CN108449896A - Electronic equipment and preparation method thereof - Google Patents
Electronic equipment and preparation method thereof Download PDFInfo
- Publication number
- CN108449896A CN108449896A CN201810203485.2A CN201810203485A CN108449896A CN 108449896 A CN108449896 A CN 108449896A CN 201810203485 A CN201810203485 A CN 201810203485A CN 108449896 A CN108449896 A CN 108449896A
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- China
- Prior art keywords
- hinge
- shell
- noumenon
- fixing structure
- electronic equipment
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0226—Hinges
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0247—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings comprising more than two body parts
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Present disclose provides a kind of electronic equipment.The electronic equipment includes：Hinge, and pass through the hinged the first noumenon and the second ontology；Wherein, the first noumenon includes：Stamping forming shell；And the hinge fixing structure positioned at the surface of shell comprising be molded in the hinge mounts of the surface of shell, wherein the hinge is fixedly connected by the hinge fixing structure with the first noumenon.The disclosure additionally provides the preparation method of a kind of electronic equipment.
Description
Technical field
This disclosure relates to a kind of electronic equipment and preparation method thereof.
Background technology
With the continuous development of electronics techniques, new technology is constantly added into the preparation of electronic equipment, to change
The appearance precision and stability of kind electronic equipment.
In realizing process of the present invention, inventor has found that at least there are the following problems in the prior art：Existing electronics is set
Standby hinge fixing structure is that rear pressure welding is prepared separately in electronic equipment casing, and the method is limited due to the technique of pressure welding technology
System, causes the fixation tolerance of hinge fixing structure larger, it is difficult to ensure the demand of Product Precision, and be generally considered that tolerance, meeting
The space of redundancy is reserved to the fixation of hinge, this is necessarily unfavorable for the design of electronics miniaturization.
Invention content
The first aspect of the disclosure provides a kind of electronic equipment.The electronic equipment includes hinge and is connected by the hinge
The first noumenon and the second ontology connect.Wherein, the first noumenon includes：Stamping forming shell；And it is located at the surface of shell
Hinge fixing structure, which includes the hinge mounts for being molded in the surface of shell；The hinge
Chain is fixedly connected by the hinge fixing structure with the first noumenon.
Optionally, above-mentioned hinge fixing structure further includes one or more positioning columns, the one or more positioning column and institute
Hinge mounts integrated molding is stated, to limit position of the hinge relative to the first noumenon.
Optionally, the surface for being injection molded with the shell of the hinge mounts has nano micropore structure,
So as to be injection molded with the hinge mounts of part in the micropore of the nano micropore structure.
Optionally, above-mentioned hinge fixing structure further includes one or more thread bush, so that the hinge and described first
Ontology is threadedly coupled；And above-mentioned hinge mounts are molded in the outer edge of the thread bush.
Optionally, above-mentioned shell includes metal material, and the hinge mounts include rubber material.
The second aspect of the disclosure provides the preparation method of a kind of electronic equipment, and the electronic equipment includes hinge, with
And pass through the hinged the first noumenon and the second ontology.Wherein, the preparation method of the electronic equipment includes：It strikes out
The shell of the first noumenon described in type；And the hinge mounts in the surface of shell injection molding hinge fixing structure.Its
In, the hinge is fixedly connected by the hinge fixing structure with the first noumenon.
Optionally, above-mentioned hinge fixing structure includes：It is integrally formed one or more fixed with the hinge mounts
Position column, to limit position of the hinge relative to the first noumenon.
Optionally, in the preparation method of above-mentioned electronic equipment, in the surface of shell injection molding hinge fixing structure
Further include before hinge mounts：The shell is pre-processed, so that the surface of the shell forms nano micropore structure.
Optionally, above-mentioned hinge fixing structure further includes one or more thread bush, so that the hinge and described first
Ontology is threadedly coupled；And the hinge mounts of above-mentioned hinge fixing structure are molded in the outer edge of the thread bush.
Optionally, above-mentioned shell includes metal material, and the hinge mounts include rubber material.
Description of the drawings
In order to which the disclosure and its advantage is more fully understood, referring now to being described below in conjunction with attached drawing, wherein：
Fig. 1 is diagrammatically illustrated using the application scenarios according to the electronic equipment of the embodiment of the present disclosure and preparation method thereof
Figure；
Fig. 2 diagrammatically illustrates the part-structure schematic diagram of the first noumenon in the electronic equipment according to the embodiment of the present disclosure；
Fig. 3 A diagrammatically illustrate the structural schematic diagram with reference to the hinge fixing structure first angle of the first noumenon in figure 2；
Fig. 3 B diagrammatically illustrate the structural schematic diagram with reference to the hinge fixing structure second angle of the first noumenon in figure 2；
Fig. 4 is diagrammatically illustrated to be fixed according to the injection molding of embodiment of the present disclosure formation hinge with reference to shown in figure 3A~Fig. 3 B
Using the part-structure schematic diagram of mold when structure；
Fig. 5 is diagrammatically illustrated according to the hinge mounts of the embodiment of the present disclosure and showing for the first noumenon housing junction
Micro- enlarged drawing；
Fig. 6 diagrammatically illustrates the preparation method of the electronic equipment according to the embodiment of the present disclosure；
Fig. 7 diagrammatically illustrates the preparation method of the electronic equipment according to another embodiment of the disclosure.
Specific implementation mode
Hereinafter, will be described with reference to the accompanying drawings embodiment of the disclosure.However, it should be understood that these descriptions are only exemplary
, and it is not intended to limit the scope of the present disclosure.In addition, in the following description, descriptions of well-known structures and technologies are omitted, with
Avoid unnecessarily obscuring the concept of the disclosure.
Term as used herein is not intended to limit the disclosure just for the sake of description specific embodiment.It uses herein
The terms "include", "comprise" etc. show the presence of the feature, step, operation and/or component, but it is not excluded that in the presence of
Or other one or more features of addition, step, operation or component.
There are all terms (including technical and scientific term) as used herein those skilled in the art to be generally understood
Meaning, unless otherwise defined.It should be noted that term used herein should be interpreted that with consistent with the context of this specification
Meaning, without should by idealization or it is excessively mechanical in a manner of explain.
It, in general should be according to this using " in A, B and C etc. at least one " such statement is similar to
Field technology personnel are generally understood the meaning of the statement to make an explanation (for example, " with system at least one in A, B and C "
Should include but not limited to individually with A, individually with B, individually with C, with A and B, with A and C, with B and C, and/or
System etc. with A, B, C).Using " in A, B or C etc. at least one " such statement is similar to, it is general come
Say be generally understood the meaning of the statement to make an explanation (for example, " having in A, B or C at least according to those skilled in the art
One system " should include but not limited to individually with A, individually with B, individually with C, with A and B, with A and C, have
B and C, and/or system etc. with A, B, C).It should also be understood by those skilled in the art that substantially arbitrarily indicating two or more
The adversative conjunction and/or phrase of optional project shall be construed as either in specification, claims or attached drawing
It gives including one of these projects, the possibility of these projects either one or two projects.For example, phrase " A or B " should
It is understood to include the possibility of " A " or " B " or " A and B ".
Embodiment of the disclosure provides a kind of electronic equipment and preparation method thereof.The electronic equipment includes hinge, with
And pass through the hinged the first noumenon and the second ontology.Wherein, the first noumenon include stamping forming shell with
And the hinge fixing structure positioned at the surface of shell.The hinge fixing structure includes the hinge for being molded in the surface of shell
Chain fixed pedestal, and the hinge is fixedly connected by the hinge fixing structure with the first noumenon.
In accordance with an embodiment of the present disclosure, compared to traditional electronic equipment, the electronic equipment of the disclosure is by Sheet Metal Forming Technology+note
Modeling moulding process is formed, and specifically, the pedestal in hinge fixing structure is molded in surface of shell, and in unconventional process
Pressure welding, therefore at least part of fixed error for reducing fixed pedestal and the first noumenon shell, so as to be reduced to consolidating for hinge
Fixed and reserved redundant space is convenient for the Miniaturization Design of electronic equipment；The shell of the first noumenon be it is stamping forming, compared to
Traditional milling moulding process, can reduce the manufacturing cost of electronic equipment.
Fig. 1 diagrammatically illustrates the application scenarios according to the electronic equipment of the embodiment of the present disclosure and preparation method thereof.
As shown in Figure 1, the application scenarios include terminal device 100.
The terminal device 100 can be the various electronic equipments with hinge arrangement.
The terminal device 100 can be the portable device for having display screen, such as net book, portable computer, intelligence
Energy mobile phone, smartwatch or electronic dictionary etc..
Various telecommunication customer end applications, such as the application of shopping class, web browser can be installed on the terminal device 100
Using (merely illustrative) such as, searching class application, instant messaging tools, mailbox client, social platform softwares.
As shown in Figure 1, the terminal device 100 includes the first noumenon 110, the second ontology 120, and connect the first noumenon
110 and second ontology 120 hinge 130.The number of the hinge 130 and position can be set according to actual demand.
Wherein, the first noumenon 110 and the second ontology 120 can have recessed hinge, in the first noumenon 110 and the second ontology
120 via hinge 130 when connecting, and the position of the recessed hinge of two ontologies is corresponding, and hinge 130 is placed in the position of the recessed hinge
It sets.
Wherein, the first noumenon 110 can for example have shell and display screen, and the shell is for embedded fixed described aobvious
Display screen.
The first noumenon can also have hinge fixing structure, hinge to be connect with the first noumenon by the hinge fixing structure.
Likewise, the second ontology 120 can also be equipped with similar hinge fixing structure, with connects hinge and the second ontology.
Hinge fixing structure includes hinge mounts and thread bush etc., and hinge mounts limit hinge and first
The link position of the ontology of body/second, thread bush is for making the first noumenon and/or the second ontology and hinge pass through bolt, screw etc.
Realize dismountable connection.
In accordance with an embodiment of the present disclosure, the hinge 130 for example may include shaft, so that the first noumenon can be around this turn
Shaft rotation is dynamic, to change its angle between the second ontology.Angular range between the first noumenon and the second ontology is for example
It can be 0 °~360 °.
Specifically, in the prior art, in order to connect the hinge 130 and the first noumenon 110, it will usually molding hinge will be prepared
The pressure welding of chain fixed pedestal is on the shell of the first noumenon, so that hinge connects via the hinge mounts and the first noumenon
It connects.But since the technique of pressure welding technology limits, position of the hinge mounts on the shell of the first noumenon and the separate hinge
The distance between edge of recessed hinge of chain fixed structure has certain tolerance, usually +/- 0.1mm.
Furthermore positioning column can be also riveted in the hinge mounts of the first noumenon, for being located at recessed hinge to hinge
In position be defined, but it should be recognized that due to the limitation of traditional riveting process, which fixes base with hinge
The Edge Distance of seat has certain riveting tolerance, which is about +/- 1.5mm, this undoubtedly can be located at hinge to hinge
Band of position in key way carrys out error.
The cumulative limit of above two tolerance is about 0.25mm, therefore when designing electronic equipment, due to above-mentioned accumulation public affairs
The design of difference, usual hinge well width can be more than hinge length, and to reserve the space of redundancy to the fixation of hinge, this will necessarily not
Conducive to the design of electronics miniaturization.For example, in the prior art after hinge is set to recessed hinge, hinge and hinge groove edge
Gap be about 0.8 ± 0.5mm.
In order to reduce such cumulative limit, in the prior art generally use milling process so that the shell of the first noumenon with should
Hinge mounts are integrally formed, and the milling grown are needed very much to wash the time in the milling process, therefore to wash cost very high for milling.
It should be understood that the terminal equipment type in Fig. 1 is only schematical.According to needs are realized, can have arbitrary
The terminal device of type.
Fig. 2 diagrammatically illustrates the part-structure schematic diagram of the first noumenon in the electronic equipment according to the embodiment of the present disclosure.
In order to avoid above-mentioned tolerance and cost is reduced, in accordance with an embodiment of the present disclosure, with reference to the first noumenon 110 in figure 1
It may include shell 111 as shown in Figure 2 and the hinge fixing structure 112 positioned at the surface of shell.
Wherein, which has recessed hinge 1110, to be arranged as referred to hinge shown in FIG. 1 in the recessed hinge 1110
Chain 130 enables the first noumenon 110 of the electronic equipment to be rotated relative to the second ontology 120 by the hinge 130.
Wherein, which is stamping forming, i.e., depended on pressure machine and mold apply external force to plank, and plank is made to generate
Deformation or separation obtain hull shape as illustrated with reference to fig. 2.Since the shell is stamping forming, shell has wall
The advantages that thin, light weight, rigidity are good and surface quality is high.
The material of the shell 111 can be ABS engineering plastics, metal material, carbon fibre material etc., and wherein metal material can
Think the material with outstanding intensity, scratch resistance degree and lighter weight such as aluminium alloy, magnesium alloy, titanium alloy.
Wherein, hinge fixing structure 112 includes hinge mounts, which is molded in reference chart
The surface of shell 111 shown in 2.
Wherein, the material of the hinge mounts can be plastic cement, such as ABS, PP, PVC and PC etc..
Specifically, the hinge mounts that the hinge fixing structure of the surface of shell of the first noumenon 110 includes, by
The mold matched is formed in surface of shell using injection molding technology.
In accordance with an embodiment of the present disclosure, above-mentioned hinge fixing structure may also be disposed on the surface of shell of the second ontology 120, with
Make hinge pass through the hinge fixing structure to connect with the second ontology.
Hinge mounts of the above-described embodiment due to forming surface of shell using injection molding technology, mismachining tolerance are note
Therefore compared to bond technology, processing can be obviously reduced in the tolerance of the mold used in modeling forming technique, about +/- 0.05mm
Error to be conducive to the Miniaturization Design of electronic equipment, and avoids milling and washes technique, therefore, compared to milling technology, can have
Effect reduces manufacturing cost.
Fig. 3 A diagrammatically illustrate the structural schematic diagram with reference to the hinge fixing structure first angle of the first noumenon in figure 2；
Fig. 3 B diagrammatically illustrate the structural schematic diagram with reference to the hinge fixing structure second angle of the first noumenon in figure 2；Fig. 4 is schematic
Show according to the injection molding of the embodiment of the present disclosure formed with reference to shown in figure 3A~Fig. 3 B when hinge fixing structure using mold
Part-structure schematic diagram.
As shown in Fig. 3 A~Fig. 3 B, which includes hinge mounts 1120.It is understood that
Shape with reference to figure 3A~Fig. 3 B hinge mounts 1120 described is merely illustrative, and the disclosure is defined not to this, this
Field technology personnel can be provided with hinge mounts of different shapes according to the electronic equipment of different type even different model.
When being formed such as the hinge mounts 1120 with reference to shown in figure 3A~Fig. 3 B using injection molding technology, such as can
It is carried out using injection mold 400 as shown in Figure 4.
Specifically, when carrying out injection molding process, will with reference to figure 2 in stamping forming shell 111 be fixed on the note
After mould 400, by pressurization the raw material (materials of hinge mounts) of melting can be injected the injection mold surface with
The corresponding region in position of the hinge mounts after the completion of implant operation, can be obtained ginseng via operations such as cooling, disengagings
Examine structure shown in Fig. 2, wherein hinge fixing structure is the structure with reference to shown in figure 3A~Fig. 3 B.
In accordance with an embodiment of the present disclosure, as shown in Fig. 3 A~Fig. 3 B, the hinge fixing structure 112 can also include one or
Multiple positioning columns 1121.
Correspondingly, location hole corresponding with the positioning column 1121 should be provided with reference to the hinge 130 in figure 1, in the hinge
When chain 130 is placed in reference in the recessed hinge 1110 in figure 2, which should be inserted in the location hole, to limit hinge
Position of the chain 130 in recessed hinge 1110 relative to the first noumenon 110.
It is understood that the positioning column 1121 is similarly and is obtained using injection molding technology.Specifically, such as Fig. 4 institutes
The injection mold 400 shown has one or more positioning grooves 410.Hinge fixing structure is being formed using injection molding process
When, the raw material of melting injects in the positioning groove 410 simultaneously, after via operations such as cooling, disengagings, such as Fig. 3 A~Fig. 3 B institutes
Show, you can obtain and 1120 integrally formed one or more positioning columns 1121 of the hinge mounts.
Due to being defined on the hinge fixing structure of above-mentioned the first noumenon for being located at the position in recessed hinge to hinge
Positioning column 1121, be integrally formed to obtain in injection molding hinge mounts 1120, thus there is no riveting tolerance,
The distance between the edge of the positioning column and hinge fixing structure tolerance is the tolerance of above-mentioned injection mold.
In conclusion accumulated tolerance is not present in the hinge fixing structure, global tolerance is the tolerance of injection mold, about
For 0.05mm, compared to the 0.25mm in traditional handicraft, machining tolerance has obtained great reduction, therefore, when hinge is set to
After recessed hinge, the gap between hinge and recessed hinge can be reduced to 0.6 ± 0.3mm by 0.8 ± 0.5mm in the prior art, from
And the appearance of electronic equipment can be beautified.
In accordance with an embodiment of the present disclosure, as shown in Fig. 3 A~Fig. 3 B, the hinge fixing structure 112 is solid in addition to above-mentioned hinge
Determine outside pedestal 1120 and one or more positioning columns 1121, can also include one or more thread bush 1122, so that with reference to figure 1
In hinge 130 can be connect by screw thread, bolt etc. with the first noumenon 110.
In order to avoid introducing additional tolerance and improving thread bush and the stable connection of hinge mounts, which can
Before forming hinge mounts using injection molding technology, which is fixed on injection mold
On, so that the hinge mounts are molded in the outer edge of the thread bush.
Wherein, as shown in Figure 3B, which is partially protrude through the surface of hinge mounts, and stretches into run through and be somebody's turn to do
Hinge mounts, so that hinge is fixedly connected with the cooperation of screw or bolt with the first noumenon by the thread bush.
As shown in figure 4, injection mold 400 should include one or more annular grooves 420, the annular diameters of the annular groove 420
Match with the internal diameter of thread bush.
Before stamping forming shell 111 in Fig. 2 and the injection mold 400 are put into injection molding apparatus, by this one
A or multiple thread bush 1122 are placed on the outside of the inner ring of one or more of annular grooves 420.Then, the hinge fixing structure
In hinge mounts can be molded in the outer edge of the thread bush so that the thread bush is fastened with the hinge mounts
Connection.
The tension-torsion power of the screw is tested by being screwed into screw in the thread bush, can judge indirectly thread bush with
The stable connection of hinge mounts.
Tension-torsion power test report shows that each screw can meet pulling force and be more than 20kgf, and harshness of the torsion more than 5kgf is wanted
It asks, illustrates that thread bush can be bonded with hinge mounts in hinge fixing structure obtained by the above method, and stability
By force.Therefore, when being fixedly connected with hinge with the first noumenon by screw, due to the firm company of the thread bush and hinge mounts
It connects, even if can ensure the stability that hinge is connect with the first noumenon if using height small screw and thread bush, to be conducive to
The lightening design of electronic equipment.
Fig. 5 is diagrammatically illustrated according to the hinge mounts of the embodiment of the present disclosure and showing for the first noumenon housing junction
Micro- enlarged drawing.
In accordance with an embodiment of the present disclosure, in order to promote the texture of electronic equipment, with reference to the shell of the first noumenon 110 in figure 2
111 can be metal material, and in view of processing cost and electronic equipment it is integrally-built lightening, can use be molded into
Type technology forms hinge fixing structure, then plastic material may be used in the hinge mounts 1120 in Fig. 3 A~Fig. 3 B.
If in view of that directly in ordinary metallic material surface injection moulding plastic material, can there is metal material and plastic material
Associativity is bad, the defect that metal cannot be bonded with plastic cement, therefore, is moulded if being directly molded in stamping forming surface of shell
It is unstable so that hinge fixing structure is connect with shell to form hinge fixing structure for glue material, the first noumenon relative to
For second ontology repeatedly after rotation, may have the first noumenon cannot be in the case where stablizing angle relative to the second ontology.
In accordance with an embodiment of the present disclosure, in order to avoid above-mentioned defect that may be present, stamping forming surface of shell can have
Have nano micropore structure, with using injection molding process formed hinge mounts when, the nano micropore structure it is micro-
The hinge mounts of part are injection molded in hole.
Specifically, NMT (Nano Molding Technology) technique can be used to prepare with reference to shown in figure 3A~Fig. 3 B
Hinge fixing structure.NMT techniques are the metals shell of the first noumenon (such as in the embodiment of the present disclosure) and plastic cement (such as the disclosure
The hinge of embodiment is same to determine structure) with the engineering method of nanotechnology combination.
Specifically, the method for preparing hinge fixing structure in the shell of the first noumenon is：Surface of shell is received first
Riceization processing, to form nano level microcellular structure in the surface of shell；Then hinge is fixed by base using injection molding process
The material (plastic cement) of the melting of seat is directly injected into metal surface (surface of shell), allows shell can be integrated with hinge fixing structure
Molding, adopts this method the texture for being not only able to take into account metal appearance, can also simplify the design of electronic product, electronics is allowed to set
Standby past lighter, thin, short, small trend development.
Wherein, after above-mentioned NMT technologies are due to that can remove rust, the grease of thin metal surface (surface of shell), pass through spy
Different solution is surface-treated, and therefore surface of shell has aperture, then the shell is put into injection mold and carries out injection molding
When, plastic cement, which can enter in aperture, to be cured, and achievees the purpose that strong engagement shell and hinge fixing structure.
As shown in figure 5, after preparing hinge fixing structure using NMT technologies for the embodiment of the present disclosure, hinge mounts and
The micro- enlarged drawing of the housing junction of the first noumenon, as seen from the figure, the segment boundaries 510 of hinge mounts enter the
In the aperture on the boundary 520 of one ontology shell, therefore, the shell of the hinge mounts and the first noumenon closely connects, is strong
In conjunction with, overcome in the prior art directly surface of shell using injection molding technology formed hinge fixing structure caused by the shell
Body connect unstable defect with hinge mounts.
Fig. 6 diagrammatically illustrates the preparation method of the electronic equipment according to the embodiment of the present disclosure.
Another aspect of the disclosure additionally provides the preparation method of a kind of electronic equipment, wherein the electronic equipment includes
Hinge and pass through the hinged the first noumenon and the second ontology, in accordance with an embodiment of the present disclosure, the system of the electronic equipment
Preparation Method can be used for preparing electronic equipment as described in Figure 1.
As shown in fig. 6, in accordance with an embodiment of the present disclosure, which may include operating S610~S620.It is operating
S610, the shell of punch forming the first noumenon；In operation S620, in the hinge of the surface injection molding hinge fixing structure of the shell
Chain fixed pedestal.That is the preparation method combination punch forming process and injection molding process of the electronic equipment, without using biography
Pressure welding in technique of uniting and milling process, thus can at least part of reductions prepare error, and can specific lower cost.
Therefore, which includes shell and above-mentioned hinge fixing structure, hinge by the hinge fixing structure with
The first noumenon is fixedly connected.In accordance with an embodiment of the present disclosure, first be prepared by the preparation method of above-mentioned electronic equipment
Ontology for example can be structure shown in reference chart 2.Details are not described herein.
In accordance with an embodiment of the present disclosure, the connection type of the hinge fixing structure and the first noumenon for example can be to pass through spiral shell
Dismountable mode such as nail, bolt.
In accordance with an embodiment of the present disclosure, above-mentioned hinge fixing structure further includes：With hinge mounts integrally formed one
A or multiple positioning columns, correspondingly, should be furnished with one or more location holes on hinge, when hinge passes through hinge fixing structure and the
When one ontology is fixedly connected, positioning column is matched with location hole, to play the restriction to hinge relative to the first noumenon position.
Wherein, since the one or more positioning column is integrally formed with hinge mounts, compared to tradition
In preparation method, by positioning column compared with hinge mounts rivet, it can effectively avoid riveting the additional tolerance brought so that
Entire electronic equipment the first noumenon and the tolerance that hinged tolerance is injection mold, to be conducive to beautify electronic equipment
Appearance.
In accordance with an embodiment of the present disclosure, the structural schematic diagram of the above-mentioned hinge fixing structure with positioning column can be reference
Structure shown in Fig. 3 A~Fig. 3 B, details are not described herein again.
In accordance with an embodiment of the present disclosure, above-mentioned hinge fixing structure can also include one or more thread bush, with
It is threadedly coupled with the first noumenon in making hinge.Specifically, the thread bush can for example be arranged in the hinge fixing structure hinge it is solid
Determine pedestal, and partial protrudes from hinge mounts.
When injection molding forms hinge fixing structure, may be used with reference to injection mold shown in Fig. 4, then by one or
Multiple thread bush are sheathed on respectively on the outside of the inner ring of annular groove 420, so that hinge mounts can be molded in one
The outer edge of a or multiple thread bush so that the one or more thread bush is integrally formed with hinge mounts, ensure that spiral shell
Line set is fastenedly connected with hinge mounts.
In view of with the development of science and technology, the development of electronic equipment tends to be lightening, therefore, to connects hinge and the first noumenon
Screw or bolt etc. height dimension require it is also more ultimate attainment, and use traditional plastic molding after hot melt screw technique
Intensity requirement (screw pulling tension requirements 20kgf) is can no longer meet, although existing punch welding technique can solve strength problem,
But due to the limitation of welding procedure precision itself, the demand of electronic equipment is difficult to ensure in precision.
The electronic equipment that embodiment of the disclosure is formed by the above method, due to hinge mounts therein and screw thread
Set can be bonded, and by test it is found that when hinge and the first noumenon pass through the cooperation of the thread bush and screw or bolt
When being connected, screw or bolt can meet pulling force and be more than 20kgf, and torsion is more than the rigors of 5kgf, therefore, even if using high
Degree smaller thread bush and screw association, can also ensure the stability that hinge is connect with the first noumenon, to be set conducive to electronics
Standby lightening design, avoids defect in the prior art.
Fig. 7 diagrammatically illustrates the preparation method of the electronic equipment according to another embodiment of the disclosure.
As shown in fig. 7, in accordance with an embodiment of the present disclosure, the preparation method of the electronic equipment is in addition to operating S610~S620
Outside, further include operation S710.Operation S710 is executed after operating S610 before operation S620.
In operation S710, the shell is pre-processed, so that surface of shell forms nano micropore structure.
In accordance with an embodiment of the present disclosure, in order to promote the texture of electronic equipment, metal may be used in the shell of the first noumenon
Material, and in view of processing cost and electronic equipment are integrally-built lightening, plastic material may be used by being molded into
Type technology forms hinge fixing structure.
In view of that directly in metal material surface injection moulding plastic material, can there is the associativity of metal material and plastic material
Defect bad, that metal cannot be bonded with plastic cement.Therefore, before executing operation S620, first to stamping forming shell
It is pre-processed, to form nano micropore structure in surface of shell, then when executing operation S620, the plastic cement for being molded melting is former
Material can then inject the nano micropore structure, so that the hinge for being injection molded with part in the nano micropore structure fixes base
Seat, to ensure that being bonded for shell and hinge fixing structure.
Specifically, the preparation that NMT techniques carry out the first noumenon in above-mentioned electronic equipment, the first being prepared can be used
Body can as illustrated with reference to fig. 2, correspondingly, and the hinge fixing structure of the first noumenon can be as with reference to shown in figure 3A~Fig. 3 B, being prepared into
The micro- enlarged drawing of the junction of the shell of the hinge mounts and the first noumenon that arrive can be as refering to what is shown in Fig. 5, can by Fig. 5
Know, the segment boundary 510 of hinge mounts enters in the aperture on the boundary 520 of the first noumenon shell, and therefore, which fixes
The shell of pedestal and the first noumenon closely connects, strong combination, overcomes in the prior art directly in surface of shell using being molded
The shell connect unstable defect with hinge mounts caused by forming technique forms hinge fixing structure.
In conclusion the preparation method of the electronic equipment of the embodiment of the present disclosure can integrate punch forming process and injection molding
The advantage of technique realizes the optimization of electronic equipment quality at lower cost, and the electronic equipment being prepared is in intensity and essence
All there is larger improvement compared with traditional handicraft on degree.
It will be understood by those skilled in the art that the feature described in each embodiment and/or claim of the disclosure can
To carry out multiple combinations or/or combination, even if such combination or combination are not expressly recited in the disclosure.Particularly, exist
In the case of not departing from disclosure spirit or teaching, the feature described in each embodiment and/or claim of the disclosure can
To carry out multiple combinations and/or combination.All these combinations and/or combination each fall within the scope of the present disclosure.
Although the disclosure, art technology has shown and described with reference to the certain exemplary embodiments of the disclosure
Personnel it should be understood that in the case of the spirit and scope of the present disclosure limited without departing substantially from the following claims and their equivalents,
A variety of changes in form and details can be carried out to the disclosure.Therefore, the scope of the present disclosure should not necessarily be limited by above-described embodiment,
But should be not only determined by appended claims, also it is defined by the equivalent of appended claims.
Claims (10)
1. a kind of electronic equipment, including hinge, and by the hinged the first noumenon and the second ontology, described first
Ontology includes：
Stamping forming shell；And
Positioned at the hinge fixing structure of the surface of shell comprising the hinge for being molded in the surface of shell fixes base
Seat,
Wherein, the hinge is fixedly connected by the hinge fixing structure with the first noumenon.
2. electronic equipment according to claim 1, wherein the hinge fixing structure further includes：
One or more positioning columns, which is integrally formed with the hinge mounts, described in restriction
Position of the hinge relative to the first noumenon.
3. electronic equipment according to claim 1, wherein：
The surface for being injection molded with the shell of the hinge mounts has nano micropore structure, so that the nanometer
The hinge mounts of part are injection molded in the micropore of grade microcellular structure.
4. electronic equipment according to claim 1, wherein：
The hinge fixing structure further includes one or more thread bush, so that the hinge connects with the first noumenon screw thread
It connects；
The hinge mounts are molded in the outer edge of the thread bush.
5. electronic equipment according to claim 1, wherein the shell includes metal material, the hinge mounts
Including rubber material.
6. the preparation method of a kind of electronic equipment, the electronic equipment includes hinge, and passes through described hinged first
Ontology and the second ontology, wherein the method includes：
The shell of the first noumenon described in punch forming；And
In the hinge mounts of the surface of shell injection molding hinge fixing structure,
Wherein, the hinge is fixedly connected by the hinge fixing structure with the first noumenon.
7. according to the method described in claim 6, wherein, the hinge fixing structure further includes：
With the integrally formed one or more positioning columns of the hinge mounts, to limit the hinge relative to described first
The position of ontology.
8. according to the method described in claim 6, the hinge in the surface of shell injection molding hinge fixing structure fixes base
Further include before seat：
The shell is pre-processed, so that the surface of the shell forms nano micropore structure.
9. according to the method described in claim 6, wherein：
The hinge fixing structure further includes one or more thread bush, so that the hinge connects with the first noumenon screw thread
It connects；
The hinge mounts of the hinge fixing structure are molded in the outer edge of the thread bush.
10. according to the method described in claim 6, wherein, the shell includes metal material, the hinge mounts include
Rubber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810203485.2A CN108449896B (en) | 2018-03-12 | 2018-03-12 | Electronic device and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810203485.2A CN108449896B (en) | 2018-03-12 | 2018-03-12 | Electronic device and method for manufacturing the same |
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| CN108449896A true CN108449896A (en) | 2018-08-24 |
| CN108449896B CN108449896B (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810203485.2A Active CN108449896B (en) | 2018-03-12 | 2018-03-12 | Electronic device and method for manufacturing the same |
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| CN (1) | CN108449896B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108449896B (en) | 2020-12-18 |
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