CN108453332A - The soldering processes of amorphous state Ti-Zr-Cu-Ni solder vacuum brazing TiAl-base alloys - Google Patents

The soldering processes of amorphous state Ti-Zr-Cu-Ni solder vacuum brazing TiAl-base alloys Download PDF

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CN108453332A
CN108453332A CN201810126646.2A CN201810126646A CN108453332A CN 108453332 A CN108453332 A CN 108453332A CN 201810126646 A CN201810126646 A CN 201810126646A CN 108453332 A CN108453332 A CN 108453332A
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heated
heating rate
solder
brazing temperature
temperature
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CN108453332B (en
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蔡雨升
刘仁慈
崔玉友
杨锐
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Institute of Metal Research of CAS
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to TiAl-base alloys to be brazed field, the soldering processes of specifically a kind of amorphous state Ti Zr Cu Ni solder vacuum brazing TiAl-base alloys solve the problems such as existing amorphous state Ti Zr Cu Ni solder vacuum brazing TiAl-base alloy soldering processes research is insufficient.The solder weight percent of the present invention is Zr：25.0% 40.0%；Cu：10.0% 20.0%；Ni：10.0% 20.0%；Remaining is Ti.Preparation method：One, raw material is weighed；Two, raw material is fitted into smelting equipment and vacuumizes and pour argon gas, carry out multiple melting and cooling；Three, the master alloy after melting is subjected to the amorphous filler metal that chilling gets rid of band to get the present invention.And according to 880 DEG C 1030 DEG C, 0 120min, surface roughness (Ra)：3.2 μm 0.5 μm, solder area：More than 0 to 7cm × 7cm, solder thickness：Soldering processes more than 0 to 50 μm are brazed.The present invention optimizes and the soldering processes of supplement amorphous state Ti Zr Cu Ni solder vacuum brazing TiAl-base alloys, and abundant, valuable theoretical foundation is provided for the application of such solder.

Description

The soldering processes of amorphous state Ti-Zr-Cu-Ni solder vacuum brazing TiAl-base alloys
Technical field
The present invention relates to TiAl-base alloys to be brazed field, specifically a kind of amorphous state Ti-Zr-Cu-Ni solder vacuum brazings The soldering processes of TiAl-base alloy.
Background technology
In recent years, as the high speed development of Aeronautics and Astronautics industry also puts forward higher requirements the performance of its key member, Therefore Development of Novel high performance structures material is also extremely urgent.The tactical mobility of modern military fighter plane, short takeoff, Supersonic The excellent operational performances such as speed cruise are largely dependent upon the application of advanced high thrust-weight ratio aero-engine.Aeroplane engine Machine is the heart of aircraft, the good and bad performance for directly determining aircraft of performance.The demand for development of aero-engine is very big It is to new material, the requirement of new process in degree.Advanced new material and its relevant technique are the skills of aero-engine development Art basis.Aero-engine material therefor should have following main performance：
(1) higher thermal stability.For example, combustion chamber, guide vane and turbo blade material.
(2) enough elevated temperature strengths (or heat resistance).For example, the materials such as guide vane, turbo blade and turbine disk.
(3) enough fatigue limits.I.e.：Should have certain high temperature toughness, the pulsation of high-speed flow, engine it is violent Under audio frequency, mechanical oscillation and high-speed rotating working condition, destruction will not be produced fracture, for example, turbo blade and the turbine disk Material.
(4) higher thermal shock resistance.For example, combustion chamber, turbo blade, guide vane, after-burner material.
For aero-engine, research at this stage is concentrated mainly on its operating temperature of raising and mitigates engine components The aspect of weight two, therefore the candidate materials of Aeronautics and Astronautics aircraft engine should have " lighter, stronger and more resistant to heat " Characteristic.In recent years, there is low-density, high-melting-point, the inter-metallic compound material of high elastic modulus to progress into researcher's The visual field.These intermetallic compounds mainly have：Ti-Al systems, Fe-Al systems, Ni-Al systems and with high-melting-point, labyrinth New system intermetallic compound.In these materials, Ti-Al systems alloy just gradually receives more and more attention.According to the U.S. The research report of Aeronautics and Space Administration, arrives the year two thousand twenty, and preparing in material for engine will have 20%-25% to be closed using γ-TiAl bases Gold.The advantage of γ-TiAl-base alloy has the following：
(1) the ratio rigidity of γ-TiAl-base alloy is compared with higher by 50% than other aero-engine structural materials.This is conducive to low tone The service life of the components such as component and raising blade that gap requires；
(2) γ-TiAl-base alloy has good croop property in 600 DEG C of -750 DEG C of temperature ranges, therefore can replace Some nickel base superalloy components, to achieve the purpose that mitigate weight；
(3) fire retardancy of γ-TiAl-base alloy is excellent, therefore alternative expensive Burn-Resistant Titanium Alloy.Compared with nickel Based high-temperature alloy, γ-TiAl-base alloy can not only improve the temperature in use of combustion chamber and high temperature stressed-skin construction, but also can be big Width improves the thrust-weight ratio of jet engine.In addition, γ-TiAl-base alloy also has high specific strength, good high-temperature behavior, excellent Inoxidizability the advantages that, therefore have broad application prospects in fields such as Aeronautics and Astronautics, and substitute nickel base superalloy Ideal material.
Application of the TiAl-base alloy in engineering necessarily involves connectivity problem, at present ongoing TiAl-base alloy connection Technology mainly has electron beam weldering, Laser Welding, SHS process reaction weldering, diffusion welding (DW), friction welding (FW), soldering etc..To TiAl bases The result of study of the fusion welding method of alloy shows, although fusion welding method can be attached TiAl-base alloy itself, melts The craftsmanship of weldering is poor.This is mainly due to the essential brittleness of TiAl-base alloy, and its joint made by flame welding to be made to be also easy to produce crackle.And with it is molten Soldering method is compared, and solid-state bonding process has heat input small, and Thermal Cycle process control is relatively easy, can be with by experiment The features such as designing the Joining Technology parameter for meeting TiAl-base alloy performance characteristics, so as to improve quality of connection.Therefore both at home and abroad Solid-state is connected and carries out numerous studies, used connection method includes diffusion welding (DW), SHS process and friction welding (FW) etc..So And these solid-state bonding process have respective advantage and disadvantage, and welding satisfactory enough can be obtained without any method Connector.Such as friction welding joint form is restricted, it is difficult to connect complex-shaped component.TiAl-base alloy is spread and is connected Research shows that, joint interface brittlement phase is more, and strength of joint dispersibility is larger.Due to the company of SHS process (SHS) Connect the moment vigorous reaction feature that method itself has, the TiAl-base alloy connector porosity actually obtained is big, strength of joint Dispersion.In contrast, soldering itself have lot of advantages, such as brazing temperature it is low, on base material influence small, connector residual stress It is small, it can require to select a variety of filling metals according to connection temperature, strength of joint, metal and the xenogenesis gold for being suitble to connection infusibilized Belong to etc., so being attached TiAl-base alloy with good foreground using method for welding.Therefore scholars close TiAl bases The soldering of gold is largely studied, such as：
(1) Li little Qiang et al. is true using amorphous state Ti41.7-Zr26.7-Cu14.7-Ni13.8-Co3.1 (wt.%) alloy Sky soldering Ti-48Al-2Cr-2Nb (at.%) alloy.Result of study shows soldered fitting by Ti3Al phases and γ-Ti2Cu/ Ti2Ni phase compositions, brazing temperature and soaking time have important influence to the microscopic structure and mechanical property of soldered fitting.With The raising of brazing temperature and the extension of soaking time, the room temperature tensile properties of connector show the variation for first increasing and reducing afterwards and become Gesture.When brazing temperature is 950 DEG C, and soaking time is 5min, the maximum mechanical properties of connector are 316MPa.Crackle exists γ-Ti2Cu/Ti2Ni gets along forming core and mutually to be extended along this, and brittle fracture occurs so as to cause sample.
(2) Song Xiaoguo et al. application Ti -28Ni (wt.%) eutectic alloy vacuum brazing Ti -45Al -8.5Nb-(W, B, Y) (at.%) alloy.The result shows that soldered fitting is by Ti3Al phases, Ti2Ni phases and B2 phase compositions.The maximum shearing of soldered fitting is strong Degree is 204MPa, and soldering processes are 1100 DEG C/10min.All soldering samples show the feature of brittle fracture, and break Position is split with the increase of brazing temperature to change.
(3) Li Li et al. is using Ti-25.65Zr-13.3Cu-12.35Ni-3Co-2Mo (wt.%) vacuum brazings Ti- 47Al -2Nb -2Cr -0.15B (at.%) alloy.The result shows that with the raising of brazing temperature, connector room temperature shear strength is in Reveal the variation tendency for first increasing and reducing afterwards, maximum shear strength is 211MPa, and soldering processes are 1000 DEG C/5min.Work as survey When trying temperature less than 700 DEG C, the shear strength of soldered fitting is able to maintain that in 155MPa or more.But when test temperature is more than At 700 DEG C, shear strength is caused to drastically reduce since solid-state diffusion and serious oxidation occurring at Weld pipe mill.All samples Show the feature of brittle fracture.
(4) Song Xiaoguo et al. is using TiNi-V25 (at.%) eutectic alloy vacuum brazing Ti -42.5Al -9V -0.3Y (at.%) alloy.The experimental results showed that soldered fitting is mainly by B2 phases and τ3-Al3NiTi2Phase composition.Soldered fitting is maximum Shear strength is 196MPa, and soldering processes are 1220 DEG C/10min.Since there are brittle τ3-Al3NiTi2Phase, sample are shown Typical brittle fracture feature, and fracture position and τ3-Al3NiTi2The content of phase is related with distribution.
But in terms of the research that can be seen that current scholars from the studies above mainly concentrates three, i.e.,：Solder at Point, brazing temperature and soaking time, and other soldering processes are studied less.Further optimization soldering processes in detail can be more Add the effect for fully playing solder, to improve the performance of soldered fitting.
Invention content
For existing deficiency during above-mentioned vacuum brazing TiAl-base alloy, the object of the present invention is to provide a kind of amorphous The soldering processes of state Ti-Zr-Cu-Ni solder vacuum brazing TiAl-base alloys, it is true to solve existing amorphous state Ti-Zr-Cu-Ni solders Sky soldering TiAl-base alloy soldering processes study insufficient problem, are provided fully for application of such solder in Practical Project Theoretical foundation.
The technical scheme is that：
Before brazing, amorphous state Ti-Zr-Cu-Ni solders and the TiAl-base alloy sample to be welded of preparation is molten in petroleum ether Each 20min of ultrasonic cleaning is carried out in liquid, ethanol solution successively, to remove surface impurity, takes out drying, and close by TiAl bases The assembled in sequence of gold/solder/TiAl-base alloy is put into vacuum drying oven and is brazed in brazing jig；According to 880 DEG C -1030 DEG C, 0-120min, base material surface roughness Ra：3.2 μm -0.5 μm, solder area：More than 0 to 7cm × 7cm, solder thickness：Greatly It is brazed in 0 to 50 μm of soldering processes, brazing process vacuum degree is not less than 5 × 10-3Pa, after brazing process, stove When temperature is cooled to room temperature, brazed coupon is taken out from vacuum drying oven, to prevent sample from aoxidizing at high temperature.
Advantages of the present invention and advantageous effect are：
The purpose of the present invention is optimizing the soldering processes of amorphous state Ti-Zr-Cu-Ni solder vacuum brazing TiAl-base alloys, Solve the problems, such as existing amorphous state Ti-Zr-Cu-Ni solders vacuum brazing TiAl-base alloy soldering processes study it is insufficient, thus Application of the kind solder in Practical Project provides abundant, valuable theoretical foundation.
Description of the drawings
The displaing micro tissue topography of Fig. 1 different area solder brazing connectors：(a) it is more than 0 to 4cm × 4cm；(b)4cm×4cm- 5cm×5cm；(c) 5cm × 5cm-6cm × 6cm and (d) 6cm × 6cm-7cm × 7cm.
The displaing micro tissue topography of Fig. 2 different surface roughness base material soldered fittings：(a)3.2μm-2μm；(b)2μm-1.5μ m；(c) 1.5 μm -1 μm and 1 μm -0.5 μm of (d).
Displaing micro tissue topography after Fig. 3 different-thickness solder brazings：(a) it is more than 0 to 25 μm；(b)25μm-30μm；(c)30 μm-35μm；(d) 35 μm -40 μm and 40 μm -45 μm of (e).
Specific implementation mode
In specific implementation process, the component and content of TiAl-base alloy amorphous state Ti-Zr-Cu-Ni solders of the invention (weight percent) is Zr：25.0%-40.0%；Cu：10.0%-20.0%；Ni：10.0%-20.0%；Remaining is Ti.
1, above-mentioned TiAl-base alloy amorphous state Ti-Zr-Cu-Ni solders are prepared with technique in the steps below：
Titanium sponge, high-purity simple substance zirconium, nickel and copper that proportioning calculates are sequentially loaded into smelting furnace, in vacuum Solder master alloy ingot is smelted into arc-melting furnace.In addition in melting, argon gas is poured into vacuum chamber, can be further reduced Oxidation, scaling loss in fusion process and volatilization.In fusion process, electric arc loading current is no more than 500A.When brazing filler metal alloy fills After dividing fusing, electromagnetic agitation is used so that solder mixing is abundant；Solder after solidification is subjected at least ten remeltings, to ensure pricker Material is uniformly mixed.Component segregation in order to prevent, it is ensured that the uniformity of solder ingredient, by the brazing filler metal alloy ingot after melting in vacuum The annealing of 8-12h is carried out in heat-treatment furnace.
The solder strip of the present invention is prepared using single roller chilling method, and preparation process is as follows：
(1) it will be crushed by brazing filler metal alloy ingot made from the above method, loading is got rid of in band machine quartz ampoule；Quartz ampoule spout ruler It is very little to be：Length is a=6-8mm, width b=0.05-0.1mm；
(2) by quartz ampoule clamping in load coil, and it is 0.2- to adjust spout to copper list roller surface distance 0.3mm, it is ensured that current stabilization state is formed when injection；
(3) 1.5 × 10 are evacuated to using mechanical pump-1Pa or more, molecular pump pumping high vacuum to 3 × 10-3Pa or more, so Rear chamber is full of high-purity Ar gas；
(4) high frequency electric source is opened, after solder master alloy high-frequency induction heating to substantially uniformity is melted, keeps the temperature superheated melt 0.1-2 minutes；
(5) motor is opened, selection copper roller diameter is 220-240mm, and copper roller width is 30-50mm, and adjusts copper roller rotating speed；
(6) Ar atmospheric pressures are adjusted to 0.1-0.3MPa, are continuously sprayed the superheated melt in quartz glass tube with high pressure argon gas It is mapped to high-speed rotating cooling copper roller surface, liquid metal is made due to being formed foil shape by chilling to obtain the present invention Strip solder；
Use chilling amorphous filler metal foil thickness prepared by above-mentioned technique for 0.050 ± 0.004mm, and any surface finish, Both sides are smooth.
2, the soldering processes optimization of amorphous state Ti-Zr-Cu-Ni solders vacuum brazing TiAl-base alloy
According to《11363.2008 soldering joint strength test methods of GB/T》Requirement, surface roughness is now subdivided into 4 A grade, respectively：Ra：3.2μm-2μm、Ra：2μm-1.5μm、Ra：1.5 μm -1 μm and Ra：1 μm -0.5 μm, as surface is thick The reduction of rugosity numerical value, base material surface smoothness are gradually increased.Before brazing, solder is processed into the solder of 4 kinds of different sizes, Solder area is：More than 0 to 4cm × 4cm, 4cm × 4cm-5cm × 5cm, 5cm × 5cm-6cm × 6cm and 6cm × 6cm-7cm × 7cm (brazed coupon size is M10mm × Φ 5mm).Then solder thickness is handled, solder thickness is：More than 0 to 25 μm, 25 μm -30 μm, 30 μm -35 μm, 35 μm -40 μm, 40 μm -45 μm and 45 μm -50 μm.
3, it is brazed
When due to soldering, the quality of specimen surface is to brazing process and joint performance important, therefore, by weldering sample The surface of product need to be through handling as follows：Grinding machine corase grinding → grinding machine fine grinding → surface polishing → petroleum ether solution ultrasonic oscillation cleaning (removal surface and oil contaminant and adsorbing contaminant) → alcohol rinse, drying.Solder is placed in two TiAl alloy brazed coupons, and is adopted Clamping is carried out with special fixture.Then, the fixture assembled is put into vacuum drying oven and is welded.Brazing process vacuum degree is not low In 5 × 10-3Sample is heated to 800 DEG C by Pa with the heating rate of 10 DEG C/min-15 DEG C/min first, after keeping the temperature 10min clocks, It is heated to brazing temperature with the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -1030 DEG C, soaking time is 0-120min.After brazing process, when furnace temperature is cooled to room temperature, brazed coupon is taken out from vacuum drying oven, to prevent sample It aoxidizes at high temperature.
4, the microscopic structure of soldered fitting after different soldering processes are brazed
From figure 1 it appears that with the increase of solder area, the thickness in remaining solder region shows first to reduce to be risen afterwards High variation tendency, and the content of its Oxford gray phase also shows such variation tendency.Soldered fitting microscopic structure this Kind variation, causes soldered fitting room temperature tensile properties also to show similar variation tendency.Therefore, according to above-mentioned experiment knot Fruit, amorphous state Ti-Zr-Cu-Ni solders area used by vacuum brazing TiAl-base alloy are most with 5cm × 5cm-6cm × 6cm Good, the maximum mechanical properties of soldered fitting are 320MPa at this time.
Brazing process includes mainly fusing, soaks and sprawl, spreads and react 3 stages.The performance of soldered fitting depends on Diffusion between base material and solder and reaction process, and spread and then depend on the wetting of solder with reaction process and sprawled Journey.Therefore, liquid solder base material surface wetting and sprawl process be soldered fitting obtain superperformance premise.General feelings Under condition, the wetability of the more coarse liquid solder in base material surface is better.This is because the ditch gap increase pair of base material rough surface injustice The capillarity of molten solder, and the wall in this hair gap gap is the basis that nucleus is formed and grown during crystallisation by cooling, It is advantageous to crystallization nucleation.Coarse surface also increases base material simultaneously and liquid solder contacts with each other area, and soldering is made to be changed It is kind.But base material surface is excessively coarse to will also result in the uneven of solder distribution, to be unfavorable for carrying for soldered fitting performance It rises.Influence therefore, it is necessary to study base material surface roughness to brazing property.According to《11363.2008 soldered fittings of GB/T Strength Testing Methods》Requirement, soldering base material surface roughness should be 3.2 μm, so with this standard as benchmark, now by surface Roughness is subdivided into 4 grades, respectively：3.2 μm -2 μm, 2 μm -1.5 μm, 1.5 μm -1 μm and 1 μm -0.5 μm, with surface The reduction of roughness value, base material surface smoothness are gradually increased.Fig. 2 is to be brazed to connect after the base material of different surface roughness is brazed The displaing micro tissue topography of head.Comparison diagram 2 (a)-(d) is it can be found that soldered fitting can significantly be divided into two regions, respectively Diffusion region (I) and remaining solder area (II), as shown in Fig. 2 (d).Can significantly it find out from Fig. 2, with base material surface light The boundary in the raising of cleanliness, the form of soldered fitting and each region is also more neat.This microscopic structure shape of soldered fitting State also leads to the change of its tensile property.With the raising of base material surface smoothness, the tensile property of soldered fitting shows elder generation The variation tendency reduced after raising.Therefore, when base material surface roughness is 1.5 μm -1 μm, the wetting between solder and base material Reach best state with the process of sprawling, room temperature tensile properties also reach maximum value 354MPa.
The thickness in remaining solder area is can be seen that by above-mentioned experimental result and the content of wherein grey form and aspect connects soldering The performance of head has a direct impact.In other words, if the content of remaining solder area and wherein grey phase is lower, brazing property is just It can be higher.Therefore, under the premise of solder area determines, it is necessary to the thickness of solder is studied, so that it is determined that best Solder thickness.Fig. 3 is the displaing micro tissue topography of soldered fitting after different-thickness solder vacuum brazing.Comparison diagram 3 (a)-(e) can be with Find out, with the raising of solder thickness, the width in remaining solder area is substantially reduced, and the content of wherein grey form and aspect also obviously drops It is low.Since the microscopic structure in remaining solder area generates such variation, the room temperature tensile properties of soldered fitting also will necessarily be with Change.With gradually increasing for solder thickness, the room temperature tensile properties of soldered fitting show the variation for first increasing and reducing afterwards Trend.Therefore, when solder thickness is 35 μm -40 μm, soldered fitting can obtain best tensile property.
In the following, being further elaborated on to the present invention by embodiment.
Before brazing, amorphous state Ti-Zr-Cu-Ni solders and the TiAl-base alloy sample to be welded of preparation is molten in petroleum ether Each 10-30min of ultrasonic cleaning is carried out in liquid, ethanol solution successively, to remove surface impurity, takes out drying, and press TiAl bases The assembled in sequence of alloy/solder/TiAl-base alloy is put into vacuum drying oven and is brazed in brazing jig.
Soldering processes 1, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 2, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 3, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 4, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 5, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 6, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 7, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 8, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 9, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 10, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 11, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 12, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 13, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 14, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 15, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 16, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 17, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 18, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 19, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 20, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 21, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 22, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 23, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 24, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 25, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 26, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 27, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 28, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 29, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 30, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 31, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 32, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 33, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 34, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 35, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 36, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 37, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 38, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 39, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 40, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 41, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 42, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 43, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 44, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 45, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 46, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 47, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 48, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 49, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 50, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 51, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 52, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 53, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 54, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 55, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 56, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 57, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 58, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 59, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 60, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 61, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 62, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 63, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 64, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 65, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 66, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 67, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 68, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 69, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 70, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 71, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 72, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 73, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 74, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 75, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 76, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min.
Soldering processes 77, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 78, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 79, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 80, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 0-60min.
Soldering processes 81, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 82, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 83, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 84, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 85, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, pricker Expect that thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 86, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 87, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 88, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 89, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 90, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm × 4cm-5cm × 5cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 91, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 92, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 93, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 94, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 95, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm × 5cm-6cm × 6cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 96, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 97, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 98, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 99, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm × 6cm-7cm × 7cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 100, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 101, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 102, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 103, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 104, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 105, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 106, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 107, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 108, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 109, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 110, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 111, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 112, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 113, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 114, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 115, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 116, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 117, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 118, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 119, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 120, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 121, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 122, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 123, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 124, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 125, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 126, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 127, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 128, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 129, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 130, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 131, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 132, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 133, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 134, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 135, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 136, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 137, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 138, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 139, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 140, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 141, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 142, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 143, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 144, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 145, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, Soaking time is 60-120min.
Soldering processes 146, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 147, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 148, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 149, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 150, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 151, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 152, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 153, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 154, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 155, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 156, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C- 955 DEG C, soaking time 60-120min.
Soldering processes 157, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 158, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 159, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 160, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 880 DEG C -955 DEG C, soaking time 60-120min.
Soldering processes 161, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 0-60min.
Soldering processes 162, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 163, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 164, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 165, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 166, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 167, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 168, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 169, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 170, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 171, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 172, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 173, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 174, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 175, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 176, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 177, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 178, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 179, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 180, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 181, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 0-60min.
Soldering processes 182, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 183, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 184, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 185, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 186, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 187, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 188, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 189, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 190, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 191, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 192, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 193, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 194, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 195, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 196, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 197, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 198, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 199, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 200, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 201, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 0-60min.
Soldering processes 202, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 203, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 204, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 205, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 206, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 207, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 208, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 209, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 210, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 211, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 212, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 213, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 214, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 215, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 216, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 217, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 218, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 219, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 220, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 221, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 0-60min.
Soldering processes 222, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 223, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 224, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 225, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 0-60min.
Soldering processes 226, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 227, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 228, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 229, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 230, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 231, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 232, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 233, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 234, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 235, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 236, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 237, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 238, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 239, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 240, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 0-60min.
Soldering processes 241, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 60-120min.
Soldering processes 242, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 243, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 244, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 245, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 246, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 247, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 248, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 249, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 250, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 251, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 252, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 253, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 254, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 255, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 256, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 257, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 258, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 259, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 260, base material surface roughness are Ra：3.2 μm -2 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 261, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 60-120min.
Soldering processes 262, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 263, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 264, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 265, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 266, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 267, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 268, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 269, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 270, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 271, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 272, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 273, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 274, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 275, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 276, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 277, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 278, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 279, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 280, base material surface roughness are Ra：2 μm -1.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 281, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 60-120min.
Soldering processes 282, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 283, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 284, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 285, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 286, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 287, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 288, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 289, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 290, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 291, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 292, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 293, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 294, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 295, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 296, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 297, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 298, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 299, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 300, base material surface roughness are Ra：1.5 μm -1 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 301, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：More than 0 to 25 μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, is protected After warm 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, soaking time 60-120min.
Soldering processes 302, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 303, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 304, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 305, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：More than 0 to 4cm × 4cm, Solder thickness is：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, heat preservation After 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C -1030 DEG C, Soaking time is 60-120min.
Soldering processes 306, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 307, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 308, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 309, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 310, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：4cm×4cm-5cm× 5cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 311, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 312, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 313, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 314, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 315, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：5cm×5cm-6cm× 6cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 316, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：More than 0 to 25 μm.Sample is heated to 800 with the heating rate of 10 DEG C/min-15 DEG C/min first DEG C, after keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 317, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：25μm-30μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 318, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：30μm-35μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 319, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：35μm-40μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
Soldering processes 320, base material surface roughness are Ra：1 μm -0.5 μm, solder area is：6cm×6cm-7cm× 7cm, solder thickness are：40μm-45μm.Sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min first, After keeping the temperature 10min clocks, brazing temperature is heated to the heating rate of 15 DEG C/min-20 DEG C/min, brazing temperature is 955 DEG C- 1030 DEG C, soaking time 60-120min.
By being carried out to the soldering processes of above-mentioned optimization research shows that：
(1) with the increase of solder area, the room temperature tensile properties of soldered fitting show the variation for first increasing and reducing afterwards Trend.When solder area is 5cm × 5cm-6cm × 6cm, the tensile strength of soldered fitting is up to 320MPa.
(2) to base material surface different roughness the study found that when surface roughness is increased to 0.5 μm by 3.2 μm, pricker The room temperature tensile properties of plumb joint show the variation tendency for first increasing and reducing afterwards.When surface roughness is 1.5 μm -1 μm, pricker The room temperature tensile properties of plumb joint reach maximum value 354MPa.
(3) by solder thickness the study found that with solder thickness raising, Ti elements are dense between solder and base material There are a critical values for degree, show two different paths so as to cause the diffusion of Ti elements.When solder thickness is less than 35 μm When, Ti elements are diffused from base material into solder；When solder thickness is more than 35 μm, the Ti elements in solder are transferred to base material In be diffused.When solder thickness is 35 μm -40 μm, the room temperature tensile properties of soldered fitting reach maximum value 368MPa.

Claims (5)

1. a kind of soldering processes of amorphous state Ti-Zr-Cu-Ni solders vacuum brazing TiAl-base alloy, which is characterized in that be brazed Before, by amorphous state Ti-Zr-Cu-Ni solders and the TiAl-base alloy sample to be welded of preparation in petroleum ether solution, ethanol solution according to Secondary progress each 10-30min of ultrasonic cleaning takes out drying, and press TiAl-base alloy/solder/TiAl bases to remove surface impurity The assembled in sequence of alloy is put into vacuum drying oven and is brazed in brazing jig；According to 880 DEG C -1030 DEG C, 0-120min, mother Material surface roughness Ra：3.2 μm -0.5 μm, solder area：More than 0 to 7cm × 7cm, solder thickness：Pricker more than 0 to 50 μm Welding is brazed, and brazing process vacuum degree is not less than 5 × 10-3Pa, after brazing process, furnace temperature is cooled to room temperature When, brazed coupon is taken out from vacuum drying oven, to prevent sample from aoxidizing at high temperature.
2. the soldering processes of amorphous state Ti-Zr-Cu-Ni solders vacuum brazing TiAl-base alloy described in accordance with the claim 1, It is characterized in that, base material surface roughness is subdivided into 4 grades, respectively：Ra：3.2μm-2μm、Ra：2μm-1.5μm、Ra： 1.5 μm -1 μm or Ra：1 μm -0.5 μm, with the reduction of surface roughness value, base material surface smoothness is gradually increased；In pricker Before weldering, solder is processed into the solder of 4 kinds of different sizes, solder area is：More than 0 to 4cm × 4cm, 4cm × 4cm-5cm × 5cm, 5cm × 5cm-6cm × 6cm or 6cm × 6cm-7cm × 7cm；Then solder thickness is handled, solder thickness is：Greatly In 0 to 25 μm, 25 μm -30 μm, 30 μm -35 μm, 35 μm -40 μm, 40 μm -45 μm or 45 μm -50 μm.
3. according to the solderer of amorphous state Ti-Zr-Cu-Ni solders vacuum brazing TiAl-base alloy as claimed in claim 1 or 2 Skill, which is characterized in that using one of following soldering processes：
(1) sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min, after keeping the temperature 10min clocks, with 15 DEG C/ The heating rate of min-20 DEG C/min is heated to brazing temperature, and brazing temperature is 880 DEG C -955 DEG C, soaking time 0-60min；
(2) sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min, after keeping the temperature 10min clocks, with 15 DEG C/ The heating rate of min-20 DEG C/min is heated to brazing temperature, and brazing temperature is 880 DEG C -955 DEG C, soaking time 60- 120min；
(3) sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min, after keeping the temperature 10min clocks, with 15 DEG C/ The heating rate of min-20 DEG C/min is heated to brazing temperature, and brazing temperature is 955 DEG C -1030 DEG C, soaking time 0- 60min；
(4) sample is heated to 800 DEG C with the heating rate of 10 DEG C/min-15 DEG C/min, after keeping the temperature 10min clocks, with 15 DEG C/ The heating rate of min-20 DEG C/min is heated to brazing temperature, and brazing temperature is 955 DEG C -1030 DEG C, soaking time 60- 120min。
4. the soldering processes of amorphous state Ti-Zr-Cu-Ni solders vacuum brazing TiAl-base alloy described in accordance with the claim 1, It is characterized in that, amorphous state Ti-Zr-Cu-Ni solders are using one of following ingredient and content：
(1) solder Zr by weight percentage：25.0%-30.0%；Cu：10%-15%, Ni：10%-15%；Remaining is Ti；
(2) solder Zr by weight percentage：25.0%-30.0%；Cu：10%-15%, Ni：15%-20%；Remaining is Ti；
(3) solder Zr by weight percentage：25.0%-30.0%；Cu：15%-20%, Ni：10%-15%；Remaining is Ti；
(4) solder Zr by weight percentage：25.0%-30.0%；Cu：15%-20%, Ni：15%-20%；Remaining is Ti；
(5) solder Zr by weight percentage：30.0%-35.0%；Cu：10%-15%, Ni：10%-15%；Remaining is Ti；
(6) solder Zr by weight percentage：30.0%-35.0%；Cu：10%-15%, Ni：15%-20%；Remaining is Ti；
(7) solder Zr by weight percentage：30.0%-35.0%；Cu：15%-20%, Ni：10%-15%；Remaining is Ti；
(8) solder Zr by weight percentage：30.0%-35.0%；Cu：15%-20%, Ni：15%-20%；Remaining is Ti；
(9) solder Zr by weight percentage：35.0%-40.0%；Cu：10%-15%, Ni：10%-15%；Remaining is Ti；
(10) solder Zr by weight percentage：35.0%-40.0%；Cu：10%-15%, Ni：15%-20%；Remaining is Ti；
(11) solder Zr by weight percentage：35.0%-40.0%；Cu：15%-20%, Ni：10%-15%；Remaining is Ti；
(12) solder Zr by weight percentage：35.0%-40.0%；Cu：15%-20%, Ni：15%-20%；Remaining is Ti.
5. according to the solderer of the amorphous state Ti-Zr-Cu-Ni solder vacuum brazing TiAl-base alloys described in claim 1 or 4 Skill, which is characterized in that the preparation method of amorphous state Ti-Zr-Cu-Ni solders includes the following steps：
(1) titanium sponge, high-purity simple substance zirconium, nickel and copper that proportioning calculates are sequentially loaded into smelting furnace, in vacuum electric It is smelted into solder master alloy ingot in arc smelting furnace, in melting, argon gas is poured into vacuum chamber, is further reduced in fusion process Oxidation, scaling loss and volatilization, in fusion process, electric arc loading current be no more than 500A make after brazing filler metal alloy fully melts With electromagnetic agitation so that solder mixing is abundant；Solder after solidification is subjected at least ten remeltings, the mixing to ensure solder is equal It is even, component segregation in order to prevent, it is ensured that the uniformity of solder ingredient, by the brazing filler metal alloy ingot after melting in vacuum heat treatment furnace Carry out the annealing of 8-12h；
(2) it will be crushed by brazing filler metal alloy ingot made from the above method, loading is got rid of in band machine quartz ampoule；Quartz ampoule jet size For：Length is a=6-8mm, width b=0.05-0.1mm；
(3) by quartz ampoule clamping in load coil, and it is 0.2-0.3mm to adjust spout to copper list roller surface distance, really Current stabilization state is formed when protecting injection；
(4) 1.5 × 10 are evacuated to using mechanical pump-1Pa or more, molecular pump pumping high vacuum to 3 × 10-3Pa or more, then cavity Full of high-purity Ar gas；
(5) high frequency electric source is opened, after solder master alloy high-frequency induction heating to substantially uniformity is melted, keeps the temperature superheated melt 0.5- 2 minutes；
(6) motor is opened, selection copper roller diameter is 220-240mm, and copper roller width is 30-50mm, and adjusts copper roller rotating speed；
(7) Ar atmospheric pressures are adjusted to 0.1-0.3MPa, are continuously ejected into the superheated melt in quartz glass tube with high pressure argon gas High-speed rotating cooling copper roller surface, liquid metal are used in the present invention to obtain due to being formed foil shape by chilling Amorphous ribbon solder, amorphous filler metal foil thickness is 0.050 ± 0.004mm, and any surface finish, both sides are smooth.
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