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- laser
- cutting
- semiconductor laser
- cutting head
- nozzles
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 59
- 238000005520 cutting process Methods 0.000 claims abstract description 122
- 239000004065 semiconductor Substances 0.000 claims abstract description 76
- 230000003287 optical effect Effects 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 35
- 230000033001 locomotion Effects 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 230000005284 excitation Effects 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 21
- 239000013307 optical fiber Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003570 air Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The invention discloses a kind of laser cutting heads, including, collimate the semiconductor laser and Focused Optical system of output；The collimation output semiconductor laser includes generating the semiconductor laser of laser beam and the laser beam being adjusted the combined beam light system that conjunction beam generates the collimated laser beam of high optical brightness；The Focused Optical system includes cylinder and the focus lamp that is arranged in it, is located at the cutting nozzles of barrel front end mouth；The gas blow pipe for connecing air source is set on cylinder；Predetermined mode arrange so that the collimated laser beam of high optical brightness can be focused by Focused Optical system and form focus by the cutting nozzles wherein between Focused Optical system and the collimated laser beam；The focus can be used for material cutting under the assistance for the air pressure that the gas blow pipe and cutting nozzles generate.Laser cutting head of the present invention can directly be set up in progress material cutting in cutting bed vise, can greatly reduce cost, simplify the structure of laser cutting machine.
Description
Technical field
The invention belongs to laser cutting technique fields, are related to a kind of laser cutting head.
Background technology
High-quality since cutting speed is fast, laser cutting has become industrial trend in recent years.At present used in cutting
Laser be mainly carbon dioxide and optical fiber laser, optical fibre output semiconductor laser has also begun to a small amount of Preliminary Applications.
Include mainly laser generator, cutting bed vise and cutting head in traditional laser cutting machine.Swash in carbon dioxide
In light device cutting machine, laser beam is by transmitting mirror multiple reflections to cutting head, and then light beam is by the optical system in cutting head
Focusing is cut.In optical fiber and semiconductor laser cutting machine, laser is by optical cable transmission to cutting head, and then light beam is by cutting
Optics into focus in head is cut.Such respective outer side edges digital control platform can meet the cutting of various planks.But it passes
The cutting machine cost of system is relatively high, relatively high for the user cost of small producer and low cost operation.Therefore, one is found
Simply, at low cost, the high cutting laser of cutting efficiency is an important direction.
Invention content
It is an object of the invention to design a kind of laser cutting head, it is bright that laser output light is integrated into high-power and high-lighting
The output beam of degree is simultaneously connected directly the effective cutting for being allowed to be suitble to material with cutting head, due to not using optical fiber, does not match separately and swashs
Light cutting head simultaneously utilizes efficient semiconductor laser, is not only greatly reduced the cost of cutting machine, but also because do not use optical fiber
And system is simplified, improve reliability.
In order to achieve the above objectives, the technical scheme is that：
A kind of laser cutting head comprising, collimate the semiconductor laser and Focused Optical system of output；The collimation is defeated
It includes generating the semiconductor laser of laser beam and adjusting the laser beam to close the high optics of beam generation to go out semiconductor laser
The combined beam light system of the collimated laser beam of brightness；The Focused Optical system includes cylinder and the focus lamp that is arranged in it, position
In the cutting nozzles of barrel front end mouth；The gas blow pipe for connecing air source is set on cylinder；The wherein described Focused Optical system and the collimation
Predetermined mode arrange so that the collimated laser beam of high optical brightness can pass through Focused Optical system between laser beam
It focuses and forms focus by the cutting nozzles；The assistance for the air pressure that the focus is generated in the gas blow pipe and cutting nozzles
Under can be used for material cutting.
Preferably, the semiconductor laser is single-shot luminous point semiconductor laser or semiconductor laser arrays or folded battle array
Semiconductor laser.
Preferably, the semiconductor laser is vertical cavity launching semiconductor laser.
Preferably, the combined beam light system includes transmission and reflective optical devices.
Preferably, the semiconductor laser combined beam light system contains the optical texture of anti-light echo.
Preferably, the semiconductor laser output is single wavelength or multi-wavelength.
Preferably, the cutting nozzles insulate with laser cutting head other parts.
Further, the laser cutting head is mounted on motion, and equipped with altitude sensing unit and corresponding height-regulating
Device ensures the cutting nozzles in cutting process and is consistent by distance between cutting material.
Preferably, the motion includes two dimension or three-dimensional motion mechanism, preferably XY Cutting platforms or robot.
Also, the invention also includes the instruction light coaxially exported with focusing laser beam.
The semiconductor laser is the laser that wavelength is near-infrared.
Preferably, the type of cooling that the semiconductor laser uses is air-cooled or water cooling.
Laser cutting head of the present invention, includes the semiconductor laser and Focused Optical system of collimation output, and the collimation is defeated
It includes generating the semiconductor laser of laser beam and adjusting the laser beam to close the high optics of beam generation to go out semiconductor laser
The combined beam light system of the collimated laser beam of brightness, the Focused Optical system include focus lamp, gas blow pipe, cutting nozzles；Its
Predetermined mode carries out arranging to make the high optical brightness between middle Focused Optical system and the collimated laser beam
Collimated laser beam can be focused by Focused Optical system and form focus by the cutting nozzles；The focus is in the air blowing
Pipe can be cut under the assistance for the air-flow that cutting nozzles generate for material when inputting high pressure gas.
Laser cutting head of the present invention, includes the semiconductor laser and Focused Optical system of collimation output, and the collimation is defeated
The semiconductor laser gone out includes semiconductor laser and combined beam light element, and the Focused Optical system includes focus lamp, is blown
Tracheae, cutting nozzles；The laser of semiconductor laser output generates bloom after being adjusted and closing beam by combined beam light element
The collimated laser beam of brightness is learned, described focused by Focused Optical system is reached by the cutting nozzles by cutting material surface
High temperature nearby and in material surface is generated, when the high-speed flow for inputting high pressure gas in the gas blow pipe and being generated in cutting nozzles
When, laser cutting head in mutually moved by cutting material can complete material cutting.Wherein cutting nozzles and laser cutting head other
Part can insulate, and cutting nozzles can connect the height sensor on cutting machine by line in cutting and be used for controlling cutting
Nozzle is at a distance from by cutting material surface, to ensure in cutting process cutting nozzles and can be kept by distance between cutting material
Unanimously.
It can be more that the semiconductor laser in the semiconductor laser of output is collimated described in laser cutting head of the present invention
The semiconductor laser of a single-shot luminous point can also use the semiconductor laser of multiple arrays (so-called bar of formula) or folded configuration
Semiconductor laser.The laser package of these three types can be carried out by suitable combined beam light system on optical parameter
Adjustment and light beam conjunction beam, include the conjunction beam of the light for closing beam and polarization of multi-wavelength.Combined beam light system can have transmission, instead
It penetrates or other optical elements composition, these optical elements arranges to change optimization semiconductor laser output in a predetermined manner
Optical parameter, such as change luminous point output beam in the angle of divergence etc. of speed axial direction, can also include light in optical element
Beam shaping element.The output beam for adjusting and closing beam is the output beam of a collimation, and optical brightness allows this light beam to lead to
It is over-focusing to meet split requirement.In this laser cutting head, the semiconductor laser of vertical cavity transmitting can also be used.Also may be used
To be the combination of various packing forms.Because conjunction beam can be adjusted, the wavelength of laser used can be selected arbitrarily, such as be selected
Near-infrared wavelength is selected, it is also possible that output collimated light beam is single or multiple wavelength.The combination of multi-wavelength can be used for improving
Power.Visible light can also be imported by this method, such as feux rouges or green light, instruction light when as cutting.
The collimated output beam that the semiconductor laser of collimation output is sent out is focused by Focused Optical system.Focus optics
Include condenser lens, gas blow pipe and cutting nozzles in system.Nozzle is swashed relative to collimated laser beam by what condenser lens was formed
The position of optical focus can be adjusted as required.Gas blow pipe can connect high pressure cutting gas, such as air, oxygen, nitrogen.
When implementing to cut, the laser spot to generate high temperature near focal position by cutting material, and high pressure gas is from cutting
Nozzle generates air-flow and blows away the materials such as molten metal to achieve the purpose that punch-cuts.
In actually cutting, laser cutting head can be also mounted on two dimension or three-dimensional motion mechanism, such as XY Cutting platforms or
In robot etc., complete to cut according to set movement locus.Laser cutting head can also be with the highly sensing on laser cutting machine
Device connects, that is, connects height-regulating device, ensures that cutting nozzles are consistent with by cutting material spacing in cutting process.
The other parts of usual cutting nozzles and laser cutting head pass through the insulated with material such as ceramics, cutting in that case
The material manufactures such as nozzle red copper, at this moment cutting nozzles a function is exactly as the inductive head in height-regulating device.Cutting spray
The design of mouth shape can guarantee the sensitivity of height sensor.Semiconductor laser electro-optical efficiency is high, and good linearity, therefore
It can also can meet some requirements in cut quality by modulating frequency and the power of laser output in cutting process.
In order to which laser work is normal, laser cutting head can be furnished with suitable laser driver and refrigeration structure, such as electric cold, wind
Cold or magnetism servo-electric motor water-cooling.
It is characteristic of the invention that：
The light beam of semiconductor laser is by adjusting at directly focusing is used for material cutting, the standard of high brightness after high optical brightness
Collimated optical beam is reached by Focused Optical system by cutting material surface, and Focused Optical system has coordinated gas blow pipe and nozzle itself i.e.
Play the function of traditional cutting head.Turn due to eliminating optical fiber and dedicated laser cutting head, and as a result of high photoelectricity
The semiconductor laser of efficiency is changed, new pattern laser head of the invention can greatly reduce use cost and improve reliability.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description, which is done, briefly to be introduced, it is therefore apparent that the accompanying drawings in the following description is only the one of the present invention
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other accompanying drawings.
Fig. 1 is the structural schematic diagram of the embodiment of the present invention, in figure：Height control sensor interface etc. does not mark.
Fig. 2 is a kind of new pattern laser cutting equipment, it is illustrated that laser cutting head is combined with Cutting platform, and power supply and refrigeration are not shown
Show.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Whole description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of not making the creative labor
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 is the structural schematic diagram of the embodiment of the present invention, in figure：Height control sensor interface etc. does not mark.
Fig. 2 show a kind of new pattern laser cutting equipment, is mainly shown as the laser cutting head of the present invention is flat with cutting
Form after platform installation.
The laser cutting head of the present invention is shown in Fig. 1 comprising, it collimates the semiconductor laser 1 of output and focuses light
System 2；The collimation output semiconductor laser 1 includes generating the semiconductor laser of laser beam and by the laser beam
The combined beam light system 3 that beam generates the collimated laser beam 100 of high optical brightness is closed in adjustment；The Focused Optical system 2 includes cylinder
Body 21 and the focus lamp 22 being arranged in it are located at the cutting nozzles 23 of 21 front port of cylinder；The air blowing for connecing air source is set on cylinder 21
Pipe 24；Predetermined mode arrange so that height between the wherein described Focused Optical system 2 and the collimated laser beam 100
The collimated laser beam of optical brightness can be focused by Focused Optical system 2, focused laser beam 200 and passed through the cutting nozzles shape
At focus；The focus can be used for material cutting under the assistance for the air pressure that the gas blow pipe 24 and cutting nozzles 23 generate.
Preferably, the semiconductor laser 1 is single-shot luminous point semiconductor laser or semiconductor laser arrays or folds
Array semiconductor laser.
Preferably, the semiconductor laser 1 is vertical cavity launching semiconductor laser.
Preferably, the combined beam light system 3 includes transmission and reflective optical devices.
Preferably, the semiconductor laser combined beam light system contains the optical texture of anti-light echo.
Preferably, the semiconductor laser output is single wavelength or multi-wavelength.
Preferably, the cutting nozzles insulate with laser cutting head other parts.
Preferably, the laser cutting head is mounted on motion, and equipped with altitude sensing unit and corresponding height-regulating
Device ensures the cutting nozzles in cutting process and is consistent by distance between cutting material.The motion includes two dimension
Or three-dimensional motion mechanism, preferably XY Cutting platforms or robot.
Also, the invention also includes the instruction light coaxially exported with focusing laser beam 200.
Preferably, the semiconductor laser is the laser that wavelength is near-infrared.
Preferably, the type of cooling of the semiconductor laser is air-cooled or water cooling.
Laser cutting head of the present invention includes the semiconductor laser and Focused Optical system of collimation output, the collimation half
Conductor laser includes semiconductor laser and combined beam light system.The Focused Optical system is instead of traditional cutting
Head.Cutting nozzles can insulate with laser cutting head other parts, when laser cutting head is connect with Numerical control cutting bed and cut
Nozzle can be connect by line with the automatic leveling device in cutting bed vise.In this way the height formed is participated in by cutting nozzles
Sensing system ensures that cutting nozzles and by the constant distance on cutting material surface.
The laser of semiconductor laser output, which is adjusted and is closed after beam by combined beam light system, generates high optical brightness
Collimated laser beam focused by condenser lens in Focused Optical system and reached by cutting material by the cutting nozzles
Surface.Gas blow pipe can connect high pressure cutting gas, such as air, oxygen, nitrogen etc..
When implementing to cut, the laser spot to generate high temperature, high pressure gas near focal position by cutting material
Body generates air-flow from cutting nozzles and blows away the materials such as molten metal to achieve the purpose that punch-cuts.In this laser cutting
Semiconductor laser, which can be the semiconductor laser of multiple single-shot luminous points, in head can also use multiple arrays (so-called bar of item
Formula) semiconductor laser or folded configuration semiconductor laser.The laser package of these three types can be by suitable
Combined beam light element carries out the conjunction beam of the adjustment and light beam on optical parameter, obtains required power output.The conjunction beam
The conjunction beam of the light for closing beam and polarization including multi-wavelength.Combined beam light system can have transmission, reflection or other optical elements
Composition, these optical elements arrange to change the optical parameter of optimization semiconductor laser output in a predetermined manner, for example change
Become luminous point output beam in the angle of divergence etc. of speed axial direction, can also include beam shaping element in optical element.Such as
High brightness can be obtained by optical shaping when using bar semiconductor laser.It can also be added in combined beam light system
Optical texture or part play the function of anti-light echo.After economic cooperation beam optics system call interception and close beam light beam be one collimation output
Light beam, optical brightness allow light beam to meet split requirement by focusing.In this laser cutting head, it can also use
The semiconductor laser of vertical cavity transmitting.It can also carry out the combination of various packing forms.Because conjunction beam can be adjusted, institute
It can arbitrarily be selected with the wavelength of laser, such as select near-infrared wavelength, it is also possible that output collimated light beam is single one or more
A wavelength.The combination of multi-wavelength can be used for improving power.Visible light can also be imported by this method, such as feux rouges or green
Light, instruction light when as cutting.The focus optical that collimated output beam is connected by the semiconductor laser exported with collimation
System focuses, and Focused Optical system includes condenser lens, cutting nozzles and gas blow pipe.Position of the cutting nozzles relative to laser spot
It can be adjusted as required.Gas blow pipe can connect high pressure cutting gas, such as air, oxygen, nitrogen etc..Implementing to cut
When, laser focuses on cutting material so that generating high temperature in focal position by cutting material, high pressure gas will from cutting nozzles
The materials such as fusing metal, which are blown away, achievees the purpose that punch-cuts.
In actually cutting, laser cutting head A can be mounted on motion (two dimension is three-dimensional), such as XY Cutting platforms 10
Or robot etc. is upper (as shown in Figure 2), completes to cut according to set movement locus.Cutting nozzles in Focused Optical system with swash
The other component of light cutting head can pass through the insulated with material such as ceramics.It is described to cut when laser cutting head is connect with Numerical control cutting bed
The sensing probe of height control sensor can be functioned simultaneously as by cutting nozzle cutting nozzles, be cooperateed with cutting bed vise height controller, be led to
It crosses feedback and ensures cutting nozzles and by constant distance between cutting material.Semiconductor laser electro-optical efficiency is high, and good linearity,
Therefore it can also can meet some in cut quality by modulating frequency and the power of laser output in cutting process
It is required that.
In order to which laser work is normal, laser cutting head can be furnished with suitable laser driver and refrigeration structure, such as electric cold, wind
Cold or magnetism servo-electric motor water-cooling.
The workflow of the present invention is as follows：
In laser cutting process, the laser beam that the semiconductor laser in laser cutting head generates is by combined beam light
System is converted into the collimated output beam of high brightness, this light beam passes through condenser lens and cutting nozzles shape in Focused Optical system
At focus point, cutting nozzles and focus point distance are adjusted as required, then high pressure gas are inputted in gas blow pipe, in cutting nozzles
Place forms cutting steam, and perforation and cutting process are completed by laser cutting head and by the mutual movement between cutting material.
The present invention, with laser cutting head is combined into, is eliminated using efficient semiconductor laser and Focused Optical system
Optical fiber and special cutting head eliminate semiconductor laser and are converted to electrical efficiency damage caused by optical-fiber laser and fiber coupling
Consumption can substantially reduce the cost of material cutting, be more suitable for the demand of vast material cutting.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should be included within the scope of the present invention god.
Claims (12)
1. a kind of laser cutting head, which is characterized in that including collimating the semiconductor laser and Focused Optical system of output；Institute
It includes generating the semiconductor laser of laser beam and adjusting the laser beam to close beam production to state collimation output semiconductor laser
The combined beam light system of the collimated laser beam of raw high optical brightness；The Focused Optical system includes cylinder and is arranged poly- in it
Jiao Jing is located at the cutting nozzles of barrel front end mouth；The gas blow pipe for connecing air source is set on cylinder；The Focused Optical system and the standard
Predetermined mode arrange so that the collimated laser beam of high optical brightness can pass through focus optical between collimated excitation beam
System focuses and forms focus by the cutting nozzles；The association for the air pressure that the focus is generated in the gas blow pipe and cutting nozzles
It helps down and can be used for material cutting.
2. the laser cutting head in as described in claim 1, which is characterized in that the semiconductor laser is that single-shot luminous point is partly led
Body laser or semiconductor laser arrays or folded array semiconductor laser.
3. the laser cutting head in as described in claim 1, which is characterized in that the semiconductor laser is vertical cavity transmitting half
Conductor laser.
4. the laser cutting head in as described in claim 1, which is characterized in that the combined beam light system includes transmission and reflection
Optical element.
5. the laser cutting head in as described in claim 1, which is characterized in that the semiconductor laser combined beam light system contains
There is the optical texture of anti-light echo.
6. the laser cutting head in as described in claim 1, which is characterized in that the semiconductor laser output is single wavelength
Or multi-wavelength.
7. the laser cutting head in as described in claim 1, which is characterized in that the cutting nozzles and other portions of laser cutting head
Divide insulation.
8. the laser cutting head in as described in claim 1 or 7, which is characterized in that the laser cutting head is mounted on fitness machine
On structure, and be equipped with altitude sensing unit and corresponding height-regulating device, ensure in cutting process cutting nozzles with by cutting material
Between distance be consistent.
9. the laser cutting head in as claimed in claim 8, which is characterized in that the motion includes two dimension or three-dimensional motion
Mechanism, preferably XY Cutting platforms or robot.
10. laser cutting head as described in claim 1, which is characterized in that further include the finger coaxially exported with focusing laser beam
Show light.
11. laser cutting head as described in claim 1, which is characterized in that the semiconductor laser is that wavelength is near-infrared
Laser.
12. laser cutting head as described in claim 1, which is characterized in that the type of cooling of the semiconductor laser is wind
Cold or water cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810537507.9A CN108465952A (en) | 2018-05-30 | 2018-05-30 | A kind of laser cutting head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810537507.9A CN108465952A (en) | 2018-05-30 | 2018-05-30 | A kind of laser cutting head |
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| Publication Number | Publication Date |
|---|---|
| CN108465952A true CN108465952A (en) | 2018-08-31 |
Family
ID=63261775
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810537507.9A Pending CN108465952A (en) | 2018-05-30 | 2018-05-30 | A kind of laser cutting head |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114303686A (en) * | 2020-09-30 | 2022-04-12 | 北京振兴计量测试研究所 | Crop top advantage removing device and method |
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| CN107735206A (en) * | 2015-06-19 | 2018-02-23 | Ipg光子公司 | Include the laser cutting head of the controllable collimater with the movable lens for controlling beam diameter and/or focal position |
| EP3165489A1 (en) * | 2015-11-06 | 2017-05-10 | Saurer Germany GmbH & Co. KG | Method and device for cutting a running thread |
| CN208496087U (en) * | 2018-05-30 | 2019-02-15 | 宁波久天激光科技有限公司 | A kind of laser cutting head |
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| CN114303686A (en) * | 2020-09-30 | 2022-04-12 | 北京振兴计量测试研究所 | Crop top advantage removing device and method |
| CN114303686B (en) * | 2020-09-30 | 2023-10-20 | 北京振兴计量测试研究所 | Crop top dominance removing device and method |
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