CN108444703A - Three-dimensional Intelligent sensing device - Google Patents
Three-dimensional Intelligent sensing device Download PDFInfo
- Publication number
- CN108444703A CN108444703A CN201810216118.6A CN201810216118A CN108444703A CN 108444703 A CN108444703 A CN 108444703A CN 201810216118 A CN201810216118 A CN 201810216118A CN 108444703 A CN108444703 A CN 108444703A
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- China
- Prior art keywords
- module
- vibrating sensor
- sensor
- signal
- power supply
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
- G01M13/04—Bearings
- G01M13/045—Acoustic or vibration analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
The invention discloses a kind of three-dimensional Intelligent sensing devices comprising：Power supply module, the power supply for being suitble to offers such as a vibrating sensors；Vibrating sensor is located at power supply module side, for incuding external equipment surface vibration size, and in output voltage a to anti alias filter；Infrared temperature sensor is located at vibrating sensor side, for popping one's head in external far infrared temperature measurement, non-contact type measuring device surface temperature etc..The present invention can save the in-site measurement time, and avoid due to shortage of data caused by insufficient space.
Description
Technical field
The present invention relates to a kind of sensing devices, more particularly to a kind of three-dimensional Intelligent sensing device.
Background technology
The equipment of operation in 24 hours in industrial enterprise, needing three directions of its bearing of periodic measurement to vibrate, ((Z axis) hangs down
Directly, (X-axis) is horizontal axial with (Y-axis)) and bearing surface temperature.When main purpose is to judge equipment running status it is no just
Often, when abnormal, fault diagnosis is carried out by the original waveform data and spectrogram of vibration.
When the unidirectional sensing unit of generally use measures, needs to be moved on three directions of bearing block and measure, it must
Installation need be moved three times, and acquire data three times to complete the measurement of a bearing block, it is very time-consuming.
Some equipment are since the measurement space of equipment limits, when unidirectional transducer measures, in certain directions (as axial)
Unidirectional sensing unit can not be installed, therefore the data for changing direction can not be obtained, data source has been lacked for fault diagnosis,
Cause diagnostic analysis data deficiencies.
Invention content
Technical problem to be solved by the invention is to provide a kind of three-dimensional Intelligent sensing devices, can save in-site measurement
Time, and avoid due to shortage of data caused by insufficient space.
The present invention is to solve above-mentioned technical problem by following technical proposals：A kind of three-dimensional Intelligent sensing device,
Including：
Power supply module, the power supply for being suitble to offers such as a vibrating sensors；
Vibrating sensor is located at power supply module side, for incuding external equipment surface vibration size, and exports electricity
It is pressed onto in an anti alias filter；
Infrared temperature sensor is located at vibrating sensor side, for popping one's head in external far infrared temperature measurement, contactless survey
Measure equipment surface temperature；
Switching switch, is located at infrared temperature sensor side, is respectively connected in vibrating sensor for passing through switching switch
An Acquisition Circuit in；
Hardware integrating circuit module is located at switching switch side, for obtaining vibration acceleration signal integral post-processing
Vibration velocity or displacement；
Envelope demodulation circuit module is located at hardware integrating circuit module side, after demodulating vibration acceleration signal
Vibration envelope signal is obtained, bearing failure diagnosis is used for；
Magnetic absorbing seat is positioned, is located at envelope demodulation circuit module side, for realizing vibrating sensor, infrared temperature sensor
Fast Installation；
Bluetooth communication module is located at positioning magnetic absorbing seat side, a point is uploaded in real time for vibration values will to be calculated
Mobile phone is examined, and initial data is vibrated by uploading, is used for accident analysis；
Data memory module is located at bluetooth communication module side, for that will vibrate initial data, vibration total value, sensitive spy
Value indicative data preserve temporarily；
Dsp processor is located at data memory module side, based on the signals such as vibration velocity, envelope, displacement progress total value
It calculates, sensitive indicator calculates；
Analog-digital converter is located at dsp processor side, for amplified signal to be converted to digital signal, and carries out
Subsequent data processing；
Signal amplifier is located at analog-digital converter side, for amplifying the output signal of vibrating sensor, to improve
Measuring accuracy；
Anti alias filter is located at signal amplifier side, is filtered for the signal except analysis of vibration signal bandwidth range
It removes, filters out garbage signal；
Wireless charging module is located at anti alias filter side, and is located at power supply module side, is passed for realizing vibration
The wireless charging of sensor etc., and wireless charging module uses radio induction charging technology；
Central control unit module is passed with positioning magnetic absorbing seat, power supply module, vibrating sensor, infrared temperature respectively
Sensor, switching switch, anti alias filter, signal amplifier, hardware integrating circuit module, envelope demodulation circuit module, modulus turn
Parallel operation, dsp processor, data memory module, bluetooth communication module, wireless charging module are connected, for controlling power supply power supply mould
Block, vibrating sensor, infrared temperature sensor, switching switch, anti alias filter, signal amplifier, hardware integrating circuit module,
Envelope demodulation circuit module, analog-digital converter, dsp processor, data memory module, bluetooth communication module, wireless charging module
Function realize and sequential.
Preferably, the vibrating sensor includes X to vibrating sensor, Y-direction vibrating sensor, Z-direction vibrating sensor, X
It is located at Y-direction vibrating sensor side to vibrating sensor, Y-direction vibrating sensor is located at Z-direction vibrating sensor side.
Preferably, the positioning magnetic absorbing seat is equipped with positioning magnetic absorbing seat.
Compared with prior art, the present invention has following advantageous effect：
One, the present invention uses built-in integrated X to vibrating sensor, Y-direction vibrating sensor, Z-direction vibrating sensor, infrared survey
Temperature probe is measured in one, only once installation, so that it may to obtain vibration values, the original of three directions (X-axis, Y-axis, Z axis) simultaneously
Beginning waveform and frequency spectrum data, bearing surface temperature data etc.；
Two, the present invention can save the in-site measurement time, and avoid due to shortage of data caused by insufficient space.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Specific implementation mode
Present pre-ferred embodiments are provided below in conjunction with the accompanying drawings, with the technical solution that the present invention will be described in detail.
As shown in Figure 1, three-dimensional Intelligent sensing device of the present invention includes：
Power supply module, the power supply for being suitble to offers such as a vibrating sensors；
Vibrating sensor is located at power supply module side, for incuding external equipment surface vibration size, and exports electricity
It is pressed onto in an anti alias filter；
Infrared temperature sensor is located at vibrating sensor side, for popping one's head in external far infrared temperature measurement, contactless survey
Measure equipment surface temperature；
Switching switch, is located at infrared temperature sensor side, is respectively connected in vibrating sensor for passing through switching switch
An Acquisition Circuit in；
Hardware integrating circuit module is located at switching switch side, for obtaining vibration acceleration signal integral post-processing
Vibration velocity or displacement；
Envelope demodulation circuit module is located at hardware integrating circuit module side, after demodulating vibration acceleration signal
Vibration envelope signal is obtained, bearing failure diagnosis is used for；
Magnetic absorbing seat is positioned, is located at envelope demodulation circuit module side, for realizing vibrating sensor, infrared temperature sensor
Fast Installation；
Bluetooth communication module is located at positioning magnetic absorbing seat side, a point is uploaded in real time for vibration values will to be calculated
Mobile phone is examined, and initial data is vibrated by uploading, is used for accident analysis；
Data memory module is located at bluetooth communication module side, for that will vibrate initial data, vibration total value, sensitive spy
Value indicative data preserve temporarily；
Dsp processor is located at data memory module side, based on the signals such as vibration velocity, envelope, displacement progress total value
It calculates, sensitive indicator calculates；
Analog-digital converter is located at dsp processor side, for amplified signal to be converted to digital signal, and carries out
Subsequent data processing；
Signal amplifier is located at analog-digital converter side, for amplifying the output signal of vibrating sensor, to improve
Measuring accuracy；
Anti alias filter is located at signal amplifier side, is filtered for the signal except analysis of vibration signal bandwidth range
It removes, filters out garbage signal；
Wireless charging module is located at anti alias filter side, and is located at power supply module side, is passed for realizing vibration
The wireless charging of sensor etc., and wireless charging module uses radio induction charging technology；
Central control unit module is passed with positioning magnetic absorbing seat, power supply module, vibrating sensor, infrared temperature respectively
Sensor, switching switch, anti alias filter, signal amplifier, hardware integrating circuit module, envelope demodulation circuit module, modulus turn
Parallel operation, dsp processor, data memory module, bluetooth communication module, wireless charging module are connected, for controlling power supply power supply mould
Block, vibrating sensor, infrared temperature sensor, switching switch, anti alias filter, signal amplifier, hardware integrating circuit module,
Envelope demodulation circuit module, analog-digital converter, DSP (Digital Signal Processing, Digital Signal Processing) processing
Device, data memory module, bluetooth communication module, the function realization of wireless charging module and sequential.
The vibrating sensor includes X to vibrating sensor, Y-direction vibrating sensor, Z-direction vibrating sensor, and X is passed to vibration
Sensor is located at Y-direction vibrating sensor side, and Y-direction vibrating sensor is located at Z-direction vibrating sensor side, can realize three in this way
Direction positioning function.
The positioning magnetic absorbing seat is equipped with positioning magnetic absorbing seat, and institute's bias measures size will be caused error in this way, convenient
Installation positioning.
Particular embodiments described above, the technical issues of to the solution of the present invention, technical solution and advantageous effect carry out
It is further described, it should be understood that the above is only a specific embodiment of the present invention, is not limited to
The present invention, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should be included in this
Within the protection domain of invention.
Claims (3)
1. a kind of three-dimensional Intelligent sensing device, which is characterized in that it includes：
Power supply module, the power supply for being suitble to offers such as a vibrating sensors；
Vibrating sensor is located at power supply module side, and for incuding external equipment surface vibration size, and output voltage arrives
In one anti alias filter；
Infrared temperature sensor is located at vibrating sensor side, and for popping one's head in external far infrared temperature measurement, non-contact measurement is set
Standby surface temperature；
Switching switch, is located at infrared temperature sensor side, and one for being respectively connected in vibrating sensor by switching switch
In a Acquisition Circuit；
Hardware integrating circuit module is located at switching switch side, for being vibrated vibration acceleration signal integral post-processing
Speed or displacement；
Envelope demodulation circuit module is located at hardware integrating circuit module side, for being obtained after demodulating vibration acceleration signal
Envelope signal is vibrated, bearing failure diagnosis is used for；
Position magnetic absorbing seat, be located at envelope demodulation circuit module side, for realizing vibrating sensor, infrared temperature sensor it is fast
Speed installation；
Bluetooth communication module is located at positioning magnetic absorbing seat side, and a point inspection hand is uploaded in real time for vibration values will to be calculated
Machine, and initial data is vibrated by uploading, it is used for accident analysis；
Data memory module is located at bluetooth communication module side, for that will vibrate initial data, vibration total value, sensitive features value
Data preserve temporarily；
Dsp processor is located at data memory module side, for the signals such as vibration velocity, envelope, displacement carry out total value calculating,
Sensitive indicator calculates；
Analog-digital converter is located at dsp processor side, for amplified signal to be converted to digital signal, and carries out follow-up
Data processing；
Signal amplifier is located at analog-digital converter side, for amplifying the output signal of vibrating sensor, to improve test
Precision；
Anti alias filter is located at signal amplifier side, is filtered out for the signal except analysis of vibration signal bandwidth range, filters
Except garbage signal；
Wireless charging module is located at anti alias filter side, and is located at power supply module side, for realizing vibrating sensor
Deng wireless charging, and wireless charging module use radio induction charging technology；
Central control unit module, respectively with positioning magnetic absorbing seat, power supply module, vibrating sensor, infrared temperature sensor,
Switch switch, anti alias filter, signal amplifier, hardware integrating circuit module, envelope demodulation circuit module, analog-digital converter,
Dsp processor, data memory module, bluetooth communication module, wireless charging module are connected, for controlling power supply module, shaking
Dynamic sensor, infrared temperature sensor, switching switch, anti alias filter, signal amplifier, hardware integrating circuit module, envelope
The work(of demodulator circuit module, analog-digital converter, dsp processor, data memory module, bluetooth communication module, wireless charging module
It can realization and sequential.
2. three-dimensional Intelligent sensing device according to claim 1, which is characterized in that the vibrating sensor includes X to shaking
Dynamic sensor, Y-direction vibrating sensor, Z-direction vibrating sensor, X are located at Y-direction vibrating sensor side to vibrating sensor, and Y-direction is shaken
Dynamic sensor is located at Z-direction vibrating sensor side.
3. three-dimensional Intelligent sensing device according to claim 1, which is characterized in that the positioning magnetic absorbing seat is equipped with positioning
Magnetic absorbing seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810216118.6A CN108444703A (en) | 2018-03-15 | 2018-03-15 | Three-dimensional Intelligent sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810216118.6A CN108444703A (en) | 2018-03-15 | 2018-03-15 | Three-dimensional Intelligent sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108444703A true CN108444703A (en) | 2018-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810216118.6A Pending CN108444703A (en) | 2018-03-15 | 2018-03-15 | Three-dimensional Intelligent sensing device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1557664A (en) * | 2004-01-16 | 2004-12-29 | 湖南科技大学 | Bus type intelligent sensor set for state monitoring |
| CN102107222A (en) * | 2009-12-24 | 2011-06-29 | 上海梅山钢铁股份有限公司 | On-line vibration detection device and method for equipment state of hot finishing mill |
| CN203464957U (en) * | 2013-08-15 | 2014-03-05 | 山东驰阳智能技术有限公司 | Device for monitoring operation state of off-grid wind power generation system |
| CN205068742U (en) * | 2015-10-12 | 2016-03-02 | 上海士翌测试技术有限公司 | Appearance is examined to intelligence point based on wireless sensing unit |
| CN205283573U (en) * | 2016-01-07 | 2016-06-01 | 上海士翌测试技术有限公司 | Diagnostic system of network monitoring facilities state |
| CN206248327U (en) * | 2016-12-05 | 2017-06-13 | 中国工程物理研究院机械制造工艺研究所 | dynamic pressure foil bearing performance testing device |
-
2018
- 2018-03-15 CN CN201810216118.6A patent/CN108444703A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1557664A (en) * | 2004-01-16 | 2004-12-29 | 湖南科技大学 | Bus type intelligent sensor set for state monitoring |
| CN102107222A (en) * | 2009-12-24 | 2011-06-29 | 上海梅山钢铁股份有限公司 | On-line vibration detection device and method for equipment state of hot finishing mill |
| CN203464957U (en) * | 2013-08-15 | 2014-03-05 | 山东驰阳智能技术有限公司 | Device for monitoring operation state of off-grid wind power generation system |
| CN205068742U (en) * | 2015-10-12 | 2016-03-02 | 上海士翌测试技术有限公司 | Appearance is examined to intelligence point based on wireless sensing unit |
| CN205283573U (en) * | 2016-01-07 | 2016-06-01 | 上海士翌测试技术有限公司 | Diagnostic system of network monitoring facilities state |
| CN206248327U (en) * | 2016-12-05 | 2017-06-13 | 中国工程物理研究院机械制造工艺研究所 | dynamic pressure foil bearing performance testing device |
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Application publication date: 20180824 |